Crystal temperature control device

Abstract

The utility model belongs to the technical field of temperature control, and discloses a crystal temperature control device. The crystal temperature control device comprises a base, a heat conduction piece, a clamping piece and a frequency multiplication piece. The top of the base is provided with a temperature control member. The heat conduction piece is arranged at the top end of the base. A clamping side wall is arranged on the side, away from the base, of the heat conduction piece. A first abutting part is arranged at the bottom end of the clamping piece, the first abutting part abuts against the side, away from the base, of the heat conduction piece, the clamping piece is further provided with a second abutting part, the second abutting part abuts against the clamping side wall, and the first abutting part, the second abutting part, the clamping side wall and the top end of the heat conduction piece jointly form a containing space; the frequency doubling piece is an LBO frequency doubling crystal and is arranged in the containing space. The frequency doubling piece of the crystal temperature control device is the LBO frequency doubling crystal, and the refraction efficiency of the LBO frequency doubling crystal is obviously changed along with the temperature, so that the frequency doubling efficiency can reach the maximum value by controlling the temperature of the LBO frequency doubling crystal; in addition, the device is compact in structure and small in occupied space.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, in particular to a crystal temperature control device. Background Art

[0002] In the field of optics, frequency doubling is one of the most common nonlinear optical processes. Nonlinear optical crystals are affected by the ambient temperature during operation, and the crystals also heat up due to absorbing part of the laser energy. Changes in crystal temperature will destroy the phase matching conditions to a certain extent, reduce the nonlinear conversion efficiency and output stability. Therefore, it is necessary to control the temperature of nonlinear crystals. However, existing temperature control devices have many optical components, occupy a large space, and cannot achieve the maximum frequency doubling efficiency by controlling the crystal temperature.

[0003] Therefore, there is an urgent need for a crystal temperature control device that not only occupies a small space but also can maximize the frequency doubling efficiency by controlling the temperature of the crystal. Utility Model Content

[0004] The utility model aims to provide a crystal temperature control device, which not only occupies a small space but also can realize temperature control of the crystal and make the frequency doubling efficiency reach the maximum value.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A crystal temperature control device, comprising:

[0007] The base has a temperature control unit at the top;

[0008] A heat conducting member is arranged at the top of the base, and a clamping side wall is arranged on a side of the heat conducting member away from the base;

[0009] A clamping member, a first abutting portion is provided at a bottom end thereof, the first abutting portion abuts against a side of the heat conducting member away from the base, the clamping member is further provided with a second abutting portion, the second abutting portion abuts against the clamping side wall, the first abutting portion, the second abutting portion, the clamping side wall and the top end of the heat conducting member together form a receiving space;

[0010] A frequency doubling component, which is an LBO frequency doubling crystal, is arranged in the accommodating space.

[0011] Preferably, a placement groove is provided at the top of the base, the placement groove is used to accommodate the temperature control unit, and a wiring hole is provided in the placement groove.

[0012] Preferably, the clamping member is detachably connected to the heat conducting member.

[0013] Preferably, a connecting portion is provided on a side of the clamping member facing away from the second abutting portion, and a first mounting hole is provided on the connecting portion. The mounting member can detachably mount the clamping member to the top end of the heat conducting member through the first mounting hole.

[0014] Preferably, the first mounting hole is a waist hole.

[0015] Preferably, the temperature control accuracy of the temperature control part is not greater than 0.01 degrees.

[0016] Preferably, the crystal temperature control device further comprises a heat insulating member, wherein the heat insulating member is covered at the top end of the clamping member, and light holes are arranged on both sides of the heat insulating member along its length direction, and the light holes are directly opposite to the two ends of the frequency doubling member.

[0017] Preferably, the heat insulating member is detachably connected to the heat conducting member.

[0018] Preferably, a heat sink is provided at the bottom end of the base.

[0019] Preferably, a plurality of heat dissipation fins are arranged at intervals at the bottom end of the base.

