Display module and display device

Abstract

The utility model provides a display module and a display device, and the display module comprises a cover plate; the display panel is arranged on one side of the cover plate, and the display panel is provided with a display area and a binding area; the binding end of the flexible circuit board is arranged on the display panel and located in the binding area; the first buffer layer is arranged between the display panel and the cover plate, and the first buffer layer is located in the binding area; wherein the orthographic projection of at least part of the binding end on the display panel is located in the range of the orthographic projection of the first buffer layer on the display panel. According to the display module, the extrusion stress borne by the display panel can be relieved, the fracture risk of the display module is reduced, the structural reliability and impact resistance of the display module can be enhanced, the service life of the display module is prolonged, the adaptability of the display module to a case made of a soft material is improved, and the display effect is improved. And meanwhile, the performance of the display module and the corresponding display device in the drop test process can be improved, and the production yield of products is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display equipment, and in particular to a display module and a display device. Background Art

[0002] In the field of display devices, the requirements for product lightweight and aesthetics are increasing day by day, so more and more products use plastic casings. However, due to the soft material, plastic casings are prone to deformation in actual applications, which weakens the casing's protection effect on the display module, increases the risk of module damage, and limits the improvement of the product's structural reliability. Utility Model Content

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] To this end, a first aspect of the present disclosure provides a display module.

[0005] A first aspect of the present disclosure provides a display device.

[0006] In view of this, according to a first aspect of an embodiment of the present disclosure, a display module is provided, comprising:

[0007] Cover plate;

[0008] A display panel is arranged on one side of the cover plate, and the display panel has a display area and a binding area;

[0009] A flexible circuit board, wherein a binding end of the flexible circuit board is disposed on the display panel and is located in a binding area;

[0010] A first buffer layer is disposed between the display panel and the cover plate, and the first buffer layer is located in the binding area;

[0011] Wherein, the orthographic projection of at least part of the binding end on the display panel is located within the range of the orthographic projection of the first buffer layer on the display panel.

[0012] In a feasible implementation manner, the orthographic projection of the binding end on the display panel is located within the range of the orthographic projection of the first buffer layer on the display panel.

[0013] In a feasible implementation manner, the flexible circuit board includes:

[0014] A conductive layer, wherein the first binding pin of the binding end is arranged on the conductive layer;

[0015] Wherein, the first buffer layer is arranged between the conductive layer and the display panel; and / or

[0016] The first buffer layer is disposed between the conductive layer and the cover plate.

[0017] In a feasible implementation manner, the flexible circuit board further includes:

[0018] A first insulating layer is disposed on a side of the conductive layer facing the cover plate;

[0019] The second insulating layer is arranged on the side of the conductive layer facing the display panel. The display module also includes a driving chip, which is arranged on the display panel and located in the binding area. The second insulating layer covers the side of the driving chip facing the cover plate.

[0020] In a feasible implementation manner, an orthographic projection of the first buffer layer on the display panel coincides with an orthographic projection of the second insulating layer on the display panel.

[0021] In a feasible implementation manner, the first buffer layer is disposed between the first insulating layer and the cover plate; and / or

[0022] The first buffer layer is disposed between the conductive layer and the second insulating layer.

[0023] In a feasible implementation manner, the first buffer layer and the flexible circuit board are an integrated structure.

[0024] In a feasible implementation manner, the display module further includes:

[0025] A second buffer layer is disposed between the display panel and the cover plate and is located in the binding area;

[0026] The second buffer layer includes a first buffer segment and a second buffer segment. Along the length direction of the binding area, the first buffer segment and the second buffer segment are respectively arranged on both sides of the binding end.

[0027] In a feasible implementation manner, the second buffer layer is made of a plastic material or a rubber material.

[0028] In a feasible implementation manner, part of the first buffer layer is located between the first buffer section and the cover plate; and / or

[0029] Part of the first buffer layer is located between the second buffer section and the cover plate.

[0030] In a feasible implementation manner, the first buffer layer and the second buffer layer are an integrated structure.

[0031] In a possible implementation, the first buffer layer is made of plastic material.

[0032] According to a second aspect of an embodiment of the present disclosure, a display device is provided, including:

[0033] A display module as proposed in any one of the first aspects above.

