Electronic equipment

Abstract

The embodiment of the utility model provides electronic equipment which can comprise a mobile phone, a tablet personal computer, a notebook computer and the like, a groove is formed in the front side surface of a middle frame to enlarge the installation space of a soaking part, the soaking part is arranged to be of a structure comprising a first soaking plate and a second soaking plate, and after the first soaking plate and the front side surface of the middle frame are fixed, the first soaking plate and the second soaking plate are fixed. The second vapor chamber is fixed in the mounting cavity defined by the first vapor chamber and the groove, and due to the arrangement of the second vapor chamber, the overall size of the vapor chamber can be increased, the heat dissipation performance of the electronic equipment can be improved, and meanwhile the light and thin design of the electronic equipment cannot be affected.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to an electronic device. Background Art

[0002] With the development of industry and social progress, electronic devices, such as mobile phones, are used in more and more scenarios in life and have become a necessity in human life. As people become more dependent on mobile phones, mobile phones need to have more and more functions. The power consumption of mobile phones during use is getting higher and higher, the products are getting hotter, and the user experience is affected.

[0003] The heat dissipation performance is ensured inside the mobile phone through a heat spreader. However, as mobile phones become thinner and lighter, the installation space of the heat spreader is limited, and the heat dissipation performance is limited. How to improve the heat dissipation performance of mobile phones and other electronic devices within a limited space is a technical problem that technical personnel in this field urgently need to solve. Utility Model Content

[0004] An embodiment of the present application provides an electronic device, in which a groove is provided in a middle frame to increase the installation space of a heat spreader, and the heat spreader is provided to have a structure including a first heat spreader plate and a second heat spreader plate, wherein the second heat spreader plate is located in the groove, thereby increasing the overall volume of the heat spreader, and being able to improve the heat dissipation performance of the electronic device without affecting the requirements of a lightweight and thin design.

[0005] The embodiment of the present application provides an electronic device, including a middle frame and a heat spreader, the heat spreader includes a first heat spreader and at least one second heat spreader; a groove is provided on the front side surface of the middle frame, the first heat spreader is bonded and fixed to the front side surface of the middle frame, and is enclosed with the groove to form an installation cavity. By providing the groove in the middle frame, the installation space of the heat spreader is increased, and the heat spreader is provided as a structure including the first heat spreader and the second heat spreader, and the second heat spreader is located in the groove, which can improve the heat dissipation performance of the heat spreader without affecting the requirements of lightweight design.

[0006] In some embodiments of the present application, the first heat spreader and the middle frame are fixed by bonding along the circumferential direction through the first adhesive layer, which has good fixing stability and simple structure.

[0007] In some embodiments of the present application, the first vapor chamber and the middle frame are further fixed by glue dots arranged along the circumference to further ensure the bonding stability between the first vapor chamber and the middle frame.

[0008] In some embodiments of the present application, the first heat spreader and the second heat spreader are integrated into one structure, which can simplify the overall structure of the heat spreader and facilitate installation.

[0009] In some embodiments of the present application, the first vapor chamber and the second vapor chamber are independent structures and fixed by bonding. In this way, the second vapor chamber has better layout flexibility and can reduce costs.

[0010] In some embodiments of the present application, the first heat spreader and the second heat spreader are bonded and fixed by a second adhesive layer, and the second adhesive layer is arranged along the circumference of the second heat spreader. The first heat spreader and the second heat spreader are bonded and fixed by the second adhesive layer, which has good stability and simple structure.

[0011] In some embodiments of the present application, a first thermally conductive adhesive layer is further disposed between the first and second thermally conductive plates, and the first thermally conductive adhesive layer is located in the area enclosed by the second back adhesive layer. The first thermally conductive adhesive layer is disposed to ensure the heat conduction effect between the first and second thermally conductive plates.

[0012] In some embodiments of the present application, a second thermal conductive adhesive layer is disposed between the second vapor chamber and the bottom wall of the groove. The second thermal conductive adhesive layer ensures the heat conduction effect between the second vapor chamber and the bottom wall of the groove, and can also balance the processing error.