[0020] Beneficial effects of the utility model:

[0021] The utility model belongs to the technical field of temperature control, and discloses a crystal temperature control device. The crystal temperature control device includes a base, a heat conducting member, a clamping member and a frequency doubling member. A temperature control member is arranged at the top of the base; a heat conducting member is arranged at the top of the base, and a clamping side wall is arranged on the side of the heat conducting member away from the base; a first abutting portion is arranged at the bottom of the clamping member, and the first abutting portion abuts against the side of the heat conducting member away from the base, and the clamping member is also provided with a second abutting portion, and the second abutting portion abuts against the clamping side wall, and the first abutting portion, the second abutting portion, the clamping side wall and the top of the heat conducting member jointly form a receiving space; the frequency doubling member is an LBO frequency doubling crystal, which is arranged in the receiving space. The frequency doubling member of the crystal temperature control device is an LBO frequency doubling crystal, and its refractive efficiency changes significantly with temperature, so the frequency doubling efficiency can be maximized by controlling its temperature; in addition, the device has a compact structure, occupies a small space, and is extremely simple and convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The utility model provides a crystal temperature control device. Figure 1 ;

[0023] Figure 2 The utility model provides a crystal temperature control device. Figure 2 ;

[0024] Figure 3 It is a structural schematic diagram of the base and temperature control unit provided by the utility model;

[0025] Figure 4 It is a structural schematic diagram of the heat conducting member provided by the utility model;

[0026] Figure 5 It is a structural schematic diagram of the clamping member provided by the utility model;

[0027] Figure 6 It is a structural schematic diagram of the clamping member provided by the utility model being installed on the heat conducting member;

[0028] Figure 7 It is a structural schematic diagram of the frequency multiplication component provided by the utility model;

[0029] Figure 8 It is a structural schematic diagram of the heat insulation component provided by the utility model.

[0030] In the figure:

[0031] 10. Base; 11. Placement slot; 111. Wiring hole; 12. Heat sink fins

[0032] 20. Temperature control unit;

[0033] 30. heat conducting member; 31. clamping side wall; 32. placement surface; 33. connection surface; 331. second mounting hole; 34. third mounting hole; 35. fourth mounting hole;

[0034] 40. Clamping member; 41. First abutting portion; 42. Second abutting portion; 43. Connecting portion; 431. First mounting hole; 44. Accommodating space;

[0035] 50. Frequency doubling parts;

[0036] 60. thermal insulation member; 61. light-through hole; 62. fifth mounting hole;

[0037] 70. Heat sink. DETAILED DESCRIPTION

[0038] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0039] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0042] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0043] This embodiment provides a crystal temperature control device, such as Figure 1-Figure 7 As shown, the device includes a base 10, a heat conducting member 30, a clamping member 40 and a frequency doubling member 50. A temperature control unit 20 is arranged at the top of the base 10; the heat conducting member 30 is arranged at the top of the base 10, and a clamping side wall 31 is arranged on the side of the heat conducting member 30 away from the base 10; a first abutting portion 41 is arranged at the bottom of the clamping member 40, and the first abutting portion 41 abuts against the side of the heat conducting member 30 away from the base 10. The clamping member 40 is also provided with a second abutting portion 42, and the second abutting portion 42 abuts against the clamping side wall 31. The first abutting portion 41, the second abutting portion 42, the clamping side wall 31 and the top of the heat conducting member 30 jointly form a accommodating space 44; the frequency doubling member 50 is an LBO frequency doubling crystal, which is arranged in the accommodating space 44.

