Nozzle device and semiconductor equipment

Abstract

The utility model relates to a nozzle device which comprises a body extending in the first direction and a plurality of independent airflow channels arranged in the body. Each airflow channel comprises an air inlet part, an air outlet part and a communicating part connecting the air inlet part and the air outlet part, the communicating parts extend in the first direction, and the air inlet parts and the air outlet parts are arranged at intervals in the first direction; the gas inlet part is arranged in a disc shape and comprises an upper wall, a lower wall, a peripheral wall, a first space, a second space and a gas uniformizing structure, wherein the first space and the second space are located in the gas inlet part, and the gas uniformizing structure is used for separating the first space and the second space. The peripheral wall is provided with at least one air inlet hole communicated with the first space, the second space is communicated with the communicating part, in the radial direction of the air inlet part, the first space is arranged on the periphery of the second space, and the communicating part is located on the inner side of the second space. The gas uniformizing structure of the nozzle device provided by the utility model is arranged outside the reaction cavity, so that the gas uniformizing requirement is met, the space in the cavity can be effectively saved, and the gas outlet part of the nozzle is miniaturized.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment, and in particular to a nozzle device and a semiconductor equipment. Background Art

[0002] In semiconductor manufacturing, the nozzle device is a key component of the film-forming equipment, and its performance directly affects the quality and uniformity of the film. However, existing nozzle devices often have problems such as large size and heavy weight, which limit the integration of the equipment and the flexibility of operation. Traditional nozzle design ignores the needs of miniaturization and lightweight. In practical applications, although large nozzles can provide stable gas flow, they occupy a large space, which is not conducive to the compact layout and integration of equipment.

[0003] In addition, the large nozzle device occupies a large space in the reaction chamber, reducing the internal space of the reaction chamber and limiting the processing capacity and production efficiency of the equipment.

[0004] Therefore, there is a great need for a nozzle design that can be miniaturized while maintaining or improving performance. Such a design should be able to provide precise and uniform gas distribution within a limited space. Utility Model Content

[0005] In order to achieve the above-mentioned object, the utility model provides a nozzle device for a reaction chamber of a semiconductor device, the nozzle device comprising a body extending along a first direction and a plurality of mutually independent gas flow channels arranged in the body, the gas flow channels being used to introduce external gas into the reaction chamber through different paths;

[0006] Each of the air flow channels comprises an air inlet, an air outlet and a connecting portion connecting the two, the connecting portion is extended along a first direction, and in the first direction, the air inlet and the air outlet are spaced apart;

[0007] The air intake portion is arranged in a disc shape, including an upper wall, a lower wall, an outer peripheral wall, a first space and a second space located inside the air intake portion, and an air uniforming structure separating the first space and the second space; the outer peripheral wall is provided with at least one air intake hole connected to the first space, the second space is connected to the connecting portion, and in the radial direction of the air intake portion, the first space is arranged on the periphery of the second space, and the connecting portion is located on the inner side of the second space.

[0008] Preferably, the air uniforming structure comprises an annularly arranged air uniforming plate, the air uniforming plate connects the upper wall and the lower wall, a plurality of through holes are arranged on the air uniforming plate, and a cross-sectional area of ​​each of the through holes is smaller than a cross-sectional area of ​​the air inlet hole.

[0009] Preferably, the air outlet portion is composed of a top wall, a bottom wall, a side wall and an air outlet space formed between the top wall, the bottom wall and the side wall, and a plurality of air outlet holes are arranged in the circumference of the side wall.

[0010] Preferably, the air inlets and air outlets of different air flow channels are coaxially arranged and arranged in parallel along the axial direction; and the outer edges of the outer peripheral walls of the air inlets of different air flow channels are flush.

[0011] Preferably, outer edges of the side walls of the air outlets of different airflow channels are flush.

[0012] Preferably, the air outlet is arranged in a disc shape, and the outer diameter of the air outlet is smaller than the outer diameter of the air inlet;

[0013] The axial height of the air outlet is smaller than the axial height of the air inlet.

[0014] Preferably, the connecting portion is configured as an inner and outer sleeve coaxial with the air inlet portion, and the connecting portion connects the air inlet portion and the air outlet portion through an annular channel between the inner and outer sleeves; the connecting portions of different air flow channels are configured as a plurality of coaxial sleeves with different radial sizes, and adjacent sleeves are connected to different air inlets or air outlets.

