Leveling device and bonding equipment

Abstract

The utility model provides a leveling device and bonding equipment, and belongs to the field of semiconductors. The leveling device comprises a workbench; the bonding platform is configured on the surface of the workbench; the plurality of fixing parts are connected to the bonding platform, and the plurality of fixing parts are arranged along the circumferential direction of the bonding platform; the adjusting part penetrates through the fixing part in the longitudinal direction and is rotationally connected with the workbench, and the adjusting part is rotated to drive the fixing part to move in the longitudinal direction of the fixing part, so that the levelness of the bonding platform is adjusted. According to the bonding platform, the adjusting part is arranged on the fixing part, when the levelness of the bonding platform needs to be adjusted, the fixing part can be driven to move along the longitudinal direction by rotating the adjusting part, and the fixing part drives one side of the bonding platform to move upwards or downwards, so that the levelness of the bonding platform is adjusted. The leveling device is easy and convenient to operate, the leveling time is shortened, the adjusting efficiency is improved, the working efficiency is improved, and the adjusting precision is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a leveling device and a bonding device. Background Art

[0002] With the continuous evolution and update of advanced packaging technology, the trend of product type diversification is becoming increasingly significant. As a result, the requirements for the horizontal adjustment of the bonding platform used to carry chips are gradually increasing. At the same time, the diversification and replacement frequency of the bonding platform are also increasing. Figure 1 As shown, Figure 1 The schematic diagram of the structure of the leveling device in one embodiment is shown in FIG. 10 , wherein 10 is a carrier; 20 is a screw; 30 is a fixing block; and 40 is a platform. The carrier 10 is used to carry objects such as chips to be welded. In existing semiconductor packaging process equipment, in order to make the carrier in a horizontal state, the levelness of the carrier is adjusted by padding a feeler gauge in the gap between the carrier and the platform. Then, the screw 20 is passed through the fixing block 30 and threadedly connected to the platform to fix the carrier 10 to the platform.

[0003] The existing method of adjusting the horizontality of the support platform is not only cumbersome to operate, takes a long time to adjust, reduces work efficiency, but also difficult to ensure the adjustment accuracy.

[0004] It should be noted that the information disclosed in the background technology section of the utility model is only intended to deepen the understanding of the general background technology of the utility model, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The utility model aims to provide a leveling device and a bonding device to solve the problems of the traditional leveling method, such as complicated operation, long adjustment time, low working efficiency and difficulty in ensuring adjustment accuracy.

[0006] In order to solve the above technical problems, the utility model provides a leveling device, comprising:

[0007] Workbench;

[0008] A bonding platform, arranged on the surface of the workbench;

[0009] A plurality of fixing parts connected to the bonding platform, and the plurality of fixing parts are arranged along the circumference of the bonding platform;

[0010] The adjusting part penetrates the fixing part in the longitudinal direction and is rotatably connected to the workbench, wherein the adjusting part is rotated to drive the fixing part to move in the longitudinal direction thereof, thereby adjusting the horizontality of the bonding platform.

[0011] Preferably, the leveling device further comprises a limiting portion, wherein the limiting portion passes through the adjusting portion and is connected to the workbench.

[0012] Preferably, the adjusting portion is provided with a through hole along its longitudinal direction, the limiting portion has a first end and a second end, the first end of the limiting portion passes through the through hole, and the diameter of the first end is smaller than the diameter of the through hole, and the diameter of the second end is larger than the diameter of the through hole.

[0013] Preferably, the limiting portion is a fixing screw, and the fixing screw is threadedly connected to the fixing portion.

[0014] Preferably, a plurality of threaded holes are provided on the surface of the workbench, and the threaded holes correspond to the positions of the fixing screws, and the fixing screws are threadedly connected to the threaded holes.

[0015] Preferably, the fixing portion is provided with a groove, and the diameter of the groove is larger than the diameter of the second end.

[0016] Preferably, the adjusting portion is a threaded sleeve.

[0017] Preferably, the threaded sleeve is threadedly connected to the fixing portion.

[0018] Preferably, four fixing portions are provided, and the four fixing portions are evenly arranged along the circumferential direction of the bonding platform.

[0019] Based on the same inventive concept, the utility model also provides a bonding device, including the above-mentioned leveling device.

