Wafer surface resistance detection device

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a wafer surface resistance detection device. The wafer surface resistance detection device comprises a base, a bearing part, a first driving part, a second driving part and a detection assembly. The detection assembly comprises a first detection piece and a second detection piece. When the wafer surface resistance detection device is used for detection, under the action of the first driving piece and the second driving piece, the wafer can move to the detection position and rotate around the axis of the wafer, and the resistance of each part of the surface of the wafer can be detected through the rotation of the wafer and the reciprocating motion of the first detection piece or the second detection piece along the second direction. Only one of the first detection piece and the second detection piece works, that is, the corresponding first detection piece or the second detection piece can be selected for detection according to wafers with different surface treatments, different detection pieces do not need to be replaced and installed, and the detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer surface resistance detection device. Background Art

[0002] Measuring the surface resistivity of a wafer can be used to evaluate whether the wafer meets specific electrical performance requirements. For example, when manufacturing a wafer, the wafer is required to have a specific resistivity, which can be determined by measuring the resistivity of the wafer surface. In addition, the surface resistivity of the wafer can also be used to assist in determining defects in the wafer. Defects can affect the electrical properties of the wafer, so defects in the wafer can be identified by measuring the surface resistivity of the wafer and appropriate adjustments can be made during processing.

[0003] For wafers with different surface treatments, corresponding probes need to be replaced to detect the resistance at different locations on the wafer surface. However, in the prior art, each device can only be installed with one probe, and it is impossible to detect the resistance at different locations on the wafer surface. When measuring the resistance at different locations on the wafer surface, the probes need to be replaced frequently, resulting in low work efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer surface resistance detection device, which is compatible with two probes, the two probes can be switched for use, and can detect the resistance of wafer surfaces with different surface treatments, without the need to frequently replace the probes, thereby helping to improve detection efficiency.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A wafer surface resistance detection device is provided, which is used to detect the resistance value at various locations on the wafer surface. The wafer surface resistance detection device comprises:

[0007] Base;

[0008] A carrier, the carrier is arranged on the base and moves along a first direction, and the carrier is used for placing the wafer;

[0009] a first driving member, wherein the first driving member can drive the bearing member to move along the first direction;

[0010] A second driving member; the second driving member can drive the carrier to rotate around its central axis to drive the wafer to rotate;

[0011] A detection component, the detection component includes a first detection component and a second detection component, the first detection component and the second detection component are both arranged on the base for movement along the second direction, when the supporting component moves along the first direction, the two end points of the diameter of the wafer can pass through the detection end of the first detection component in sequence or pass through the detection end of the second detection component in sequence, the first detection component and the second detection component are both used to detect the resistance at various locations on the surface of the wafer.

[0012] Preferably, the detection component comprises:

[0013] A mounting member, the mounting member being arranged on the base;

[0014] A first connecting member and a second connecting member, wherein the first connecting member and the second connecting member are both arranged on the mounting member, the first connecting member is provided with a first hole, and the detection end of the first detection member is placed in the first hole; the second connecting member is provided with a second hole, and the detection end of the second detection member is placed in the second hole.

[0015] Preferably, the detection component further comprises:

[0016] A first abutment member and a second abutment member; the first abutment member and the second abutment member are respectively arranged on the first connecting member and the second connecting member;

[0017] a first cam and a second cam, wherein the first cam can abut against the first abutting member, and the second cam can abut against the second abutting member;

[0018] A third driving member, the third driving member is connected to a connecting shaft, the first cam and the second cam are sequentially sleeved on the connecting shaft, when the first cam abuts against the first abutting member, the third driving member can drive the first cam to rotate, the first cam abuts against the first abutting member to drive the first connecting member to move along the second direction; when the second cam abuts against the second abutting member, the third driving member can drive the second cam to rotate, the second cam abuts against the second abutting member to drive the second connecting member to reciprocate along the second direction.

[0019] Preferably, the detection assembly further comprises a support member, wherein the support member is arranged on the base, the third driving member is arranged on the support member, and the support member is provided with a through hole for the connecting shaft to pass through.

[0020] Preferably, the detection component also includes a fourth driving member and a fifth driving member, and the fourth driving member and the fifth driving member are both arranged on the mounting member. In the second direction, the fourth driving member can drive the first connecting member to move to separate the first connecting member from the first cam; the fifth driving member can drive the second connecting member to move to separate the second connecting member from the second cam.

[0021] Preferably, the detection assembly further comprises a first slide rail and a second slide rail, a first slider is slidably provided on the first slide rail, a second slider is slidably provided on the second slide rail, the first connecting member is connected to the first slider, and the second connecting member is connected to the second slider.

