PCB for FPDLINK4 signal image processing

Abstract

The utility model provides a printed circuit board (PCB) for FPDLINK4 signal image processing, which comprises the components of a PCB which is of a laminated structure, and at least one laminated layer of the PCB is provided with a signal layer-changing via hole and a bonding pad; the image signal circuit is arranged in the PCB, the image signal circuit is connected with the bonding pad through the signal layer changing via hole, and the image signal circuit is arranged between the top lamination layer and the bottom lamination layer of the PCB. According to the image transmission circuit, the technical problem that the wiring difficulty of the image transmission circuit on the surface layer of the PCB is large is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB circuit routing, in particular to a PCB board used for FPD_LINK4 signal image processing. Background Art

[0002] With the development of automobile technology, people's requirements for image transmission in cars are becoming higher and higher, and FPD_LINK circuits are being used more frequently. FPD_LINK4 signals have high requirements on PCB design, and it is difficult to route image transmission circuits on the surface of PCB.

[0003] To address the above-mentioned problems, no effective solution has been proposed yet. Utility Model Content

[0004] The main purpose of the utility model is to provide a PCB board for FPD_LINK4 signal image processing to solve the technical problem that it is difficult to route the image transmission circuit on the surface of the PCB.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a PCB board for FPD_LINK4 signal image processing is provided, including: a PCB board, the PCB board is a stacked structure, at least one stack of the PCB board is provided with a signal layer switching via and a pad; an image signal circuit, the image signal circuit is arranged in the PCB board, and the image signal circuit is connected to the pad through the signal layer switching via, and is arranged between the top stack and the bottom stack of the PCB board.

[0006] Furthermore, the PCB board is provided with a basic via hole, and the aperture of the signal layer-changing via hole is larger than the aperture of the basic via hole.

[0007] Furthermore, the distance between the outer edge of the signal layer-changing via hole and the outer edge of the basic via hole is D, 19.9 μm≤D≤20.1 μm.

[0008] Further, the pad includes a first pad, the first pad is used to connect the package capacitor, and the distance between the outer boundary of the first pad and the outer boundary of the package capacitor is L1, 2.9 μm≤L1≤3.1 μm.

[0009] Furthermore, the pad also includes a second pad, and the second pad is used to connect the package resistor. The distance between the outer boundary of the second pad and the outer boundary of the package resistor is L2, and 2.9 μm≤L2≤3.1 μm.

[0010] Furthermore, the pads further include a third pad, and the third pad is used to connect the packaged chip. The distance between the outer boundary of the third pad and the outer boundary of the packaged chip is L3, and 2.9 μm≤L3≤3.1 μm.

[0011] Furthermore, a back-drilled hole is provided at one end of the signal layer-changing via hole, and the distance between the back-drilled hole and the non-drilled layer is L3, 9.9 μm≤L3≤10.1 μm.

[0012] Furthermore, the longest wiring length of the image signal circuit is less than 12 inches.

[0013] Furthermore, the PCB board uses medium-loss board.

[0014] By applying the technical solution of the utility model, a signal layer-changing via and a pad are provided on at least one stack of the PCB board, and the image signal circuit is connected to the pad through the signal layer-changing via and arranged between the top stack and the bottom stack of the PCB board, and the device is connected by inner layer routing, and the chip arrangement and the structural requirements for the transmission path are met through the signal layer-changing via and the pad. The technical solution of the application solves the technical problem that the image transmission circuit is difficult to route on the surface layer of the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0016] Figure 1 A circuit diagram of an embodiment of an image signal circuit according to the utility model is shown;

[0017] Figure 2 A circuit diagram of an embodiment of a PCB board according to the utility model is shown;

[0018] Figure 3 A circuit diagram of an embodiment of a laminate of a PCB board according to the utility model is shown.

[0019] The above drawings include the following reference numerals:

[0020] 1. First pad; 2. Package capacitor. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for the sake of clarity, the thickness of the layers and regions may be enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0025] Printed Circuit Board (PCB) is a printed circuit board with point connections and printed components on a general substrate according to a predetermined design. The main function of PCB products is to connect various electronic components to form a predetermined circuit and play a role in relay transmission.