[0020] Compared with the prior art, the leveling device of the utility model has the following advantages:

[0021] The utility model is provided with a workbench; a bonding platform, which is arranged on the surface of the workbench; a plurality of fixing parts, which are connected to the bonding platform, and the plurality of fixing parts are arranged along the circumference of the bonding platform; an adjusting part, which penetrates the fixing part along the longitudinal direction and is rotatably connected to the workbench, wherein the adjusting part is rotated to drive the fixing part to move along its longitudinal direction, thereby adjusting the horizontality of the bonding platform. Therefore, the leveling device provided by the utility model has the adjusting part arranged on the fixing part. When it is necessary to adjust the horizontality of the bonding platform, the adjusting part is rotated to drive the fixing part to move along the longitudinal direction, and the fixing part drives one side of the bonding platform to move upward or downward, thereby adjusting the horizontality of the bonding platform. The leveling device is not only easy to operate, shortens the leveling time, improves the adjustment efficiency, and improves the work efficiency, but also further improves the adjustment accuracy.

[0022] The bonding device provided by the utility model and the leveling device provided by the utility model belong to the same inventive concept. Therefore, the bonding device provided by the utility model has at least all the advantages of the leveling device provided by the utility model. When the bonding device bonds the chip, it is convenient to adjust the horizontality of the bonding platform, and the adjustment accuracy is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a positional relationship diagram of a workbench and a bonding platform in one embodiment;

[0024] Figure 2 It is a schematic diagram of the overall structure of the leveling device in one embodiment of the utility model;

[0025] Figure 3 yes Figure 2 A schematic diagram of the enlarged structure at the middle dotted square A;

[0026] Figure 4 yes Figure 3 A schematic diagram of the main cross-sectional structure of the middle fixing part;

[0027] Figure 5 yes Figure 3 A schematic diagram of the main cross-sectional structure of the middle adjustment part;

[0028] Figure 6 yes Figure 3 A schematic diagram of the structure of the middle limiter;

[0029] In the figure,

[0030] 10-carrying platform; 20-screw;

[0031] 30-fixed block; 40-platform;

[0032] 100-working table; 200-bonding platform;

[0033] 300-fixing portion; 310-threaded portion;

[0034] 320-groove; 400-adjustment part;

[0035] 410-through hole; 500-limiting part;

[0036] 510-second end; 520-first end. DETAILED DESCRIPTION

[0037] In order to make the purpose, advantages and features of the utility model clearer, the leveling device and bonding device proposed in the utility model are further described in detail in combination with the drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. It should be understood that the drawings in the specification do not necessarily show the specific structure of the utility model in proportion, and the illustrative features used to illustrate certain principles of the utility model in the drawings in the specification will also adopt a slightly simplified drawing method. The specific design features of the utility model disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific application and use environment. And, in the embodiments described below, sometimes the same figure mark is used in common between different drawings to represent the same part or the part with the same function, and its repeated description is omitted. In this specification, similar numbers and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0040] It should be noted that, in the following embodiments, the term "longitudinal" refers to a direction perpendicular to the horizontal plane of the bonding platform 200 (ie, Figure 2 and Figure 5 in the direction of arrow a).

[0041] Ginseng Figures 2 to 6A specific embodiment of a leveling device disclosed herein. The leveling device described herein is used to adjust the level of the bonding platform 200. However, it should be understood that the leveling device in this embodiment, including but not limited to being applied only in the semiconductor process of wafers, can also be applied to other fields, such as adjusting the level of a carrier plate for carrying objects.

[0042] Ginseng Figures 2 to 6 A specific embodiment of a leveling device is disclosed. The leveling device includes a workbench 100; a bonding platform 200, which is arranged on the surface of the workbench 100; a plurality of fixing parts 300, which are connected to the bonding platform 200, and the plurality of fixing parts 300 are arranged along the circumference of the bonding platform 200; an adjusting part 400, which penetrates the fixing part 300 along the longitudinal direction and is rotatably connected to the workbench 100, wherein the adjusting part 400 is rotated to drive the fixing part 300 to move along its longitudinal direction, thereby adjusting the horizontality of the bonding platform 200.

[0043] When bonding the chip, the chip needs to be placed on the bonding platform 200, and the bonding platform 200 needs to be placed on the surface of the workbench 100, while keeping the bonding platform 200 in a horizontal position. In order to adjust the horizontality of the bonding platform 200, the traditional leveling method is to use a feeler gauge to fill the gap between the bonding platform 200 and the workbench 100. After the bonding platform 200 is manually leveled, the limiting part 500 is then threaded through the fixing part 300 and the workbench 100 to fix the bonding platform 200 to the workbench 100. This leveling method is not only cumbersome to operate, takes a long time to adjust, but also has low adjustment accuracy.

