Finished Mini LED product repairing equipment

Abstract

The utility model relates to finished Mini LED product repairing equipment which comprises a support. A linear motion module is fixedly arranged on the support. The repair platform is used for placing a to-be-repaired product and comprises a repair table, and an X-axis linear module and a Y-axis linear module which are arranged below the repair table and are used for driving the repair table to move in the X-axis direction and the Y-axis direction respectively; the positioning module comprises a height measuring module used for measuring the height of glue on the bad point positions and a bad point identification module used for identifying the bad point positions; the glue removing module is used for removing glue on the bad point positions; the bonding pad cleaning module is used for removing bad chips on the bonding pad and cleaning the bonding pad after the bad chips are removed; the tin dispensing module is used for supplementing tin to the cleaned points on the bonding pad; the chip taking and mounting module is used for mounting a chip on the defective point after tin dispensing is completed; and the welding module is used for welding after chips are mounted on the bad point positions. According to the utility model, the Mini LED product which is manufactured into a finished product can be repaired through the repair equipment, so that the yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of repair of MiniLED lamp beads and MiniIC, and in particular to a MiniLED product finished product repair equipment. Background Art

[0002] In the current electronic manufacturing industry, Mini LED products are highly favored due to their high efficiency and high brightness. However, during the production process, after the product has gone through multiple steps such as high temperature treatment in the reflow oven, film pressing and packaging, and glue pressing and curing, the finished product may have flashing points or other undesirable conditions. This is mainly due to the test of high temperature and high pressure environment on product performance, as well as the low yield rate caused by complex process procedures.

[0003] Traditional rework methods mainly rely on manual operation, which is not only inefficient but also labor-intensive. Secondly, since the product is fully packaged after multiple process stages and the solder paste is solidified, rework becomes more difficult and the product may be scrapped if you are not careful. In addition, the consistency of products after manual rework is low. Even if the rework is successful, the effect may lead to a decline in product quality and a high defect rate due to differences in manual operation.

[0004] Therefore, there is an urgent need to provide a Mini LED product finished product repair equipment to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to overcome the shortcomings and defects of the prior art and provide a Mini LED product finished product repair equipment, which can repair Mini LED products that have been manufactured into finished products and improve the yield rate.

[0006] The purpose of this utility model is achieved through the following technical solutions:

[0007] A Mini LED product finished product repair equipment is used to repair the Mini LED product that has been manufactured into a finished product, including:

[0008] A bracket, on which a linear motion module is fixed;

[0009] A rework platform is provided at the front side of the support and is used to place the product to be reworked. The rework platform includes a rework table and an X-axis linear module and a Y-axis linear module provided below the rework table and used to drive the rework table to move along the X-axis direction and the Y-axis direction respectively;

[0010] A positioning module is provided on the linear motion module, and the positioning module includes a height measuring module for measuring the height of glue on the bad point and a bad point identification module for identifying the bad point;

[0011] The glue removal module is located on one side of the rework platform and is used to remove glue from defective spots;

[0012] The pad cleaning module is arranged on the linear motion module and is used to remove bad chips on the pad and clean the pad after removal;

[0013] The tinning module is installed on the linear motion module and is used to add tin to the points on the pad that have been cleaned;

[0014] The chip picking and mounting module includes a chip picking module and a chip mounting module which are arranged on one side of the bracket and are used to pick and mount chips on defective spots after tinning.

[0015] The welding module is arranged on the linear motion module and is used for welding after mounting the chip on the bad point.

[0016] As a preferred technical solution of the utility model, the linear motion module includes a first linear motion module and a second linear motion module, the first linear motion module is provided with a first fixed plate, the second linear motion module is provided with a second fixed plate, the positioning module and the welding module are both fixed on the first fixed plate, and the pad cleaning module and the tinning module are both fixed on the second fixed plate.

[0017] As a preferred technical solution of the utility model, the bad point identification module includes a Mark point positioning component located on the rework table, a bad point identification camera arranged on the first fixed plate, and a Z-axis lifting module that drives the bad point identification camera and the welding module to move along the Z-axis direction. The height measurement module includes a measuring part and a measuring lifting module that drives the measuring part to move along the Z-axis direction.