[0044] like Figure 4-Figure 6As shown, the crystal temperature control device can simply fix the frequency doubling component 50 on the heat conducting component 30 by clamping by setting the heat conducting component 30 and the clamping component 40; and because the frequency doubling component 50 is an LBO frequency doubling crystal, due to the particularity of the LBO frequency doubling crystal material, its refractive index of light changes significantly with temperature, so it is possible to control the temperature of the LBO frequency doubling crystal, thereby achieving the maximum frequency doubling efficiency. And the temperature control component 20 is located at the bottom of the heat conducting component 30, and the LBO frequency doubling crystal is located at the top of the heat conducting component 30, so it can be ensured that the temperature control component 20 effectively controls the temperature of the LBO frequency doubling crystal. Therefore, the device is not only convenient for achieving the maximum frequency doubling efficiency, but also has a simple and compact structure, occupies less space, and is easy to use.

[0045] It is worth noting that, in this embodiment, Figure 1-Figure 3 and Figure 6 The heat conducting member 30 is detachably connected to the top of the base 10 through the mounting member and the third mounting hole 34. The mounting member can be any structure such as a screw or a bolt, which has a simple structure, low price, is relatively common and convenient for mass production, is not only easy to install, but also has a good fastening effect. It is further explained that in this embodiment, the temperature control unit 20 is a TEC temperature controller. The TEC temperature controller is a commonly used component in the field of temperature control, which is low in price and has an extremely simple principle of use. The temperature monitor in the TEC temperature controller sends temperature information to compare with the reference and generates an error signal, which is amplified and sent to the TEC temperature controller. The TEC temperature controller then heats or cools to change the temperature of the device, and the monitored temperature changes accordingly to complete the cycle. In addition, in this embodiment, in order to accurately control the temperature, the temperature control accuracy value of the selected TEC temperature controller is not greater than 0.01 degrees. In other embodiments, temperature control units 20 with different accuracy values ​​can be selected according to actual needs. It is further explained that in this embodiment, the heat conducting member 30 is made of copper material, which has excellent thermal conductivity, ductility and corrosion resistance, and can quickly and efficiently transfer temperature between the temperature control unit 20 and the frequency doubling member 50. In other embodiments, metals such as brass and tungsten can also be used instead of copper, as long as the material can be guaranteed to have a high thermal conductivity, and no other restrictions are made in this embodiment.

[0046] Considering that it is inconvenient to place the heat conducting member 30 directly on the top of the temperature control unit 20, Figure 3As shown, a placement groove 11 is provided at the top of the base 10, and the placement groove 11 is used to accommodate the temperature control unit 20, and a wiring hole 111 is also provided in the placement groove 11. In this arrangement, since the temperature control unit 20 is arranged in the placement groove 11, it can avoid the temperature control unit 20 from forming a protrusion at the bottom end of the base 10, so that it is convenient to set the heat conducting member 30 at the top of the temperature control unit 20; in addition, since the wiring hole 111 is provided in the placement groove 11, the line of the temperature control unit 20 can be directly connected to the bottom end of the base 10 through the wiring hole 111, which is simple and convenient, and will not cause the line to be entangled.

[0047] For easy installation, the clamping member 40 can be detachably connected to the heat conducting member 30; Figure 4-Figure 6 As shown, a connecting portion 43 is provided on the side of the clamping member 40 away from the second abutting portion 42, and a first mounting hole 431 is provided on the connecting portion 43. The mounting member can detachably mount the clamping member 40 to the top of the heat conducting member 30 through the first mounting hole 431. This structure can facilitate the mounting of the clamping member 40 to the top of the heat conducting member 30, and because it is a detachable connection, it is convenient for subsequent maintenance and replacement of components.

[0048] What needs to be explained here is that Figure 4-Figure 6 As shown, the top surface of the heat conducting member 30 is provided with a placement surface 32 and a connection surface 33, and the height of the connection surface 33 is higher than that of the placement surface 32, and a stepped protrusion is formed between the two. The placement surface 32 is vertically connected to the clamping side wall 31, and the first abutting portion 41 is vertically connected to the second abutting portion 42, so that the first abutting portion 41, the second abutting portion 42, the placement surface 32, and the clamping side wall 31 together enclose a receiving space 44; and the connection portion 43 is also vertically connected to the first abutting portion 41, and forms a right-angle groove with the first abutting portion 41, and the right-angle groove just matches the shape of the stepped protrusion, so that the connection portion 43 is conveniently placed on the connection surface 33; in addition, a second mounting hole 331 is provided on the connection surface 33, and when the first mounting hole 431 is directly opposite to the second mounting hole 331, it can be installed on the heat conducting member 30 through the mounting member clamping member 40, which is simple and convenient. It should be noted here that the mounting parts can be any structure such as screws and bolts, which have simple structure, low price, are relatively common and easy to mass produce. They are not only easy to install, but also have good fastening effect.

