Load inlet switching base and semiconductor equipment

Abstract

The utility model belongs to the technical field of semiconductor equipment, and discloses a carrier inlet switching base and semiconductor equipment. The loading port switching base comprises a top plate, a bottom plate, a detection assembly and an adjusting assembly, the top plate is used for bearing a wafer cartridge containing a wafer, the bottom plate is connected with the loading port base, the detection assembly is configured to detect whether the wafer loaded in the wafer cartridge is parallel to a preset wafer taking plane or not, and the adjusting assembly comprises an adjusting column; the adjusting column comprises a first end and a second end which are arranged oppositely, the first end is movably connected into the first adjusting hole in the Z direction, the second end is movably connected into the second adjusting hole in the Z direction, and the height or levelness of the top plate can be conveniently adjusted by rotating the adjusting column. Therefore, the wafer carried in the wafer cartridge is parallel to the preset wafer taking plane. The semiconductor equipment comprises a wafer taking arm and the loading port switching base, wafers of different sizes can be loaded into the universal semiconductor equipment, and the damage rate of the wafers is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a loading port adapter base and semiconductor equipment. Background Art

[0002] Before semiconductor equipment operates on wafers, it is necessary to use an automatic transfer arm to take the wafers out of the wafer box on the load port and transfer them to the pre-alignment machine. After pre-alignment, the wafers are transferred to the sample stage in a specific direction for operation.

[0003] In the process of semiconductor process development, advanced semiconductor equipment generally uses 12-inch wafer cassettes suitable for 12-inch wafers to transfer wafers. However, some semiconductor industries use 8-inch wafers for operation, and 8-inch wafers need to be transferred using 8-inch wafer cassettes. Since wafer cassettes of different sizes use different mechanical interface standards, and existing loading ports generally only support wafer cassettes of fixed sizes, semiconductor equipment cannot transfer and measure wafers of other sizes. Therefore, before domestic production lines use advanced semiconductor equipment, the problem of wafer size mismatch at the loading port must be solved first.

[0004] In order to reduce costs and facilitate mass production, the existing method is to design an adapter base for the loading port. Since the spacing between wafers in an 8-inch wafer cassette is smaller than that in a 12-inch wafer cassette, the safety spacing margin is small. Therefore, the parallelism requirements between the wafer picking arm of the semiconductor equipment and the wafers in the wafer cassette are extremely strict. The existing technology aligns the surface of the adapter base and the wafer picking arm of the semiconductor equipment through a bubble level. This alignment method is not accurate enough in adjusting the parallelism, and the alignment is not the parallelism between the preset wafer picking plane and the wafer carried in the wafer cassette, which can easily cause the wafer to be scratched by the wafer picking arm when taking out the wafer. Utility Model Content

[0005] The first purpose of the utility model is to provide a loading port adapter base, which can make the loading port adapt to the wafer cassettes for loading wafers of different sizes, so as to load wafers of different sizes into the semiconductor equipment, and accurately calibrate the parallelism between the preset wafer picking plane and the wafers carried in the wafer cassette to avoid scratching the wafers by the wafer picking arm, thereby realizing the automatic transmission of wafers of different sizes.

[0006] The second purpose of the utility model is to provide a semiconductor device, which can dock a wafer cassette loaded with wafers of different sizes with the loading port by using a wafer picking arm and the above-mentioned loading port adapter base, so that wafers of different sizes can be loaded into the semiconductor device for processing, thereby reducing the damage rate of the wafers and improving the automation level of wafer transmission.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] A loading port adapter base, comprising:

[0009] A top plate, used for carrying a wafer cassette containing wafers, wherein a first adjustment hole is provided on the top plate;

[0010] A bottom plate, the bottom plate is used to be connected to the loading port base, and the bottom plate is provided with a second adjustment hole;

[0011] A detection component is configured to detect whether the wafer loaded in the wafer cassette is parallel to a preset wafer picking plane;

[0012] An adjustment assembly, the number of the adjustment assemblies is at least two, the adjustment assembly includes an adjustment column, and the adjustment column includes a first end and a second end disposed opposite to each other;

[0013] The first end is movably connected to the first adjustment hole along the Z direction; and / or the second end is movably connected to the second adjustment hole along the Z direction;

[0014] Wherein, the Z direction is the height direction of the loading port adapter base.