[0022] Preferably, the detection assembly further includes a first limiting member and a second limiting member, wherein the first limiting member and the second limiting member are respectively used for limiting the first connecting member and the second connecting member along the second direction.

[0023] Preferably, the wafer surface resistance detection device further comprises a linear guide rail and a third slider, wherein the third slider is slidably arranged on the linear guide rail, and the first driving member can drive the third slider to slide to drive the wafer to move.

[0024] Preferably, the wafer surface resistance detection device further comprises a placement member, wherein the placement member is connected to the third slider, the second driving member is placed on the placement member, and the supporting member is connected to an output end of the second driving member.

[0025] Preferably, a groove is provided on the carrier, and the groove is used for placing a suction pen of the wafer, and the suction pen is used to adsorb the back side of the wafer.

[0026] Beneficial effects of the utility model:

[0027] The wafer surface resistance detection device provided by the utility model includes a base, a bearing, a first driving member, a second driving member and a detection assembly. The bearing is arranged on the base and moves along the first direction, and the bearing is used for placing the wafer; the first driving member can drive the bearing to move along the first direction; the second driving member can drive the bearing to rotate around its central axis to drive the wafer to rotate; the detection assembly includes a first detection member and a second detection member, and the first detection member and the second detection member are both arranged on the base and move along the second direction. When the bearing moves along the first direction, the two end points of the diameter of the wafer can pass through the detection end of the first detection member or the detection end of the second detection member in sequence, and the first detection member and the second detection member are both used to detect the resistance at various places on the surface of the wafer. When the wafer surface resistance detection device is performing detection, under the action of the first driving member and the second driving member, the wafer can move to the detection position and rotate around its own axis. Through the rotation of the wafer and the reciprocating movement of the first detection member or the second detection member along the second direction, the resistance at various places on the surface of the wafer can be detected. Only one of the first detection component and the second detection component is working, that is, according to the wafers with different surface treatments, the corresponding first detection component or the second detection component can be selected for detection without replacing and installing different detection components, thereby improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of a wafer surface resistance detection device provided by an embodiment of the utility model;

[0029] Figure 2 It is a structural schematic diagram of the detection component provided by an embodiment of the utility model;

[0030] Figure 3 is another view of the detection assembly provided by the embodiment of the utility model;

[0031] Figure 4 It is an exploded view of the detection assembly provided by the embodiment of the utility model;

[0032] Figure 5 It is an exploded view of the base and the bearing member provided in the embodiment of the utility model.

[0033] In the figure:

[0034] X, first direction; Z, second direction;

[0035] 1. Base; 11. Placement slot; 2. Carrying member; 21. Groove; 3. First driving member; 4. Second driving member;

[0036] 5. Detection components;

[0037] 511, first detection member; 512, second detection member;

[0038] 52. Mounting parts;

[0039] 531, first connecting member; 5311, first hole; 5312, first abutting member;

[0040] 532, second connecting member; 5321, second hole; 5322, second abutting member;

[0041] 541, a first cam; 542, a second cam;

[0042] 55. A third driving member; 551. A connecting shaft;

[0043] 56. Support member;

[0044] 57. fourth driving member; 571. first slide rail; 572. first slide block;

[0045] 58. fifth driving member; 581. second slide rail; 582. second slide block;

[0046] 591, first stopper; 592, second stopper;

[0047] 6. Linear guide rail; 7. Third slider; 8. Placement piece. DETAILED DESCRIPTION

[0048] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0049] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0051] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0052] like Figures 1 to 5 As shown, the utility model provides a wafer surface resistance detection device for detecting the resistance value at various places on the wafer surface, and the wafer surface resistance detection device includes a base 1, a carrier 2, a first driving member 3, a second driving member 4 and a detection assembly 5. The carrier 2 is arranged on the base 1 along the first direction X, and the carrier 2 is used for placing the wafer; the first driving member 3 can drive the carrier 2 to move along the first direction X; the second driving member 4 can drive the carrier 2 to rotate around its central axis to drive the wafer to rotate; the detection assembly 5 includes a first detection member 511 and a second detection member 512, and the first detection member 511 and the second detection member 512 are both arranged on the base 1 along the second direction Z. When the carrier 2 moves along the first direction X, the two end points of the diameter of the wafer can pass through the detection end of the first detection member 511 or the detection end of the second detection member 512 in sequence, and the first detection member 511 and the second detection member 512 are both used to detect the resistance at various places on the wafer surface. Specifically, the first driving member 3 can be a linear motor or a servo motor, and the second driving member 4 is a rotary motor.