[0015] Preferably, the nozzle device comprises a cooling channel extending from the top to the bottom of the nozzle device, and the top and the bottom of the cooling channel are both provided with a radially extending first cooling portion;

[0016] The top of the cooling channel is provided with an inlet and an outlet, the inlet is provided at the axis center position, and the outlet is provided at the top of the first cooling part at the top;

[0017] A circuitous structure is arranged in the first cooling part at the bottom, and the cooling fluid is introduced into the cooling channel through the inlet and discharged from the outlet after passing through the circuitous structure.

[0018] Preferably, the nozzle device comprises a second cooling portion, and in the first direction, the second cooling portion is disposed between the air inlet portion and the air outlet portion, and the second cooling portion is sleeved on the outer periphery of the connecting portion.

[0019] In addition, the utility model also provides a semiconductor device, including:

[0020] A reaction chamber comprises a main body, a rotating base supporting a wafer arranged in the main body, and a reaction space located above the rotating base; and the above-mentioned nozzle device, wherein the nozzle device is fixedly connected to the reaction chamber and is opposite to the center position of the rotating base, the air outlet of the nozzle device is arranged in the main body and protrudes into the reaction space, and the air inlet of the nozzle device is located outside the main body.

[0021] The utility model has the following beneficial effects:

[0022] 1. The miniaturized nozzle occupies less space in the reaction chamber, so that the reaction chamber has a larger reaction space;

[0023] 2. The gas homogenizing structure is placed outside the reaction chamber. On the one hand, it can also achieve a better gas homogenizing effect. On the other hand, it can effectively save the space in the chamber and make the gas outlet part of the nozzle miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the semiconductor device of the utility model;

[0025] Figure 2 It is a cross-sectional schematic diagram of the nozzle device of the utility model;

[0026] Figure 3 It is a structural schematic diagram of the nozzle device of the utility model. DETAILED DESCRIPTION

[0027] The following is a further detailed description of a nozzle device and a semiconductor device proposed by the utility model in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so it has no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the utility model.

[0028] See also Figure 1The present application discloses a semiconductor device, which includes a reaction chamber 90, the reaction chamber 90 includes a main body, a rotating base 70 for supporting a wafer 60 arranged in the main body, and a reaction space located above the rotating base 70; a nozzle device is arranged at the top of the reaction chamber 90, which can flow the external gas 50 into the interior of the reaction chamber 90 in different paths. The external gas 50 undergoes a chemical or physical reaction in the reaction space. The nozzle device is fixedly connected to the reaction chamber 90 and is opposite to the center position of the rotating base 70. The gas outlet of the nozzle device is arranged in the main body and protrudes into the reaction space, and the gas inlet of the nozzle device is located outside the main body. The reaction chamber 90 is also provided with an exhaust port 80 for discharging the external gas 50 after the reaction. The external gas 50 usually includes multiple gas components. In order to ensure the uniformity of the external gas 50 and promote the uniform mixing of the gas components, the nozzle device is designed to be a structure that can uniformly gas and uniformly output the external gas 50. The external gas includes protective gas, process gas, cleaning gas, etc. Different gases can enter the reaction chamber 90 independently through different gas flow channels on the nozzle device.

[0029] like Figure 2 , 3As shown, the nozzle device provided in the present application includes a body 10 extending along a first direction and a plurality of mutually independent airflow channels arranged in the body 10, the airflow channels are used to introduce external gas 50 into the reaction chamber 90 in different paths; each of the airflow channels includes an air inlet 11, an air outlet 12 and a connecting portion 13 connecting the two, the connecting portion 13 is extended along the first direction (axial direction), and in the first direction, the air inlet 11 and the air outlet 12 are spaced apart. The air inlet 11 is located at the top of the connecting portion 13 and is arranged outside the reaction chamber 90, the air inlet 11 is connected to a pipeline providing the external gas 50, and the air outlet 12 is arranged inside the reaction chamber 90. In order to meet the requirements of uniform gas effect and miniaturization of the nozzle device, the present solution sets a uniform gas space in the air inlet 11 and reduces the size of the air outlet 12. Specifically, the air inlet 11 is arranged in a disc shape, including an upper wall, a lower wall, an outer peripheral wall, a first space 111 and a second space 112 located in the air inlet 11, and a uniform gas structure 113 separating the first space 111 and the second space 112; the outer peripheral wall is provided with at least one air inlet hole 114 connected to the first space 111, and the external gas 50 is introduced through the air inlet hole 114; the second space 112 is connected to the connecting portion 13, and in the radial direction of the air inlet 11, the first space 111 is arranged at the periphery of the second space 112, and the connecting portion 13 is located on the inner side of the second space 112. Further, the air outlet 12 is composed of a top wall, a bottom wall, a side wall, and an air outlet space formed between the top wall, the bottom wall and the side wall, and a plurality of air outlet holes 121 are arranged in the circumferential direction of the side wall. The plurality of air outlet holes 121 are evenly distributed along the circumferential direction, so that the gas in all directions of the reaction chamber 90 is evenly distributed.