[0015] Preferably, the first end is provided with a first external thread, and the second end is provided with a second external thread, the first external thread and the second external thread have opposite rotation directions, at least part of the hole wall of the first adjustment hole is provided with a first internal thread, the first external thread is threadedly connected to the first internal thread, and the hole wall of the second adjustment hole is provided with a second internal thread, and the second external thread is threadedly connected to the second internal thread.

[0016] Preferably, the top plate includes a top plate body and a connecting piece arranged at the bottom of the top plate body, the first adjustment hole is arranged on the connecting piece, the first internal thread is arranged on the hole wall of the first adjustment hole, a first hole is arranged on the top plate body, and the adjustment assembly also includes a fastener, and the fastener passes through the first hole and is threadedly connected to the first adjustment hole.

[0017] Preferably, the first hole is a waist-shaped hole extending along the Y direction, and the fastener can move along the Y direction in the first hole;

[0018] The Y direction and the Z direction are perpendicular to each other.

[0019] Preferably, the first hole is a stepped hole structure, and the large hole end of the first hole is arranged upward to accommodate the head of the fastener.

[0020] Preferably, the number of the adjustment components is four, and the four adjustment components are arranged at intervals along the circumference of the top plate.

[0021] Preferably, the detection component is further configured to detect whether the wafer cassette is placed in place;

[0022] A first mounting position and a second mounting position are provided on the base plate, and the detection component can be detachably mounted on the first mounting position and / or the second mounting position. The detection component located on the first mounting position is used to detect whether the wafer loaded in the wafer cassette is parallel to a preset wafer picking plane; the detection component located on the second mounting position is used to detect whether the wafer cassette is placed in place.

[0023] Preferably, the detection component includes at least three distance sensors installed on the base plate. When the number of the distance sensors is three, the three distance sensors are not collinear; when the number of the distance sensors is greater than three, there are at least three distance sensors that are not collinearly arranged.

[0024] Preferably, an avoidance structure is further provided on the bottom plate, and the avoidance structure is located at the front end of the bottom plate to avoid a wafer box locking mechanism on the loading port base.

[0025] On the other hand, the utility model provides a semiconductor device, comprising a wafer picking arm and a loading port adapter base in any of the above-mentioned schemes, wherein the loading port adapter base is used to carry a wafer cassette containing wafers, and the wafer picking arm is configured to grab and transfer the wafers in the wafer cassette, and the preset wafer picking plane is the top surface of the wafer picking arm.

[0026] Beneficial effects of the utility model:

[0027] The utility model provides a loading port transfer base, comprising a top plate, a bottom plate, a detection component and an adjustment component, wherein the top plate is used to carry a wafer cassette loaded with wafers, a first adjustment hole is arranged on the top plate, the bottom plate is used to connect with the loading port base, and a second adjustment hole is arranged on the bottom plate, the detection component is configured to detect whether the wafer loaded in the wafer cassette is parallel to a preset film taking plane, the number of the adjustment components is at least two, the adjustment component comprises an adjustment column, the adjustment column comprises a first end and a second end arranged opposite to each other, the first end is movably connected to the first adjustment hole along the Z direction, and the second end is movably connected to the second adjustment hole along the Z direction, wherein the Z direction is the height direction of the loading port transfer base. According to the detection data fed back by the detection component, the height or level of the top plate can be conveniently adjusted by moving the adjustment column in the first adjustment hole and the second adjustment hole along the Z direction, thereby adjusting the height and level of the wafer cassette carried on the top plate, so that the wafer carried in the wafer cassette is at the film taking height of the loading port and is parallel to the preset film taking plane, thereby avoiding the film taking arm from scratching the wafer.