[0018] As a preferred technical solution of the utility model, the degumming module includes a degumming head and a degumming head lifting module for driving the degumming head to move closer to or away from the rework station along the Z-axis direction;

[0019] A blowing assembly is also provided on one side of the degumming module for removing residues on the reworked product after degumming.

[0020] As a preferred technical solution of the utility model, the pad cleaning module includes a removal head and a removal head lifting module for driving the removal head to rise and fall, and the tinning module includes a tinning head and a tinning lifting module for driving the tinning head to rise and fall.

[0021] As a preferred technical solution of the utility model, the chip picking module includes a picking component arranged on the second linear motion module, a chip recognition camera fixedly mounted on the bracket, a wafer platform discharge device located directly below the chip recognition camera, and a ejector module located below the wafer platform discharge device. A wafer platform rotating motor, a wafer platform X-axis linear module, and a wafer platform Y-axis linear module are also arranged below the wafer platform discharge device. The wafer platform X-axis linear module is arranged on the wafer platform Y-axis linear module, and a plurality of discharge troughs are arranged on the wafer platform discharge device.

[0022] As a preferred technical solution of the utility model, the ejector module includes an ejector and an ejector lifting module for driving the ejector to push up or down.

[0023] As a preferred technical solution of the utility model, the chip mounting module includes a mounting component arranged on the second linear motion module, a chip detection camera fixedly mounted on a bracket, a turntable located directly below the chip detection camera, and a chip angle correction camera located on one side of the turntable. A turntable rotating motor, a slide and a turntable XY adjustment component are arranged below the turntable. The slide is arranged below the turntable rotating motor and fixedly connected to the turntable rotating motor. The turntable XY adjustment component is connected to the slide.

[0024] As a preferred technical solution of the present utility model, the welding module includes a welding head, the welding head is fixed on a first fixed plate, and the Z-axis lifting module is used to drive the welding head to perform lifting movement.

[0025] Compared with the prior art, the utility model has the following beneficial effects:

[0026] The utility model carries the product to be repaired on a repair platform and runs it to the positioning module, the glue removal module, the pad cleaning module, the tinning module, the chip picking and mounting module, and the welding module to perform repair operations such as defective point identification, glue removal, pad cleaning, tinning, chip mounting, and welding on the Mini LED products that have been manufactured into finished products. The entire process is completed automatically without human intervention, thereby ensuring the consistency and stability of the products, while reducing production costs and improving production efficiency and yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of a Mini LED product finished product repair equipment proposed in the utility model.

[0028] Figure 2 This is a top view of a Mini LED product finished product rework device proposed in the utility model.

[0029] Figure 3 This is a structural schematic diagram of a glue removal module for a Mini LED product finished product repair device proposed in the utility model.

[0030] Figure 4 for Figure 3 A magnified view of the structure at center.

[0031] Figure 5 for Figure 3 A magnified view of the structure at point B.

[0032] Figure 6 This is a structural side view of a glue removal module of a Mini LED product finished product rework equipment proposed in the utility model.

[0033] Figure 7 for Figure 6 Enlarged view of the structure at C in the middle.

[0034] Figure 8 for Figure 6 Enlarged view of the structure at D in the middle.

[0035] Fig. 9 This is a partial front view structural diagram of a Mini LED product finished product repair equipment proposed in the utility model.

[0036] Fig.10 for Fig. 9 Enlarged view of the structure at E in the middle.