[0026] Printed circuit boards are known as the "mother of electronic system products". Almost all electronic devices use printed circuit boards. Their irreplaceability is one of the important factors for the long-term and stable development of the printed circuit board manufacturing industry.

[0027] PCB can be divided into single-sided board, double-sided board and multi-layer board according to the number of conductive pattern layers; it can be divided into rigid board, flexible board and rigid-flexible board according to the board material; it can be divided into HDI board and special board according to the technical process dimension.

[0028] Combination Figures 1 to 3 As shown, according to a specific embodiment of the present application, a PCB board for FPD_LINK4 signal image processing is provided to solve the technical problem that it is difficult to route the image transmission circuit on the surface of the PCB.

[0029] A PCB board for FPD_LINK4 signal image processing includes: a PCB board, the PCB board is a laminated structure, at least one laminate of the PCB board is provided with a signal layer switching via and a pad; an image signal circuit, the image signal circuit is arranged in the PCB board, and the image signal circuit is connected to the pad through the signal layer switching via and arranged between the top laminate and the bottom laminate of the PCB board.

[0030] The laminated structure of a PCB board refers to a multi-layer layout in the board, in which electrical connection and signal transmission are achieved by setting copper foil layers and dielectric layers between different layers.

[0031] By applying the technical solution of the utility model, a signal layer-changing via and a pad are provided on at least one stack of the PCB board, and the image signal circuit is connected to the pad through the signal layer-changing via and arranged between the top stack and the bottom stack of the PCB board, and the device is connected by inner layer routing, and the chip arrangement and the structural requirements for the transmission path are met through the signal layer-changing via and the pad. The technical solution of the application solves the technical problem that the image transmission circuit is difficult to route on the surface layer of the PCB.

[0032] Furthermore, the PCB board is provided with a basic via, and the aperture of the signal layer-changing via is larger than the aperture of the basic via. The PCB board via has a design specification, a certain board thickness corresponds to a certain via, and the size is expanded on the basis of the reference via, and the basic via runs through all layers. The signal layer-changing via ensures the implementation of the process of arranging the image signal circuit between the top stack and the bottom stack of the PCB board.

[0033] Furthermore, the distance between the outer edge of the signal layer-changing via hole and the outer edge of the basic via hole is D, 19.9 μm≤D≤20.1 μm. By expanding the hole wall of the signal layer-changing via hole outward, it is helpful to reduce the impedance at this location.

[0034] In an alternative embodiment, Figure 2 Shown is the schematic diagram of the image processing circuit design based on FPD4.

[0035] The value of C1 is 100nf and is placed close to pin1;

[0036] The value of C2 is 47nf, placed near pin2; the value of R1 is 50 ohms, C2 is connected to R1, placed near pin2, and R1 is connected to the ground;

[0037] The resistance of R2 is 10k ohms, and that of R3 is 22k ohms. R3 pulls up to 1.8v. The wiring between R2 and R3 is the DET network, which returns to the detection pin of the chip and is used to detect the status of the I image signal IVI.

[0038] The image signal passes through C1 and reaches the coaxial connector, and is transmitted to the screen end through the wiring harness.

[0039] Further, the pad includes a first pad 2, the first pad is used to connect the package capacitor 1, the distance between the outer boundary of the first pad 2 and the outer boundary of the package capacitor 1 is L1, 2.9μm≤L1≤3.1μm. Preferably, the package of capacitor 1 is 0402 package, the capacitor refers to the 5th layer, and expands 3μm according to the package size.

[0040] Furthermore, the pad also includes a second pad, and the second pad is used to connect the package resistor. The distance between the outer boundary of the second pad and the outer boundary of the package resistor is L2, and 2.9 μm≤L2≤3.1 μm.

[0041] like Figure 3 A schematic diagram of the stacking of the board material of the PCB board is shown, wherein the board material is IT170GRA.

