Silicon wafer transferring and grabbing device
By designing a silicon wafer load transfer device including a grab mount, grab cylinder and position sensor, the problem of insufficient versatility in the existing technology is solved, and the rapid grasping and storage of silicon wafers of various thickness specifications is achieved, and the improvement of enhanced The suitability of the device.
Patent Information
- Application Number
- CN202420833331.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-22
AI Technical Summary
The existing silicon wafer transfer and grabbing devices have poor versatility and cannot be quickly applied to silicon wafer grabbing of multiple thickness specifications.
A silicon wafer transfer grab device including a grabber and a load transfer part is designed. The grabber is composed of a grabber mounting frame, a grabber cylinder, a position sensor and a clamp. Through the cooperation of the position sensor and the moving clamp, it can be Adapt to silicon wafers of different thickness specifications, and use scale marks to adapt to different size specifications during clamping.
It realizes rapid grabbing and storage of silicon wafers of various thickness specifications, enhances the versatility of the device, and ensures the smooth progress of subsequent operations.
Smart Images
Figure CN222281967U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of silicon wafer transfer and grasping, and particularly relates to a silicon wafer transfer and grasping device. Background Art
[0002] Silicon crystal photovoltaic technology is the most widely used photovoltaic technology at present. Its cells use silicon as the main material and are made of single crystal silicon or polycrystalline silicon. Silicon crystal photovoltaics have the advantages of high efficiency, stability and reliability, but their production cost is high. The materials used in thin-film solar cells mainly include amorphous silicon, copper indium gallium selenide, organic materials, etc., which have the characteristics of light weight, low production cost and strong flexibility, but their efficiency is lower than that of silicon crystal photovoltaics. Polycrystalline silicon photovoltaics use microcrystalline crystals of high-purity silicon, which can be comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than silicon crystal photovoltaic technology, and silicon crystal rods are a commonly used silicon crystal.
[0003] After the silicon crystal rod is sliced, silicon wafers are formed. In order to facilitate the subsequent transportation of the silicon wafers, a transfer and grasping device is needed to transfer the silicon wafers. The existing transfer and grasping device usually uses a cylinder to grasp the silicon wafers. A group of sensors are often provided on the existing cylinder to grasp silicon wafers of one thickness specification. If silicon wafers of different thickness specifications need to be grasped, the position of the sensor needs to be adjusted to adapt to the corresponding thickness silicon wafer specifications. Therefore, the versatility of the existing transfer and grasping device is poor, and it cannot be quickly adapted to the grasping of silicon wafers of various thickness specifications. Utility Model Content
[0004] The utility model overcomes the shortcomings of the prior art and provides a silicon wafer transfer and grasping device to solve the problem that the prior transfer and grasping device has poor versatility and cannot be quickly adapted to grasp silicon wafers of various thickness specifications.
[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a silicon wafer transfer and grasping device, comprising
[0006] A gripping part, the gripping part includes a gripping mounting frame, a gripping cylinder arranged on the gripping mounting frame, and a gripping group for gripping the silicon wafer, the gripping mounting frame is provided with a plurality of position sensors, the position sensors are arranged along the driving direction of the gripping cylinder, the gripping cylinder includes a fixed end and a moving end, after the gripping cylinder grips the silicon wafer, the moving end corresponds to one of the position sensors, and the gripping group grips the silicon wafer;
[0007] A transfer unit is provided for transferring the gripping unit.
[0008] In a preferred embodiment of the utility model, the grabbing group includes a fixed clamping plate and a movable clamping plate, the fixed clamping plate is arranged on the grabbing mounting frame, and the movable clamping plate is located on the movable end of the grabbing cylinder, and the movable end drives the movable clamping plate to approach the fixed clamping plate to clamp the silicon wafer.
[0009] In a preferred embodiment of the utility model, the movable clamping plate is provided with scale lines suitable for silicon wafers of different specifications.
[0010] In a preferred embodiment of the present invention, the number of the position sensor is at least one and the position sensor is detachably mounted on the grabbing mounting frame.
[0011] In a preferred embodiment of the utility model, the grabbing and mounting frame is provided with a plurality of holes for mounting the position sensor.
[0012] In a preferred embodiment of the utility model, the transferring part includes a transferring bracket, an X-axis module located on the transferring bracket, a Y-axis module moving along the length direction of the X-axis module, a Z-axis module moving along the length direction of the Y-axis module, and a rotating cylinder arranged at the driving end of the Z-axis module, and the grabbing mounting frame is arranged at the rotating end of the rotating cylinder.
[0013] In a preferred embodiment of the present invention, the X-axis module, the Y-axis module and the Z-axis module are all electric cylinder drive modules.