[0034] Compared with the prior art, the present disclosure includes at least the following beneficial effects: the display module provided by the embodiment of the present disclosure includes a cover plate, a display panel, a flexible circuit board and a first buffer layer, wherein the cover plate and the display panel are stacked, the display panel is arranged on one side of the cover plate, the binding end of the flexible circuit board is arranged on the side of the display panel close to the cover plate, the first buffer layer is arranged between the display panel and the cover plate, the aforementioned binding end and the first buffer layer are both located in the binding area, and at least part of the binding end is located within the range of the first buffer layer's orthographic projection on the display panel, so that based on the aforementioned arrangement, the first buffer layer can cooperate with the binding end to at least partially fill the gap between the display panel and the cover plate in the binding area, thereby reducing the front The size of the gap in the thickness direction of the display module is reduced or the aforementioned gap is eliminated, and then when the display module is applied to a display device, if the casing of the display device is deformed and the display panel is squeezed in the direction close to the cover plate, the deformation of the portion of the display panel corresponding to the binding area can be constrained, and the display module can use the first buffer layer to alleviate the squeezing stress on the display panel, thereby reducing the risk of fracture of the portion of the display module corresponding to the buffer zone, thereby enhancing the structural reliability and impact resistance of the display module, extending the service life of the display module, and improving the adaptability of the display module to a casing with a relatively soft material, and at the same time, it is also beneficial to improve the performance of the display module and the corresponding display device during the drop test, thereby improving the production yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the exemplary embodiments below. The accompanying drawings are only for the purpose of illustrating exemplary embodiments and are not to be considered as limiting the present disclosure. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0036] Figure 1 A schematic structural diagram of a display module of an embodiment provided by the present disclosure at a first viewing angle;

[0037] Figure 2 for Figure 1 A schematic partial enlarged view of a region A in the middle;

[0038] Figure 3 A schematic structural diagram of a display module of an embodiment provided by the present disclosure from a second viewing angle;

[0039] Figure 4 for Figure 3 Schematic partial enlarged view of area B in the middle;

[0040] Figure 5 A schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure;

[0041] Figure 6 for Figure 5 A schematic cross-sectional view of the flexible circuit board along the CC direction shown in FIG.

[0042] Figure 7 A schematic structural diagram of a display module according to another embodiment of the present disclosure;

[0043] Figure 8 for Figure 7 Schematic partial enlarged view of area D in the middle;

[0044] Fig. 9 for Figure 5 Another schematic cross-sectional view of the flexible circuit board along the CC direction shown in FIG.

[0045] Fig.10 for Figure 1 Another schematic partial enlarged view of region A;

[0046] Fig.11 for Fig.10 A schematic cross-sectional view of the display module along the EE direction shown in FIG.

[0047] Fig.12 for Fig.10 A schematic cross-sectional view of the display module along the FF direction shown in FIG.

[0048] Fig.13 A schematic structural diagram of a first buffer layer according to an embodiment of the present disclosure;

[0049] Fig.14 A schematic diagram of the connection structure of a first buffer layer and a second buffer layer of an embodiment provided in the present disclosure.

[0050] in, Figures 1 to 14 The corresponding relationship between the reference numerals and the component names is as follows:

[0051] 100 cover plate; 200 display panel; 300 flexible circuit board; 400 first buffer layer; 500 driver chip; 600 second buffer layer;

[0052] 310 conductive layer; 320 first insulating layer; 330 second insulating layer;

[0053] 610 first buffer section; 620 second buffer section;

[0054] 201 display area; 202 binding area;

[0055] 301 Binding End. DETAILED DESCRIPTION

[0056] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0057] like Figures 1 to 14 As shown, according to the first aspect of an embodiment of the present disclosure, a display module is proposed, comprising: a cover plate 100; a display panel 200, which is arranged on one side of the cover plate 100, and the display panel 200 has a display area 201 and a binding area 202; a flexible circuit board 300, and the binding end 301 of the flexible circuit board 300 is arranged on the display panel 200 and is located in the binding area 202; a first buffer layer 400, which is arranged between the display panel 200 and the cover plate 100, and the first buffer layer 400 is located in the binding area 202; wherein, at least part of the binding end 301 on the display panel 200 is located within the range of the orthographic projection of the first buffer layer 400 on the display panel 200.

[0058] The display module provided by the embodiment of the present disclosure includes a cover plate 100, a display panel 200, a flexible circuit board 300 and a first buffer layer 400, wherein the cover plate 100 and the display panel 200 are stacked, the display panel 200 is arranged on one side of the cover plate 100, the binding end 301 of the flexible circuit board 300 is arranged on the side of the display panel 200 close to the cover plate 100, and the first buffer layer 400 is arranged between the display panel 200 and the cover plate 100, the aforementioned binding end 301 and the first buffer layer 400 are both located in the binding area 202, and at least part of the binding end 301 on the display panel 200 is located within the range of the first buffer layer 400 on the display panel 200. Based on the aforementioned arrangement, the first buffer layer 400 can cooperate with the binding end 301 to at least partially fill the display area 202. The gap between the display panel 200 and the cover plate 100 is reduced, the size of the aforementioned gap in the thickness direction of the display module is reduced or the aforementioned gap is eliminated. Further, when the display module is applied to a display device, if the housing of the display device is deformed and the display panel 200 is squeezed in the direction close to the cover plate 100, the deformation amount of the portion of the display panel 200 corresponding to the binding area 202 can be constrained, and the display module can use the first buffer layer 400 to alleviate the squeezing stress on the display panel 200, thereby reducing the risk of partial fracture of the display module corresponding to the buffer zone, thereby enhancing the structural reliability and impact resistance of the display module, extending the service life of the display module, and improving the adaptability of the display module to a housing with a relatively soft material. At the same time, it is also beneficial to improve the performance of the display module and the corresponding display device during the drop test, thereby improving the production yield of the product.