[0042] Furthermore, the pads further include a third pad, and the third pad is used to connect the packaged chip. The distance between the outer boundary of the third pad and the outer boundary of the packaged chip is L3, and 2.9 μm≤L3≤3.1 μm.

[0043] Furthermore, a back-drilled hole is provided at one end of the signal layer-changing via hole, and the distance between the back-drilled hole and the non-drilled layer is L3, 9.9 μm≤L3≤10.1 μm.

[0044] Furthermore, the longest wiring length of the image signal circuit is less than 12 inches.

[0045] A multi-layer PCB is a PCB board that is made by stacking multiple single-sided or double-sided boards together through a certain lamination process. In a multi-layer PCB, the circuit lines and pads of each layer are formed by electrolytic copper process, and the connection between different layers is achieved by setting pads or reserved holes between different layers, thereby achieving higher integration and smaller footprint. The stacking definition of a multi-layer PCB usually refers to the number of layers in a multi-layer PCB board.

[0046] By adopting the above technical solution, an optimized PCB design solution is provided through the design of the longest routing length, the distance between the back drill hole and the non-drilled layer, and the connection to the pad, which can realize inner layer routing and is suitable for situations where outer layer routing is more difficult.

[0047] Furthermore, the PCB board uses medium-loss board.

[0048] From the above description, it can be seen that the above embodiments of the utility model achieve the following technical effects:

[0049] A PCB board for FPD_LINK4 signal image processing is provided, which uses inner layer routing to connect devices; the board material, stacking, routing length, anti-pad size of vias, and back drilling depth of vias are limited to meet the chip's structural requirements for the transmission path. In the case where the surface layer cannot be routed, this solution provides an inner layer routing solution, which can meet the standard requirements of FPD_LINK4 using this structural solution design.

[0050] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0051] In addition to the above, it should be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of the present utility model.

[0052] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0053] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A PCB board for FPD_LINK4 signal image processing, characterized in that: include: A PCB board, wherein the PCB board is a laminated structure, and at least one laminated layer of the PCB board is provided with a signal layer-changing via and a pad; An image signal circuit is arranged in the PCB board, and the image signal circuit is connected to the pad through the signal layer-changing via hole, and is arranged between the top stack and the bottom stack of the PCB board.

2. The PCB board for FPD_LINK4 signal image processing according to claim 1, characterized in that: The PCB board is provided with a basic via hole, and the aperture of the signal layer-changing via hole is larger than the aperture of the basic via hole.

3. The PCB board for FPD_LINK4 signal image processing according to claim 2, characterized in that: The distance between the outer edge of the signal layer-changing via hole and the outer edge of the basic via hole is D, 19.9 μm≤D≤20.1 μm.

4. The PCB board for FPD_LINK4 signal image processing according to claim 1, characterized in that: The pad comprises a first pad (2), the first pad being used to connect to a package capacitor (1), the distance between the outer boundary of the first pad (2) and the outer boundary of the package capacitor (1) being L1, 2.9 μm≤L1≤3.1 μm.

5. The PCB board for FPD_LINK4 signal image processing according to claim 1, characterized in that: The pad further includes a second pad, and the second pad is used to connect the package resistor. The distance between the outer boundary of the second pad and the outer boundary of the package resistor is L2, and 2.9 μm≤L2≤3.1 μm.

6. The PCB board for FPD_LINK4 signal image processing according to claim 1, characterized in that: The pads further include a third pad, and the third pad is used to connect the packaged chip. The distance between the outer boundary of the third pad and the outer boundary of the packaged chip is L3, and 2.9 μm≤L3≤3.1 μm.

7. The PCB board for FPD_LINK4 signal image processing according to claim 1, characterized in that: A back-drilled hole is provided at one end of the signal layer-changing via hole, and the distance between the back-drilled hole and the non-drilled layer is L3, 9.9 μm≤L3≤10.1 μm.

8. The PCB board for FPD_LINK4 signal image processing according to claim 1, characterized in that: The longest wiring length of the image signal circuit is less than 12 inches.

9. The PCB board for FPD_LINK4 signal image processing according to claim 1, characterized in that: The PCB board is made of medium-loss board.

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