[0014] The utility model solves the defects existing in the background technology, and has the following beneficial effects:
[0015] (1) The transfer and grabbing device of the utility model can grab silicon wafers of different thickness specifications, and has stronger versatility. In actual use, the number of silicon wafers to be grabbed can be quickly determined according to the corresponding relationship between the position sensor and the position of the moving end, thereby ensuring the smooth progress of subsequent storage operations;
[0016] (2) Scale lines are provided on the movable clamping plate, so that silicon wafers of different sizes can be grasped, thereby enhancing the versatility of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments;
[0018] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the utility model;
[0019] Figure 2 This is a first structural schematic diagram of the grabbing portion of a preferred embodiment of the utility model;
[0020] Figure 3 This is a second structural schematic diagram of the grabbing portion of the preferred embodiment of the utility model;
[0021] In the figure: 10, grabbing part; 11, grabbing mounting frame; 111, position sensor; 112, hole position; 12, grabbing cylinder; 121, fixed end; 122, moving end; 13, grabbing group; 131, fixed clamping plate; 132, moving clamping plate; 1321, scale line; 20, transfer part; 21, transfer bracket; 22, X-axis module; 23, Y-axis module; 24, Z-axis module; 25, rotating cylinder. DETAILED DESCRIPTION
[0022] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.
[0023] This embodiment provides a silicon wafer transfer and grasping device, which can grasp silicon wafers of different thickness specifications. It has stronger versatility and can quickly determine the grasping quantity of silicon wafers in actual use, thereby ensuring the smooth progress of subsequent storage operations.
[0024] like Figure 1 As shown, the silicon wafer transfer and grasping device of this embodiment includes a grasping part 10 and a transferring part 20. The grasping part 10 can grasp the silicon wafer, and the transferring part 20 transfers the grasping part 10 to drive the silicon wafer to be transferred.
[0025] Combination Figure 2 and Figure 3 As shown, the grabbing part 10 includes a grabbing mounting frame 11, a grabbing cylinder 12 arranged on the grabbing mounting frame 11, and a grabbing group 13 for grabbing the silicon wafer. The grabbing mounting frame 11 is provided with a plurality of position sensors 111, and the position sensors 111 are arranged along the driving direction of the grabbing cylinder 12. The grabbing cylinder 12 includes a fixed end 121 and a movable end 122. After the grabbing cylinder 12 grabs the silicon wafer, the movable end 122 corresponds to one of the position sensors 111. The grabbing group 13 grabs the silicon wafer. The grabbing group 13 includes a fixed clamping plate 131 and a movable clamping plate 132. Plate 132, the fixed clamping plate 131 is arranged on the grabbing mounting frame 11, the movable clamping plate 132 is located on the movable end 122 of the grabbing cylinder 12, and the movable end 122 drives the movable clamping plate 132 to approach the fixed clamping plate 131 to clamp the silicon wafer. In the process of clamping the silicon wafer, the movable end 122 is driven by the grabbing cylinder 12 to move. At this time, the movable end 122 drives the movable clamping plate 132 to approach the fixed clamping plate 131 until the clamping of the silicon wafer is completed. After clamping, the movable end 122 of the grabbing cylinder 12 corresponds to a position sensor 111, and the clamping thickness of the silicon wafer can be determined at this time.
[0026] In the present embodiment, there are three position sensors 111 in the present embodiment, and adjacent position sensors 111 are arranged at equal intervals. There is a group of original sensors on the grasping cylinder 12 used in the present embodiment, and the group of original sensors can clamp silicon wafers of a certain thickness (hereinafter referred to as standard thickness specifications), but cannot be applied to silicon wafers of other thickness specifications. After the grasping cylinder 12 clamps and grasps the silicon wafer, when the moving end 122 of the grasping cylinder 12 corresponds to one of the position sensors 111, it indicates that the grasping cylinder 12 has grasped a silicon wafer of non-standard thickness specifications, and the thickness of the silicon wafer can be confirmed according to the different position sensors 111 corresponding to the moving end 122.
[0027] Specific as Figure 3 As shown, when the top of the moving end 122 corresponds to the position of the lowest position sensor 111, it indicates that the thickness of the silicon wafer grasped by the grasping cylinder 12 exceeds the standard thickness by one unit; when the top of the moving end 122 corresponds to the position of the middle position sensor 111, it indicates that the thickness of the silicon wafer grasped by the grasping cylinder 12 exceeds the standard thickness by two units; when the top of the moving end 122 corresponds to the position of the highest position sensor 111, it indicates that the thickness of the silicon wafer grasped by the grasping cylinder 12 exceeds the standard thickness by three units.