[0037] The above drawings include the following reference numerals:

[0038] 100, bracket, 101, first linear motion module, 102, second linear motion module, 103, first fixed plate, 104, second fixed plate, 1, rework platform, 11, rework table, 12, X-axis linear module, 13, Y-axis linear module, 2, positioning module, 21, Mark point positioning component, 22, bad point recognition camera, 23, Z-axis lifting module, 24, measuring part, 25, measuring lifting module, 3, glue removal module, 31, glue removal head, 32, glue removal head lifting module, 33, blowing component, 4, pad cleaning module, 41, removal head, 42, removal head lifting module, 5, tinning module, 51, tinning head, 52, tinning lifting module, 6, core Chip picking and mounting module, 61. Chip picking module, 611. Chip identification camera, 612. Wafer platform discharge device, 613. Wafer platform rotating motor, 614. Wafer platform X-axis linear module, 615. Wafer platform Y-axis linear module, 616. Discharge trough, 62. Chip mounting module, 621. Chip detection camera, 622. Turntable, 623. Turntable rotating motor, 624. Slide, 625. Turntable XY adjustment component, 626. Chip angle correction camera, 63. Picking component, 64. Mounting component, 7. Welding module, 71. Welding head, 8. Ejector module, 81. Ejector component, 82. Ejector lifting module. DETAILED DESCRIPTION

[0039] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0040] The specific implementation process of the utility model is as follows:

[0041] Reference Figures 1 to 10 , a Mini LED product finished product repair equipment, used for repairing the Mini LED product that has been manufactured into a finished product, including:

[0042] A bracket 100, on which a linear motion module is fixed;

[0043] The rework platform 1 is arranged at the front side of the bracket 100 and is used to place the product to be reworked. The rework platform 1 includes a rework table 11 and an X-axis linear module 12 and a Y-axis linear module 13 arranged below the rework table 11 and used to drive the rework table 11 to move along the X-axis direction and the Y-axis direction respectively. The X-axis linear module 12 is arranged on the Y-axis linear module 13;

[0044] The positioning module 2 is arranged on the linear motion module, and the positioning module 2 includes a height measuring module for measuring the height of the glue on the bad point and a bad point identification module for identifying the bad point;

[0045] The glue removal module 3 is located on one side of the rework platform 1 and is used to remove glue on defective spots;

[0046] The pad cleaning module 4 is arranged on the linear motion module and is used to remove bad chips on the pad and clean the pad after removal;

[0047] The tinning module 5 is arranged on the linear motion module and is used to add tin to the points on the pad that have been cleaned;

[0048] The chip picking and mounting module 6 includes a chip picking module 61 and a chip mounting module 62 which are arranged on one side of the bracket 100 and are used to pick and mount chips on defective spots after tinning.

[0049] The welding module 7 is arranged on the linear motion module and is used for welding after mounting the chip on the bad point.

[0050] Specifically, the product to be repaired can be placed on the rework table 11 by a loading device or manually, and the Y-axis linear module 13 moves the rework table 11 to the bottom of the height measuring module to measure the glue height on the defective point. After measurement, the X-axis linear module 12 moves the rework platform 1 to the defective point identification module to identify the defective points of the product to be repaired. After identification, the Y-axis linear module 13 moves the rework table 11 to the bottom of the glue removal module 3 to remove the glue on the defective points. After the glue is removed, the Y-axis linear module 13 moves the rework table 11 to the bottom of the positioning module 2 to confirm whether the glue is completely removed. After confirming that it is completely removed, the pad cleaning module 4 moves along the linear motion module to the top of the rework platform 1 to remove the defective chips or other foreign matter on the pad. The tinning module 5 adds tin to the points on the pad that have been cleaned. At the same time, the chip picking module 61 clamps the chip and identifies the chip, and then places it on the chip mounting module 62. The chip mounting module 62 confirms that the chip is OK / NG and adjusts the angle. After the tinning of the reworked product on the rework platform 1 is completed, the chip mounting module 62 mounts the qualified chip on the defective point of the reworked product. After the mounting is completed, the rework platform 1 moves to the bottom of the welding module 7, and laser welding is performed on the defective point after the chip is mounted. Finally, the Y-axis linear module 13 drives the rework table 11 back to the original starting position to unload the material.