[0028] The utility model also provides a semiconductor device, including a wafer picking arm and the above-mentioned loading port adapter base, the loading port adapter base is used to carry a wafer cassette containing wafers, the wafer picking arm is configured to grab and transfer the wafers in the wafer cassette, and the preset wafer picking plane is the top surface of the wafer picking arm. By using the wafer picking arm and the above-mentioned loading port adapter base, the utility model can load wafers of different sizes into a universal semiconductor device for processing, thereby reducing the damage rate of the wafers and improving the automation level of wafer transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the loading port transfer base provided by the utility model;

[0030] Figure 2 It is a schematic diagram of the wafer of the utility model loaded in the wafer cassette under one viewing angle;

[0031] Figure 3 It is a cross-sectional view of the wafer of the utility model loaded in the wafer cassette;

[0032] Figure 4 is a schematic diagram of the wafer of the present invention loaded on the wafer cassette from another viewing angle;

[0033] Figure 5 It is a structural schematic diagram of the top plate of the loading port transfer base provided by the utility model;

[0034] Figure 6 It is a structural schematic diagram of the bottom plate of the loading port transfer base provided by the utility model;

[0035] Figure 7 A schematic diagram of the structure of the adjustment component provided by the utility model;

[0036] Figure 8 It is a schematic diagram of the distribution of wafer detection holes and cassette detection holes on the top plate of the utility model;

[0037] Fig. 9 It is a schematic diagram of the distribution of the first installation position and the second installation position on the bottom plate of the utility model.

[0038] In the figure:

[0039] 100, wafer cassette; 110, crossbar; 120, cassette detection point; 200, loading port base; 300, wafer; 301, wafer detection point;

[0040] 10. top plate; 101. top plate body; 102. connector; 11. first limiting structure; 12. second limiting structure; 121. cassette tail slot; 13. cassette transverse slot; 14. first hole; 15. wafer detection hole; 16. cassette detection hole;

[0041] 20. Bottom plate; 21. Second adjustment hole; 22. Loading port limit hole; 23. Base fixing hole; 24. First installation position; 25. Second installation position; 26. Avoidance structure;

[0042] 30. Detection components;

[0043] 40. Adjustment assembly; 41. Adjustment column; 411. First end; 412. Second end; 42. Fastener; 43. First nut; 44. Second nut. DETAILED DESCRIPTION

[0044] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0045] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0047] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0048] like Figures 1 to 7 As shown, this embodiment provides a loading port adapter base, which is used to dock the wafer cassette 100 loaded with wafers 300 of different sizes with the loading port base 200 of the universal loading port, so that the wafer 300 can be transported to the semiconductor device for processing by the wafer taking arm through the window on the back of the loading port. The existing loading port adapter base uses a bubble level to align the surface of the loading port adapter base and the wafer taking arm. This alignment method is not accurate enough in adjusting the parallelism, and the alignment is not the parallelism between the preset wafer taking plane and the wafer 300 carried in the wafer cassette 100, which easily causes the wafer 300 to be scratched by the wafer taking arm when taking out the wafer 300.

[0049] To solve the above problems, the loading port adapter base provided in this embodiment includes a top plate 10, a bottom plate 20, a detection component 30 and an adjustment component 40. The top plate 10 is used to support a wafer cassette 100 containing a wafer 300. A first adjustment hole is provided on the top plate 10. The bottom plate 20 is used to connect with the loading port base 200, and a second adjustment hole 21 is provided on the bottom plate 20. The detection component 30 is configured to detect whether the wafer 300 loaded in the wafer cassette 100 is parallel to a preset wafer picking plane. The number of adjustment components 40 is at least two. The adjustment component 40 includes an adjustment column 41. The adjustment column 41 includes a first end 411 and a second end 412 arranged back to back. The first end 411 is movably connected to the first adjustment hole along the Z direction, and the second end 412 is movably connected to the second adjustment hole 21 along the Z direction, wherein the Z direction is the height direction of the loading port adapter base.

[0050] In this embodiment, there are four adjustment components 40, which are arranged at intervals along the circumference of the top plate 10, and can provide more support for the top plate 10, which is conducive to improving the stability of the loading port adapter base. According to the detection data fed back by the detection component 30, the height or level of the top plate 10 can be easily adjusted by moving the adjustment column 41 in the first adjustment hole and the second adjustment hole 21 along the Z direction, thereby adjusting the height and level of the wafer cassette 100 carried on the top plate 10, so that the wafer 300 in the wafer cassette 100 is at the wafer taking height of the loading port base 200 and parallel to the preset wafer taking plane.