[0013] In some embodiments of the present application, a first support portion is further provided between the second vapor chamber and the bottom wall of the groove, and the height of the first support portion is less than the distance between the second vapor chamber and the bottom wall of the groove. During the pressure holding test, the first support portion can provide support for the second vapor chamber, and then provide support for the first vapor chamber, thereby avoiding the situation where the first vapor chamber is greatly deformed at the groove and cannot be restored due to the crushing of the second thermal conductive adhesive layer, thereby improving the product yield.

[0014] In some embodiments of the present application, the first support portion is a support adhesive layer, and the support adhesive layer is bonded to the second heat spreader or the bottom wall of the groove. Such a configuration can simplify the molding process of the first support portion.

[0015] In some embodiments of the present application, the second heat spreader is fixed to the bottom wall of the groove by a third adhesive layer, and the third adhesive layer is arranged along the circumference of the second heat spreader. The second heat spreader is fixed to the middle frame by the third adhesive layer, which can achieve good stability and simple structure.

[0016] In some embodiments of the present application, a third thermally conductive adhesive layer is further provided between the second heat spreader and the bottom wall of the groove, and the third thermally conductive adhesive layer is located in the area enclosed by the third back adhesive layer. The third thermally conductive adhesive layer is provided to ensure the heat conduction effect between the second heat spreader and the bottom wall of the groove.

[0017] In some embodiments of the present application, a fourth thermally conductive adhesive layer is further disposed between the first vapor chamber and the second vapor chamber, and the fourth thermally conductive adhesive layer is disposed to ensure the heat conduction effect between the first vapor chamber and the second vapor chamber.

[0018] In some embodiments of the present application, a second support portion is further provided between the first vapor chamber and the second vapor chamber, and the height of the second support portion is less than the distance between the first vapor chamber and the second vapor chamber. During the pressure holding test, the second support portion can provide support for the first vapor chamber, thereby preventing the first vapor chamber from being greatly deformed at the groove and unable to recover due to the crushing of the fourth thermal conductive adhesive layer, thereby improving the product yield.

[0019] In some embodiments of the present application, the second support portion is a support adhesive layer, and the support adhesive layer is bonded to the first vapor chamber or the second vapor chamber. Such a configuration can simplify the molding process of the second support portion.

[0020] In some embodiments of the present application, a display screen and a rear shell are further included. The display screen is fixedly arranged on a side of the middle frame facing the heat spreader, and the rear shell is fixedly arranged on a side of the middle frame away from the heat spreader. The display screen, the rear shell and the middle frame are enclosed to form a housing. The electronic device can be a mobile phone, a tablet computer, etc. The heat spreader ensures the overall heat dissipation performance of the electronic device, thereby ensuring the normal operation of the electronic device.

[0021] In some embodiments of the present application, a mainboard is fixed in the housing, the mainboard is fixed to the side of the middle frame away from the heat-spreading part, and a groove is provided at the corresponding position of the middle frame and the mainboard. The mainboard is the main heat-generating component inside the electronic device, and a second heat-spreading plate is provided at the position corresponding to the mainboard, which can dissipate the heat generated by the mainboard in time to ensure the overall heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0023] Figure 2 yes Figure 1 Front and side view after removing the display screen;

[0024] Figure 3 is a cross-sectional view of an electronic device provided in an embodiment of the present application;

[0025] Figure 4 is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a second vapor chamber is fixed to a first vapor chamber;

[0026] Figure 5 is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a first supporting portion is fixedly disposed on a bottom wall of the groove;

[0027] Figure 6 is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a first supporting portion is integrally formed on a bottom wall of the groove;

[0028] Figure 7is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a first supporting portion is fixedly disposed on a second heat spreader;

[0029] Figure 8 is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a second heat spreader is integrally formed with a first support portion;

[0030] Fig. 9 is a cross-sectional view of the electronic device without the display screen and the rear housing, wherein the second heat spreader is fixed to the bottom wall of the groove;

[0031] Fig.10 is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a second support portion is fixedly provided on a second heat spreader;

[0032] Fig.11 is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a second heat spreader is integrally formed with a second supporting portion;

[0033] Fig.12 is a cross-sectional view of an electronic device without a display screen and a rear housing, wherein a second supporting portion is fixedly disposed on a first heat spreader;

[0034] Fig.13 It is a cross-sectional view of an electronic device without a display screen and a rear shell, wherein a first heat spreader is integrally formed with a second support portion.

