Glue-overflow-preventing LED plane support with formed base

Abstract

The utility model belongs to a glue-overflow-preventing LED plane support with a formed base. An anti-glue-overflow LED plane support with a base formed into a table comprises a base body, a table frame is arranged below the base body, glue injection packaging holes communicated with the top face of the table frame are formed in the base body, a circuit arrangement area is defined by the bottoms of the glue injection packaging holes in the top face of the table frame, and the small-size glue injection packaging holes can reduce the contact area of packaging glue, a base hardware sheet and PPA. The humidity sensitivity grade of a product is improved, meanwhile, the abnormal proportion of poor glue face consistency caused by the fact that surface glue overflows to the edge of a cup opening is reduced, the glue face consistency is improved, meanwhile, glue consumption is reduced by 60%, and therefore the product cost is reduced. The base wall thickness is increased, the uneven proportion of the hardware bonding pad base is reduced, the bonding wire quality is improved, and the service life of a ceramic nozzle is prolonged.

Description

[Technical field]

[0002] The utility model relates to the technical field of lighting brackets, in particular to a base-formed, glue-overflow-proof LED plane bracket. [Background technology]

[0004] In traditional flat LED brackets, the length of one side of the base usually accounts for more than 80% of the single-side length of the entire product. This structural design results in a large contact area between the metal sheet, PPA material and the encapsulation glue on the bracket base, and a relatively large amount of encapsulation glue is used; the expansion coefficients of the metal sheet and the encapsulation glue are quite different, and the product moisture sensitivity level is poor; after the structure is exposed to the air for a certain period of time, it is more likely to cause abnormal delamination of the colloid and the bracket. The path for external water vapor to penetrate into the metal sheet and chip in the base is shorter, and the water vapor will produce electrolysis when powered on, causing metal migration, which will reduce the service life of the lamp beads. [Contents of the utility model]

[0006] In order to solve the above problems, the utility model proposes a base-mounted anti-overflow glue LED flat bracket, which can reduce the contact area between the packaging glue and the base hardware sheet and PPA, and improve the moisture sensitivity level of the product.

[0007] The utility model is realized by the following technical solutions:

[0008] A base-mounted anti-glue overflow LED flat bracket comprises a base body, a support frame for carrying is arranged below the base body, and a glue injection packaging hole communicating with the top surface of the support frame is arranged on the base body.

[0009] As described above, the base is a flat LED bracket with anti-glue overflow, and the upper part of the base body is provided with a step hole to prevent glue overflow.

[0010] As described above, the base is a platform for preventing glue overflow of the LED flat bracket, and the step hole and the glue injection packaging hole are respectively provided with a first inclined hole wall and a second inclined hole wall to prevent glue overflow.

[0011] As described above, in the base-mounted anti-overflow glue LED flat bracket, a first plane is connected between the upper end of the first inclined hole wall and the periphery of the base body; a second plane is connected between the upper end of the second inclined hole wall and the lower end of the first inclined hole wall.

[0012] As described above, the base is a glue overflow-proof LED flat bracket, wherein the first inclined hole wall surrounds the step hole, and the second inclined hole wall surrounds the glue injection packaging hole.

[0013] As described above, the base is a flat LED bracket that prevents glue from overflowing, wherein the first plane surrounds the step hole; and the second plane surrounds the glue injection and packaging hole.

[0014] As described above, the base is a flat LED bracket with anti-overflow glue, and the thickness of the upper part of the base body is smaller than the thickness of the lower part.

[0015] As described above, a base is an anti-overflow glue LED flat bracket, the base body includes a circuit layout area, and the circuit layout area is provided with a discontinuous band dividing the circuit layout area, and the circuit layout area is divided into a first circuit layout area, a second circuit layout area, a third circuit layout area, and a fourth circuit layout area.

[0016] In the above-mentioned base-forming anti-overflow glue LED flat bracket, the circuit layout area is provided with electronic components connected to the circuit; the circuit layout area is provided with chips connected to the circuit.

[0017] As described above, the base is a glue overflow-proof LED flat bracket, and the base body is fixedly connected to the bracket.