[0051] In one embodiment, the number of the adjustment components 40 can also be three, and the height and level of the entire plane of the top plate 10 can be adjusted by adjusting the height of three points on the plane of the top plate 10. In another embodiment, the number of the adjustment components 40 can also be two, and the loading port transfer base also includes a support frame connecting the top plate 10 and the bottom plate 20, and the height of the support frame is set according to the film taking position of the film taking arm, so that after the top plate 10 is installed on the support frame, the wafer 300 in the wafer cassette 100 is at the film taking height of the loading port base 200, and the level of the top plate 10 is adjusted by two adjustment components 40, so that the wafer 300 in the wafer cassette 100 is parallel to the preset film taking plane. Optionally, the number of the adjustment components 40 can be adaptively adjusted to more than four according to factors such as the area of ​​the top plate 10 or the weight carried by the top plate 10, and no specific limitation is made here.

[0052] It should be noted that the size, mechanical interface and wafer spacing of wafer cassettes for loading wafers of different sizes are also different, and the wafer cassettes are named according to the size of the wafers they are adapted to. For example, a wafer cassette for loading 8-inch wafers is called an 8-inch wafer cassette, and general semiconductor equipment is suitable for 12-inch wafers. The loading port adapter base provided in this embodiment is mainly used to dock the 8-inch wafer cassette with the semiconductor equipment suitable for 12-inch wafers. Of course, in other embodiments, the loading port adapter base can also be adapted to wafer cassettes suitable for wafers of other sizes.

[0053] Preferably, a loading entrance limiting hole 22 is opened on the bottom plate 20 to be plugged into and matched with the limiting column on the loading entrance base 200. The loading entrance limiting hole 22 is an open hole structure with a diameter gradually decreasing from bottom to top, and the large hole end of the loading entrance limiting hole 22 is arranged downward to facilitate the plug-in cooperation between the loading entrance limiting hole 22 and the limiting column.

[0054] In order to connect the bottom plate 20 with the loading port base 200, a base fixing hole 23 is also opened on the bottom plate 20. The method of connecting the bottom plate 20 with the loading port base 200 through the base fixing hole 23 includes but is not limited to screws, bolts or snaps, etc., which can effectively prevent the loading port adapter base from moving during operation and causing position changes, thereby ensuring smooth production.

[0055] Furthermore, if Figures 4-5As shown, a limiting structure for limiting the position of the wafer cassette 100 is provided on the top plate 10, so as to achieve stable bearing of the wafer cassette 100 by the top plate 10. Specifically, a first limiting structure 11 and a second limiting structure 12 protruding from the surface of the top plate 10 are provided on the top plate 10. The first limiting structure 11 is located at one end of the top plate 10 near the window on the back of the loading port, and its shape is the same as the concave shape provided at the front of the wafer cassette 100, so as to achieve the front position limiting of the wafer cassette 100; the second limiting structure 12 is located at the other end of the top plate 10, and its shape is the same as the concave shape provided at the rear of the wafer cassette 100, and a The cassette tail groove 121 is adapted to the tail protrusion of the wafer cassette 100, and the tail protrusion of the wafer cassette 100 can be plugged and matched in the cassette tail groove 121, thereby realizing the tail limitation of the wafer cassette 100; the interval between the first limiting structure 11 and the second limiting structure 12 forms a cassette cross groove 13 to limit the position of the cross bar 110 of the wafer cassette 100. The above-mentioned settings are used to jointly realize the stable limitation of the wafer cassette 100, ensuring that the wafer cassette 100 will not shift on the surface of the top plate 10 during the production process.

[0056] It should be noted that, since the wafer cassette 100 is carried on the top plate 10 , adjusting the height and levelness of the top plate 10 can adjust the wafers 300 in the wafer cassette 100 to be at a wafer taking height and parallel to a preset wafer taking plane.