[0035] Attached Figure 1-Figure 13 In the figure, the reference numerals are described as follows:

[0036] 1 middle frame, 11 groove, 111 groove bottom wall;

[0037] 2 a heat sink, 21 a first heat sink, 22 a second heat sink;

[0038] 3. The first adhesive layer;

[0039] 4. The second adhesive layer;

[0040] 5. The third adhesive layer;

[0041] 6. The first thermal conductive adhesive layer;

[0042] 7 second thermal conductive adhesive layer;

[0043] 8 the third thermal conductive adhesive layer;

[0044] 9 fourth thermal conductive adhesive layer;

[0045] 10 a first supporting portion;

[0046] 12 second supporting portion;

[0047] 13 display screen;

[0048] 14 rear shell;

[0049] 15. Motherboard;

[0050] 16 batteries. DETAILED DESCRIPTION

[0051] The embodiments of the present application provide an electronic device, including but not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a driving recorder, a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a mobile or fixed terminal with a middle frame, such as a car front-end.

[0052] When the electronic device is a mobile phone or tablet computer, Figure 1-Figure 3 As shown, the electronic device includes a middle frame 1, a display screen 13 and a rear shell 14. The display screen 13 can be fixed to the front side of the middle frame 1 by bonding, snapping, etc., and the rear shell 14 can be fixed to the rear side of the middle frame 1 by bonding, snapping, fastener connection, etc. The middle frame 1, the display screen 13, and the rear shell 14 are surrounded to form a shell. The electronic device also includes components such as a mainboard 15, a battery 16, and a heat spreader 2 arranged in the shell. The electronic device can improve the heat dissipation performance through the heat spreader 2.

[0053] Among them, the main board 15 is fixed on the rear side of the middle frame 1, and the heat spreader 2 is fixed on the front side of the middle frame 1 and is located between the middle frame 1 and the display screen 13. When the electronic device is in use, the main board 15, the battery 16 and other components will generate heat. The heat spreader can disperse the heat generated by the main board 15, the battery 16, etc. to avoid local excessive temperature that may cause the electronic device to burn out. At the same time, it can also provide protection for the main board 15, the battery 16 and other components.

[0054] In this article, Figure 1 and Figure 3 As shown by the middle arrow, “front” refers to the side facing the display screen 13, and “rear” refers to the side facing the rear housing 14.

[0055] like Figure 3-Figure 13 As shown, in this embodiment, the heat spreading part 2 includes a first heat spreading plate 21 and a second heat spreading plate 22 stacked in the front-to-back direction, wherein the heat spreading area of ​​the first heat spreading plate 21 is larger than the heat spreading area of ​​the second heat spreading plate 22, the first heat spreading plate is fixed to the front surface of the middle frame 1, the second heat spreading plate 22 is located between the first heat spreading plate 21 and the middle frame 1, and the rear surface of the second heat spreading plate 22 is fixed to the front surface of the middle frame 1.

[0056] The first vapor chamber 21 can be fixed to the middle frame 1 through the first adhesive layer 3. The first adhesive layer 3 is arranged along the circumference of the first vapor chamber 21 and is specifically fixed by adhesive between the skirt of the first vapor chamber 21 and the middle frame 1. This arrangement has good fixing stability and a simple structure. When the width of the first adhesive layer 3 is narrow, it can be further fixed on the front side surface of the first vapor chamber 21 and the middle frame 1 by adhesive dispensing to ensure bonding stability.

