Wafer grinding disc in up-and-down smooth fit
By designing the guide and height adjustment device on the crystal grinding disc, the problem of poor coordination between the upper and lower plates of the traditional grinding discs is solved, stable alignment and precise adjustment during the grinding process are achieved, and grinding efficiency and quality are improved.
Patent Information
- Application Number
- CN202420811715.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-18
AI Technical Summary
In the design and manufacturing process of traditional round crystal abrasive discs, the matching accuracy and friction characteristics between the upper and lower disc surfaces are not fully considered, resulting in insufficient contact, large friction resistance, uneven distribution of grinding force, affecting grinding efficiency and quality.
A round crystal grinding disc with smooth cooperation up and down is designed, using a guide device and a height adjustment device to ensure the precise alignment and spacing adjustment of the upper and lower disc surfaces during the grinding process, through the guide sleeve, sliding ring groove, limit rod, Components such as guide rods, springs and height adjustment rotors achieve stable relative position and precise distance adjustment of the upper and lower disk surfaces.
It realizes stable relative position and precise adjustment of the upper and lower disc surfaces during the grinding process, reduces friction and vibration, improves grinding efficiency and quality, and is suitable for the semiconductor industry and other high-precision grinding fields.
Smart Images
Figure CN222243956U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a round crystal grinding disc which can be smoothly matched up and down. Background Art
[0002] Wafer grinding disc is a kind of equipment component specially used for wafer grinding. It plays a key role in the grinding process. Through high-speed rotation and friction, it removes defects, burrs, oxide layers, etc. on the surface of the wafer, making the surface smoother and flatter. It is not only helpful for subsequent processing and coating treatment, but also can improve the surface quality of the wafer to meet the specific roughness requirements. Wafer grinding disc is widely used in the semiconductor industry to remove the uneven layer on the surface of the wafer and make the surface of the wafer flatter. In addition, in the fields of metal processing, ceramic processing, glass processing, etc., wafer grinding disc also has important applications for precision grinding and processing of various materials.
[0003] During the design and manufacturing process of traditional round wafer grinding discs, the matching accuracy and friction characteristics between the upper and lower disc surfaces are often not fully considered. As a result, during the actual grinding process, the contact between the upper and lower disc surfaces is not tight enough, the friction resistance is large, and uneven grinding force distribution is easily generated. For this reason, we propose a round wafer grinding disc with smooth upper and lower matching. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model provides a round wafer grinding disc that can fit smoothly up and down, thereby solving the above-mentioned problems.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a round wafer grinding disc with smooth upper and lower matching, comprising an upper grinding disc and a lower grinding disc, a lower grinding disc is arranged above the upper grinding disc, a connecting shaft is fixedly connected at the center of the upper side of the upper grinding disc, two symmetrically arranged guide sleeves are fixedly connected to the annular outer end of the upper side of the connecting shaft, a lower disc connector is arranged on the bottom surface of the lower grinding disc, an integrated vacuum suction cup is fixedly connected to the upper side of the lower grinding disc, and further comprising:
[0006] A guide device is provided between the upper grinding disc and the lower grinding disc to ensure that the upper and lower disc surfaces maintain a stable relative position;
[0007] The height adjustment device is arranged in the inner cavity of the lower plate connecting piece and is used for adjusting the distance between the upper grinding plate and the lower grinding plate in the device.
[0008] Preferably, the guiding device comprises a sliding ring groove, a limiting rod and a guide rod. The upper surface of the lower grinding disc is provided with a sliding ring groove corresponding to the annular outer ring of the vacuum suction cup. The lower end of the guide sleeve extends to the lower surface of the upper grinding disc and presents an open structure. A guide rod is movably inserted in the guide sleeve. The top of the guide rod is fixedly connected to the limiting rod. The upper end of the limiting rod extends to the top of the guide sleeve and is rotatably connected to the upper surface of the guide sleeve.