[0057] In order to achieve the height adjustment between the top plate 10 and the bottom plate 20, the first end 411 of the adjusting column 41 is provided with a first external thread, and the second end 412 is provided with a second external thread. The rotation directions of the first external thread and the second external thread are opposite. At least part of the hole wall of the first adjusting hole is provided with a first internal thread, and the first external thread is threadedly connected to the first internal thread. The hole wall of the second adjusting hole 21 is provided with a second internal thread, and the second external thread is threadedly connected to the second internal thread. When the operator rotates the adjusting column 41, the moving direction of the first end 411 relative to the first adjusting hole and the moving direction of the second end 412 relative to the second adjusting hole 21 are opposite, so that the top plate 10 and the bottom plate 20 can be close to or away from each other, which is convenient for adjusting the height and levelness of the top plate 10.

[0058] Specifically, in this embodiment, the top plate 10 includes a top plate body 101 and a connecting piece 102 disposed at the bottom of the top plate body 101, a first adjustment hole is disposed on the connecting piece 102, a first internal thread is disposed on the hole wall of the first adjustment hole, a first hole 14 is disposed on the top plate body 101, and the adjustment assembly 40 further includes a fastener 42, and the fastener 42 passes through the first hole 14 and is threadedly connected to the first adjustment hole. In this embodiment, when installing and adjusting the loading port adapter base, the operator passes the fastener 42 through the first hole 14 and connects it to the first adjustment hole, the fastener 42 is threadedly connected to one end of the first internal thread and is not locked, and then the operator threadedly connects the first end 411 of the adjustment column 41 to the other end of the first internal thread, and roughly adjusts the height and levelness of the top plate 10 by rotating the adjustment column 41. In addition, with this arrangement, the top plate 10 is detachably connected to the adjustment column 41 via the fastener 42, and the top plate 10 can also be replaced. When wafer cassettes 100 of other sizes need to be loaded, the top plate 10 having a limiting structure that is compatible with the bottom of the corresponding wafer cassette 100 can be replaced, thereby further improving the versatility of the loading port adapter base.

[0059] For ease of description, the length direction of the loading port base 200 is defined as the Y direction, which is perpendicular to the Z direction, and is the direction in which the wafer cassette 100 approaches or moves away from the film picking arm. The first hole 14 is a waist-shaped hole extending along the Y direction, and the fastener 42 can move along the Y direction in the first hole 14. After the operator completes the rough adjustment of the height and levelness of the top plate 10, the top plate 10 is adjusted along the Y direction according to the distance of the film picking arm, so that the wafer cassette 100 is in the film picking position of the film picking arm, and then the fastener 42 is locked with the connecting piece 102, thereby locking the position of the top plate 10 in the Y direction, that is, locking the position of the wafer cassette 100 in the Y direction. Next, the operator can rotate the adjustment column 41 according to the detection data fed back by the detection component 30 to fine-tune the height and levelness of the top plate 10.

[0060] Preferably, the first hole 14 is a stepped hole structure, and the large hole end of the first hole 14 is arranged upward to accommodate the head of the fastener 42, prevent the fastener 42 from protruding from the surface of the top plate 10, ensure the flatness of the surface of the top plate 10, and further ensure the levelness of the wafer cassette 100 installed on the surface of the top plate 10. In this embodiment, the fastener 42 is a fastening bolt, and the large hole end of the first hole 14 is used to accommodate the bolt head of the fastening bolt.

[0061] Preferably, the adjustment assembly 40 further includes a first nut 43, and the first end 411 of the adjustment column 41 is threadedly connected to the first nut 43 and the connector 102 in sequence. When the operator has adjusted the height and level of the top plate 10, tightening the first nut 43 can lock the position of the connector 102 relative to the adjustment assembly 40, thereby improving the stability of the loading port adapter base. Further, the adjustment assembly 40 further includes a second nut 44, and the second end 412 of the adjustment column 41 is threadedly connected to the second nut 44 and the second adjustment hole 21 in sequence. When the operator has adjusted the height and level of the top plate 10, tightening the second nut 44 can lock the position of the bottom plate 20 relative to the adjustment assembly 40, thereby improving the stability of the loading port adapter base.

