Multifunctional board for PCB production
By designing multifunctional boards in PCB production, and using the bonding characteristics of the annular conductive adhesive layer and alloy plate layer, the problem of difficulty in recycling and waste of traditional fake boards is solved, and the recycling of copper layers and the production cost is reduced.
Patent Information
- Application Number
- CN202420946460.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-30
AI Technical Summary
In the PCB production process, traditional fake plates are usually copper plates, which are difficult to separate and recycle after use, resulting in waste of copper plates and are difficult to be suitable for graphic electroplating, electrographic thickening and etching tests.
A multifunctional board is designed, including an annular conductive adhesive layer between the resin layer and the two alloy plate layers to ensure electrical conduction, and the bonding force between the alloy plate layer and copper is less than the bonding force between copper and copper. This allows the copper layer to be peeled off manually or by potion to achieve recycling.
This multi-functional board can be used for graphic electroplating, electrographic thickening and etching testing, reducing copper waste, reducing production costs, and achieving effective recycling and recycling of copper layers.
Smart Images
Figure CN222283566U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of PCB production, and in particular to a multifunctional board used in PCB production. Background Art
[0002] PCB, also known as printed circuit board, is the provider of electrical connections for electronic components. It has a history of more than 100 years. The main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, and improve the level of automation and production labor rate.
[0003] When the PCB electroplating process is performing copper plating, the current density on both sides of the hanging rack is the largest, and the circuit boards close to the two ends of the hanging rack are easily burned. For this reason, when copper plating is performed, the board is now moved to the middle, leaving the space at both ends to be replaced with some other conductive materials. This is what the industry often calls a fake board (accompanying plated board).
[0004] When making some small batches of boards or testing new boards or some expensive boards, the pattern electroplating process needs to be full of flying targets, that is, the flying targets are full of boards. Generally, 8-12 boards are needed for a full flying target, but when the number of boards is less than 8, some fake boards need to be made. The traditional fake boards are copper plates, and then the pattern transfer process is required to make them consistent with the real board pattern to ensure uniform current distribution and improve copper plating uniformity. However, due to the good combination of copper and copper, that is, the copper layer and the copper plate are difficult to separate, these fake boards are scrapped after being used once, resulting in a waste of copper plates.
[0005] Although the fake board undergoing the graphic and electrical thickening process does not need to undergo the graphic transfer process, a copper plate is also used as a fake board, and the copper plating process is carried out together with the real board undergoing the graphic and electrical thickening process. There may also be fake boards that are scrapped after being used once, resulting in a waste of copper plates.
[0006] However, after the pattern thickening process, the board needs to undergo an etching process. Often, a test board is used to test the etching circuit before the etching process. The test board also uses a copper plate for pattern electroplating, pattern transfer and pattern thickening processes. In other words, there will be test boards that are scrapped after being used once, resulting in a waste of copper plates.
[0007] In summary, the current PCB production process urgently needs a multifunctional board that can be recycled and is suitable for graphic electroplating, graphic thickening and etching testing. Utility Model Content
[0008] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a multifunctional board for PCB production that can be recycled and is suitable for pattern electroplating, pattern thickening and etching testing.
[0009] The purpose of this disclosure is achieved through the following technical solutions:
[0010] A multifunctional board for PCB production, comprising:
[0011] Resin layer;
[0012] a first alloy plate layer, one side of the first alloy plate layer being bonded to one side of the resin layer;
[0013] a second alloy plate layer, the other side of the second alloy plate layer being bonded to the other side of the resin layer;
[0014] The conductive component comprises an annular conductive adhesive layer, and the annular conductive adhesive layer is respectively bonded to the side wall periphery of the first alloy plate layer, the side wall periphery of the resin layer and the side wall periphery of the second alloy plate layer.
[0015] In one embodiment, the resin layer, the first alloy plate layer and the second alloy plate layer are all rectangular plate layer structures.
[0016] In one embodiment, the annular conductive adhesive layer includes a first conductive adhesive layer, a second conductive adhesive layer, a third conductive adhesive layer and a fourth conductive adhesive layer bonded in a head-to-tail order, the first conductive adhesive layer is respectively bonded to the first side wall of the resin layer, the first side wall of the first alloy plate layer and the first side wall of the second alloy plate layer, the second conductive adhesive layer is respectively bonded to the second side wall of the resin layer, the second side wall of the first alloy plate layer and the second side wall of the second alloy plate layer, the third conductive adhesive layer is respectively bonded to the third side wall of the resin layer, the third side wall of the first alloy plate layer and the third side wall of the second alloy plate layer, and the fourth conductive adhesive layer is respectively bonded to the fourth side wall of the resin layer, the fourth side wall of the first alloy plate layer and the fourth side wall of the second alloy plate layer.