[0049] like Figure 5 As shown, the first mounting hole 431 is a waist hole. This structure can ensure that the clamping member 40 has a certain degree of mobility relative to the heat conducting member 30 during installation. Therefore, during the installation process, the clamping degree of the clamping member 40 on the frequency doubling member 50 can be adjusted, and the operation is simple and convenient.

[0050] In addition, to prevent heat loss, Figure 1 and Figure 8As shown, the crystal temperature control device also includes a heat insulating member 60, which is covered on the top of the clamping member 40, and light holes 61 are provided on both sides of the heat insulating member 60 along the length direction, and the light holes 61 are opposite to the two ends of the frequency doubling member 50. By providing the heat insulating member 60 and covering the heat insulating member 60 on the top of the clamping member 40, it is not only possible to prevent the loss of heat, but also to reduce the influence of dust and the external environment on the frequency doubling member 50, thereby ensuring the frequency doubling efficiency of the temperature control unit 20 on the frequency doubling member 50. In addition, the two ends of the frequency doubling member 50 are respectively the input end and the output end, and the two light holes 61 of the heat insulating member 60 are respectively opposite to the input end and the output end, and the fundamental frequency light can be injected into the frequency doubling member 50 through the light hole 61 opposite to the input end, and be ejected through the light hole 61 opposite to the output end, and irradiated on the power detector, so as to observe the frequency doubling efficiency of different temperatures. It is worth noting that the heat insulating member 60 is made of any material capable of blocking heat flow transfer, such as vacuum board, asbestos, and glass fiber.

[0051] To facilitate installation, Figure 1 , Figure 4 and Figure 8 As shown, the heat insulating member 60 is detachably connected to the heat conducting member 30. In this embodiment, a fourth mounting hole 35 is further provided at the top of the heat conducting member 30, and a fifth mounting hole 62 is provided on the heat insulating member 60. When the fourth mounting hole 35 is directly opposite to the fifth mounting hole 62, the heat insulating member 60 can be detachably connected to the heat conducting member 30 through the mounting member, which is convenient to operate. It should be noted here that the mounting member can be any structure such as a screw or a bolt, which has a simple structure, low price, is relatively common and is easy to mass produce, and is not only easy to install, but also has a good fastening effect.

[0052] To prevent the temperature of the temperature control unit 20 from being too high, Figure 2 As shown, a heat sink 70 is disposed at the bottom of the base 10, which can effectively dissipate heat from the temperature control unit 20. It is worth noting that in this embodiment, the heat sink 70 is a fan, which is relatively common and inexpensive.

[0053] To further ensure the heat dissipation effect, Figure 1-Figure 3 As shown, a plurality of heat dissipation fins 12 are arranged at intervals at the bottom end of the base 10. The principle is to increase the heat dissipation area to improve the heat dissipation efficiency, that is, the heat is quickly dispersed to a larger surface area through the heat dissipation fins 12, so that the heat can be absorbed and taken away by the surrounding air more quickly, thereby ensuring the stability of the internal temperature of the temperature control unit 20.

