Mobile phone middle frame polishing ring
By designing a ring-shaped structure of mobile phone mid-frame polishing ring, combined with the interface optimization of diamond sand cloth and high elastic sponge, the problem of difficulty in polishing complex shapes of frames is solved, achieving better polishing effect and durability.
Patent Information
- Application Number
- CN202420056843.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-10
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-01-10
AI Technical Summary
Traditional mobile phone mid-frame grinding tools are difficult to adapt to complex shapes of curved frames, resulting in poor polishing effect, and when using soft substrate sand cloth, it is easy to have problems such as excessive covering or insufficient support.
Design a mobile phone midframe polishing ring, including an annular polishing layer, a buffer layer and a friction layer arranged in sequence from the outside to the inside. The polishing layer uses diamond sand cloth, the buffer layer uses a high elastic sponge, and the interface is designed as miter and large wave type The friction layer is a velvet cloth, and the contact area and flatness are optimized by bonding the glue layer.
The grinding ring can effectively process the facade and arc surfaces of various shapes. The support and covering of the sponge avoid interference. The interface design improves durability and grinding effect, ensuring that the product is smooth and traceless.
Smart Images
Figure CN222269948U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of mobile phone middle frame polishing, in particular to a mobile phone middle frame polishing ring. Background Art
[0002] With the diversification of mobile phone designs, the shape of the mobile phone middle frame is becoming more and more complex. There are both right-angle frames and curved frames on the market. The traditional mobile phone middle frame grinding and polishing mainly uses grinding discs, which are limited to the grinding of right-angle frames and cannot meet the needs of curved frames. When using soft-based sandpaper for small arc grinding, there will be problems such as excessive coverage and insufficient sandpaper support, resulting in the vertical surface after grinding becoming an arc surface or edge collapse.
[0003] Therefore, a mobile phone middle frame grinding tool suitable for various shapes is needed to improve the grinding effect. Utility Model Content
[0004] The utility model provides a mobile phone middle frame polishing ring, which solves the problem of poor polishing effect of arc-shaped frames in the prior art.
[0005] The technical solution of the utility model is implemented as follows: a mobile phone middle frame polishing ring comprises a ring-shaped polishing layer, a buffer layer and a friction layer which are sequentially arranged from the outside to the inside.
[0006] Furthermore, the polishing layer, the buffer layer and the friction layer are bonded together by a glue layer.
[0007] Furthermore, the grinding layer is made of diamond emery cloth.
[0008] Furthermore, the polishing layer has a first interface, and the first interface is a bevel joint.
[0009] Furthermore, the angle between the first interface and the horizontal edge line of the polishing layer is 40°-70°.
[0010] Furthermore, the buffer layer is made of high-elastic sponge.
[0011] Furthermore, the hardness of the high-elastic sponge is 25°-35°, and the thickness of the high-elastic sponge is 4.5mm-5.5mm.
[0012] Furthermore, the buffer layer has a second interface, and the second interface is a large wave shape.
[0013] Furthermore, the first interface is located near the second interface.
[0014] Furthermore, the friction layer is made of flannel.
[0015] After adopting the above technical solution, the beneficial effect of the utility model is as follows: the mobile phone middle frame polishing ring in the utility model can process the vertical surface and arc angle as the angle changes by setting an annular sandpaper polishing layer and a sponge buffer layer. When polishing the arc surface, the sponge has certain support and covering properties to avoid interference with the 3D surface; when polishing the 3D vertical surface, it can be well connected with the arc surface. In addition, the interface design of the polishing ring optimizes the contact area and flatness, and improves the durability of the polishing ring and the polishing effect of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0017] Figure 1 This is a schematic diagram of the structure of the mobile phone middle frame grinding ring of the utility model;
[0018] Figure 2 This is an exploded schematic diagram of the grinding ring of the mobile phone middle frame of the utility model;
[0019] Figure 3 It is a schematic diagram of the unfolded state of the grinding layer in the utility model;
[0020] Figure 4 It is a schematic diagram of the unfolded state of the buffer layer in the utility model.