[0030] Through the above design, the external gas 50 first enters the first space 111, flows along the circumference of the first space 111, and is treated by the uniform gas structure 113 to form a uniformly mixed external gas. Subsequently, the external gas treated by the uniform gas enters the second space 112, and enters the gas outlet portion 12 through the connecting portion 13. The component is provided with a plurality of uniformly distributed gas outlet holes 121. After the external gas 50 passes through these gas outlet holes 121, it can be ensured that the gas can be evenly distributed in the reaction chamber 90.

[0031] Since the gas uniforming structure 113 is arranged in the air inlet 11, the structures of the air outlet 12 and the connecting portion 13 are simplified, and in particular, the air outlet 12 can be miniaturized. Further, the air outlet 12 is arranged in a disc shape, the outer diameter of the air outlet 12 is smaller than the outer diameter of the air inlet 11, and the axial height of the air outlet 12 is smaller than the axial height of the air inlet 11.

[0032] Preferably, the air uniforming structure 113 includes an annular air uniforming plate 1131 connecting the upper wall and the lower wall. The air uniforming plate 1131 is provided with a plurality of through holes 1132 , and the cross-sectional area of ​​each through hole 1132 is smaller than the cross-sectional area of ​​the air inlet 114 .

[0033] Preferably, the air inlets 11 and air outlets 12 of different air flow channels are coaxially arranged and arranged in parallel along the axial direction; the outer edges of the peripheral walls of the air inlets 11 of different air flow channels are flush, and the outer edges of the side walls of the air outlets 12 of different air flow channels are flush. Since the outer edges of the side walls of the air outlets 12 are flush and the air outlets 12 are coaxially arranged, the gas discharged from each air outlet 12 is diffused in a concentric shape, so that the gas is evenly distributed in the reaction chamber 90, and the flush outer edges of the side walls make it easier for the operator to control the spatial distribution of the gas, thereby achieving refined control of the spatial distribution of the gas. Similarly, the flush outer edges of the peripheral walls are conducive to controlling the uniformity of the gas in each air inlet 11.

[0034] Preferably, the connecting portion 13 is configured as an inner and outer sleeve coaxial with the air inlet portion 11, and the connecting portion 13 connects the air inlet portion 11 and the air outlet portion 12 through an annular channel between the inner and outer sleeves; the connecting portions 13 of different air flow channels are configured as multiple coaxial sleeves with different radial sizes, and adjacent sleeves are connected to different air inlets 11 or air outlets 12.

[0035] Furthermore, the nozzle device includes a cooling channel 20 extending from the top to the bottom of the nozzle device, and the top and bottom of the cooling channel 20 are both provided with radially extending first cooling parts 203 and 204; the top of the cooling channel 20 is provided with an inlet 201 and an outlet 202, the inlet 201 is provided at the axial position, and the outlet 202 is provided at the top of the first cooling part 203 at the top; a detour structure 205 is provided in the first cooling part 204 at the bottom, and the cooling fluid 40 is introduced into the cooling channel 20 through the inlet 201 and discharged from the outlet 202 after passing through the detour structure 205. Among them, the first cooling part 203 at the top is mainly used to cool the gas in the air inlet part 11, and the first cooling part 204 at the bottom is mainly used to cool the gas in the air outlet part 12. In addition, the axially extending cooling channel 20 is also used to cool the gas in the connecting part 13.