[0062] In this embodiment, if Figure 4 and Figure 8-Figure 9 As shown, the detection component 30 is also configured to detect whether the wafer cassette 100 is in place. A first mounting position 24 and a second mounting position 25 are provided on the base plate 20. The detection component 30 can be detachably mounted on the first mounting position 24 and / or the second mounting position 25. The detection component 30 located on the first mounting position 24 is used to detect whether the wafer 300 loaded in the wafer cassette 100 is parallel to the preset wafer picking plane; the detection component 30 located on the second mounting position 25 is used to detect whether the wafer cassette 100 is in place.

[0063] In one embodiment, the detection component 30 is detachably mounted on the first mounting position 24 or the second mounting position 25. The operator first installs the detection component 30 on the first mounting position 24, adjusts the height between the top plate 10 and the bottom plate 20, until the wafer 300 carried in the wafer cassette 100 is parallel to the preset wafer picking plane, and then removes the detection component 30 from the first mounting position 24 and installs it on the second mounting position 25, detects the wafer cassette 100, and uses the data measured after the wafer cassette 100 is placed in place and the height of the top plate 10 is adjusted as the stable state, and detects in real time whether the wafer cassette 100 replaced later is placed in place. If the data obtained by the detection is different from the data of the stable state, it is determined that the wafer cassette 100 is not placed in place. The above-mentioned configuration enables the detection component 30 to be reused, saves the number of detection components 30, and reduces production costs.

[0064] In another embodiment, when the number of detection components 30 is sufficient, detection components 30 are disposed on both the first installation position 24 and the second installation position 25 to reduce operation steps and improve production efficiency.

[0065] Preferably, the detection assembly 30 is mounted on the first mounting position 24 through a bracket, so that the detection assembly 30 can move and adjust its position along the Z direction, so as to facilitate the detection of the distance between the preset wafer picking plane and the wafer detection point 301 on the wafer 300 carried in the wafer cassette 100. Preferably, the detection assembly 30 is mounted on the second mounting position 25 through a bracket, and the detection assembly 30 can move and adjust its position along the Z direction, so as to facilitate the detection of the distance between the detection points on the wafer cassette 100.

[0066] When the detection component 30 detects that the wafer cassette 100 is not in place, in order to issue a prompt message to the operator, the loading port adapter base provided in this embodiment also includes a cassette alarm (not shown in the figure); when the detection component 30 detects that the distance between each cassette detection point 120 is different from the distance measured by the cassette detection point 120 when the initial horizontal adjustment is completed, it is determined that the wafer cassette 100 is not in place, and the cassette alarm immediately sounds an alarm to remind the operator to check the wafer cassette 100, thereby avoiding damage to the wafer 300 by the wafer picking arm due to misalignment of the wafer cassette 100.

[0067] Specifically, the detection assembly 30 includes at least three distance sensors installed on the bottom plate 20. When the number of the distance sensors is three, the three distance sensors are not collinear; when the number of the distance sensors is greater than three, there are at least three distance sensors that are not collinearly arranged. The data measured by at least three non-collinear distance sensors can determine the lower surface of the wafer 300 or the wafer cassette 100. In order to save the number of sensors, this embodiment uses three distance sensors for distance detection.

[0068] In order to enable the laser emitted by the distance sensor to pass through the top plate 10 and reach the lower surface of the wafer 300 or the wafer cassette 100, a wafer detection hole 15 corresponding to the first mounting position 24 and a cassette detection hole 16 corresponding to the second mounting position 25 are opened on the top plate 10. When the operator connects at least three distance sensors to the first mounting position 24, at least three distance sensors can perform distance detection on at least three non-collinear wafer detection points 301 on the wafer 300 through the wafer detection hole 15, thereby detecting the parallelism between the wafer 300 carried in the wafer cassette 100 and the preset wafer picking plane. By adjusting the horizontality of the top plate 10 through the adjustment component 40 according to the data fed back by at least three distance sensors, it can be ensured that the wafer 300 in the wafer cassette 100 is parallel to the preset wafer picking plane; when the operator connects at least three distance sensors to the second mounting position 25, at least three distance sensors can perform distance detection on at least three non-collinear cassette detection points 120 on the wafer cassette 100 through the cassette detection holes 16, thereby detecting whether the wafer cassette 100 carried on the top plate 10 is installed in place, thereby improving the utilization efficiency of the detection component 30 and improving production efficiency.

