Chip turnover device and chip test equipment

Abstract

The utility model provides a chip turnover device and chip testing equipment. The chip turnover device comprises a rack, a bearing module and a turnover module. The rack is provided with a first position and a second position; the bearing module is located at the second position and comprises a lifting assembly, the lifting assembly comprises a bearing part and a lifting part which are connected, the lifting part is connected with the rack, and the lifting part is located below the bearing part; the overturning module comprises a moving assembly and an overturning assembly, the moving assembly is connected with the rack in a sliding mode, the overturning assembly is connected with the moving assembly, the overturning assembly comprises at least one pair of overturning frames, and clamping pieces are connected to the overturning frames in a sliding mode; the chip overturning device can overturn the chip at the first position and bear the chip at the second position through cooperation of the bearing module and the overturning module, the stability of chip overturning can be improved, the chip testing equipment comprises the chip testing device, a transfer device and the chip overturning device, and the chip overturning efficiency is improved. And testing, transferring and overturning of the chip can be realized.

Description

Technical Field

[0001] The present application relates to the technical field of chip testers, and in particular to a chip flipping device and a chip testing equipment. Background Art

[0002] During chip testing, in order to test both the upper and lower sides of the chip, the chip needs to be flipped over after testing one side of the chip to test the other side. However, for larger chips, the stability is poor when flipping, which can easily cause chip damage, especially for large rectangular chips, which are difficult to load and unload and place when flipping, making flipping difficult. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a chip flipping device that can achieve stable flipping of large-size chips and reduce the difficulty of flipping large-size chips.

[0004] The present application also proposes a chip testing device including the above-mentioned chip flipping device.

[0005] According to the first aspect of the present application, the chip flipping device includes a frame, a carrying module and a flipping module. Along the first direction, the frame is provided with a first position and a second position;

[0006] The bearing module is located at the second position, the bearing module includes a lifting assembly, the lifting assembly includes a bearing member and a lifting member, the bearing member is connected to the lifting member, the lifting member is connected to the frame, and along the second direction, the lifting member is located below the bearing member;

[0007] The flip module includes a moving component and a flip component, the moving component is slidably connected to the frame, the flip component is connected to the moving component, the flip component includes at least one pair of flip frames, and a clamp is slidably connected to the flip frame;

[0008] Along the first direction, the moving component can drive the flip module to move back and forth between the first position and the second position. At the first position, the flip frame and the clamping member are used to cooperate in clamping the chip and can flip the chip. At the second position, the lifting member can drive the carrier to carry the chip and move along the second direction to cooperate with the clamping or release of the clamping member and the flip frame at the second position. The clamping member and the flip frame can slide relative to each other at the second position to clamp or release the chip.

[0009] According to the chip flipping device of the embodiment of the present application, there are at least the following beneficial effects: along the first direction, the moving component slides relative to the frame, the moving component can drive the flip frame and the clamping member to reciprocate between the first position and the second position, along the second direction, the lifting member can drive the carrier to lift and lower the chip at the second position, the flip frame and the clamping member can slide relative to each other at the second position to cooperate in clamping or releasing the chip, and can move to the first position along the first direction to flip the chip after clamping the chip through the driving of the moving component, the moving component can also drive the flip frame and the clamping member to move the flipped chip to the second position, the lifting member drives the carrier to move along the second direction, and can carry the flipped chip. Therefore, through the mutual cooperation of the carrying module and the flipping module, the stable flipping and placement of large-size chips can be achieved, the difficulty of flipping large-size chips is reduced, and it is beneficial to protect the integrity of the chip.

[0010] According to some embodiments of the present application, a first positioning portion is connected to the clamping member, the first positioning portion moves synchronously with the clamping member, a first detection portion is provided on the flip frame, the first positioning portion and the first detection portion are arranged correspondingly, and the first detection portion is used to detect the position of the first positioning portion.

[0011] According to some embodiments of the present application, the carrying module also includes a carrying seat, a second detection unit is provided on the carrying seat, the lifting member is connected to the frame through the carrying seat, the second detection unit is used to detect the position information of the carrying member relative to the carrying seat, the lifting member can be lifted or lowered along the second direction according to the position information, and the carrying member is used to carry the chip.