[0018] Compared with the prior art, the utility model has the following advantages:

[0019] The utility model proposes a base-mounted anti-overflow glue LED flat bracket. The base size of the utility model is reduced from more than 80% of the original single-side size to less than 60% of the single side, reducing the contact area between the packaging glue and the base hardware sheet and PPA, and improving the moisture sensitivity level of the product; increasing the base wall thickness, extending the water vapor intrusion path, and further improving product reliability; and after increasing the base wall thickness, reducing the unevenness ratio of the hardware pad base, improving the welding line quality and porcelain nozzle life. The base adopts a double-step design, and the upper wall thickness of the base is thinned to form a double-step design, thereby reducing the abnormal proportion of poor glue surface consistency caused by surface glue overflowing to the edge of the cup mouth, and improving the consistency of the glue surface.

Brief Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the drawings required for describing the embodiments are briefly introduced below.

[0022] Figure 1 It is a schematic diagram of the top view structure of the utility model;

[0023] Figure 2 It is a cross-sectional structural schematic diagram of the utility model;

[0024] Figure 3 The utility model is a cross-sectional structural schematic diagram of an electronic component. [Specific implementation method]

[0026] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0027] Specific embodiments, such as Figures 1 to 3 The base is a flat LED bracket with anti-overflow glue, including a base body 1, a support frame 3 is arranged below the base body 1, and a glue injection packaging hole 2 communicating with the top surface of the support frame 3 is arranged on the base body 1, and the glue injection packaging hole 2 occupies less than 60% of the single side size.

[0028] Furthermore, as a preferred implementation manner of the present solution but not a limitation, a stepped hole 4 is provided on the upper portion of the base body 1 to prevent glue from overflowing.

[0029] In this implementation case, the size of the glue injection packaging hole is reduced from more than 80% of the single side size to less than 60% of the single side, reducing the contact area between the packaging glue and the base hardware and PPA, and improving the moisture sensitivity level of the product. The step hole reduces the abnormal proportion of poor glue surface consistency caused by surface glue overflowing to the edge of the cup mouth, thereby improving the consistency of the glue surface.

[0030] Further, as a preferred implementation mode of the present solution but not a limitation, the step hole 4 and the glue injection packaging hole 2 are respectively provided with a first inclined hole wall 41 and a second inclined hole wall 42 for preventing glue from overflowing.

[0031] In this implementation case, the inclined hole wall reduces the abnormal proportion of poor glue surface consistency caused by the surface glue overflowing to the edge of the cup mouth, thereby improving the consistency of the glue surface.

[0032] Furthermore, as a preferred embodiment of the present solution but not a limitation, a first plane 51 is connected between the upper end of the first inclined hole wall 41 and the periphery of the base body 1 ; a second plane 52 is connected between the upper end of the second inclined hole wall 42 and the lower end of the first inclined hole wall 41 .

[0033] In this implementation case, the inclined hole wall and the connecting plane reduce the abnormal proportion of poor glue surface consistency caused by surface glue overflowing to the edge of the cup mouth, thereby improving the consistency of the glue surface.

[0034] Further, as a preferred implementation manner of the present solution but not a limitation, the first inclined hole wall 41 surrounds the step hole 4 for one circle, and the second inclined hole wall 42 surrounds the glue injection packaging hole 2 for one circle.

[0035] In this embodiment, the inclined hole wall is arranged around to improve the consistency of the glue surface in all directions. Further, as a preferred embodiment of this scheme but not a limitation, the first plane 51 surrounds the step hole 4 for one circle; the second plane 52 surrounds the glue injection packaging hole 2 for one circle.

[0036] In this implementation case, the plane surround setting improves the consistency of the rubber surface in all directions.

[0037] Furthermore, as a preferred implementation of the present solution but not a limitation, the thickness of the upper portion of the base body 1 is smaller than the thickness of the lower portion.

[0038] In this implementation case, the thickness of the lower part of the base body is thickened to extend the water vapor intrusion path and improve the moisture sensitivity level.