[0057] A groove 11 is provided on the front side surface of the middle frame 1. After the first heat spreader 21 and the middle frame 1 are fixed, an installation cavity can be enclosed between the first heat spreader 21 and the groove 11, and the second heat spreader 22 is fixed in the installation cavity. Such a configuration can prevent the second heat spreader 22 from affecting the installation of the first heat spreader 21, and can also prevent the second heat spreader 22 from affecting the overall thickness of the electronic device. That is to say, when the overall thickness of the electronic device remains unchanged, the installation space of the heat spreader 2 is increased by partially providing the groove 11 in the middle frame 1, and the second heat spreader 22 is added to increase the overall volume of the heat spreader 2, thereby improving the heat dissipation performance of the heat spreader 2, thereby improving the heat dissipation capacity of the electronic device, ensuring the stable operation of the electronic device, and at the same time not affecting the overall thickness of the electronic device.

[0058] Specifically, in the present embodiment, there is no restriction on the number of second heat spreaders 22, and it may be one, two or more. The main board 15 is the main heating element inside the electronic device, and the heat spreader 2 is provided with a second heat spreader 22 corresponding to the main board 15. That is to say, the main board 15 is fixed to the rear side of the middle frame 1, and a groove 11 is provided at a position on the front surface of the middle frame 1 corresponding to the main board 15. With such a configuration, the distance between the second heat spreader 22 and the main board 15 is small, and the heat generated by the main board 15 can be transferred to the first heat spreader 21 in a timely and effective manner, thereby improving the heat dissipation performance. The heat spreader 2 may also be provided with a second heat spreader 22 corresponding to the imaging element, and the specific configuration may be based on actual conditions.

[0059] In this embodiment, there is no specific restriction on the shape, area, thickness, etc. of each heat spreader (including the first heat spreader 21 and the second heat spreader 22). It is not difficult to understand that the larger the area and thickness of the heat spreader, the better the heat dissipation capacity. The shape, area and thickness of each heat spreader can be arranged according to the structure of the middle frame 1 and the space between the middle frame 1 and the screen.

[0060] When there are two or more second heat spreaders 22 , the shapes, areas, thicknesses, etc. of the second heat spreaders 22 may be the same or different, and may be specifically arranged according to actual space.

[0061] Moreover, in this embodiment, in order to further improve the heat dissipation performance, the heat-sinking part 2 can also be set to include a third heat-sinking plate, and the third heat-sinking plate is fixed between the rear side surface of the second heat-sinking plate 22 and the middle frame 1. For example, a receiving groove for accommodating the third heat-sinking plate is provided on the bottom wall 111 of the groove 11. The installation method between the third heat-sinking plate, the second heat-sinking plate 22 and the middle frame 1 can refer to the installation method of the second heat-sinking plate 22, and can be specifically set according to the structure of the middle frame 1. When the heat-sinking part 2 is set to include a first heat-sinking plate 21 and a second heat-sinking plate 22, the overall structure can be simplified while improving the heat dissipation performance, and the molding process of the middle frame 1 can be simplified.

[0062] like Figure 3 As shown, in this embodiment, the first and second vapor chambers 21 and 22 can be an integrated structure. In this case, the rear surface of the first vapor chamber 21 is partially raised to form the second vapor chamber 22. This arrangement can simplify the molding process and the installation operation. Alternatively, the first and second vapor chambers 21 and 22 can be configured as independent structures. This arrangement can provide better flexibility in the configuration of the second vapor chamber 22 and reduce costs.

[0063] like Figure 4-Figure 6 As shown, when the first heat spreader 21 and the second heat spreader 22 are independent structures and are fixed by bonding, the first heat spreader 21 and the second heat spreader 22 are bonded and fixed by the second adhesive layer 4, and the second adhesive layer 4 is arranged along the circumference of the second heat spreader 22 to ensure the bonding stability between the first heat spreader 21 and the second heat spreader 22.