[0009] Preferably, the lower end of the guide rod extends into the sliding ring groove and is rotatably connected to a sliding ball, a spring is fixedly connected between the upper surface of the guide rod and the bottom inner wall of the guide sleeve, and the spring is movably sleeved on the side of the guide sleeve.
[0010] Preferably, the height adjustment device includes a mounting splint, a support base, an extrusion block and a height adjustment block, the bottom inner wall of the lower plate connecting piece is fixedly connected to the support base, both sides of the support base are fixedly connected to a mounting splint, a sandwich is formed between the two mounting splints, two extrusion blocks are movably connected at both ends of the sandwich, and a height adjustment block is movably connected to the upper end of the sandwich formed by the two mounting splints.
[0011] Preferably, both ends of the upper surface of the support base are inclined slopes, the two extrusion blocks are symmetrical isosceles trapezoids, the lower side of the extrusion block matches the inclined surface of the upper surface of the support base, and the height adjustment block has the same shape as the support base.
[0012] Preferably, the height adjustment device also includes a height adjustment rod and a limit column, one side of the extrusion block is threadedly connected to the height adjustment rod, one end of the height adjustment rod extends to the other side of the extrusion block and is fixedly connected to the second extrusion block, the upper ends of the two side surfaces of the two mounting clamps are provided with sliding grooves, the lower ends of the side surfaces of the height adjustment block are fixedly connected to the limit column, and both ends of the limit column are movably clamped in the sliding grooves of the mounting clamps on both sides.
[0013] Compared with the prior art, the utility model provides a round wafer grinding disc that can be smoothly matched up and down, and has the following beneficial effects:
[0014] The round wafer grinding disc that smoothly fits up and down is provided with a guide device between the upper grinding disc and the lower grinding disc, ensuring the accurate alignment of the upper and lower disc surfaces during the grinding process, so that the upper and lower disc surfaces can maintain a stable relative position when fitting.
[0015] The wafer grinding disc that smoothly fits up and down adjusts the distance between the upper grinding disc and the lower grinding disc through an adjusting device to meet the grinding requirements of wafers of different specifications, and can achieve precise adjustment of the distance between the upper and lower disc surfaces. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the upper surface structure of the lower grinding disc of the utility model;
[0018] Figure 3 This is a schematic cross-sectional view of the upper grinding disc of the utility model;
[0019] Figure 4 This is a schematic diagram of the height adjustment device of the utility model;
[0020] Figure 5 This is a schematic diagram of the disassembled structure of the height adjustment device of the utility model.
[0021] In the figure: 1. upper grinding disc; 2. lower grinding disc; 3. connecting shaft; 4. guide sleeve; 5. lower disc connecting piece; 6. height adjustment rotary rod; 7. vacuum suction cup; 8. sliding ring groove; 9. limit rod; 10. guide rod; 11. spring; 12. sliding ball; 13. mounting clamp; 14. supporting base; 15. extrusion block; 16. height adjustment block; 17. limit column; 18. guide device; 19. height adjustment device. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] See also Figure 1-5 A round wafer grinding disc with smooth upper and lower matching includes an upper grinding disc 1 and a lower grinding disc 2. The lower grinding disc 2 is arranged above the upper grinding disc 1. A connecting shaft 3 is fixedly connected at the center of the upper side of the upper grinding disc 1. Two symmetrically arranged guide sleeves 4 are fixedly connected to the annular outer end of the upper side of the connecting shaft 3. A lower disc connector 5 is arranged on the bottom surface of the lower grinding disc 2. An integrated vacuum suction cup 7 is fixedly connected to the upper side of the lower grinding disc 2. It also includes:
[0024] A guide device 18, which is arranged between the upper grinding disc 1 and the lower grinding disc 2, and is used to ensure that the upper and lower disc surfaces maintain a stable relative position;
[0025] The height adjustment device 19 is arranged in the inner cavity of the lower plate connecting member 5 and is used to adjust the distance between the upper grinding plate 1 and the lower grinding plate 2 in the device.