[0017] In one embodiment, the first alloy plate layer and the second alloy plate layer are both zinc-copper alloy plate layers or aluminum-copper alloy plate layers.
[0018] In one embodiment, the thickness of the first alloy plate layer and the second alloy plate layer are both 0.05 mm to 0.1 mm.
[0019] In one embodiment, the thickness of the resin layer is 0.5 mm to 1.5 mm.
[0020] In one embodiment, the length of the first conductive adhesive layer is 0.6-1.7 mm, and the width of the first conductive adhesive layer is 0.05 mm-0.1 mm.
[0021] In one embodiment, the length of the second conductive adhesive layer is 0.6-1.7 mm, and the width of the second conductive adhesive layer is 0.05 mm-0.1 mm.
[0022] In one embodiment, the length of the third conductive adhesive layer is 0.6-1.7 mm, and the width of the third conductive adhesive layer is 0.05 mm-0.1 mm.
[0023] In one embodiment, the length of the fourth conductive adhesive layer is 0.6-1.7 mm, and the width of the fourth conductive adhesive layer is 0.05 mm-0.1 mm.
[0024] Compared with the prior art, the present invention has at least the following advantages:
[0025] 1. Due to the setting of the annular conductive adhesive layer, electrical conduction can be achieved between the first alloy plate layer and the first alloy plate layer, thereby ensuring that copper plating can be achieved on the first alloy plate layer and the first alloy plate layer. At the same time, the other side of the first alloy plate layer and the other side of the first alloy plate layer can be used for pattern transformation process for pattern forming, so that the multifunctional board can be suitable for fake boards for pattern electroplating, fake boards for pattern thickening, and test boards for etching tests. At the same time, copper will not be plated on the annular conductive adhesive layer, reducing copper waste, thereby effectively saving the production cost of PCB boards.
[0026] 2. Since the bonding force between the alloy plate layer and copper is smaller than the bonding force between copper and copper, when the multifunctional board is used for fake boards for graphic electroplating, fake boards for graphic electroplating thickening, and test boards for etching tests, the copper layer on the first alloy plate layer and the copper layer on the first alloy plate layer can be peeled off manually or with chemicals, which can not only effectively recover copper, but also the first alloy plate layer and the first alloy plate layer after peeling can be recycled, avoiding the waste of copper plates, thereby effectively saving the production cost of PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0028] Figure 1 A schematic diagram of the structure of a multifunctional board for PCB production in one embodiment;
[0029] Figure 2 for Figure 1 The schematic diagram of the partial structure of the multifunctional board used in PCB production after the explosion is shown;
[0030] Figure 3 for Figure 1 A partial cross-sectional view of a multifunctional board used in PCB production is shown;
[0031] Figure 4 for Figure 1 A partial cross-sectional view from another perspective of a multi-function board used for PCB production is shown. DETAILED DESCRIPTION
[0032] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.
[0033] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0035] The present disclosure provides a multifunctional board for PCB production, comprising a resin layer, a first alloy plate layer, a second alloy plate layer and a conductive component. One side of the first alloy plate layer is bonded to one side of the resin layer. The other side of the second alloy plate layer is bonded to the other side of the resin layer. The conductive component comprises an annular conductive adhesive layer, and the annular conductive adhesive layer is respectively bonded to the side wall periphery of the first alloy plate layer, the side wall periphery of the resin layer and the side wall periphery of the second alloy plate layer.
[0036] See also Figures 1 to 4 In order to better understand the multifunctional board 10 for PCB production disclosed in the present invention, the multifunctional board 10 for PCB production is further explained below:
[0037] A multifunctional board 10 for PCB production according to one embodiment includes a resin layer 100, a first alloy plate layer 200, a second alloy plate layer 300, and a conductive component 400. One side of the first alloy plate layer 200 is bonded to one side of the resin layer 100. The other side of the second alloy plate layer 300 is bonded to the other side of the resin layer 100. The conductive component 400 includes an annular conductive adhesive layer 410, which is bonded to the side wall periphery of the first alloy plate layer 200, the side wall periphery of the resin layer 100, and the side wall periphery of the second alloy plate layer 300, respectively.