[0064] Furthermore, a first thermally conductive adhesive layer 6 is provided between the first thermally conductive plate 21 and the second thermally conductive plate 22. The first thermally conductive adhesive layer 6 is located in the area enclosed by the second back adhesive layer 4. Specifically, the second back adhesive layer 4 is first circumferentially bonded to the front surface of the second thermally conductive plate 22 or the rear surface of the first thermally conductive plate 21, and then the thermally conductive adhesive is filled in the area enclosed by the second back adhesive layer 4. Then, the rear surface of the first thermally conductive plate 21 and the front surface of the second thermally conductive plate 22 are bonded together. The two can be fixed by the second back adhesive layer 4, and the first thermally conductive adhesive layer 6 can be spread flat in the area enclosed by the second back adhesive layer 4. The thickness of the first thermally conductive adhesive layer 6 and the second back adhesive layer 4 are the same.

[0065] The rear surface of the first heat spreader 21 and the front surface of the second heat spreader 22 are bonded and fixed by the second backing adhesive layer 4 and the first thermal conductive adhesive layer 6, which can improve the heat transfer effect while ensuring the fixing stability, thereby improving the heat dissipation performance.

[0066] like Figure 4-Figure 8As shown, a second heat-conducting adhesive layer 7 is further provided between the second heat-spreading plate 22 and the groove bottom wall 111 of the groove 11 to ensure the stability of the second heat-spreading plate 22 and the groove bottom wall 111 and the heat transfer effect.

[0067] After the first heat spreader 21 and the second heat spreader 22 are set as an integrated structure, or after the first heat spreader 21 and the second heat spreader 22 that are independent of each other are bonded and fixed, the heat spreader 2 can be used as an integral structure and assembled with the middle frame 1 as a whole. Specifically, the second thermal conductive adhesive layer 7 can be coated on the bottom wall 111 of the groove 11, and then the heat spreader 2 can be fixed to the middle frame 1 as a whole. During the process of bonding and fixing the first heat spreader 21 to the middle frame 1 through the first back adhesive layer 3, the second heat spreader 22 can squeeze the second thermal conductive adhesive layer 7 until the first heat spreader 21 is fixed to the middle frame 1. The heat spreader 2 is fixed to the middle frame 1 as a whole, and the second heat spreader 22 is stably fixed in the installation cavity. That is to say, in the assembled state, the second heat spreader 22 is bonded to the first heat spreader 21 through the first thermal conductive adhesive layer 6, and at the same time, the second heat spreader 22 is bonded to the bottom wall 111 of the groove through the second thermal conductive adhesive layer 7 to ensure the heat transfer effect.

[0068] Furthermore, due to errors, the distance between the second heat spreader 22 and the groove bottom wall 111 may change before assembly. When a second thermally conductive adhesive layer 7 is provided between the second heat spreader 22 and the groove bottom wall 111, the error can be balanced by the second heat spreader 22 squeezing and deforming the second thermally conductive adhesive layer 7. This can prevent the second heat spreader 22 from lifting up the first heat spreader 21 during assembly, causing the first heat spreader 21 to be unable to be installed. At the same time, it can also prevent the rear side surface of the second heat spreader 22 from being unable to fit with the groove bottom wall 111.

[0069] For example, electronic devices such as mobile phones need to be subjected to a pressure test. During the test, due to the setting of the groove 11, the first heat spreader 21 is subjected to pressure, and the position corresponding to the groove 11 may be deformed and sunken into the groove 11. In order to prevent the first heat spreader 21 from being excessively sunken and deformed and unable to recover, Figure 3 , Figure 5 and Figure 6 As shown, in this embodiment, a first supporting portion 10 is further fixedly provided between the second heat spreader 22 and the groove bottom wall 111. The first supporting portion 10 provides support for the second heat spreader 22, and further provides support for the first heat spreader 21, thereby avoiding the situation in which the first heat spreader 21 is greatly deformed in the groove 11 and cannot be restored due to the crushing of the second thermal conductive adhesive layer 7, thereby improving the product yield.

[0070] The height of the first support portion 10 is smaller than the distance between the second heat spreader 22 and the groove bottom wall 111. In the installed state, the thickness of the second thermal conductive adhesive layer 7 is greater than the thickness of the first support portion 10. The first support portion 10 is arranged continuously or at intervals along the circumference of the second heat spreader 22. Such an arrangement can further ensure the support stability of the first support portion 10.