[0053] When the wafer surface resistance detection device is performing detection, under the action of the first driving member 3 and the second driving member 4, the wafer can move to the detection position and rotate around its own axis. Through the rotation of the wafer and the reciprocating motion of the first detection member 511 or the second detection member 512 along the second direction Z, the resistance at various locations on the wafer surface can be detected. Only one of the first detection member 511 and the second detection member 512 is working, that is, according to the wafers with different surface treatments, the corresponding first detection member 511 or the second detection member 512 can be selected for detection, without the need to replace different detection members, thereby improving the detection efficiency.

[0054] Combination Figures 1 to 4 As shown, in order to facilitate the arrangement of the first detection member 511 and the second detection member 512, the detection assembly 5 includes a mounting member 52, a first connecting member 531 and a second connecting member 532. The first connecting member 531 and the second connecting member 532 are both arranged on the mounting member 52. The first connecting member 531 is provided with a first hole 5311, and the detection end of the first detection member 511 is placed in the first hole 5311; the second connecting member 532 is provided with a second hole 5321, and the detection end of the second detection member 512 is placed in the second hole 5321. The first detection member 511 and the second detection member 512 can detect the resistance of the wafer surface through the first hole 5311 and the second hole 5321 respectively. The arrangement of the first hole 5311 and the second hole 5321 facilitates the detection of the first detection member 511 and the second detection member 512, and enables the first detection member 511 and the second detection member 512 to be more stably installed on the first connecting member 531 and the second connecting member 532 respectively.

[0055] When detecting the resistance of the wafer surface, it is necessary to bring the detection end of the detection component into contact with the wafer surface to measure the resistance value at the contact point. In order to facilitate the first detection component 511 or the second detection component 512 to continuously detect the resistance values ​​of multiple points, the detection component 5 also includes a first abutment member 5312, a second abutment member 5322, a first cam 541, a second cam 542 and a third driving member 55. The first abutment 5312 and the second abutment 5322 are respectively arranged on the first connecting member 531 and the second connecting member 532; the first cam 541 can abut against the first abutment 5312, and the second cam 542 can abut against the second abutment 5322; the third driving member 55 is connected with the connecting shaft 551, and the first cam 541 and the second cam 542 are sequentially sleeved on the connecting shaft 551. When the first cam 541 abuts against the first abutment 5312, the third driving member 55 can drive the first cam 541 to rotate, and the first cam 541 abuts against the first abutment 5312 to drive the first connecting member 531 to reciprocate along the second direction Z; when the second cam 542 abuts against the second abutment 5322, the third driving member 55 can drive the second cam 542 to rotate, and the second cam 542 abuts against the second abutment 5322 to drive the second connecting member 532 to reciprocate along the second direction Z.

[0056] Specifically, the third driving member 55 is a motor, the first connecting member 531 and the second connecting member 532 are arranged adjacent to each other, and the first cam 541 and the second cam 542 are sequentially sleeved on the connecting shaft 551 so that the third driving member 55 can drive the first cam 541 and the second cam 542 to rotate simultaneously, without adding other driving members, which is conducive to cost saving. Since the first abutting member 5312 and the second abutting member 5322 abut against the first cam 541 and the second cam 542 respectively, the first cam 541 and the second cam 542 rotate so that the first connecting member 531 and the second connecting member 532 can carry the corresponding first detection member 511 and the second detection member 512 to reciprocate along the second direction Z, thereby facilitating continuous detection of the resistance value at various locations on the surface of the wafer.

[0057] Further, in order to facilitate the arrangement of the first cam 541, the second cam 542, the third driving member 55 and the connecting shaft 551, the detection assembly 5 further includes a supporting member 56, the supporting member 56 is arranged on the base 1, the third driving member 55 is arranged on the supporting member 56, and a through hole is provided on the supporting member 56 for the connecting shaft 551 to pass through. The arrangement of the supporting member 56 and the through hole enables the first cam 541, the second cam 542, the third driving member 55 and the connecting shaft 551 to be arranged on the base 1 more stably.

[0058] In order to facilitate the reciprocating movement of the first connecting member 531 and the second connecting member 532 along the second direction Z, the detection assembly 5 also includes a first slide rail 571 and a second slide rail 581. The first slide rail 571 is slidably provided with a first slider 572, and the second slide rail 581 is slidably provided with a second slider 582. The first connecting member 531 is connected to the first slider 572, and the second connecting member 532 is connected to the second slider 582.