[0012] According to some embodiments of the present application, a placement groove is provided on the flip frame, and a limiting portion is also provided at the end of the placement groove along the first direction. The clamping member slides relative to the flip frame to fix the chip in the placement groove, and the limiting portion is used to limit the chip from slipping out of the placement groove.

[0013] According to some embodiments of the present application, the flip assembly further includes a first driving member, a first rotating shaft, a second rotating shaft and a fixed seat, the moving assembly includes a base plate and a second driving member, the first driving member is connected to the base plate, the first driving member is connected to the first rotating shaft, the second driving member is connected to the frame, the base plate is slidably connected to the frame, the first rotating shaft is connected to at least two of the second rotating shafts, the second rotating shaft is rotatably connected to the fixed seat, the second rotating shaft is connected to the flip frame, the fixed seat is connected to the base plate, and along the first direction, the first driving member, the first rotating shaft, the second rotating shaft and the bearing module are distributed in sequence;

[0014] Among them, the first driving member is used to drive the first rotating shaft to rotate, the first rotating shaft is used to drive at least two second rotating shafts to rotate, the fixed seat is used to carry the second rotating shaft, the second rotating shaft can drive the flip frame to rotate around a horizontal axis, and the second driving member is configured to drive the substrate to reciprocate relative to the frame along a first direction.

[0015] According to some embodiments of the present application, the carrier module also includes a carrier seat, which is connected to the lifting member. Along the second direction, the carrier seat is located below the carrier member. A positioning member is movably connected to the carrier seat. The positioning member protrudes from the surface of the carrier seat and can form a placement area for placing the chip around the surface of the carrier seat. The positioning member is used to abut the edge of the chip.

[0016] According to some embodiments of the present application, a plurality of supporting modules are configured to be spaced apart along a second direction, and each supporting module also includes a supporting seat, adjacent supporting seats are connected to each other, and the supporting seats are movably connected to a frame, and the supporting seats are connected to a lifting member, and along the second direction, the supporting seat is located below the supporting member, and the supporting seat can reciprocate relative to the frame along the second direction, and the supporting seat and the lifting member are used to jointly drive each supporting member to move up and down along the second direction.

[0017] According to some embodiments of the present application, the carrying module further includes a carrying seat, the lifting member is connected to the frame via the carrying seat, and an adsorption portion is provided on the carrying member, and the adsorption portion is used to adsorb the chip.

[0018] According to some embodiments of the present application, the chip flipping device further includes a code scanning module, which is located above the first position along the second direction, and the code scanning module can scan codes when the chip is flipped.

[0019] The chip testing equipment according to the second aspect embodiment of the present application includes a chip testing device, a transfer device and the chip flipping device in any of the above embodiments, wherein the chip testing device is used to test the chip, the chip flipping device is used to flip the chip, and the transfer device is configured to transfer the chip between the chip testing device and the chip flipping device.

[0020] The chip testing equipment according to the embodiment of the present application has at least the following beneficial effects: by transferring the chip between the chip testing device and the chip flipping device through the transfer device, the separation of chip flipping and detection can be achieved, and the chip flipping device can achieve stable flipping of the chip and support of the chip, thereby achieving stable testing of the chip and improving the safety of the test.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a schematic diagram of the structure of a chip flipping device according to an embodiment of the present application;

[0024] Figure 2 This is a side view of the chip flipping device according to an embodiment of the present application;

[0025] Figure 3 This is a schematic diagram of the structure of the flip frame and the clamping member of the embodiment of the present application;

[0026] Figure 4 A top view of a chip flipping device according to an embodiment of the present application;

[0027] Figure 5 This is a front view of the chip flipping device according to an embodiment of the present application;

[0028] Figure 6 for Figure 1 A local enlarged schematic diagram of point A in the middle.