[0059] It should be noted that in the drawings of the specification of the present disclosure, direction line L1, direction line W1 and direction line H are respectively used to schematically illustrate the length direction, width direction and thickness direction of the display module; direction line L2 and direction line W2 are respectively used to schematically illustrate the length direction and width direction of the binding area 202.

[0060] It is understandable that the display module provided by the present disclosure can be applied to a display device or used as a component of a display device, and the aforementioned display device can be but not limited to a mobile communication terminal, a display, etc. The aforementioned display device may include a housing, and the display module provided by the present disclosure may be arranged in the aforementioned housing, so that the housing is used to provide structural protection for the display module and reduce the risk of damage to the display module. The aforementioned housing may be made of but not limited to plastic material.

[0061] It can be understood that the display panel 200 of the display module provided by the present disclosure can be but not limited to an LCD (Liquid Crystal Display) panel; the display panel 200 can include a stacked color filter substrate and a driving substrate, the driving substrate has a portion extending beyond the color filter substrate, the aforementioned portion extending beyond the color filter substrate can be provided with circuit elements, such as binding pins for connecting the flexible circuit board 300, so that the aforementioned binding area 202 can be an area corresponding to the aforementioned portion extending beyond the color filter substrate, and the aforementioned display area 201 can be an area corresponding to the aforementioned color filter substrate.

[0062] It should be noted that the portion of the display panel 200 corresponding to the binding area 202 usually only has the driving substrate and there is a gap between this portion and the cover plate 100, so that the portion of the display panel 200 in the binding area 202 is often of low strength and prone to stress concentration. In conventional technology, silicone glue is usually applied to the portion of the display panel corresponding to the binding area. The silicone glue can be supported between the cover plate and the display panel, thereby relieving the force when the display panel is squeezed. However, since there is also a certain amount of gap between the binding end of the flexible circuit board and the cover plate, when the display device undergoes a whole-machine drop test or is subjected to an impact, if the housing is deformed and squeezes the display panel close to the cover plate, the risk of the portion of the display panel corresponding to the binding end breaking is high.

[0063] Compared with the aforementioned conventional technology, the display module provided by the embodiment of the present disclosure can, based on the aforementioned setting, make the first buffer layer 400 and the binding end 301 at least partially overlap along the thickness direction of the display module, so that the first buffer layer 400 is used to at least partially fill the gap between the binding end 301 and the cover plate 100, so as to improve the stress distribution of the display panel 200 when it is squeezed and alleviate the force on the display module, while limiting the deformation of the portion of the display panel 200 corresponding to the binding end 301, reducing the risk of fracture of the portion of the display module corresponding to the buffer zone, and can enhance the structural reliability and impact resistance of the display module, extend the service life of the display module, and also help to improve the performance of the display module and the corresponding display device during the drop test, thereby improving the production yield of the product.

[0064] It is understandable that the structure of the flexible circuit board 300 is relatively soft and can be easily bent in practical applications to achieve different shapes. Figure 1 and Figure 5 The structure of the flexible circuit board 300 in the unfolded state is schematically shown in FIG. Figure 3 , Figure 4 , Figure 7 and Figure 8 The structure of the flexible circuit board 300 in a bent state is schematically shown, so that the flexible circuit board 300 is conducive to realizing a narrow frame of the display device and improving the aesthetics of the product.

[0065] It can be understood that the orthographic projection of at least part of the binding end 301 on the display panel 200 is located within the range of the orthographic projection of the first buffer layer 400 on the display panel 200. The orthographic projection of the binding end 301 on the display panel 200 may be completely located within the range of the orthographic projection of the first buffer layer 400 on the display panel 200. The orthographic projection of the binding end 301 on the display panel 200 may coincide with the orthographic projection of the first buffer layer 400 on the display panel 200. The orthographic projection of the binding end 301 on the display panel 200 may completely intersect with the orthographic projection of the first buffer layer 400 on the display panel 200. This ensures that the first buffer layer 400 and the binding end 301 at least partially overlap along the thickness direction of the display module.