[0059] In order to limit the displacement of the first connecting member 531 and the second connecting member 532 in the second direction Z to prevent the first connecting member 531 and the second connecting member 532 from falling off, the detection component 5 also includes a first limiting member 591 and a second limiting member 592, and the first limiting member 591 and the second limiting member 592 are respectively used to limit the upper limit positions of the first connecting member 531 and the second connecting member 532 along the second direction Z.

[0060] Since the wafer surface resistance detection device only needs to selectively use one of the first detection member 511 and the second detection member 512 according to the wafers with different surface treatments when in use, when one of them is in a working state, the other needs to be in a non-working state. Therefore, the detection component 5 also includes a fourth driving member 57 and a fifth driving member 58. The fourth driving member 57 and the fifth driving member 58 are both arranged on the mounting member 52. In the second direction Z, the fourth driving member 57 can drive the first connecting member 531 to move to separate the first connecting member 531 from the first cam 541; the fifth driving member 58 can drive the second connecting member 532 to move to separate the second connecting member 532 from the second cam 542.

[0061] Specifically, the fourth driving member 57 and the fifth driving member 58 are cylinders. When the first detection member 511 needs to work, the fourth driving member 57 lifts the second connecting member 532 upward, so that the second abutment member 5322 of the second connecting member 532 and the second cam 542 are in a separated state. At this time, the first abutment member 5312 of the first connecting member 531 and the first cam 541 are still in an abutment state. The third driving member 55 is started, and the third driving member 55 drives the first cam 541 and the second cam 542 on the rotating shaft to rotate. The first cam 541 enables the first connecting member 531 to reciprocate along the second direction Z through the first abutment member 5312. Similarly, when the second detection member 512 is needed to work, the fifth driving member 58 lifts the first connecting member 531 upward, so that the first abutment member 5312 of the first connecting member 531 and the first cam 541 are in a separated state. At this time, the second abutment member 5322 of the second connecting member 532 and the second cam 542 are still in an abutment state. The third driving member 55 is started, and the third driving member 55 drives the first cam 541 and the second cam 542 on the rotating shaft to rotate. The second cam 542 enables the second connecting member 532 to reciprocate along the second direction Z through the second abutment member 5322.

[0062] Combination Figure 1 and Figure 5 As shown, in order to facilitate the movement of the wafer along the first direction X, the wafer surface resistance detection device also includes a linear guide rail 6 and a third slider 7. The third slider 7 is slidably arranged on the linear guide rail 6. The first driving member 3 can drive the third slider 7 to slide to drive the wafer to move. Specifically, a placement groove 11 is provided on the base 1, and the linear guide rail 6 is placed in the placement groove 11. The arrangement of the placement groove 11 allows the linear guide rail 6 to be more stably arranged on the base 1.

[0063] Furthermore, in order to facilitate the placement of the wafer and the second driving member 4, the wafer surface resistance detection device also includes a placement member 8, which is connected to the third slider 7, the second driving member 4 is placed on the placement member 8, and the carrier 2 is connected to the output end of the second driving member 4.

[0064] In order to facilitate the placement of the wafer on the carrier 2 , a groove 21 is provided on the carrier 2 . The groove 21 is used for placing a wafer suction pen to suction the back side of the wafer.

[0065] In the specific implementation, one of the first detection member 511 and the second detection member 512 is selected for detection according to the wafer with different surface treatments. Taking the first detection member 511 for detection as an example, the fifth driving member 58 drives the second connecting member 532 to rise, so that the second abutting member 5322 of the second connecting member 532 is separated from the second cam 542. At this time, the first detection member 511 is in a working state, and the second detection member 512 is in a non-working state. The first detection member 511 on the first connecting member 531 reciprocates along the second direction Z, and the first driving member 3 drives the wafer to approach the detection end of the first detection member 511 along the first direction X, so that the two end points of the diameter of the wafer can pass through the detection end of the first detection member 511 in sequence. At the same time, the second driving member 4 drives the wafer to rotate to measure the resistance value of each coordinate point on the wafer surface. After the detection is completed, the second connecting member 532 is reset by the fifth driving member 58 to perform the next detection of the resistance at each location on the wafer surface. When the second detection member 512 is selected for detection, the operation process is the same and will not be described in detail here.