[0044] However, in the leveling device disclosed in this embodiment, during the adjustment process, the micrometer is first used to test the level of the bonding platform 200, and then the height difference position that needs to be adjusted is determined. When the adjustment part 400 is rotated clockwise or counterclockwise, the fixing part 300 can move in the longitudinal direction or downward, thereby driving one side of the bonding platform 200 to move upward or downward, and the horizontality of the bonding platform 200 can be adjusted. After one adjustment is completed, the micrometer is used again to test the level of the bonding platform 200 to ensure that the bonding platform 200 meets the horizontality requirement. The entire adjustment process is simple and convenient to operate, which shortens the leveling time, improves the adjustment efficiency and work, and at the same time, improves the accuracy of the adjustment.

[0045] The workbench 100 is a work platform for chip bonding. The shape of the workbench 100 can be as follows: Figure 2The cylindrical structure shown may also be a rectangular parallelepiped, a cube, or the like. The shape of the workbench 100 may be arbitrarily changed according to the needs of chip bonding, and no specific requirements are made for the workbench 100. The size and material of the workbench 100 may also be arbitrarily changed according to the needs of chip bonding or the actual needs of other fields, and no specific requirements are made in this embodiment.

[0046] The bonding platform 200 can be used to carry a chip or a substrate with solder balls or resistors. When the leveling device is applied to other fields, the bonding platform 200 can be used as a carrier for carrying other objects. The shape of the bonding platform 200 can be as follows: Figure 2 The cylindrical structure shown may also be a rectangular parallelepiped, a cube, or the like. In actual production, the shape of the bonding platform 200 may be arbitrarily changed according to the needs of chip bonding. Similarly, no specific requirements are made for the shape of the bonding platform 200. The size and material of the bonding platform 200 may also be arbitrarily changed according to the needs of chip bonding or the actual needs of other fields. In this embodiment, no specific requirements are made.

[0047] Among them, Figures 2 to 4 As shown, the fixing part 300 and the bonding platform 200 can be fixed together by welding, or can be detachably fixed together. For example, the fixing part 300 and the bonding platform 200 can be connected by screw threads to achieve a detachable connection between the fixing part 300 and the bonding platform 200. The shape of the fixing part 300 can be a block structure, or can be a structure such as Figure 4 The structural shape shown. Figure 4 In the structure of the fixing part 300 shown in the figure, the fixing part 300 has a groove 320. Two or more fixing parts 300 may be provided. In order to facilitate the adjustment of the horizontality of the bonding platform 200, in this embodiment, preferably four fixing parts 300 are provided, and the four fixing parts 300 are arranged along the circumferential direction of the bonding platform 200 (that is, Figure 2 The two pieces are evenly arranged in the direction of the arrow b).

[0048] Among them, Figures 2 to 6As shown, the adjusting part 400 can be a rod-shaped structure or an I-shaped structure. The adjusting part 400 penetrates the fixing part 300 in the longitudinal direction and is rotatably connected to the workbench 100. The adjusting part 400 can be rotatably connected to the workbench 100 through a bearing. The adjusting part 400 is threadedly connected to the fixing part 300. The fixing part 300 is provided with a threaded part 310. The periphery of the adjusting part 400 can be provided with a thread that matches the threaded part 310, so that the adjusting part 400 is threadedly connected to the fixing part 300. In this embodiment, the adjusting part 400 is preferably a threaded sleeve. The threaded sleeve is threadedly connected to the fixing part 300. When the threaded sleeve is rotated clockwise or counterclockwise, the fixing part 300 can be moved in the longitudinal direction or downward, thereby driving one side of the bonding platform 200 to move upward or downward, and the horizontality of the bonding platform 200 can be adjusted.

[0049] Exemplarily, the leveling device further includes a limiting portion 500 , which passes through the adjusting portion 400 and is connected to the workbench 100 .