[0029] Reference numerals: rack 100, first position 110, second position 120;

[0030] The carrying module 200, the first carrying module 201, the second carrying module 202, the lifting assembly 210, the carrying member 211, the adsorption portion 2112, the lifting member 212, the carrying seat 220, the second detection portion 221, the positioning member 222, and the placement area 223;

[0031] Flip module 300, moving assembly 310, second driving member 311, substrate 312, flip assembly 320, flip frame 321, first detection portion 3211, placement slot 3212, limit portion 3213, clamping position 3214, release position 3215, buffer block 3216, clamping member 322, first positioning portion 3221, first driving member 330, first rotating shaft 340, second rotating shaft 350, second positioning portion 351, fixing seat 360, third detection portion 361;

[0032] Scan code module 400;

[0033] Chip 500. DETAILED DESCRIPTION

[0034] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0035] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0037] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0038] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0039] The following is an introduction to the embodiments of the present application in conjunction with the accompanying drawings:

[0040] refer to Figure 1 and Figure 2 According to the chip flipping device of the embodiment of the present application, it includes a frame 100, a carrying module 200 and a flipping module 300. Along the first direction, the frame 100 is provided with a first position 110 and a second position 120, the carrying module 200 is located at the second position 120, the carrying module 200 includes a lifting assembly 210, the lifting assembly 210 includes a carrying member 211 and a lifting member 212, the carrying member 211 is connected to the lifting member 212, the lifting member 212 is connected to the frame 100, along the second direction, the lifting member 212 is located below the carrying member 211, driven by the lifting member 212, the carrying member 211 can move along the second direction to carry the chip 500 to move along the second direction.

[0041] The flip module 300 includes a moving component 310 and a flip component 320. The moving component 310 is slidably connected to the frame 100. The flip component 320 is connected to the moving component 310. Driven by the moving component 310, the flip component 320 can reciprocate between the first position 110 and the second position 120 along the first direction. The flip component 320 includes at least one pair of flip frames 321. The flip frames 321 are slidably connected with a clamping member 322. At the first position 110, the flip frames 321 and the clamping member 322 are used to cooperate with each other to clamp the chip 500 and flip the chip 500.

[0042] It should be noted that the clamping member 322 is slidably connected to the flip frame 321 , so that the flip frame 321 and the clamping member 322 have a clamping state that cooperates with each other to fix the chip 500 , and a releasing state that allows the chip 500 to be taken and placed.

[0043] Specifically, the chip 500 is placed on the carrier 211, the lifting member 212 is connected to the carrier 211, the lifting member 212 can drive the carrier 211 to move along the second direction, and the carrier 211 carries the chip 500 to the position height of the flip assembly 320 for clamping the chip 500. The flipping assembly 320 is moved to the second position 120 along the first direction. The portion of the flipping frame 321 for carrying the chip 500 is located below the chip 500, and the clamping member 322 is located above the chip 500. At this time, the flipping frame 321 and the clamping member 322 are in a released state. The lifting member 212 drives the carrier 211 to move downward along the second direction. The chip 500 on the carrier 211 is supported by the flipping frame 321. The carrier 211 is separated from the chip 500. The clamping member 322 and the flipping frame 321 slide in cooperation to clamp the chip 500. The chip 500 is transferred from the carrier 211 to the flipping assembly 320, so that the flipping assembly 320 moves along the first direction to the first position 110 to flip the chip. There is a flipping space below the first position 110 along the second direction. Therefore, the chip 500 can be flipped at the same height as the carrier 211 carrying the chip 500, which is convenient for flipping maintenance and ensures the integrity of the chip 500.

[0044] After the chip 500 is flipped, the flip frame 321 and the clamping member 322 can move the chip 500 along the first direction to the second position 120, the lifting member 212 drives the carrier 211 to rise along the second direction, the carrier 211 resists the chip 500 clamped by the flip frame 321 and the clamping member 322, the flip frame 321 and the clamping member 322 release the chip 500, the carrier 211 carries the chip 500 and moves along the second direction, so that the chip 500 is separated from the flip frame 321 and / or the clamping member 322, the moving component 310 drives the flipping component 320 to move along the first direction to the first position 110, and the flipped chip 500 is placed on the carrier 211 to wait for being transported to the testing machine for testing. Therefore, the chip 500 flipping device can realize the flipping of the chip 500, especially the flipping of the large-sized rectangular chip 500, and the flipping module 300 and the carrying module 200 cooperate with each other to facilitate the loading and unloading of the chip 500, which is beneficial to protecting the integrity of the chip 500.