[0069] Preferably, the wafer detection hole 15 and the cassette detection hole 16 are waist-shaped holes to improve the error tolerance for the installation position of the distance sensor.

[0070] Since a wafer 300 box locking mechanism for locking the wafer 300 transfer box or the wafer cassette 100 is provided on the loading port base 200, in this embodiment, an avoidance structure 26 is also provided on the bottom plate 20. The avoidance structure 26 is located at the front end of the bottom plate 20 to avoid the wafer box locking mechanism on the loading port base 200.

[0071] This embodiment also provides a semiconductor device, including a wafer picking arm and the above-mentioned loading port adapter base, the loading port adapter base is used to support the wafer cassette 100 containing the wafer 300, the wafer picking arm is configured to grab and transfer the wafer 300 in the wafer cassette 100, and the preset wafer picking plane is the top surface of the wafer picking arm.

[0072] Combine the following Figures 1 to 9 The specific installation and adjustment method of the above-mentioned loading port adapter base is briefly described, including the following steps:

[0073] S1: docking the bottom plate 20 with the loading port base 200 through the loading port limiting hole 22, and fixing the bottom plate 20 with the loading port base 200 through the base fixing hole 23;

[0074] S2: Connect the three distance sensors to the first installation positions 24 respectively;

[0075] S3: Use the fastener 42 to connect the second end 412 of the connecting member 102 to the top plate body 101, and the fastener 42 and the connecting member 102 are not locked;

[0076] S4: Connect the second end 412 of the adjusting column 41 to the bottom plate 20 through the second adjusting hole 21, and connect the first end 411 of the adjusting column 41 to the connecting member 102;

[0077] S5: Rotate the adjustment column 41 to roughly adjust the height and level of the top plate 10;

[0078] S6: Adjust the position of the fastener 42 in the first hole 14 along the Y direction, so that the wafer cassette 100 is in the wafer taking position of the wafer taking arm, and lock the fastener 42 and the connecting member 102;

[0079] S7: Adjust the position of the distance sensor so that the laser emitted by the distance sensor can pass through the wafer detection hole 15 to perform distance detection;

[0080] S8: Place the debug wafer 300 on the wafer picking arm and fix it by adsorption, control the wafer picking arm to extend to the wafer picking position above the loading port adapter base, check and record the distance values ​​of each wafer detection point 301 detected by the three distance sensors, which are recorded as a1, b1 and c1 respectively. The distance detection value is the distance from the three distance sensors to the preset wafer picking plane, and then control the wafer picking arm to move away.

[0081] S9: Install the wafer cassette 100 on the top plate 10, and place the wafer 300 in the wafer cassette 100, check and record the distance values ​​of each wafer detection point 301 detected by the three distance sensors, which are recorded as a2, b2 and c2 respectively, and finely adjust the horizontality of the top plate 10 by rotating each adjustment column 41 until a1-a2=b1-b2=c1-c2, and lock the positions of the top plate 10 and the bottom plate 20 respectively by the first nut 43 and the second nut 44. At this time, the bottom plane of the wafer 300 carried in the wafer cassette 100 is parallel to the preset film-picking plane of the film-picking arm, and the fine adjustment of the parallelism of the top plate 10 is completed.

[0082] S10: Remove the three distance sensors and transfer them to the second installation position 25 for installation, so that they can detect the distance value of each cassette detection point 120 through the cassette detection hole 16, and use this distance value as the stable state to detect in real time whether the subsequently replaced wafer cassette 100 is placed in place. If the detected distance value is different from the distance value of the stable state, the cassette alarm will sound an alarm and the film-taking arm will stop taking the film.