[0026] Furthermore, the guide device 18 includes a sliding ring groove 8, a limit rod 9 and a guide rod 10. The upper surface of the lower grinding disc 2 is provided with a sliding ring groove 8 corresponding to the annular outer ring of the vacuum suction cup 7. The lower end of the guide sleeve 4 extends to the lower surface of the upper grinding disc 1 and presents an open structure. The guide sleeve 4 is movably inserted with a guide rod 10. The top of the guide rod 10 is fixedly connected to the limit rod 9. The upper end of the limit rod 9 extends to the top of the guide sleeve 4 and is rotatably connected to the upper surface of the guide sleeve 4.
[0027] Furthermore, the lower end of the guide rod 10 extends into the sliding ring groove 8 and is rotatably connected to a sliding ball 12. A spring 11 is fixedly connected between the upper surface of the guide rod 10 and the bottom inner wall of the guide sleeve 4. The spring 11 is movably sleeved on the side of the guide sleeve 4.
[0028] Furthermore, the height adjustment device 19 includes a mounting splint 13, a support base 14, an extrusion block 15 and a height adjustment block 16. The bottom inner wall of the lower plate connecting member 5 is fixedly connected to the support base 14. Both sides of the support base 14 are fixedly connected to a mounting splint 13. A sandwich is formed between the two mounting splints 13. Two extrusion blocks 15 are movably connected at both ends of the sandwich. A height adjustment block 16 is movably connected to the upper end of the sandwich formed by the two mounting splints 13.
[0029] Furthermore, both ends of the upper surface of the support base 14 are inclined slopes, the two extrusion blocks 15 are symmetrical isosceles trapezoids, the lower side of the extrusion block 15 matches the inclined surface of the upper surface of the support base 14, and the height adjustment block 16 has the same shape as the support base 14.
[0030] Furthermore, the height adjustment device 19 also includes a height adjustment rod 6 and a limit column 17. One side of the extrusion block 15 is threadedly connected to the height adjustment rod 6, one end of the height adjustment rod 6 extends to the other side of the extrusion block 15 and is fixedly connected to the second extrusion block 15, and sliding grooves are provided at the upper ends of the two side mounting clamps 13. The lower end of the side of the height adjustment block 16 is fixedly connected to the limit column 17, and both ends of the limit column 17 are movably clamped in the sliding grooves of the mounting clamps 13 on both sides.
[0031] Working principle: First, the distance between the upper grinding disc 1 and the lower grinding disc 2 is adjusted by the height adjustment device 19 to meet the requirements of grinding round wafers of different specifications. During the adjustment process, the height adjustment rotary rod 6 is rotated to drive the two symmetrically arranged isosceles trapezoidal structure extrusion blocks 15 to move relative to or opposite to each other in the interlayer formed by 13. Since the lower side of the extrusion block 15 matches the inclined surface of the upper surface of the support base 14, when the extrusion block 15 moves, it will move up or down along the inclined surface, thereby pushing or pulling the height adjustment block 16 to rise or fall in the interlayer. The limit column 17 fixedly connected to the lower end of the side of the node block 16 slides in the sliding grooves of the two sides 13 to ensure the stable lifting and lowering of the height adjustment block 16. When the height adjustment is completed, the distance between the upper grinding disc 1 and the lower grinding disc 2 is accurately set. At this time, the grinding equipment is started to make the upper grinding disc 1 and the lower grinding disc 2 start relative movement. During the grinding process, the guide device 18 ensures that the upper and lower disc surfaces maintain a stable relative position. Specifically, the guide rod 10 slides in the guide sleeve 4 and rotates in the sliding ring groove 8 through the sliding ball 12, thereby achieving a smooth fit between the upper and lower disc surfaces. At the same time, the spring 11 provides a certain elastic buffer, so that the upper and lower disc surfaces are more closely fitted when in contact, reducing friction and vibration. During the entire grinding process, due to the smooth fit of the upper and lower disc surfaces and the precise control of the height adjustment device, the grinding efficiency and grinding quality are significantly improved. This grinding disc is not only suitable for wafer grinding in the semiconductor industry, but can also be widely used in other fields that require high-precision grinding.