[0045] It should be noted that a guide rail extending along a first direction is provided on the frame 100, and the moving component 310 is placed on the guide rail. The sliding of the moving component 310 relative to the frame 100 can be achieved by driving a screw mechanism. For example, the screw mechanism is fixed on the frame 100, and the movable part on the screw mechanism is connected to the moving component 310. The moving component 310 can move relative to the frame 100 along the first direction under the drive of the movable part. The flipping component 320 is connected to the moving component 310. The screw mechanism has a high transmission accuracy. Along the first direction, it helps the flipping frame 321 and the clamping member 322 to clamp or release the position of the chip 500, thereby ensuring the stability of the chip 500 during the flipping process.

[0046] refer to Figures 1 to 3 In some embodiments, a first positioning portion 3221 is connected to the clamping member 322, and the first positioning portion 3221 moves synchronously with the clamping member 322. A first detecting portion 3211 is provided on the flip frame 321. Along the second direction, the first detecting portion 3211 is correspondingly arranged with the first positioning portion 3221. The first detecting portion 3211 can detect the position of the first positioning portion 3221 to determine whether the clamping member 322 reaches the clamping or releasing position, thereby achieving stable clamping and complete release of the chip 500 at the second position 120, ensuring the stability of the chip 500 when flipping, and facilitating detachment after flipping.

[0047] Specifically, the first detection portion 3211 is used to detect the position of the first positioning portion 3221. The first detection portion 3211 can be a photoelectric sensor. The first positioning portion 3221 slides relative to the flip frame 321 together with the clamping member 322. When the flip frame 321 is horizontal, along the second direction, the clamping member 322 drives the first positioning portion 3221 to move between the clamping position 3214 and the release position 3215. The first detection portion 3211 has two detection states corresponding to the clamping position 3214 and the release position 3215. 21 is placed in the clamping position 3214, the first detection portion 3211 is in a clamping state, and the first positioning portion 3221 is placed in the releasing position 3215, the first detection portion 3211 is in a releasing state, and the position of the first positioning portion 3221 is detected by the first detection portion 3211. At the second position 120, the flip frame 321 and the clamping member 322 can switch between the clamping state and the releasing state, so as to clamp the chip 500 on the carrier 211 or place the chip 500 on the carrier 211, thereby realizing a stable flipping of the chip 500.

[0048] It should be noted that a guide rail is provided on the flip frame 321, and the clamping member 322 is slidably connected to the flip frame 321 via the guide rail. The clamping member 322 can be driven by any one of a cylinder, an electric cylinder or a hydraulic cylinder, and the clamping member 322 is also provided with a buffer block 3216 for anti-slip, which can clamp the chip 500 more stably and prevent the clamping member 322 from causing wear and sliding to the chip 500 when clamping the chip 500, which is beneficial to improving the integrity of the flipping of the chip 500.

[0049] refer to Figure 1 and Figure 2 In some embodiments, the carrier module 200 also includes a carrier seat 220, and the lifting member 212 is connected to the frame 100 through the carrier seat 220. Along the second direction, the carrier seat 220 is located below the carrier 211. A second detection unit 221 is provided on the carrier seat 220. The second detection unit 221 can be a photoelectric sensor. The second detection unit 221 is used to detect the position information of the carrier 211 relative to the carrier seat 220. The lifting member 212 can be lifted or lowered along the second direction according to the position information, thereby driving the carrier 211 to lift or lower the chip 500 along the second direction.

[0050] It should be noted that the position information of the carrier 211 relative to the carrier seat 220 includes the lifting member 212 driving the carrier 211 to rise along the second direction to the same height as the flipping component 320, and the lifting member 212 driving the carrier 211 to descend to abut against the carrier seat 220. The second detection unit 221 can detect the position information of the carrier 211 after the carrier 211 rises into position along the second direction and forms a first signal to feedback to the lifting member 212, so as to stop driving the carrier 211, so as to facilitate the flipping component 320 to clamp or release the chip 500. The second detection unit 221 can also detect the position information of the carrier 211 after the carrier 211 descends into position along the second direction and forms a second signal to feedback to the lifting member 212, so as to avoid collision between the carrier 211 and the carrier seat 220, thereby ensuring stable operation of the flipping operation.