[0071] like Figure 3 , Figure 5 and Figure 6 As shown, the first support portion 10 is fixed to the bottom wall 111 of the groove, and in the installed state, a gap is left between the first support portion 10 and the second heat spreader 22. Figure 7 and Figure 8 As shown, the first support portion 10 is fixed to the second heat spreader 22 , and in the installed state, a gap is left between the first support portion 10 and the groove bottom wall 111 .

[0072] During the pressure holding test, the first heat spreader 22 is recessed into the groove 11 due to the lack of support at the groove 11, and pushes the second heat spreader 22 to continue to extrude the second thermal conductive adhesive layer 7. The thickness of the second thermal conductive adhesive layer 7 is thinned after being extruded until the two sides of the first support portion 10 are respectively pressed against or fixed to the second heat spreader 22 and the groove bottom wall 111. The first support portion 10 can provide support for the second heat spreader 22, and then provide support for the first heat spreader 21.

[0073] In this embodiment, the specific structure of the first support portion 10 is not limited. The first support portion 10 can be set as a support adhesive layer, and the support adhesive layer is directly bonded to the groove bottom wall 111 (such as Figure 5 as shown) or the second heat plate 22 (as shown Figure 7 As shown), the processing technology can be simplified. Figure 6 As shown, a protrusion is integrally formed on the bottom wall 111 of the groove, and it can also be as follows Figure 8 As shown, a protrusion is integrally formed on the rear surface of the second heat spreader 22 , and the first support portion 10 can be formed by the protrusion.

[0074] And, if Figure 5-Figure 8 As shown, the second thermally conductive adhesive layer 7 is located in the area enclosed by the first support portion 10 , or the second thermally conductive adhesive layer 7 can also completely cover the rear surface of the second heat spreader 22 , or the second thermally conductive adhesive layer 7 can also completely cover the bottom wall 111 of the groove 11 .

[0075] like Figure 9-13As shown, when the first heat spreader 21 and the second heat spreader 22 are independent structures, the second heat spreader 22 can also be fixed to the groove bottom wall 111. During assembly, the second heat spreader 22 is first placed in the groove 11 and bonded and fixed to the groove bottom wall 111, and then the first heat spreader 21 is fixed to the middle frame 1.

[0076] Specifically, the second heat spreader 22 and the groove bottom wall 111 are bonded and fixed by a third adhesive layer 5 , and the third adhesive layer 5 is arranged along the circumference of the second heat spreader 22 to ensure the bonding stability between the second heat spreader 22 and the middle frame 1 .

[0077] Furthermore, a third thermally conductive adhesive layer 8 is provided between the second heat spreader 22 and the groove bottom wall 111, and the third thermally conductive adhesive layer 8 is located in the area enclosed by the third back adhesive layer 5. Specifically, the third back adhesive layer 5 is first circumferentially bonded to the rear side surface of the second heat spreader 22 or the groove bottom wall 111, and then the thermally conductive adhesive is filled in the area enclosed by the third back adhesive layer 5, and then the rear side surface of the second heat spreader 22 and the groove bottom wall 111 are bonded, and the two can be fixed by the third back adhesive layer 5, and the third thermally conductive adhesive layer 8 can be spread flat in the area enclosed by the third back adhesive layer 5, and the thickness of the third thermally conductive adhesive layer 8 and the third back adhesive layer 5 are the same.

[0078] The rear surface of the second heat spreader 22 and the groove bottom wall 111 are bonded and fixed by the third backing adhesive layer 5 and the third thermal conductive adhesive layer 8, which can improve the heat transfer effect while ensuring the fixing stability, thereby improving the heat dissipation performance.

[0079] like Figure 9-13 As shown, a fourth thermal conductive adhesive layer 9 is further provided between the first vapor chamber 21 and the second vapor chamber 22 to ensure the stability of the bonding between the first vapor chamber 21 and the second vapor chamber 22 and the heat transfer effect.