[0028] Furthermore, the position sensor 111 is detachably mounted on the grabbing mounting frame 11, and a plurality of holes 112 for installing the position sensor 111 are provided on the grabbing mounting frame 11. By changing the installation position of the position sensor 111, the standard thickness of the silicon wafer grabbed by the grabbing cylinder 12 is changed to adapt to the grabbing operation of silicon wafers of different specifications.
[0029] In this embodiment, the movable clamping plate 132 is provided with scale lines 1321 suitable for silicon wafers of different specifications, so as to be suitable for grabbing silicon wafers of different sizes and specifications.
[0030] like Figure 1 As shown, the transfer portion 20 includes a transfer bracket 21, an X-axis module 22 located on the transfer bracket 21, a Y-axis module 23 moving along the length direction of the X-axis module 22, a Z-axis module 24 moving along the length direction of the Y-axis module 23, and a rotating cylinder 25 arranged at the driving end 122 of the Z-axis module 24. The grabbing mounting frame 11 is arranged at the rotating end of the rotating cylinder 25. With the cooperation of the X-axis module 22, the Y-axis module 23, the Z-axis module 24 and the rotating cylinder 25, all-round driving of the grabbing portion 10 is realized.
[0031] In this embodiment, the X-axis module 22, the Y-axis module 23 and the Z-axis module 24 are all electric cylinder drive modules with high drive accuracy and greater stability.
[0032] In actual use of the silicon wafer transferring and grasping device of this embodiment, after the grasping cylinder 12 grasps the silicon wafer, the moving end 122 of the grasping cylinder 12 corresponds to one of the position sensors 111, and receives the signal of the position sensor 111, thereby determining the thickness specification of the silicon wafer. The use of multiple position sensors 111 can be applicable to silicon wafers of various thickness specifications, thereby enhancing the applicability of the silicon wafer transferring and grasping device of this embodiment, and can quickly determine the number of silicon wafers grasped, thereby ensuring the smooth progress of subsequent storage operations. The moving clamp 132 is provided with a scale line 1321, which can grasp silicon wafers of different sizes, thereby enhancing the versatility of the utility model.
[0033] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.
Claims
1. A silicon wafer transfer and grabbing device, characterized in that: include A gripping portion (10), the gripping portion (10) comprising a gripping mounting frame (11), a gripping cylinder (12) arranged on the gripping mounting frame (11), and a gripping group (13) for gripping a silicon wafer, the gripping mounting frame (11) being provided with a plurality of position sensors (111), the position sensors (111) being arranged along the driving direction of the gripping cylinder (12), the gripping cylinder (12) comprising a fixed end (121) and a movable end (122), after the gripping cylinder (12) grips the silicon wafer, the movable end (122) corresponds to one of the position sensors (111), and the gripping group (13) grips the silicon wafer; A transfer unit (20), wherein the transfer unit (20) transfers the grasping unit (10).
2. The silicon wafer transfer and grabbing device according to claim 1, characterized in that: The gripping group (13) comprises a fixed clamping plate (131) and a movable clamping plate (132); the fixed clamping plate (131) is arranged on the gripping mounting frame (11); the movable clamping plate (132) is located on the movable end (122) of the gripping cylinder (12); the movable end (122) drives the movable clamping plate (132) to approach the fixed clamping plate (131) to clamp the silicon wafer.
3. The silicon wafer transfer and grabbing device according to claim 2, characterized in that: The movable clamping plate (132) is provided with scale lines (1321) suitable for silicon wafers of different specifications.
4. The silicon wafer transfer and grabbing device according to claim 1, characterized in that: The number of the position sensor (111) is at least one and is detachably mounted on the grabbing mounting frame (11).
5. The silicon wafer transfer and grabbing device according to claim 4, characterized in that: The grabbing and mounting frame (11) is provided with a plurality of holes (112) for mounting the position sensor (111).
6. The silicon wafer transfer and grabbing device according to claim 1, characterized in that: The transfer part (20) comprises a transfer bracket (21), an X-axis module (22) located on the transfer bracket (21), a Y-axis module (23) moving along the length direction of the X-axis module (22), a Z-axis module (24) moving along the length direction of the Y-axis module (23), and a rotary cylinder (25) arranged at the driving end (122) of the Z-axis module (24), and the grabbing mounting frame (11) is arranged at the rotating end of the rotary cylinder (25).
7. The silicon wafer transfer and grabbing device according to claim 6, characterized in that: The X-axis module (22), the Y-axis module (23) and the Z-axis module (24) are all electric cylinder drive modules.