[0051] It should be understood that the first detection unit 3211 and the second detection unit 221 are a feedback loop component widely used in industrial control applications, such as a programmable memory, which generally stores instructions for performing operations such as logical operations, sequential control, timing, counting and arithmetic operations, and controls various types of mechanical equipment or production processes through digital or analog input and output. In the embodiment of the present application, the first detection unit 3211 detects the position of the clamping member 322, and the second detection unit 221 detects the position of the bearing member 211 to achieve mutual cooperation between the bearing module 200 and the flip module 300. This can be achieved by those skilled in the art based on the existing control module functions, and its control principle and control method are not described in detail here.

[0052] refer to Figure 3 In some embodiments, a placement groove 3212 is provided on the flip frame 321. When the flip frame 321 is in a horizontal state, the placement groove 3212 extends along a first direction. The placement groove 3212 is used to carry the chip 500. Along the first direction, a limiting portion 3213 is provided at the end of the placement groove 3212. The clamping member 322 slides relative to the flip frame 321. The clamping member 322 can fix the chip 500 in the placement groove 3212. The limiting portion 3213 is used to limit the chip 500 from sliding along the extension direction of the placement groove 3212 when the chip 500 is flipped, which is beneficial to improving the safety of the flipping operation.

[0053] refer to Figure 1 and Figure 2In some embodiments, the flip assembly 320 further includes a first driving member 330, a first rotating shaft 340, a second rotating shaft 350 and a fixed seat 360, the moving assembly 310 includes a second driving member 311 and a base plate 312, the first driving member 330 is connected to the base plate 312, the first driving member 330 is also connected to the first rotating shaft 340, the first driving member 330 is used to drive the first rotating shaft 340 to rotate around a horizontal axis, the second driving member 311 is connected to the frame 100, the base plate 312 is slidably connected to the frame 100, and the second driving member 311 is used to drive the base plate 312 to rotate. 12 moves relative to the frame 100 along the first direction, the first rotating shaft 340 is connected to at least two second rotating shafts 350, the two second rotating shafts 350 have a gap, and the size of the gap should correspond to the size of the flip chip 500, the second rotating shaft 350 is rotatably connected to the fixed seat 360, the fixed seat 360 is connected to the substrate 312, the fixed seat 360 is used to support the second rotating shaft 350, the second rotating shaft 350 is connected to the flip frame 321, the second rotating shaft 350 can drive the flip frame 321 to rotate around the horizontal axis, thereby, the chip 500 can be flipped.

[0054] Specifically, the second rotating shaft 350 is connected to the flip frame 321, and the second rotating shaft 350 is rotatably connected to the fixed seat 360. The fixed seat 360 is used to support the second rotating shaft 350. The first driving member 330 drives the first rotating shaft 340 to rotate, and the first rotating shaft 340 drives at least two second rotating shafts 350 to rotate. The second rotating shaft 350 can drive the flip frame 321 to rotate around the horizontal axis when rotating. By driving at least two second rotating shafts 350 to rotate at the same time through the first rotating shaft 340, the synchronous rotation of the second rotating shafts 350 can be achieved, thereby driving the synchronous rotation of the flip frames 321, which is beneficial to the mutual coordination between the flip frames 321 and improves the stability of the flipping of the chip 500.

[0055] It should be noted that the first driving member 330 can use a motor with a brake as the power to drive the first rotating shaft 340 to rotate. The first rotating shaft 340 can simultaneously drive the two second rotating shafts 350 to rotate. The two second rotating shafts 350 are respectively connected to a flip frame 321. When the second rotating shaft 350 rotates, it also drives the flip frame 321 to flip. Since the two second rotating shafts 350 are both connected to the first rotating shaft 340 in transmission, the two second rotating shafts 350 can achieve synchronous rotation and stop, which is beneficial to the synchronous flipping of the two flip frames 321 and avoids damage to the chip 500.

[0056] It should be understood that the motor with brake can quickly stop running when encountering unexpected problems such as power outages and failures during the flipping process, so that the flip frame 321 is fixed in the current position, preventing the flip frame 321 from swinging around the horizontal axis and preventing the chip 500 from being damaged. In addition, the above transmission connection method can select synchronous belt transmission to achieve long-distance precise engagement, which helps to improve the levelness of the chip 500 after flipping. The flipped chip 500 is placed horizontally to facilitate being carried by the carrier 211, making the flipping process more stable and safe.