[0080] Before fixing the first heat spreader 21 to the middle frame 1, the second heat spreader 22 has been fixed to the groove bottom wall 111. During the process of assembling the first heat spreader 21 so that it is bonded and fixed to the middle frame 1 through the first back adhesive layer 3, the first heat spreader 21 moves toward the side close to the second heat spreader 22 and squeezes the fourth thermal conductive adhesive layer 9 until the first heat spreader 21 is fixed to the middle frame 1, thereby ensuring that the fourth thermal conductive adhesive layer 9 can be stably fitted between the first heat spreader 21 and the second heat spreader 22 in the assembled state.

[0081] Furthermore, due to errors, the distance between the first heat spreader 21 and the second heat spreader 22 may change before assembly. When the fourth thermally conductive adhesive layer 9 is set between the first heat spreader 21 and the second heat spreader 22, the error can be balanced by squeezing and deforming the fourth thermally conductive adhesive layer 9 by the first heat spreader 21 and the second heat spreader 22. This can prevent the second heat spreader 22 from lifting the first heat spreader 21 during assembly, causing the first heat spreader 21 to be unable to be installed or to hit the display screen 13. At the same time, it can also prevent the first heat spreader 21 and the second heat spreader 22 from being unable to fit together.

[0082] like Figure 10-13 As shown, in this embodiment, a second support portion 12 is further fixedly provided between the first heat spreader 21 and the second heat spreader 22. The second support portion 12 provides support to the first heat spreader 21 to avoid a situation in which the first heat spreader 21 is significantly deformed in the groove 11 and cannot be restored due to the fourth thermal conductive adhesive layer 9 being crushed, thereby improving the product yield.

[0083] The height of the second support portion 12 is smaller than the spacing between the first heat spreader 21 and the second heat spreader 22. In the installed state, the thickness of the fourth thermal conductive adhesive layer 9 is greater than the thickness of the second support portion 12. Specifically, the second support portion 12 is fixed to the first heat spreader 21, or the second support portion 12 is fixed to the second heat spreader 22. The second support portion 12 is arranged continuously or at intervals along the circumference of the second heat spreader 22. Such an arrangement can further ensure the support stability of the first support portion 10.

[0084] like Fig.10 and Fig.11 As shown, the second support portion 12 is fixed to the second heat spreader 22, and in the installed state, a gap is left between the second support portion 12 and the first heat spreader 21. Fig.12 and Fig.13 As shown, the second support portion 12 is fixed to the first heat spreader 21 , and in the installed state, a gap is left between the second support portion 12 and the second heat spreader 22 .

[0085] During the pressure holding test, the first heat spreader 22 is recessed into the groove 11 due to the lack of support at the groove 11, and squeezes the fourth thermal conductive adhesive layer 9. The thickness of the fourth thermal conductive adhesive layer 9 is thinned after being squeezed until the two sides of the second support portion 12 are respectively pressed against or fixed to the first heat spreader 21 and the second heat spreader 22. The second support portion 12 can provide support for the first heat spreader 21.

[0086] In this embodiment, the specific structure of the second support portion 12 is not limited. The second support portion 12 can be set as a support adhesive layer, and the support adhesive layer is directly bonded to the first heat spreader 21 (such as Fig.12as shown) or the second heat plate 22 (as shown Fig.10 As shown), the processing technology can be simplified. Or it can also be as follows Fig.13 As shown, a protrusion is integrally formed on the rear surface of the first heat spreader 21, or as shown in Fig.11 As shown, a protrusion is integrally formed on the front surface of the second heat spreader 22 , and the second support portion 12 can be formed by the protrusion.

[0087] And, if Figure 10-13 As shown, the fourth thermally conductive adhesive layer 9 is located in the area enclosed by the second supporting portion 12 , or the fourth thermally conductive adhesive layer 9 can also completely cover the front surface of the second heat spreader 22 .

[0088] In addition, in this embodiment, the thickness of each adhesive layer (including the first adhesive layer 3, the second adhesive layer 4 and the third adhesive layer) is not limited, such as 0.01mm-0.05mm, which can be set according to actual conditions. The thickness of the supporting adhesive layer can be set according to the actual space.