[0050] Specifically, refer to Figures 2 to 6 As shown, the limiting part 500 passes through the threaded sleeve and is fixedly connected to the workbench 100 to further fix the workbench 100 and the bonding platform 200. The limiting part 500 can be a T-shaped, I-shaped or other structure. In this embodiment, the limiting part 500 is preferably a fixing screw, and the fixing screw is a T-shaped structure. The fixing screw has a first end 520 and a second end 510. The threaded sleeve is provided with a through hole 410. The diameter d4 of the first end 520 is smaller than the diameter d2 of the through hole 410, and the diameter d3 of the second end 510 is larger than the diameter of the through hole 410. It is necessary to ensure that the first end 520 can pass through the through hole 410, and to avoid the second end 510 from passing through the through hole 410, so that the fixing screw falls when the fixing screw is disassembled from the workbench 100. In addition, the diameter d4 of the second end 510 is smaller than the diameter d1 of the groove 320 on the fixing part 300, so that the rotating tool can be inserted into the groove 320 when the threaded sleeve needs to be rotated. The surface of the workbench 100 is provided with threaded holes, and the positions of the threaded holes correspond to the positions of the fixing screws. The fixing screws are passed through the through holes 410 and threadedly connected with the threaded holes, so that the bonding platform 200 and the workbench 100 can be further fixed.

[0051] The specific use process of the leveling device disclosed in this embodiment is as follows:

[0052] First, use a micrometer to perform a horizontal test on the bonding platform 200 to determine the height difference and position that need to be adjusted. Then, loosen the fixing screws at the position to be adjusted from the workbench 100 to separate the workbench 100 and the bonding platform 200 at that position. Use a special tool, such as a ratchet wrench, an automatic screw locking machine, etc. to rotate the threaded sleeve clockwise or counterclockwise, and the threaded sleeve can drive the fixing part 300 to move in the longitudinal direction, thereby being able to drive the bonding platform 200 at that position to move upward or downward in the longitudinal direction to adjust the horizontality of the bonding platform 200 at that position. After the adjustment is completed, use the micrometer to perform a horizontal test on the bonding platform 200 again, and adjust the bonding platform 200 at least once according to the above method until the bonding platform 200 meets the horizontal requirement. Finally, tighten the fixing screws to further fix the workbench 100 and the bonding platform 200, thereby completing the entire adjustment process.

[0053] This embodiment also discloses a bonding device, including the leveling device as described above.

[0054] The bonding device provided in this embodiment and the leveling device provided in this embodiment belong to the same inventive concept. Therefore, the bonding device provided in this embodiment has at least all the advantages of the leveling device provided in this embodiment. When the bonding device bonds the chip, it is convenient to adjust the horizontality of the bonding platform 200, and the adjustment accuracy is high.

[0055] In summary, the above embodiments provide detailed descriptions of different configurations of the leveling device and the bonding device. Of course, the above description is only a description of the preferred embodiments of the utility model, and is not any limitation to the scope of the utility model. The utility model includes but is not limited to the configurations listed in the above implementations. Those skilled in the art can draw inferences based on the contents of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure are within the scope of protection of the claims.

Claims

1. A leveling device, characterized in that: include: Workbench; A bonding platform, arranged on the surface of the workbench; A plurality of fixing parts connected to the bonding platform, and the plurality of fixing parts are arranged along the circumference of the bonding platform; The adjusting part penetrates the fixing part in the longitudinal direction and is rotatably connected to the workbench, wherein the adjusting part is rotated to drive the fixing part to move in the longitudinal direction thereof, thereby adjusting the horizontality of the bonding platform.

2. The leveling device according to claim 1, characterized in that: The leveling device further includes a limiting portion, which passes through the adjusting portion and is connected to the workbench.

3. The leveling device according to claim 2, characterized in that: The adjusting portion is provided with a through hole along its longitudinal direction, the limiting portion has a first end and a second end, the first end of the limiting portion passes through the through hole, and the diameter of the first end is smaller than the diameter of the through hole, and the diameter of the second end is larger than the diameter of the through hole.

4. The leveling device according to claim 2, characterized in that: The limiting portion is a fixing screw, and the fixing screw is threadedly connected to the fixing portion.

5. The leveling device according to claim 4, characterized in that: A plurality of threaded holes are arranged on the surface of the workbench, and the positions of the threaded holes correspond to the positions of the fixing screws, and the fixing screws are threadedly connected with the threaded holes.

6. The leveling device according to claim 3, characterized in that: The fixing portion is provided with a groove, and a diameter of the groove is greater than a diameter of the second end.

7. The leveling device according to any one of claims 1 to 6, characterized in that: The adjusting portion is a threaded sleeve.

8. The leveling device according to claim 7, characterized in that: The threaded sleeve is threadedly connected to the fixing portion.

9. The leveling device according to claim 1, characterized in that: Four fixing portions are provided, and the four fixing portions are evenly arranged along the circumferential direction of the bonding platform.

10. A bonding device, characterized in that: include: A levelling device as claimed in any one of claims 1 to 9.

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