[0057] refer to Figures 3 to 6 In some embodiments, a second positioning portion 351 is provided on the second rotating shaft 350, and the second positioning portion 351 rotates synchronously with the second rotating shaft 350. A third detection portion 361 is provided on the fixed seat 360, and the third detection portion 361 can be a photoelectric sensor. The third detection portion 361 is correspondingly arranged with the second positioning portion 351. The fixed seat 360 is used to support the second rotating shaft 350 to rotate around the horizontal axis. The second rotating shaft 350 drives the flip frame 321 to rotate around the horizontal axis to realize the flipping of the chip 500. The third detection portion 361 can detect the position of the second positioning portion 351, so that when the second rotating shaft 350 stops rotating, the second positioning portion 351 points to the third detection portion 361, thereby ensuring that the plane where the flip frame 321 is located is parallel to the horizontal plane when stationary, which helps the flip frame 321 and the clamping member 322 to cooperate with each other to clamp or release the chip 500.

[0058] refer to Figure 2 and Figure 4 In some embodiments, the carrier module 200 includes a carrier seat 220, which is connected to a lifting member 212. The lifting member 212 can be any one of a hydraulic, pneumatic or electric cylinder. Along the second direction, the carrier 211 is connected to the movable end of the lifting member 212, and the carrier 211 is lifted or lowered with the movement of the lifting member 212. Along the second direction, the carrier seat 220 is located below the carrier 211. A positioning member 222 is movably connected to the carrier seat 220. The positioning member 222 protrudes from the surface of the carrier seat 220 and can be formed on the surface of the carrier seat 220 to form a placement area 223 for placing the chip 500. The positioning member 222 is used to abut the edge of the chip 500, so that the carrier 211 can carry the chip 500 in a balanced manner in the placement area 223, which is beneficial to improving the stability of the carrier 211 carrying the chip 500.

[0059] It should be noted that as the position of the positioning members 222 changes, the range of the placement area 223 also changes accordingly. For example, along the second direction, the four positioning members 222 protrude from the upper surface of the carrier seat 220. The four positioning members 222 are movably connected to the carrier seat 220. The four positioning members 222 can surround the carrier seat 220 to form a placement area 223 for placing the chip 500. The outline of the placement area 223 can be square, rectangular or circular. Taking a square as an example, the side length of the placement area can be 500mm or 600mm to abut the edge of the chip 500 of this size, which is beneficial to improve the positioning accuracy of the chip 500, thereby ensuring the continuous operation of the chip flipping operation.

[0060] refer to Figures 1 to 5 In some embodiments, the chip 500 flipping device may include a plurality of carrier modules 200, and the plurality of carrier modules 200 are spaced apart from each other along the second direction. Each carrier module 200 includes a carrier seat 220, a lifting member 212, and a carrier 211, wherein the carrier 211 is connected to the carrier seat 220 through the lifting member 212, and the lifting member 212 is used to support the carrier 211 to move along the second direction, so that the carrier 211 can carry the chip 500 to rise or fall along the second direction. The carrier seats 220 on adjacent carrier modules 200 are connected to each other, and there is an avoidance space between two adjacent carrier seats 220 along the second direction to avoid the movement of the carrier 211 along the second direction. The carrier seats 220 are movably connected to the rack 100, so that each carrier seat 220 can synchronously move relative to the rack 100 along the second direction, so as to realize multi-station chip 500 carrying, which is beneficial to improve the detection efficiency of the chip 500.

[0061] Specifically, the chip 500 flipping device includes two carrier modules 200, and the two carrier modules 200 can be divided into a first carrier module 201 and a second carrier module 202. The first carrier module 201 and the second carrier module 202 are configured to be distributed along the second direction. The first carrier module 201 and the second carrier module 202 both include a carrier seat 220, a lifting member 212 and a carrier 211. The carrier seat 220 on the same carrier module 200 is connected to the lifting member 212, and the lifting member 212 is connected to the carrier 211. The carrier seat 220 is also movably connected to the frame 100. Along the second direction, the carrier 211 is located above the carrier seat 220 and can move along the second direction under the joint action of the carrier seat 220 and the lifting member 212. The first carrier module 201 and the second carrier module 202 both carry chips 500 on their carrier members 211.