[0039] Furthermore, as a preferred embodiment of the present invention but not a limitation, the base body 1 includes a circuit layout area 10, and the circuit layout area 10 is provided with an intermittent band 11 for dividing the circuit layout area 10, and the circuit layout area 10 is divided into a first circuit layout area 101, a second circuit layout area 102, a third circuit layout area 103, and a fourth circuit layout area 104.

[0040] In this implementation case, the discontinuity zone reasonably divides the circuit layout area.

[0041] Furthermore, as a preferred implementation of the present solution but not limiting, the circuit arrangement area 10 is provided with electronic components 12 connected to the circuit.

[0042] In this embodiment, the electronic components are used to connect the circuits.

[0043] Furthermore, as a preferred implementation manner of the present solution but not a limitation, the base body 1 is fixedly connected to the stand 3 .

[0044] In this implementation case, the base body is fixedly connected to the stand to improve the integrity of the device.

[0045] This implementation case works as follows:

[0046] The utility model provides a base-mounted anti-overflow glue LED flat bracket, wherein electronic components are welded on a table surface whose glue injection packaging hole is communicated with a stand, and when a manufacturer injects glue into the glue injection packaging hole, when the glue injection packaging hole is filled with glue and overflows outward, the second plane can prevent the overflowed glue from flowing out, and when the glue on the second plane continues to flow outward, the first inclined hole wall can prevent the glue from overflowing out, and when the glue overflows the first inclined hole wall, the first plane can continue to prevent the glue from flowing out.

[0047] The above is an implementation method provided in combination with specific content, and it is not considered that the specific implementation of the utility model is limited to these descriptions. At the same time, due to different industry names, it is not limited to the above names, nor is it limited to English names. Any method, structure, etc. similar to or identical to the method, structure, etc. of the utility model, or a number of technical deductions or replacements made on the premise of the concept of the utility model, shall be regarded as the protection scope of the utility model.

Claims

1. A base-mounted anti-overflow LED flat bracket, characterized in that: It comprises a base body (1), a support frame (3) for carrying is arranged below the base body (1), and a glue injection packaging hole (2) which is in communication with the top surface of the support frame (3) is arranged on the base body (1); The glue injection packaging hole (2) occupies less than 60% of the single side size; The upper part of the base body (1) is provided with a step hole (4) for preventing glue from overflowing.

2. The base-forming anti-overflow LED flat bracket according to claim 1, characterized in that: The step hole (4) is provided with a first inclined hole wall (41) for preventing glue from overflowing, and the glue injection and packaging hole (2) is provided with a second inclined hole wall (42) for preventing glue from overflowing.

3. The base-forming anti-overflow glue LED flat bracket according to claim 2, characterized in that: A first plane (51) is connected between the upper end of the first inclined hole wall (41) and the periphery of the base body (1); and a second plane (52) is connected between the upper end of the second inclined hole wall (42) and the lower end of the first inclined hole wall (41).

4. The base-forming anti-overflow LED flat bracket according to claim 2, characterized in that: The first inclined hole wall (41) surrounds the step hole (4) for one circle, and the second inclined hole wall (42) surrounds the glue injection packaging hole (2) for one circle.

5. The base-forming anti-overflow LED flat bracket according to claim 3, characterized in that: The first plane (51) surrounds the step hole (4); and the second plane (52) surrounds the glue injection packaging hole (2).

6. The base-forming anti-overflow LED flat bracket according to claim 1, characterized in that: The thickness of the upper portion of the base body (1) is smaller than the thickness of the lower portion.

7. The base-forming anti-overflow LED flat bracket according to claim 1, characterized in that: The base body (1) comprises a circuit layout area (10), on which a discontinuous band (11) for dividing the circuit layout area (10) is arranged, and the circuit layout area (10) is divided into a first circuit layout area (101), a second circuit layout area (102), a third circuit layout area (103), and a fourth circuit layout area (104).

8. The base-forming anti-overflow LED flat bracket according to claim 7, characterized in that: An electronic component (12) connected to the circuit is arranged on the circuit layout area (10); and a chip (7) connected to the circuit is arranged on the circuit layout area (10).

9. The base-forming anti-overflow LED flat bracket according to claim 1, characterized in that: The base body (1) is fixedly connected to the stand (3).

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