[0066] It can be understood that, considering the filling effect of the first buffer layer 400 on the gap between the binding end 301 and the panel, the thickness of the first buffer layer 400 can be equal to the difference between the gap between the display panel 200 and the cover plate 100 in the binding area 202 and the thickness of the binding end 301, so that after the display module is assembled, the first buffer layer 400 can cooperate with the binding end 301 to be supported between the cover plate 100 and the display panel 200, thereby more reliably limiting the deformation of the part of the display panel 200 corresponding to the binding end 301, and improving the first buffer layer 400. The effect of alleviating extrusion stress reduces the risk of fracture of the portion of the display module corresponding to the buffer zone.

[0067] It is understandable that, considering the stress relief effect of the first buffer layer 400, in practical applications, the first buffer layer 400 can be made of a material with good flexibility or elasticity, or a material with good supporting performance. For example, the first buffer layer 400 can be made of a plastic material or a rubber material, such as PET (Polyethyleneterephthalate) or foam or silicone.

[0068] It should be noted that, when the material of the first buffer layer 400 has good flexibility or elasticity, for example, when the first buffer layer 400 is made of foam or silicone, the thickness of the first buffer layer 400 in the free state can be slightly greater than the difference between the gap between the display panel 200 and the cover plate 100 in the binding area 202 and the thickness of the binding end 301. Accordingly, after the display module is assembled, the first buffer layer 400 can remain in a compressed state, thereby improving the support effect on the display panel 200. It can be understood that the aforementioned free state is also the state of the first buffer layer 400 when it is not affected by external force.

[0069] In some examples, the orthographic projection of the binding end 301 on the display panel 200 is located within the range of the orthographic projection of the first buffer layer 400 on the display panel 200 .

[0070] In this technical solution, the orthographic projection of the binding end 301 on the display panel 200 can be set to be within the range of the orthographic projection of the first buffer layer 400 on the display panel 200, that is, the orthographic projection of the binding end 301 on the display panel 200 can be completely within the range of the orthographic projection of the first buffer layer 400 on the display panel 200, or coincide with the orthographic projection of the first buffer layer 400 on the display panel 200. Based on the above setting, it can be ensured that the first buffer layer 400 fully covers the binding end 301, avoiding a large gap between the binding end 301 and the cover plate 100, thereby more reliably limiting the deformation of the part of the display panel 200 corresponding to the binding end 301, reducing the risk of fracture of the part of the display module corresponding to the buffer zone, and enhancing the structural reliability and impact resistance of the display module.

[0071] like Figure 4 and Figure 8 As shown, in some examples, the flexible circuit board 300 includes: a conductive layer 310, and a first binding pin of the binding end 301 is arranged on the conductive layer 310; wherein the first buffer layer 400 is arranged between the conductive layer 310 and the display panel 200; and / or the first buffer layer 400 is arranged between the conductive layer 310 and the cover plate 100.

[0072] In this technical solution, the flexible circuit board 300 may include a conductive layer 310, and the first binding pin of the flexible circuit board 300 may be arranged on the conductive layer 310, so as to facilitate the binding of the flexible circuit board 300 to the display panel 200. It can be understood that a second binding pin may be arranged on the display panel 200, and the aforementioned first binding pin is connected to the aforementioned second binding pin to facilitate signal transmission between the flexible circuit board 300 and the display panel 200.

[0073] Correspondingly, the aforementioned first buffer layer 400 can be arranged between the aforementioned conductive layer 310 and the display panel 200, or the aforementioned first buffer layer 400 can be arranged between the aforementioned conductive layer 310 and the cover plate 100, so that when the portion of the display panel 200 corresponding to the binding end 301 is compressed and produces a deformation trend close to the cover plate 100, the first buffer layer 400 can support the display panel 200, constrain the deformation of the display panel 200 and alleviate the force on the display panel 200, thereby reducing the risk of breakage of the portion of the display panel 200 corresponding to the binding end 301.

[0074] It is understandable that a first buffer layer 400 can be provided between the conductive layer 310 and the display panel 200 and between the conductive layer 310 and the cover plate 100, so that the display module can utilize each first buffer layer 400 to perform multi-level buffering on the force of the display panel 200, which is beneficial to further reduce the probability of damage to the display panel 200.

[0075] It is understandable that the aforementioned conductive layer 310 can be made of a metal material, for example, a copper material, so as to ensure the electrical signal transmission performance of the conductive layer 310 .