[0062] During the flipping operation, along the second direction, the first carrying module 201 is located above the second carrying module 202, and the carriers 211 on the first carrying module 201 and the second carrying module 202 can both carry the chip 500. The lifting member 212 on the first carrying module 201 supports the carrier 211 to rise along the second direction. The carrier 211 is used to carry the chip 500 to rise. The chip 500 rises to the same height as the position where the flip frame 321 and the clamping member 322 are used to clamp the chip 500. The moving component 310 drives the flipping component 320 to move along the first direction to the second position 120 The flip frame 321 and the clamping member 322 cooperate with each other to clamp the chip 500 at the second position 120, and the moving component 310 drives the flip component 320 to move to the first position 110. At the first position 110, the flip frame 321 and the clamping member 322 jointly clamp the chip 500 to flip it. Driven by the moving component 310, the flip component 320 clamps the flipped chip 500 and moves back to the second position 120. The carrier 211 carries the flipped chip 500 again, and the flip frame 321 and the clamping member 322 release the chip 500, thereby realizing the flipping of the chip 500.

[0063] After flipping, the chip 500 can be moved to a test position for testing using a moving device. During the test, the first carrier module 201 and the second carrier module 202 rise along the second direction. Similarly, the carrier 211 on the second carrier module 202 can carry the chip 500 and rise to the same height of the flip frame 321 and the clamping member 322 for clamping the chip 500. The second carrier module 202 and the flip module 300 cooperate with each other to flip the chip 500 on the second carrier module 202 while testing the chip 500, and the carrier 211 on the first carrier module 201 is empty and can be used to carry the chip 500 that has been tested. For example, when the chip 500 on the second carrier module 202 is flipped, if the chip 500 test is completed, the empty carrier 211 on the first carrier module 201 can carry the chip 500 that has been tested, so as to avoid interfering with the flipping operation of the chip 500 carried on the second carrier module 202.

[0064] It should be understood that the test operation detects a single side of the chip 500 each time, and the test is completed when the single side detection is completed. The chip 500 after the single side detection is completed needs to be placed on the carrier 211 again to flip it to detect the other side of the chip 500. Setting a single carrier module 200 cannot perform the flipping operation when the chip 500 is tested. The flipping operation requires the carrier 211 to carry the flipped chip 500. Therefore, after the single side detection of the chip 500 is completed, there is no free placement position on the carrier module 200, resulting in interference between the flipping and detection of the chip 500. Setting multiple carrier modules 200 can realize continuous flipping and detection of the chip 500, which is beneficial to improving the cooperation between the flipping and detection of the chip 500 and improving the detection efficiency of the chip 500.

[0065] It should be noted that the number of carrier modules 200 is not limited to two, and can also be three, four, etc. according to actual carrying requirements. Setting up multiple carrier modules 200 can avoid mutual interference between chip 500 flipping and detection, and ensure that chip 500 flipping and detection are carried out continuously and simultaneously, which is beneficial to improving the test efficiency of chip 500.

[0066] refer to Figure 4 In some embodiments, the carrier module 200 also includes a carrier seat 220, which is movably connected to the frame 100, and the lifting member 212 is connected to the frame 100 through the carrier seat 220. The carrier 211 is connected to the lifting member 212. Along the second direction, the carrier 211 is located above the carrier seat 220. The carrier 211 is provided with an adsorption portion 2112, which can be a vacuum suction nozzle, and the vacuum suction nozzle is connected to the vacuum pipe. When the carrier 211 is used to carry the chip 500, the chip 500 can be further fixed by the adsorption portion 2112, thereby improving the stability of the chip 500 during lifting and lowering.