[0021] Explanation of the reference numerals: polishing layer (10), first interface (11); buffer layer (20), second interface (21); friction layer (30). DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] like Figure 1-4 As shown, the mobile phone middle frame polishing ring in the embodiment of the utility model includes a ring-shaped polishing layer 10, a buffer layer 20 and a friction layer 30 arranged in sequence from the outside to the inside, and the polishing layer 10, the buffer layer 20 and the friction layer 30 are bonded together with a glue layer.
[0024] The grinding layer 10 is made of diamond cloth. The grinding layer 10 has a first interface 11, which is beveled, and the angle between the first interface 11 and the horizontal edge line of the grinding layer 10 is 40°-70°. Compared with vertical splicing, the beveled first interface 11 has a larger contact area and is smoother. In the process of use, the instantaneous contact area is smaller, which is conducive to long-term use.
[0025] The buffer layer 20 uses a high-elastic sponge to ensure that it can rebound in time after polishing several products, thereby improving the service life and use efficiency. The hardness of the high-elastic sponge is 25°-35°, which can not only avoid the surface of the product being not polished cleanly due to insufficient coverage, but also prevent the sponge from being too soft and causing the sponge to be too strong in coverage, thereby causing the product to collapse and interfere with other surfaces. The thickness of the high-elastic sponge is 4.5mm-5.5mm, which can not only avoid the sponge thickness being too low and causing insufficient support, but also avoid the sponge being too thick and causing interference.
[0026] The buffer layer 20 has a second interface 21, and the second interface 21 is a large wave shape. Compared with the W-shaped interface, the large wave shape of the second interface 21 is not easy to be squeezed out during the grinding process, thereby ensuring the stability of use.
[0027] The first interface 11 is located near the second interface 21. The force release through the sponge gap of the buffer layer 20 effectively offsets the high point and insufficient coverage of the first interface 11 of the polishing layer 10, thereby avoiding premature wear due to high points, improving the durability of the polishing ring, and ensuring that the polished product is smooth and traceless.
[0028] The friction layer 30 is made of flannel to increase friction so that the grinding ring is not easy to fall off.
[0029] The mobile phone middle frame polishing ring in the utility model can process the vertical surface and arc angle as the angle changes by setting the annular sandpaper polishing layer 10 and the sponge buffer layer 20. When polishing the arc surface, the sponge has certain support and covering properties to avoid interference with the 3D surface; when polishing the 3D vertical surface, it can be well connected with the arc surface. In addition, the interface design of the polishing ring optimizes the contact area and flatness, improves the durability of the polishing ring and the polishing effect of the product.
[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A mobile phone middle frame polishing ring, characterized by: The invention comprises an annular grinding layer (10), a buffer layer (20) and a friction layer (30) which are arranged in sequence from the outside to the inside.
2. The mobile phone middle frame polishing ring according to claim 1, characterized in that: The polishing layer (10), the buffer layer (20) and the friction layer (30) are bonded together by a glue layer.
3. The mobile phone middle frame polishing ring according to claim 1 or 2, characterized in that: The grinding layer (10) is made of diamond emery cloth.
4. The mobile phone middle frame polishing ring as claimed in claim 3, characterized in that: The polishing layer (10) has a first interface (11), and the first interface (11) is a bevel joint.
5. The mobile phone middle frame polishing ring as claimed in claim 4, characterized in that: The included angle between the first interface (11) and the horizontal edge line of the polishing layer (10) is 40°-70°.
6. The mobile phone middle frame polishing ring according to claim 4, characterized in that: The buffer layer (20) is made of high-elastic sponge.
7. The mobile phone middle frame polishing ring according to claim 6, characterized in that: The hardness of the high-elastic sponge is 25°-35°, and the thickness of the high-elastic sponge is 4.5mm-5.5mm.
8. The mobile phone middle frame polishing ring according to claim 4, characterized in that: The buffer layer (20) has a second interface (21), and the second interface (21) is in a large wave shape.
9. The mobile phone middle frame polishing ring according to claim 8, characterized in that: The first interface (11) is located near the second interface (21).
10. The mobile phone middle frame polishing ring according to claim 1 or 2, characterized in that: The friction layer (30) is made of flannel.