[0076] like Figures 4 to 9 and Fig.11 As shown, in some examples, the flexible circuit board 300 also includes: a first insulating layer 320, which is arranged on the side of the conductive layer 310 facing the cover plate 100; a second insulating layer 330, which is arranged on the side of the conductive layer 310 facing the display panel 200. The display module also includes a driving chip 500, which is arranged on the display panel 200 and located in the binding area 202. The second insulating layer 330 covers the side of the driving chip 500 facing the cover plate 100.

[0077] In this technical solution, the flexible circuit board 300 may also include a first insulating layer 320 and a second insulating layer 330, wherein the first insulating layer 320 is arranged on the side of the conductive layer 310 facing the cover plate 100, so that the first insulating layer 320 can provide insulation protection for the conductive layer 310, and the second insulating layer 330 is arranged on the side facing the display panel 200 and is used to cover the driving chip 500, so that the second insulating layer 330 can provide insulation protection for the driving chip 500, thereby improving the operating stability and reliability of the display module in actual applications and reducing the failure probability of the display module.

[0078] In some examples, an orthographic projection of the first buffer layer 400 on the display panel 200 coincides with an orthographic projection of the second insulating layer 330 on the display panel 200 .

[0079] In this technical solution, the orthographic projection of the first buffer layer 400 on the display panel 200 can be set to coincide with the orthographic projection of the second insulating layer 330 on the display panel 200, that is, along the width direction of the binding area 202, the sizes of the first buffer layer 400 and the second insulating layer 330 are consistent, and along the length direction of the binding area 202, the sizes of the first buffer layer 400 and the second buffer layer 600 are consistent. Based on the above-mentioned setting, the first buffer layer 400 and the second insulating layer 330 can maintain a high degree of overlap in the thickness direction of the display module, thereby avoiding the generation of a stress concentration point between the first conversion layer and the binding end 301, which is beneficial to further improve the stress distribution of the display module when it is squeezed, reduce the risk of damage to the display module, and make the structure of the display module more reliable.

[0080] like Figure 6 and Fig. 9 As shown, in some examples, the first buffer layer 400 is disposed between the first insulating layer 320 and the cover plate 100 ; and / or the first buffer layer 400 is disposed between the conductive layer 310 and the second insulating layer 330 .

[0081] In this technical solution, the aforementioned first buffer layer 400 can be arranged between the first insulating layer 320 and the cover plate 100, so that when the portion of the display panel 200 corresponding to the binding end 301 is compressed and produces a deformation trend close to the cover plate 100, the first buffer layer 400 can support the display panel 200, constrain the deformation of the display panel 200 and alleviate the force on the display panel 200, reduce the risk of the portion of the display panel 200 corresponding to the binding end 301 breaking, and at the same time avoid the influence of the first buffer layer 400 on the insulation effect of each insulating layer, providing reliable guarantee for the smooth operation of the display module.

[0082] Alternatively, the aforementioned first buffer layer 400 can be arranged between the conductive layer 310 and the second insulating layer 330, so that when the portion of the display panel 200 corresponding to the binding end 301 is compressed and produces a deformation tendency in the direction close to the cover plate 100, the first buffer layer 400 can support the display panel 200, constrain the deformation of the display panel 200 and alleviate the force on the display panel 200, thereby reducing the risk of breakage of the portion of the display panel 200 corresponding to the binding end 301, and at the same time, it can also ensure the insulation protection effect of the second insulating layer 330 on the driving chip 500, providing reliable guarantee for the smooth operation of the display module.

[0083] It can be understood that a first buffer layer 400 can be arranged between the first insulating layer 320 and the cover plate 100 and between the conductive layer 310 and the second insulating layer 330, so that the display module can utilize each first buffer layer 400 to buffer the force of the display panel 200 at multiple levels, which is beneficial to further reduce the probability of damage to the display panel 200.

[0084] In some examples, the first buffer layer 400 and the flexible circuit board 300 are an integrated structure.

[0085] In this technical solution, the first buffer layer 400 and the flexible circuit board 300 can be set as an integrated structure, that is, the first buffer layer 400 and the flexible circuit board 300 can be made as a whole, thereby avoiding the setting of the first buffer layer 400 after the flexible circuit board 300 is bound, which is beneficial to reducing the processing difficulty of the display module.