[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A round wafer grinding disc with smooth fit up and down, comprising an upper grinding disc (1) and a lower grinding disc (2), wherein the lower grinding disc (2) is arranged above the upper grinding disc (1), characterized in that: A connecting shaft (3) is fixedly connected at the center of the upper side of the upper grinding disc (1); two symmetrically arranged guide sleeves (4) are fixedly connected to the annular outer end of the upper side of the connecting shaft (3); a lower disc connecting piece (5) is arranged on the bottom surface of the lower grinding disc (2); an integrated vacuum suction cup (7) is fixedly connected to the upper side of the lower grinding disc (2); and further comprising: A guide device (18) disposed between the upper grinding disc (1) and the lower grinding disc (2) and used to ensure that the upper and lower disc surfaces maintain a stable relative position; A height adjustment device (19) is arranged in the inner cavity of the lower plate connecting member (5) and is used to adjust the distance between the upper grinding plate (1) and the lower grinding plate (2) in the device.
2. The round wafer grinding disc with smooth fit up and down according to claim 1, characterized in that: The guide device (18) comprises a sliding ring groove (8), a limiting rod (9) and a guide rod (10); the upper surface of the lower grinding disc (2) is provided with a sliding ring groove (8) corresponding to the annular outer ring of the vacuum suction cup (7); the lower end of the guide sleeve (4) extends to the lower surface of the upper grinding disc (1) and is in an open structure; the guide rod (10) is movably inserted in the guide sleeve (4); the top of the guide rod (10) is fixedly connected to the limiting rod (9); the upper end of the limiting rod (9) extends to the top of the guide sleeve (4) and is rotatably connected to the upper surface of the guide sleeve (4).
3. The round wafer grinding disc with smooth fit up and down according to claim 2, characterized in that: The lower end of the guide rod (10) extends into the sliding ring groove (8) and is rotatably connected to a sliding ball (12); a spring (11) is fixedly connected between the upper surface of the guide rod (10) and the bottom inner wall of the guide sleeve (4); the spring (11) is movably sleeved on the side surface of the guide sleeve (4).
4. The wafer grinding disc with smooth fit up and down according to claim 1, characterized in that: The height adjustment device (19) comprises a mounting clamp (13), a support base (14), an extrusion block (15) and a height adjustment block (16); the inner wall of the bottom side of the lower plate connecting member (5) is fixedly connected to the support base (14); both sides of the support base (14) are fixedly connected to a mounting clamp (13); a sandwich is formed between the two mounting clamps (13); two extrusion blocks (15) are movably inserted at both ends of the sandwich; and a height adjustment block (16) is movably inserted at the upper end of the sandwich formed by the two mounting clamps (13).
5. The wafer grinding disc with smooth fit up and down according to claim 4, characterized in that: Both ends of the upper surface of the support base (14) are inclined surfaces, the two extrusion blocks (15) are symmetrical isosceles trapezoids, the lower side surfaces of the extrusion blocks (15) match the inclined surfaces of the upper surface of the support base (14), and the height adjustment block (16) has the same shape as the support base (14).
6. The wafer grinding disc with smooth fit up and down according to claim 4, characterized in that: The height adjustment device (19) further comprises a height adjustment rotary rod (6) and a limit column (17); one side of the extrusion block (15) is threadedly connected to the height adjustment rotary rod (6); one end of the height adjustment rotary rod (6) extends to the other side of the extrusion block (15) and is fixedly connected to the second extrusion block (15); the upper ends of the side surfaces of the two mounting clamps (13) are provided with sliding grooves; the lower ends of the side surfaces of the height adjustment block (16) are fixedly connected to the limit column (17); and both ends of the limit column (17) are movably clamped in the sliding grooves of the mounting clamps (13) on both sides.