[0038] In the present embodiment, due to the provision of the annular conductive adhesive layer 410, electrical conduction can be achieved between the first alloy plate layer 200 and the first alloy plate layer 300, thereby ensuring that copper plating can be achieved on the first alloy plate layer 200 and the first alloy plate layer 300. At the same time, the other side of the first alloy plate layer 200 and the other side of the first alloy plate layer 300 can be used for graphic transformation process for graphic forming, so that the multifunctional board 10 can be suitable for fake boards for graphic electroplating, fake boards for graphic thickening, and test boards for etching tests. At the same time, copper will not be plated on the annular conductive adhesive layer 410, which reduces the waste of copper and effectively saves the production cost of the PCB board.
[0039] Furthermore, since the bonding force between the alloy plate layer and copper is smaller than the bonding force between copper and copper, when the multifunctional board 10 is used for a dummy board for graphic electroplating, a dummy board for graphic electroplating thickening, and a test board for etching test, the copper layer on the first alloy plate layer 200 and the copper layer on the first alloy plate layer 300 can be peeled off manually or with chemicals, which not only effectively recovers the copper, but also the first alloy plate layer 200 and the first alloy plate layer 300 can be recycled after peeling, thus avoiding the waste of copper plates and effectively saving the production cost of PCB boards.
[0040] It should be noted that when the multifunctional board 10 disclosed in the present invention is used for a fake board for graphic electroplating, a forming pattern is first formed on the other side of the first alloy plate layer 200 and the other side of the first alloy plate layer 300 so that the pattern is consistent with the pattern of the real board. Then, the multifunctional board 10 is subjected to graphic electroplating together with the real board. In this way, the uniformity of copper plating can be improved, and the surface copper layers of the first alloy plate layer 200 and the first alloy plate layer 300 can be manually peeled off or peeled off with chemicals, so that the multifunctional board 10 can be recycled.
[0041] Furthermore, the multifunctional board 10 disclosed in the present invention does not require pattern transfer when used as a dummy board for pattern electroplating, and can be directly used as a dummy board for pattern electroplating, and the surface copper layer of the first alloy plate layer 200 and the first alloy plate layer 300 can be peeled off manually or with chemicals, so that the multifunctional board 10 can be recycled.
[0042] Furthermore, when the multifunctional board 10 of the present disclosure is used as a test board for etching test, the multifunctional board 10 can be made into a test board through pattern transfer, pattern electroplating and pattern thickening processes, that is, the multifunctional board can be prepared together with the real board, and after the test is completed, the surface copper layer of the first alloy plate layer 200 and the first alloy plate layer 300 can be peeled off manually or with a liquid medicine, so that the multifunctional board 10 can be recycled. At the same time, the multifunctional board 10 used for the fake board with pattern thickening can also be used for etching circuit testing.
[0043] It is understandable that the electroplating tank of the gantry line is prone to adverse conditions such as metal and organic impurities contaminating the tank liquid or reducing the activity of the electroplating solution after being used for a period of time, which will seriously affect the quality of the coating and the efficiency of electroplating. Conventionally, the electroplating tank is subjected to a cylinder dragging treatment by a cylinder dragging plate to reduce the degree of contamination of the electroplating tank liquid and increase the activity of the electroplating solution. The multifunctional board 10 disclosed in the present invention is plated with copper on the surface and can be used as a cylinder dragging plate of the gantry line to perform cylinder dragging operations on the electroplating tank. After the gantry line cylinder dragging maintenance, the copper layer on the surface of the first alloy plate layer 200 and the first alloy plate layer 300 is manually peeled off or stripped with chemicals, so that the multifunctional board 10 can be recycled.
[0044] It should be noted that the first alloy plate layer 200, the resin layer 100 and the second alloy plate layer 300 are bonded together by stacking and pressing, and then a conductive adhesive is applied to the periphery of the side wall of the first alloy plate layer 200, the periphery of the side wall of the resin layer 100 and the periphery of the side wall of the first alloy plate layer 300 to form an annular conductive adhesive layer 410.
[0045] like Figure 2 As shown, in one embodiment, the resin layer 100, the first alloy plate layer 200 and the second alloy plate layer 300 are all rectangular plate layer structures. It can be understood that the multifunctional board 10 is a rectangular plate layer structure, so that the resin layer 100, the first alloy plate layer 200 and the second alloy plate layer 300 are also rectangular plate layer structures.