[0051] In an embodiment of the utility model, the linear motion module includes a first linear motion module 101 and a second linear motion module 102, wherein the first linear motion module 101 is provided with a first fixing plate 103, and the second linear motion module 102 is provided with a second fixing plate 104. The positioning module 2 and the welding module 7 are both fixed on the first fixing plate 103 and can perform linear motion along the second linear motion module 102. The pad cleaning module 4 and the tinning module 5 are both fixed on the second fixing plate 104 and can perform linear motion along the second linear motion module 102 to move to above the rework station 11.

[0052] In the embodiments of the present invention, Figure 3 to Figure 4 As shown, the bad point identification module includes a Mark point positioning component 21 located on the rework station 11, a bad point identification camera 22 set on the first fixed plate 103, and a Z-axis lifting module 23 that drives the bad point identification camera 22 and the welding module 7 to move along the Z-axis direction. The height measurement module includes a measuring part 24 and a measuring lifting module 25 that drives the measuring part 24 to move along the Z-axis direction. Specifically, the product to be reworked is placed on the rework station 11, and is moved to the bottom of the positioning module 2 through the Y-axis linear module 13. The measuring lifting module 25 drives the measuring part 24 to move along the Z-axis direction so that the measuring part 24 is close to the product to be reworked. The glue height on the bad point of the product to be reworked is accurately measured to avoid the warping of the reworked product due to passing through the reflow furnace and ensure the rework quality of the reworked product. The obtained glue height information is then provided to the glue removal module 3, the pad cleaning module 4, the chip material placement module 6, and the tinning module 5 for subsequent height adjustment. After measurement, the product to be repaired is positioned by the Mark point positioning component 21, and the Z-axis lifting module 23 drives the bad point recognition camera 22 to move along the Z-axis direction to make the bad point recognition camera 22 approach or move away from the rework table 11 to take pictures of the product to be repaired. The Mark point positioning component 21 combines with the bad point recognition camera 22 to obtain the precise position of the bad point on the product to be repaired.

[0053] In the embodiments of the present invention, Figure 7As shown, the degumming module 3 includes a degumming head 31 and a degumming head lifting module 32 for driving the degumming head 31 to move closer to or away from the rework station 11 along the Z-axis direction, so as to accurately locate and remove the glue on the defective points. The degumming module 3 removes the glue on the defective points by laser degumming, and other removal methods can also be used according to the characteristics of the product or process requirements. The degumming module 3 combines the glue height information obtained in the previous process, and adds the data after height measurement to the preset height to ensure that each degumming is within the same focal length. A blowing component 33 is also provided on one side of the degumming module 3 to remove the residue on the reworked product after degumming. Specifically, during the degumming process or after degumming, glue scraps or other residues will be attached to the reworked product. The residues are blown away by blowing the blowing component 33 to prevent the residues from remaining or accumulating on the reworked product and affecting the subsequent rework process and rework quality.

[0054] In the embodiments of the present invention, Figure 5 As shown, the pad cleaning module 4 includes a rejection head 41 and a rejection head lifting module 42 for driving the rejection head 41 to rise and fall. The rejection head 41 is used to remove defective chips on the product to be repaired. According to the actual situation of the product, various process methods such as scraping, rejection, and shoveling can be used to remove them. If there is solder paste, flux and other foreign matter remaining on the pad, they are also removed in this module. The tinning module 5 includes a tinning head 51 and a tinning lifting module 52 for driving the tinning head 51 to rise and fall. After the pad is cleaned, the tinning lifting module 52 drives the tinning head 51 to add tin to the defective points.