[0086] Taking the flexible circuit board 300 having the aforementioned conductive layer 310, the first insulating layer 320 and the second insulating layer 330 as an example, the first buffer layer 400, the conductive layer 310, the first insulating layer 320 and the second insulating layer 330 can all be coated with adhesive on one side. Figure 4 and Figure 6 As shown, when the first buffer layer 400 is disposed between the first insulating layer 320 and the cover plate 100, the first buffer layer 400, the first insulating layer 320, the conductive layer 310, and the second insulating layer 330 are stacked in sequence, the adhesive side of the first buffer layer 400 is adhered to the adhesive-free side of the first insulating layer 320, the adhesive side of the first insulating layer 320 is adhered to the adhesive-free side of the conductive layer 310, and the adhesive side of the conductive layer 310 is adhered to the adhesive-free side of the second insulating layer 330. Accordingly, in the process of binding the flexible circuit board 300, the adhesive-free side of the first buffer layer 400 faces the cover plate 100, and the adhesive side of the second insulating layer 330 faces the display panel 200 and is adhered to the driving chip 500; as shown in FIG. Figure 8 and Fig. 9As shown, when the first buffer layer 400 is disposed between the conductive layer 310 and the second insulating layer 330, the first insulating layer 320, the conductive layer 310, the first buffer layer 400 and the second insulating layer 330 are stacked in sequence, the adhesive side of the first insulating layer 320 is attached to the adhesive-free side of the conductive layer 310, the adhesive side of the conductive layer 310 is attached to the adhesive-free side of the first buffer layer 400, and the adhesive side of the first buffer layer 400 is attached to the adhesive-free side of the second insulating layer 330. Accordingly, in the process of binding the flexible circuit board 300, the adhesive-free side of the first insulating layer 320 faces the cover plate 100, and the adhesive side of the second insulating layer 330 faces the display panel 200 and is attached to the driving chip 500. The adhesive-free side refers to the side of each layer opposite to the adhesive side.

[0087] like Figure 2 , Fig.12 and Fig.14 As shown, in some examples, the display module also includes: a second buffer layer 600, which is arranged between the display panel 200 and the cover plate 100 and is located in the binding area 202; wherein the second buffer layer 600 includes a first buffer segment 610 and a second buffer segment 620, and along the length direction of the binding area 202, the first buffer segment 610 and the second buffer segment 620 are respectively arranged on both sides of the binding end 301.

[0088] In this technical solution, the display module may also include a second buffer layer 600 arranged between the display panel 200 and the cover plate 100, wherein the second buffer layer 600 is located in the binding area 202 and has a first buffer segment 610 and a second buffer segment 620, wherein along the length direction of the binding area 202, the first buffer segment 610 and the second buffer segment 620 are respectively arranged on both sides of the binding end 301, so that based on the above-mentioned setting, the display module can use the second buffer layer 600 to support the area of ​​the display panel 200 in the binding area 202 where the binding end 301 is not provided, and then the second buffer layer 600 can cooperate with the first buffer layer 400 to perform deformation constraint on different positions of the display panel 200 in the binding area 202. When the display panel 200 in the binding area 202 is squeezed, it can more reliably limit the deformation of the display panel 200 and improve the stress distribution of the display panel 200, thereby further reducing the risk of breakage and damage of the display panel 200.

[0089] In some examples, the second buffer layer 600 is made of a plastic material or a rubber material.

[0090] In this technical solution, the second buffer layer 600 can be made of plastic material, so that the second buffer layer 600 can have good supporting performance and elasticity, which is beneficial to ensure the supporting effect of the second buffer layer 600 on the display panel 200 and enhance the stress relief effect of the second buffer layer 600.

[0091] For example, the second buffer layer 600 can be made of PET or foam. It is understandable that when the second buffer layer 600 is made of PET, the second buffer layer 600 can have better support performance; when the second buffer layer 600 is made of foam, the second buffer layer 600 can have good elasticity, thereby enhancing the stress relief effect of the second buffer layer 600.

[0092] Alternatively, in this technical solution, the second buffer layer 600 can be made of rubber material, which can also ensure the supporting performance and elasticity of the second buffer layer 600, thereby facilitating the supporting effect of the second buffer layer 600 on the display panel 200 and enhancing the stress relief effect of the second buffer layer 600.

[0093] Exemplarily, the second buffer layer 600 may be made of silicone adhesive. Accordingly, during the processing of the display module, the second supporting layer may be disposed on the display panel 200 by dispensing, and the silicone adhesive may be supported between the display panel 200 and the cover plate 100 after curing.

[0094] like Fig.12 As shown, in some examples, a portion of the first buffer layer 400 is located between the first buffer segment 610 and the cover plate 100 ; and / or a portion of the first buffer layer 400 is located between the second buffer segment 620 and the cover plate 100 .

[0095] In this technical solution, a portion of the first buffer layer 400 can be arranged between the first buffer segment 610 and the cover plate 100, so that the first buffer layer 400 and the first buffer segment 610 can be stacked along the thickness direction of the display module and reduce the gap amount at the corresponding position. Further, when the corresponding area of ​​the display panel 200 is squeezed, the display module can use the first buffer layer 400 and the first buffer segment 610 to gradually alleviate the squeezing stress on the display panel 200, further enhance the structural reliability of the display module, and reduce the risk of breakage of the display panel 200.