[0046] like Figures 1 to 4As shown, in one embodiment, the annular conductive adhesive layer 410 includes a first conductive adhesive layer 4110, a second conductive adhesive layer 4120, a third conductive adhesive layer 4130 and a fourth conductive adhesive layer 4140 bonded in head to tail order, the first conductive adhesive layer 4110 is respectively bonded to the first side wall of the resin layer 100, the first side wall of the first alloy plate layer 200 and the first side wall of the second alloy plate layer 300, the second conductive adhesive layer 4120 is respectively bonded to the second side wall of the resin layer 100, the second side wall of the first alloy plate layer 200 and the second side wall of the second alloy plate layer 300, the third conductive adhesive layer 4130 is respectively bonded to the third side wall of the resin layer 100, the third side wall of the first alloy plate layer 200 and the third side wall of the second alloy plate layer 300, and the fourth conductive adhesive layer 4140 is respectively bonded to the fourth side wall of the resin layer 100, the fourth side wall of the first alloy plate layer 200 and the fourth side wall of the second alloy plate layer 300. It can be understood that since the resin layer 100, the first alloy plate layer 200 and the second alloy plate layer 300 are all rectangular plate layer structures, in order to reduce the copper plating area and improve the conductivity of the first alloy plate layer 200 and the first alloy plate layer 300, in this embodiment, the side wall periphery of the first alloy plate layer 200, the side wall periphery of the resin layer 100 and the side wall periphery of the first alloy plate layer 300 are all coated with a conductive adhesive layer through the first conductive adhesive layer 4110, the second conductive adhesive layer 4120, the third conductive adhesive layer 4130 and the fourth conductive adhesive layer 4140, and copper will not be plated on the conductive adhesive layer. At the same time, the conductivity of the first alloy plate layer 200 and the first alloy plate layer 300 can be improved, so that the copper plating uniformity of the whole batch of multifunctional boards 10 is better when they are electroplated together with the real boards.
[0047] It should be noted that the annular conductive adhesive layer 410 is formed by coating conductive adhesive in one piece, that is, the first conductive adhesive layer 4110 , the second conductive adhesive layer 4120 , the third conductive adhesive layer 4130 and the fourth conductive adhesive layer 4140 are formed by coating in one piece.
[0048] like Figure 2 As shown, in one embodiment, the first alloy plate layer 200 and the second alloy plate layer 300 are both zinc-copper alloy plate layers or aluminum-copper alloy plate layers. It can be understood that the bonding force between the zinc-copper alloy plate layer and copper is smaller than the bonding force between copper and copper, so as to facilitate the stripping of the copper layer on the alloy plate layer. Similarly, the bonding force between the aluminum-copper alloy plate layer and copper is smaller than the bonding force between copper and copper, so as to facilitate the stripping of the copper layer on the alloy plate layer.
[0049] like Figure 2As shown, in one embodiment, the thickness of the first alloy plate layer 200 and the second alloy plate layer 300 are both 0.05 mm to 0.1 mm. It is understandable that the thickness of the first alloy plate layer 200 and the second alloy plate layer 300 is adjusted according to the actual plate thickness produced.
[0050] like Figure 2 As shown, in one embodiment, the thickness of the resin layer 100 is 0.5 mm to 1.5 mm. It is understandable that the thickness of the resin layer 100 is adjusted according to the actual thickness of the real board produced.
[0051] like Figure 3 As shown, in one embodiment, the length of the first conductive adhesive layer 4110 is 0.6-1.7 mm, and the width of the first conductive adhesive layer 4110 is 0.05 mm-0.1 mm. It can be understood that the width of the first conductive adhesive layer 4110 is 0.05 mm-0.1 mm, which can ensure a good conductive effect and prevent the copper layer from being blocked on the first side wall of the first alloy plate layer 200 and the first side wall of the first alloy plate layer 300, thereby reducing the waste of copper.
[0052] like Figure 4 As shown, in one embodiment, the length of the second conductive adhesive layer 4120 is 0.6-1.7 mm, and the width of the second conductive adhesive layer 4120 is 0.05 mm-0.1 mm. It can be understood that the width of the second conductive adhesive layer 4120 is 0.05 mm-0.1 mm, which can ensure a good conductive effect and prevent the copper layer from being blocked on the second side wall of the first alloy plate layer 200 and the second side wall of the first alloy plate layer 300, thereby reducing the waste of copper.
[0053] like Figure 3 As shown, in one embodiment, the length of the third conductive adhesive layer 4130 is 0.6-1.7 mm, and the width of the third conductive adhesive layer 4130 is 0.05 mm-0.1 mm. It can be understood that the width of the third conductive adhesive layer 4130 is 0.05 mm-0.1 mm, which can ensure a good conductive effect and prevent the copper layer from being blocked on the third side wall of the first alloy plate layer 200 and the third side wall of the first alloy plate layer 300, thereby reducing the waste of copper.