[0089] Specific examples are used herein to illustrate the principles and implementation methods of the present application, and the description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An electronic device, characterized in that: It comprises a middle frame (1) and a heat-saturating portion (2), wherein the heat-saturating portion (2) comprises a first heat-saturating plate (21) and at least one layer of a second heat-saturating plate (22); The front surface of the middle frame (1) is provided with a groove (11); the first heat spreader (21) is fixed to the front surface of the middle frame (1) and encloses the groove (11) to form a mounting cavity; the second heat spreader (22) is fixed in the mounting cavity.

2. The electronic device according to claim 1, characterized in that: The first heat spreader (21) and the middle frame (1) are bonded and fixed along the circumferential direction via a first adhesive layer (3).

3. The electronic device according to claim 2, characterized in that: The first heat spreader (21) and the middle frame (1) are also fixed by glue dots arranged along the circumferential direction.

4. The electronic device according to claim 1, characterized in that: The first heat spreader (21) and the second heat spreader (22) are an integrated structure.

5. The electronic device according to claim 1, characterized in that: The first heat spreader (21) and the second heat spreader (22) are independent structures.

6. The electronic device according to claim 5, characterized in that: The first heat spreader (21) and the second heat spreader (22) are bonded and fixed via a second adhesive layer (4), and the second adhesive layer (4) is arranged along the circumference of the second heat spreader (22).

7. The electronic device according to claim 6, characterized in that: A first thermally conductive adhesive layer (6) is further provided between the first thermally conductive plate (21) and the second thermally conductive plate (22), and the first thermally conductive adhesive layer (6) is located within the area enclosed by the second back adhesive layer (4).

8. The electronic device according to any one of claims 4 to 7, characterized in that: A second heat-conducting adhesive layer (7) is provided between the second heat-spreading plate (22) and the groove bottom wall (111) of the groove (11).

9. The electronic device according to claim 8, characterized in that: A first support portion (10) is further provided between the second heat spreader (22) and the groove bottom wall (111), and a height of the first support portion (10) is smaller than a distance between the second heat spreader (22) and the groove bottom wall (111).

10. The electronic device according to claim 9, characterized in that: The first supporting portion (10) is a supporting adhesive layer, and the supporting adhesive layer is bonded to the second heat spreader (22) or the groove bottom wall (111).

11. The electronic device according to claim 5, characterized in that: The second heat spreader (22) is bonded and fixed to the groove bottom wall (111) of the groove (11) via a third adhesive layer (5), and the third adhesive layer (5) is arranged along the circumference of the second heat spreader (22).

12. The electronic device according to claim 11, characterized in that: A third thermally conductive adhesive layer (8) is further provided between the second heat spreader (22) and the groove bottom wall (111), and the third thermally conductive adhesive layer (8) is located within the area enclosed by the third back adhesive layer (5).

13. The electronic device according to claim 12, characterized in that: A fourth heat-conducting adhesive layer (9) is also provided between the first heat-vaporizing plate (21) and the second heat-vaporizing plate (22).

14. The electronic device according to claim 13, characterized in that: A second support portion (12) is further provided between the first heat soaking plate (21) and the second heat soaking plate (22), and a height of the second support portion (12) is smaller than a distance between the first heat soaking plate (21) and the second heat soaking plate (22).

15. The electronic device according to claim 14, characterized in that: The second supporting portion (12) is a supporting adhesive layer, and the supporting adhesive layer is bonded to the first heat spreader (21) or the second heat spreader (22).

16. The electronic device according to any one of claims 1 to 7, characterized in that: It also comprises a display screen (13) and a rear shell (14), wherein the display screen (13) is fixedly arranged on a side of the middle frame (1) facing the heat-dissipating portion (2), and the rear shell (14) is fixedly arranged on a side of the middle frame (1) away from the heat-dissipating portion (2), and the display screen (13), the rear shell (14) and the middle frame (1) are enclosed to form a shell.

17. The electronic device according to claim 16, characterized in that: It also comprises a main board (15) fixed in the shell, the main board (15) being fixed to a side of the middle frame (1) away from the heat-dissipating portion (2), and the groove (11) being provided at positions corresponding to the middle frame (1) and the main board (15).

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