[0055] In the embodiments of the present invention, Figures 8 to 10As shown, the chip picking module 61 includes a picking assembly 63 arranged on the second linear motion module 102, a chip recognition camera 611 fixed on the bracket 100, a wafer platform discharge device 612 located directly below the chip recognition camera 611, and an ejector module 8 located below the wafer platform discharge device 612. A wafer platform rotating motor 613, a wafer platform X-axis linear module 614, and a wafer platform Y-axis linear module 615 are also arranged below the wafer platform discharge device 612. The wafer platform X-axis linear module 614 is arranged on the wafer platform Y-axis linear module 615. The wafer platform rotating motor 613 is used to drive the wafer platform discharge device 612 to rotate, the wafer platform X-axis linear module 614 is used to drive the wafer platform discharge device 612 to move along the X-axis direction, and the wafer platform Y-axis linear module 615 is used to drive the wafer platform discharge device 612 to move along the Y-axis direction. The wafer platform discharge device 612 is provided with a plurality of discharge slots 613 for placing the chip to be identified. The ejector module 8 includes an ejector assembly 81 and an ejector lifting module 82 for driving the ejector assembly 81 to lift or lower. Specifically, the material picking assembly 63 is a material picking nozzle, and the material picking assembly 63 sucks the chip and places it on the wafer platform discharge device 612. The wafer platform discharge device 612 is used to place different types of MiniLED lamp bead chips. The wafer platform rotating motor 613 drives the wafer platform discharge device 612 to rotate so that different discharge slots 613 are located below the chip identification camera 611. The chip is identified by the chip identification camera 611 to confirm the position and direction of the chip; then the ejector assembly 81 is lifted by the ejector lifting module 82, thereby lifting the chip from the wafer platform discharge device 612, and the chip is sucked by the material picking assembly 63, and the chip is sucked and placed on the chip mounting module 62.

[0056] In the embodiment of the utility model, the chip mounting module 62 includes a mounting assembly 64 arranged on the second linear motion module 102, a chip detection camera 621 fixed on the bracket 100, a transfer table 622 located directly below the chip detection camera 621, and a chip angle correction camera 626 located on one side of the transfer table 622. A transfer table rotating motor 623, a slide 624, and a transfer table XY adjustment assembly 625 are also provided below the transfer table 622. The slide 624 is arranged below the transfer table rotating motor 623 and is fixedly connected to the transfer table rotating motor 623. The transfer table XY adjustment assembly 625 is connected to the slide 624. Specifically, the mounting assembly 64 is a mounting nozzle, which can perform linear motion along the second linear motion module 102 and mount the chip after angle correction on the bad point. The turntable rotating motor 623 is used to drive the turntable 622 to rotate, and the turntable XY adjustment component 625 is used to slightly adjust the direction of movement of the slide 624 along the X-axis and Y-axis, thereby adjusting the movement distance of the turntable 622 along the X-axis and Y-axis. First, the chip detection camera 621 first detects the chip placed on the turntable 622 to determine whether the chip is qualified (OK / NG). If it is an unqualified chip, the material picking component 63 clamps it and places it in the waste frame; if it is a qualified chip, the chip angle correction camera 626 identifies the chip electrode and corrects the chip angle, and then provides the angle correction data to the turntable rotating motor 623 and the turntable XY adjustment component 625 to rotate and adjust to the correct angle, ensuring that the chip can be accurately mounted on the bad point. The chip material picking and mounting module 6 can be operated simultaneously with the pad cleaning module 4 and the tinning module 5 to improve the rework efficiency.

[0057] In an embodiment of the utility model, the welding module 7 includes a welding head 71, and the welding head 71 is fixed on the first fixed plate 103. The Z-axis lifting module 23 is used to drive the welding head 71 to perform lifting movement, so that the welding head 71 is close to or away from the bad point, and laser welding is performed on the bad point after the chip is mounted. After welding, the rework platform 1 moves to the bottom of the bad point recognition camera 22 to confirm whether the rework is successful. Then move to the bottom of the glue removal module, take pictures, and confirm whether glue needs to be added. Loading and unloading platforms can be set on both sides of the rework platform 1 to facilitate the unloading of successfully reworked products through the unloading platform.

[0058] The Mini LED product finished product rework equipment of the present utility model can rework Mini LED products that have been manufactured into finished products. During the process of film packaging after the Mini LED product has passed through the reflow furnace, due to the influence of high temperature and high pressure, vanishing points or other undesirable conditions may appear in the finished product. In addition, even if the inspection after passing through the reflow furnace is normal, undesirable conditions may still occur during the subsequent film pasting or film packaging protection process. For defective products that appear after these process stages, the rework equipment proposed by the utility model can be used for rework, which can effectively improve the yield rate of the entire product line.