[0054] Combine the following Figure 1-Figure 8 The following describes the assembly and use process of the crystal temperature control device in this embodiment:

[0055] First, place the temperature control unit 20 in the placement groove 11 of the base 10, and the circuit of the temperature control unit 20 can be connected to the bottom end of the base 10 through the wiring hole 111; secondly, install the heat conductor 30 to the top of the base 10, and then install the clamping member 40 to the top of the heat conductor 30, and clamp the frequency doubling member 50 into the accommodating space 44, to ensure that the lower surface and the side surface of the frequency doubling member 50 are tightly fitted to the placement surface 32 and the clamping side wall 31 respectively, and finally install the heat insulation member 60 to the top of the heat conductor 30, and ensure that the heat conductor 30 and the frequency doubling member 50 are covered in the heat insulation member 60, and ensure that the light hole 61 is directly opposite to the two ends of the frequency doubling member 50; finally, install the heat sink 70 at the bottom end of the base 10.

[0056] The fundamental frequency light is injected into the frequency doubling component 50 through the light hole 61 directly opposite to the input end of the frequency doubling component 50, and the frequency doubling light after being output through the light hole 61 directly opposite to the output end is injected onto the power detector, so as to check the output efficiency, and the temperature is adjusted through the temperature control unit 20 to observe the change of the frequency doubling efficiency with temperature, and then find out the temperature that can make the frequency doubling efficiency reach the highest value.

[0057] In summary, the crystal temperature control device in this embodiment is not only compact in structure and occupies a small space, but also can achieve the maximum frequency doubling efficiency by controlling the temperature of the frequency doubling component 50 .

[0058] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A crystal temperature control device, characterized in that: include: A base (10) having a temperature control unit (20) disposed on the top thereof; A heat conducting member (30) is arranged at the top end of the base (10), and a clamping side wall (31) is arranged on a side of the heat conducting member (30) facing away from the base (10); The clamping member (40) has a first abutting portion (41) at its bottom end, the first abutting portion (41) abuts against a side of the heat-conducting member (30) that is away from the base (10), and the clamping member (40) is also provided with a second abutting portion (42), the second abutting portion (42) abuts against the clamping side wall (31), and the first abutting portion (41), the second abutting portion (42), the clamping side wall (31) and the top end of the heat-conducting member (30) together form a receiving space (44); A frequency doubling component (50), the frequency doubling component (50) being an LBO frequency doubling crystal, is arranged in the accommodation space (44).

2. The crystal temperature control device according to claim 1, characterized in that: A placement groove (11) is provided at the top of the base (10), and the placement groove (11) is used to accommodate the temperature control unit (20). A wiring hole (111) is provided in the placement groove (11).

3. The crystal temperature control device according to claim 1, characterized in that: The clamping member (40) is detachably connected to the heat conducting member (30).

4. The crystal temperature control device according to claim 3, characterized in that: A connecting portion (43) is provided on the side of the clamping member (40) facing away from the second abutting portion (42), and a first mounting hole (431) is provided on the connecting portion (43). The mounting member can detachably mount the clamping member (40) to the top end of the heat conducting member (30) through the first mounting hole (431).

5. The crystal temperature control device according to claim 4, characterized in that: The first mounting hole (431) is a waist hole.

6. The crystal temperature control device according to any one of claims 1 to 5, characterized in that: The temperature control accuracy of the temperature control unit (20) is no greater than 0.01 degrees.

7. The crystal temperature control device according to any one of claims 1 to 5, characterized in that: The crystal temperature control device also includes a heat insulating member (60), the heat insulating member (60) is covered on the top of the clamping member (40), and the heat insulating member (60) is provided with light-through holes (61) on both sides along its length direction, and the light-through holes (61) are directly opposite to the two ends of the frequency doubling member (50).

8. The crystal temperature control device according to claim 7, characterized in that: The heat insulating member (60) is detachably connected to the heat conducting member (30).

9. The crystal temperature control device according to any one of claims 1 to 5, characterized in that: A heat sink (70) is provided at the bottom end of the base (10).

10. The crystal temperature control device according to any one of claims 1 to 5, characterized in that: A plurality of heat dissipation fins (12) are arranged at intervals at the bottom end of the base (10).

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