[0036] Furthermore, the nozzle device includes a second cooling portion 30. In the first direction (axial direction), the second cooling portion 30 is arranged between the air inlet portion 11 and the air outlet portion 12, and the second cooling portion 30 is sleeved on the outer periphery of the connecting portion 13, mainly used to cool the gas in the outer peripheral airflow channel.

[0037] The utility model has the following beneficial effects:

[0038] 1. The miniaturized nozzle occupies less space in the reaction chamber, so that the reaction chamber has a larger reaction space;

[0039] 2. The gas homogenizing structure is placed outside the reaction chamber. On the one hand, it can also achieve a better gas homogenizing effect. On the other hand, it can effectively save the space in the chamber and make the gas outlet part of the nozzle miniaturized.

[0040] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A nozzle device for a reaction chamber of a semiconductor device, characterized in that: The nozzle device comprises a body extending along a first direction and a plurality of mutually independent airflow channels arranged in the body, wherein the airflow channels are used to introduce external gas into the reaction chamber through different paths; Each of the air flow channels comprises an air inlet, an air outlet and a connecting portion connecting the two, the connecting portion is extended along a first direction, and in the first direction, the air inlet and the air outlet are spaced apart; The air intake portion is arranged in a disc shape, including an upper wall, a lower wall, an outer peripheral wall, a first space and a second space located inside the air intake portion, and an air uniforming structure separating the first space and the second space; the outer peripheral wall is provided with at least one air intake hole connected to the first space, the second space is connected to the connecting portion, and in the radial direction of the air intake portion, the first space is arranged on the periphery of the second space, and the connecting portion is located on the inner side of the second space.

2. The nozzle device according to claim 1, characterized in that The air uniforming structure comprises an annularly arranged air uniforming plate, the air uniforming plate connects the upper wall and the lower wall, a plurality of through holes are arranged on the air uniforming plate, and the cross-sectional area of ​​each of the through holes is smaller than the cross-sectional area of ​​the air inlet hole.

3. The nozzle device according to claim 1, characterized in that The air outlet portion is composed of a top wall, a bottom wall, a side wall and an air outlet space formed between the top wall, the bottom wall and the side wall, and a plurality of air outlet holes are arranged in the circumference of the side wall.

4. The nozzle device according to claim 1, characterized in that The air inlets and air outlets of different air flow channels are coaxially arranged and arranged in parallel along the axial direction; the outer edges of the outer peripheral walls of the air inlets of different air flow channels are flush.

5. The nozzle device according to claim 3, characterized in that The outer edges of the side walls of the air outlets of different air flow channels are flush.

6. The nozzle device according to claim 3, characterized in that The air outlet is arranged in a disc shape, and the outer diameter of the air outlet is smaller than the outer diameter of the air inlet; The axial height of the air outlet is smaller than the axial height of the air inlet.

7. The nozzle device according to claim 1, characterized in that The connecting portion is configured as an inner and outer sleeve coaxial with the air inlet portion, and the connecting portion connects the air inlet portion and the air outlet portion through an annular channel between the inner and outer sleeves; the connecting portions of different air flow channels are configured as multiple coaxial sleeves with different radial sizes, and adjacent sleeves are connected to different air inlets or air outlets.

8. The nozzle device according to claim 1, characterized in that The nozzle device comprises a cooling channel extending from the top to the bottom of the nozzle device, and the top and the bottom of the cooling channel are both provided with a radially extending first cooling portion; The top of the cooling channel is provided with an inlet and an outlet, the inlet is provided at the axis center position, and the outlet is provided at the top of the first cooling part at the top; A circuitous structure is arranged in the first cooling part at the bottom, and the cooling fluid is introduced into the cooling channel through the inlet and discharged from the outlet after passing through the circuitous structure.

9. The nozzle device according to claim 1, characterized in that The nozzle device includes a second cooling portion. In the first direction, the second cooling portion is disposed between the air inlet portion and the air outlet portion, and the second cooling portion is sleeved on the outer periphery of the communication portion.

10. A semiconductor device, characterized in that: include: The reaction chamber comprises a main body, a rotating base plate for supporting the wafer disposed in the main body, and a reaction space located above the rotating base plate; and The nozzle device as described in any one of claims 1 to 9, wherein the nozzle device is fixedly connected to the reaction chamber and is opposite to the center position of the rotating base, the air outlet portion of the nozzle device is arranged in the main body and protrudes into the reaction space, and the air inlet portion of the nozzle device is located outside the main body.

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