[0059] The above-mentioned embodiments only express the implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A Mini LED product finished product repair equipment, used to repair the Mini LED product that has been manufactured into a finished product, characterized in that: include: A bracket, on which a linear motion module is fixed; A rework platform is provided at the front side of the support and is used to place the product to be reworked. The rework platform includes a rework table and an X-axis linear module and a Y-axis linear module provided below the rework table and used to drive the rework table to move along the X-axis direction and the Y-axis direction respectively; A positioning module is provided on the linear motion module, and the positioning module includes a height measuring module for measuring the height of glue on the bad point and a bad point identification module for identifying the bad point; The glue removal module is located on one side of the rework platform and is used to remove glue from defective spots; The pad cleaning module is arranged on the linear motion module and is used to remove bad chips on the pad and clean the pad after removal; The tinning module is installed on the linear motion module and is used to add tin to the points on the pad that have been cleaned; The chip picking and mounting module includes a chip picking module and a chip mounting module which are arranged on one side of the bracket and are used to pick and mount chips on defective spots after tinning. The welding module is arranged on the linear motion module and is used for welding after mounting the chip on the bad point.

2. The Mini LED product finished product repair equipment according to claim 1, characterized in that: The linear motion module includes a first linear motion module and a second linear motion module. The first linear motion module is provided with a first fixed plate, and the second linear motion module is provided with a second fixed plate. The positioning module and the welding module are both fixed on the first fixed plate, and the pad cleaning module and the tinning module are both fixed on the second fixed plate.

3. The Mini LED product finished product repair equipment according to claim 2, characterized in that: The bad point identification module includes a Mark point positioning component located on the rework table, a bad point identification camera arranged on the first fixed plate, and a Z-axis lifting module that drives the bad point identification camera and the welding module to move along the Z-axis direction. The height measurement module includes a measuring part and a measuring lifting module that drives the measuring part to move along the Z-axis direction.

4. The Mini LED product finished product repair equipment according to claim 3, characterized in that: The degumming module includes a degumming head and a degumming head lifting module for driving the degumming head to move along the Z-axis direction toward or away from the rework station; A blowing assembly is also provided on one side of the degumming module for removing residues on the reworked product after degumming.

5. The Mini LED product finished product repair equipment according to claim 4, characterized in that: The pad cleaning module includes a removal head and a removal head lifting module for driving the removal head to rise and fall, and the tinning module includes a tinning head and a tinning lifting module for driving the tinning head to rise and fall.

6. The Mini LED product finished product repair equipment according to claim 5, characterized in that: The chip picking module includes a picking component arranged on the second linear motion module, a chip recognition camera fixed on the bracket, a wafer platform discharge device located directly below the chip recognition camera, and a ejector module located below the wafer platform discharge device. A wafer platform rotating motor, a wafer platform X-axis linear module, and a wafer platform Y-axis linear module are also arranged below the wafer platform discharge device. The wafer platform X-axis linear module is arranged on the wafer platform Y-axis linear module, and a plurality of discharge troughs are arranged on the wafer platform discharge device.

7. The Mini LED product finished product repair equipment according to claim 6, characterized in that: The ejector module includes an ejector and an ejector lifting module for driving the ejector to be lifted up or downward.

8. The Mini LED product finished product repair equipment according to claim 7, characterized in that: The chip mounting module includes a mounting component arranged on the second linear motion module, a chip detection camera fixed on the bracket, a turntable located directly below the chip detection camera, and a chip angle correction camera located on one side of the turntable. A turntable rotating motor, a slide and a turntable XY adjustment component are arranged below the turntable. The slide is arranged below the turntable rotating motor and fixedly connected to the turntable rotating motor. The turntable XY adjustment component is connected to the slide.

9. The Mini LED product finished product repair equipment according to claim 8, characterized in that: The welding module includes a welding head, which is fixed on a first fixed plate, and the Z-axis lifting module is used to drive the welding head to perform lifting movement.

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