[0083] Through the above method, the parallelism of the preset wafer picking plane and the bottom plane of the wafer 300 carried in the wafer cassette 100 is adjusted, which can effectively increase the safe distance for wafer picking, and make the data and results visualized, so as to form a standard adjustment process and accurate results, facilitate on-site operation, avoid repeated adjustment operations, and reduce the damage rate of the wafer 300.

[0084] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A loading port adapter base, characterized in that: include: A top plate (10) for supporting a wafer cassette (100) containing wafers (300), wherein a first adjustment hole is provided on the top plate (10); A bottom plate (20), the bottom plate (20) being used to be connected to the loading port base (200), and a second adjustment hole (21) being provided on the bottom plate (20); A detection component (30) is configured to detect whether the wafer (300) loaded in the wafer cassette (100) is parallel to a preset wafer picking plane; An adjustment component (40), the number of the adjustment components (40) being at least two, the adjustment component (40) comprising an adjustment column (41), the adjustment column (41) comprising a first end (411) and a second end (412) disposed opposite to each other; The first end (411) is movably connected to the first adjustment hole along the Z direction; and / or the second end (412) is movably connected to the second adjustment hole (21) along the Z direction; Wherein, the Z direction is the height direction of the loading port adapter base.

2. The loading port adapter base according to claim 1, characterized in that: The first end (411) is provided with a first external thread, and the second end (412) is provided with a second external thread, the first external thread and the second external thread have opposite rotation directions, at least part of the hole wall of the first adjustment hole is provided with a first internal thread, the first external thread is threadedly connected to the first internal thread, and the hole wall of the second adjustment hole (21) is provided with a second internal thread, and the second external thread is threadedly connected to the second internal thread.

3. The loading port adapter base according to claim 2, characterized in that: The top plate (10) includes a top plate body (101) and a connecting piece (102) arranged at the bottom of the top plate body (101), the first adjustment hole is arranged on the connecting piece (102), the first internal thread is arranged on the hole wall of the first adjustment hole, a first hole (14) is arranged on the top plate body (101), and the adjustment component (40) also includes a fastener (42), and the fastener (42) passes through the first hole (14) and is threadedly connected to the first adjustment hole.

4. The loading port adapter base according to claim 3, characterized in that: The first hole (14) is a waist-shaped hole extending along the Y direction, and the fastener (42) can move along the Y direction in the first hole (14); The Y direction and the Z direction are perpendicular to each other.

5. The loading port adapter base according to claim 3, characterized in that: The first hole (14) is a stepped hole structure, and the large hole end of the first hole (14) is arranged upward to accommodate the head of the fastener (42).

6. The loading port adapter base according to claim 1, characterized in that: The number of the adjustment components (40) is four, and the four adjustment components (40) are arranged at intervals along the circumference of the top plate (10).

7. The loading port adapter base according to claim 1, characterized in that: The detection component (30) is also configured to detect whether the wafer cassette (100) is placed in place; A first mounting position (24) and a second mounting position (25) are provided on the base plate (20); the detection component (30) is detachably mounted on the first mounting position (24) and / or the second mounting position (25); the detection component (30) located on the first mounting position (24) is used to detect whether the wafer (300) loaded in the wafer cassette (100) is parallel to a preset wafer picking plane; and the detection component (30) located on the second mounting position (25) is used to detect whether the wafer cassette (100) is placed in place.

8. The loading port adapter base according to claim 7, characterized in that: The detection component (30) comprises at least three distance sensors mounted on the base plate (20); when the number of the distance sensors is three, the three distance sensors are not collinear; when the number of the distance sensors is greater than three, there are at least three distance sensors that are not collinearly arranged.

9. The loading port adapter base according to any one of claims 1 to 8, characterized in that: The bottom plate (20) is also provided with an avoidance structure (26), which is located at the front end of the bottom plate (20) so as to avoid the wafer box locking mechanism on the loading port base (200).

10. A semiconductor device, comprising a wafer picking arm and a loading port adapter base as described in any one of claims 1 to 9, wherein the loading port adapter base is used to carry a wafer cassette (100) containing wafers (300), and the wafer picking arm is configured to grab and transfer the wafers (300) in the wafer cassette (100), and the preset wafer picking plane is the top surface of the wafer picking arm.

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