[0096] Alternatively, a portion of the first buffer layer 400 may be arranged between the second buffer segment 620 and the cover plate 100, so that the first buffer layer 400 and the second buffer segment 620 may be stacked along the thickness direction of the display module and reduce the gap amount at the corresponding position. Further, when the corresponding area of ​​the display panel 200 is squeezed, the display module may utilize the first buffer layer 400 and the second buffer segment 620 to gradually alleviate the squeezing stress exerted on the display panel 200, thereby further enhancing the structural reliability of the display module and reducing the risk of breakage of the display panel 200.

[0097] It can be understood that a portion of the first buffer layer 400 may be disposed between the first buffer segment 610 and the cover plate 100 and between the second buffer segment 620 and the cover plate 100 .

[0098] It can be understood that, in the case where part of the first buffer layer 400 is located between the first buffer section 610 and the cover plate 100, and part of the first buffer layer 400 is located between the second buffer section 620 and the cover plate 100, considering the gap filling effect of the first buffer layer 400 and the second buffer layer 600, when the thickness of the first buffer layer 400 can be equal to the difference between the gap amount between the display panel 200 and the cover plate 100 in the binding area 202 and the thickness of the binding end 301, the thickness of the first buffer section 610 and the second buffer section 620 can be set to be equal to the thickness of the binding end 301, so that the first buffer layer 400 can cooperate with the second buffer layer 600 to fully fill the gap at the corresponding area between the display panel 200 and the cover plate 100. At the same time, the first buffer layer 400 and the second buffer layer 600 can be set to have a uniform thickness structure, which is conducive to reducing the difficulty of molding the first buffer layer 400 and the second buffer layer 600.

[0099] It should be noted that in order to facilitate the display of the structure of the display module, Fig.11 and Fig.12 Schematically illustrate the cross section of the display module when the flexible circuit board 300 is in a bent state.

[0100] like Fig.14 As shown, in some examples, the first buffer layer 400 and the second buffer layer 600 are an integral structure.

[0101] In this technical solution, the first buffer layer 400 and the second buffer layer 600 can be an integrated structure, that is, the first buffer layer 400 and the second buffer layer 600 can be made as a whole, which is beneficial to improve the integrity of the first buffer layer 400 and the second buffer layer 600, and further enhance the stress relief effect on the display panel 200, and is also beneficial to reduce the processing difficulty of the display module and improve the processing efficiency of the display module.

[0102] like Fig.14 As shown, taking the case where part of the first buffer layer 400 is located between the first buffer segment 610 and the cover plate 100, and part of the first buffer layer 400 is located between the second buffer segment 620 and the cover plate 100 as an example, the first buffer layer 400, the first buffer segment 610, and the second buffer segment 620 can all be glued on one side, and the glue-free sides of the first buffer segment 610 and the second buffer segment 620 are both attached to the glue-attached side of the first buffer layer 400, the glue-free side of the first buffer layer 400 is used to be arranged toward the cover plate 100, and the glue-attached sides of the first buffer segment 610 and the second buffer segment 620 are both used to be attached to the display panel 200. The aforementioned glue-free side refers to the side of each layer opposite to the glue-attached side.

[0103] In some examples, the first buffer layer 400 is made of a plastic material.

[0104] In this technical solution, the first buffer layer 400 can be made of plastic material, so that the first buffer layer 400 can have good supporting performance or elasticity, which is beneficial to ensure the supporting effect of the first buffer layer 400 on the display panel 200 and enhance the stress relief effect of the first buffer layer 400.

[0105] For example, the first buffer layer 400 may be made of PET or foam. It is understood that when the first buffer layer 400 is made of PET, the first buffer layer 400 may have better support performance; when the first buffer layer 400 is made of foam, the first buffer layer 400 may have good elasticity, thereby enhancing the stress relief effect of the first buffer layer 400.

[0106] It is understandable that, when the display module includes the aforementioned second buffer layer 600, the first buffer layer 400 and the second buffer layer 600 can be made of the same material or different materials, which can be set in combination with actual needs, and no further restrictions are made here. For example, the first buffer layer 400 can be made of PET, and the second buffer layer 600 can be made of foam.

[0107] According to a second aspect of an embodiment of the present disclosure, a display device is provided, comprising: a display module as provided in any one of the above-mentioned first aspects.

[0108] The display device provided in the embodiment of the present disclosure may include a display module as provided in any one of the first aspects. For example, the display device may also include a housing, and the display module may be disposed in the housing, so that the housing provides structural protection for the display module and reduces the risk of damage to the display module.