[0066] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer surface resistance detection device, used to detect the resistance value at various locations on the wafer surface, characterized in that: The wafer surface resistance detection device comprises: Base (1); A carrier (2), the carrier (2) being movable along a first direction (X) and arranged on the base (1), the carrier (2) being used for placing the wafer; a first driving member (3), the first driving member (3) being capable of driving the supporting member (2) to move along the first direction (X); A second driving member (4); the second driving member (4) can drive the carrier (2) to rotate around its central axis to drive the wafer to rotate; A detection component (5), the detection component (5) comprising a first detection component (511) and a second detection component (512), the first detection component (511) and the second detection component (512) both being arranged on the base (1) and being movable along a second direction (Z), the supporting component (2) being able to pass through the detection end of the first detection component (511) or the detection end of the second detection component (512) in sequence when the two end points of the diameter of the wafer are moved along the first direction (X), the first detection component (511) and the second detection component (512) both being used to detect the resistance at various locations on the surface of the wafer.

2. The wafer surface resistance detection device according to claim 1, characterized in that: The detection component (5) comprises: A mounting member (52), wherein the mounting member (52) is arranged on the base (1); A first connecting member (531) and a second connecting member (532), wherein the first connecting member (531) and the second connecting member (532) are both arranged on the mounting member (52), the first connecting member (531) is provided with a first hole (5311), and the detection end of the first detection member (511) is placed in the first hole (5311); the second connecting member (532) is provided with a second hole (5321), and the detection end of the second detection member (512) is placed in the second hole (5321).

3. The wafer surface resistance detection device according to claim 2, characterized in that: The detection component (5) also includes: A first abutting member (5312) and a second abutting member (5322); the first abutting member (5312) and the second abutting member (5322) are respectively arranged on the first connecting member (531) and the second connecting member (532); a first cam (541) and a second cam (542), wherein the first cam (541) can abut against the first abutting member (5312), and the second cam (542) can abut against the second abutting member (5322); A third driving member (55), wherein the third driving member (55) is connected to a connecting shaft (551), and the first cam (541) and the second cam (542) are sequentially sleeved on the connecting shaft (551). When the first cam (541) abuts against the first abutting member (5312), the third driving member (55) can drive the first cam (541) to rotate, and the first cam (541) abuts against the first abutting member (5312) to drive the first connecting member (531) to move along the second direction (Z); when the second cam (542) abuts against the second abutting member (5322), the third driving member (55) can drive the second cam (542) to rotate, and the second cam (542) abuts against the second abutting member (5322) to drive the second connecting member (532) to reciprocate along the second direction (Z).

4. The wafer surface resistance detection device according to claim 3, characterized in that: The detection assembly (5) further comprises a support member (56), wherein the support member (56) is arranged on the base (1), the third driving member (55) is arranged on the support member (56), and the support member (56) is provided with a through hole for the connecting shaft (551) to pass through.

5. The wafer surface resistance detection device according to any one of claims 3 to 4, characterized in that: The detection assembly (5) further comprises a fourth driving member (57) and a fifth driving member (58), wherein the fourth driving member (57) and the fifth driving member (58) are both arranged on the mounting member (52), and in the second direction (Z), the fourth driving member (57) can drive the first connecting member (531) to move so as to separate the first connecting member (531) from the first cam (541); The fifth driving member (58) can drive the second connecting member (532) to move so as to separate the second connecting member (532) from the second cam (542).

6. The wafer surface resistance detection device according to any one of claims 2 to 4, characterized in that: The detection assembly (5) further comprises a first slide rail (571) and a second slide rail (581); a first slider (572) is slidably disposed on the first slide rail (571); a second slider (582) is slidably disposed on the second slide rail (581); the first connecting member (531) is connected to the first slider (572); and the second connecting member (532) is connected to the second slider (582).

7. The wafer surface resistance detection device according to any one of claims 2 to 4, characterized in that: The detection assembly (5) further comprises a first limiting member (591) and a second limiting member (592), wherein the first limiting member (591) and the second limiting member (592) are respectively used to limit the first connecting member (531) and the second connecting member (532) along the second direction (Z).

8. The wafer surface resistance detection device according to claim 1, characterized in that: The wafer surface resistance detection device also includes a linear guide rail (6) and a third slider (7), wherein the third slider (7) is slidably arranged on the linear guide rail (6), and the first driving member (3) can drive the third slider (7) to slide so as to drive the wafer to move.

9. The wafer surface resistance detection device according to claim 8, characterized in that: The wafer surface resistance detection device also includes a placement member (8), the placement member (8) is connected to the third slider (7), the second driving member (4) is placed on the placement member (8), and the carrier (2) is connected to the output end of the second driving member (4).

10. The wafer surface resistance detection device according to claim 1, characterized in that: The carrier (2) is provided with a groove (21), the groove (21) being used for placing a suction pen for the wafer, the suction pen being used for sucking the back side of the wafer.

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