[0054] like Figure 4As shown, in one embodiment, the length of the fourth conductive adhesive layer 4140 is 0.6-1.7 mm, and the width of the fourth conductive adhesive layer 4140 is 0.05 mm-0.1 mm. It can be understood that the width of the fourth conductive adhesive layer 4140 is 0.05 mm-0.1 mm, which can ensure a good conductive effect and prevent the copper layer from being blocked on the fourth side wall of the first alloy plate layer 200 and the fourth side wall of the first alloy plate layer 300, thereby reducing the waste of copper.
[0055] Compared with the prior art, the present invention has at least the following advantages:
[0056] 1. Due to the setting of the annular conductive adhesive layer, electrical conduction can be achieved between the first alloy plate layer and the first alloy plate layer, thereby ensuring that copper plating can be achieved on the first alloy plate layer and the first alloy plate layer. At the same time, the other side of the first alloy plate layer and the other side of the first alloy plate layer can be used for pattern transformation process for pattern forming, so that the multifunctional board can be suitable for fake boards for pattern electroplating, fake boards for pattern thickening, and test boards for etching tests. At the same time, copper will not be plated on the annular conductive adhesive layer, reducing copper waste, thereby effectively saving the production cost of PCB boards.
[0057] 2. Since the bonding force between the alloy plate layer and copper is smaller than the bonding force between copper and copper, when the multifunctional board is used for fake boards for graphic electroplating, fake boards for graphic electroplating thickening, and test boards for etching tests, the copper layer on the first alloy plate layer and the copper layer on the first alloy plate layer can be peeled off manually or with chemicals, which can not only effectively recover copper, but also the first alloy plate layer and the first alloy plate layer after peeling can be recycled, avoiding the waste of copper plates, thereby effectively saving the production cost of PCB boards.
[0058] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.
Claims
1. A multifunctional board for PCB production, characterized in that: include: Resin layer; a first alloy plate layer, one side of the first alloy plate layer being bonded to one side of the resin layer; a second alloy plate layer, the other side of the second alloy plate layer being bonded to the other side of the resin layer; The conductive component comprises an annular conductive adhesive layer, and the annular conductive adhesive layer is respectively bonded to the side wall periphery of the first alloy plate layer, the side wall periphery of the resin layer and the side wall periphery of the second alloy plate layer.
2. The multifunctional board for PCB production according to claim 1, characterized in that: The resin layer, the first alloy plate layer and the second alloy plate layer are all rectangular plate layer structures.
3. The multifunctional board for PCB production according to claim 2, characterized in that: The annular conductive adhesive layer includes a first conductive adhesive layer, a second conductive adhesive layer, a third conductive adhesive layer and a fourth conductive adhesive layer bonded in a head-to-tail order, the first conductive adhesive layer is respectively bonded to the first side wall of the resin layer, the first side wall of the first alloy plate layer and the first side wall of the second alloy plate layer, the second conductive adhesive layer is respectively bonded to the second side wall of the resin layer, the second side wall of the first alloy plate layer and the second side wall of the second alloy plate layer, the third conductive adhesive layer is respectively bonded to the third side wall of the resin layer, the third side wall of the first alloy plate layer and the third side wall of the second alloy plate layer, and the fourth conductive adhesive layer is respectively bonded to the fourth side wall of the resin layer, the fourth side wall of the first alloy plate layer and the fourth side wall of the second alloy plate layer.
4. The multifunctional board for PCB production according to claim 1, characterized in that: The first alloy plate layer and the second alloy plate layer are both zinc-copper alloy plate layers or aluminum-copper alloy plate layers.
5. The multifunctional board for PCB production according to claim 1, characterized in that: The thickness of the first alloy plate layer and the second alloy plate layer are both 0.05 mm to 0.1 mm.
6. The multifunctional board for PCB production according to claim 1, characterized in that: The thickness of the resin layer is 0.5 mm to 1.5 mm.
7. The multifunctional board for PCB production according to claim 3, characterized in that: The length of the first conductive adhesive layer is 0.6-1.7 mm, and the width of the first conductive adhesive layer is 0.05 mm-0.1 mm.
8. The multifunctional board for PCB production according to claim 3, characterized in that: The length of the second conductive adhesive layer is 0.6-1.7 mm, and the width of the second conductive adhesive layer is 0.05 mm-0.1 mm.
9. The multifunctional board for PCB production according to claim 3, characterized in that: The length of the third conductive adhesive layer is 0.6-1.7 mm, and the width of the third conductive adhesive layer is 0.05 mm-0.1 mm.
10. The multifunctional board for PCB production according to claim 3, characterized in that: The length of the fourth conductive adhesive layer is 0.6-1.7 mm, and the width of the fourth conductive adhesive layer is 0.05 mm-0.1 mm.