[0109] The display module includes a cover plate 100, a display panel 200, a flexible circuit board 300 and a first buffer layer 400, wherein the cover plate 100 and the display panel 200 are stacked, the display panel 200 is arranged on one side of the cover plate 100, the binding end 301 of the flexible circuit board 300 is arranged on the side of the display panel 200 close to the cover plate 100, and the first buffer layer 400 is arranged between the display panel 200 and the cover plate 100, the binding end 301 and the first buffer layer 400 are both located in the binding area 202, and at least part of the binding end 301 is located in the display panel 200 The orthographic projection is located within the range of the first buffer layer 400 on the display panel 200. Based on the above-mentioned setting, the first buffer layer 400 can cooperate with the binding end 301 to at least partially fill the display panel in the binding area 202. The gap between the cover plate 100 and the display module 200 is reduced, and the size of the aforementioned gap in the thickness direction of the display module is reduced or the aforementioned gap is eliminated. Further, when the display module is applied to a display device, if the housing of the display device is deformed and the display panel 200 is squeezed in the direction close to the cover plate 100, the deformation amount of the portion of the display panel 200 corresponding to the binding area 202 can be constrained, and the display module can use the first buffer layer 400 to alleviate the squeezing stress on the display panel 200, thereby reducing the risk of partial fracture of the display module corresponding to the buffer zone, thereby enhancing the structural reliability and impact resistance of the display module, extending the service life of the display module, and improving the adaptability of the display module to a housing with a relatively soft material. At the same time, it is also beneficial to improve the performance of the display module and the corresponding display device during the drop test, thereby improving the production yield of the product.

[0110] It can be understood that the aforementioned housing is made of, but not limited to, plastic material.

[0111] In addition, since the display device proposed in the embodiment of the present disclosure may include a display module as proposed in any one of the first aspects above, it has all the beneficial effects of the display module and will not be elaborated here.

[0112] In the present disclosure, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise expressly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0113] In the description of the present disclosure, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, should not be understood as a limitation on the present disclosure.

[0114] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0115] The above are only preferred embodiments of the present disclosure and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A display module, characterized in that: include: Cover plate; A display panel is arranged on one side of the cover plate, and the display panel has a display area and a binding area; A flexible circuit board, wherein a binding end of the flexible circuit board is disposed on the display panel and is located in the binding area; A first buffer layer is disposed between the display panel and the cover plate, and the first buffer layer is located in the binding area; Wherein, at least a portion of the binding ends have an orthographic projection on the display panel located within a range of the orthographic projection of the first buffer layer on the display panel.

2. The display module according to claim 1, characterized in that: The orthographic projection of the binding end on the display panel is located within the range of the orthographic projection of the first buffer layer on the display panel.

3. The display module according to claim 1, characterized in that: The flexible circuit board comprises: A conductive layer, wherein the first binding pin of the binding end is arranged on the conductive layer; Wherein, the first buffer layer is disposed between the conductive layer and the display panel; and / or The first buffer layer is disposed between the conductive layer and the cover plate.

4. The display module according to claim 3, characterized in that: The flexible circuit board also includes: A first insulating layer, disposed on a side of the conductive layer facing the cover plate; The second insulating layer is arranged on the side of the conductive layer facing the display panel. The display module also includes a driving chip, which is arranged on the display panel and located in the binding area. The second insulating layer covers the side of the driving chip facing the cover plate.

5. The display module according to claim 4, characterized in that: An orthographic projection of the first buffer layer on the display panel overlaps with an orthographic projection of the second insulating layer on the display panel.

6. The display module according to claim 4, characterized in that: The first buffer layer is disposed between the first insulating layer and the cover plate; and / or The first buffer layer is disposed between the conductive layer and the second insulating layer.

7. The display module according to claim 1, characterized in that: The first buffer layer and the flexible circuit board are an integrated structure.

8. The display module according to any one of claims 1 to 7, characterized in that: Also includes: A second buffer layer is disposed between the display panel and the cover plate and is located in the binding area; The second buffer layer includes a first buffer segment and a second buffer segment. Along the length direction of the binding area, the first buffer segment and the second buffer segment are respectively arranged on both sides of the binding end.

9. The display module according to claim 8, characterized in that: The second buffer layer is made of plastic material or rubber material.

10. The display module according to claim 8, characterized in that: Part of the first buffer layer is located between the first buffer section and the cover plate; and / or Part of the first buffer layer is located between the second buffer segment and the cover plate.

11. The display module according to claim 10, characterized in that: The first buffer layer and the second buffer layer are an integrated structure.

12. The display module according to any one of claims 1 to 7, characterized in that: The first buffer layer is made of plastic material.

13. A display device, characterized in that: include: The display module according to any one of claims 1 to 12.

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