[0067] refer to Figures 1 to 3In some embodiments, the chip 500 flipping device further includes a code scanning module 400. The code scanning module 400 is located above the first position 110 along the second direction. The moving component 310 can drive the flipping component 320 to move between the first position 110 and the second position 120 along the first direction. The flipping component 320 clamps or releases the chip 500 at the second position 120, and can clamp the chip 500 and move it to the first position 110 for flipping, so as to avoid interference with the lifting component 210 during flipping. When the chip 500 flips at the first position 110, the code scanning module 400 performs synchronous code scanning on the chip 500. For example, when the chip 500 is placed at the first position 110 to be flipped, the code scanning module 400 scans the chip 500, and / or, after the chip 500 is placed at the first position 110 and flipped, the code scanning module 400 scans the chip 500, so as to obtain information such as the model, version, and production batch of the chip 500, and realize the coordination of the flipping and scanning processes. It should be understood that after the chip 500 is flipped, it needs to be transferred to a test machine for testing. Synchronous code scanning during the flipping process is beneficial to shorten the test cycle, avoid scanning the chip 500 individually, and improve the production efficiency of the chip 500.

[0068] refer to Figures 1 to 5 According to the chip testing equipment of the embodiment of the present application, it includes a chip testing device, a transfer device and a chip flipping device in any of the above embodiments, the chip flipping device is used to flip the chip 500, the transfer device is configured to transfer the chip 500 between the chip testing device and the chip testing device, and the chip testing device is used to test the chip 500, thereby avoiding flipping the chip 500 on the chip testing device, especially for large-sized chips 500. By flipping the chip 500 on the chip flipping device, it is beneficial to improve the stability of chip flipping. The chip flipping device can also be used to carry the chip 500 to achieve continuous flipping and testing of the chip 500, which is beneficial to improve the test efficiency.

[0069] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A chip flipping device, characterized in that: include: A frame, along a first direction, the frame is provided with a first position and a second position; A bearing module is located at the second position, the bearing module comprises a lifting assembly, the lifting assembly comprises a bearing member and a lifting member, the bearing member is connected to the lifting member, the lifting member is connected to the frame, and along the second direction, the lifting member is located below the bearing member; The flip module comprises a moving component and a flip component, wherein the moving component is slidably connected to the frame, the flip component is connected to the moving component, the flip component comprises at least one pair of flip frames, and a clamping member is slidably connected to the flip frames; Along the first direction, the moving component can drive the flip module to move back and forth between the first position and the second position. At the first position, the flip frame and the clamping member are used to cooperate in clamping the chip and can flip the chip. At the second position, the lifting member can drive the carrier to carry the chip and move along the second direction to cooperate with the clamping or release of the clamping member and the flip frame at the second position. The clamping member and the flip frame can slide relative to each other at the second position to clamp or release the chip.

2. The chip flipping device according to claim 1, characterized in that: The clamping member is connected with a first positioning portion, and the first positioning portion moves synchronously with the clamping member. The flip frame is provided with a first detection portion, and the first positioning portion is arranged corresponding to the first detection portion, and the first detection portion is used to detect the position of the first positioning portion.

3. The chip flipping device according to claim 1, characterized in that: The carrying module also includes a carrying seat, a second detection unit is provided on the carrying seat, the lifting member is connected to the frame through the carrying seat, the second detection unit is used to detect the position information of the carrying member relative to the carrying seat, the lifting member can be lifted or lowered along the second direction according to the position information, and the carrying member is used to carry the chip.

4. The chip flipping device according to claim 1, characterized in that: The flip frame is provided with a placement groove, and a limiting portion is also provided at the end of the placement groove along the first direction. The clamp slides relative to the flip frame to fix the chip in the placement groove, and the limiting portion is used to limit the chip from sliding out of the placement groove.

5. The chip flipping device according to claim 1, characterized in that: The flip assembly further includes a first driving member, a first rotating shaft, a second rotating shaft and a fixed seat, the moving assembly includes a base plate and a second driving member, the first driving member is connected to the base plate, the first driving member is connected to the first rotating shaft, the second driving member is connected to the frame, the base plate is slidably connected to the frame, the first rotating shaft is connected to at least two of the second rotating shafts, the second rotating shaft is rotatably connected to the fixed seat, the second rotating shaft is connected to the flip frame, the fixed seat is connected to the base plate, and along the first direction, the first driving member, the first rotating shaft, the second rotating shaft and the bearing module are sequentially distributed; Among them, the first driving member is used to drive the first rotating shaft to rotate, the first rotating shaft is used to drive at least two second rotating shafts to rotate, the fixed seat is used to carry the second rotating shaft, the second rotating shaft can drive the flip frame to rotate around a horizontal axis, and the second driving member is configured to drive the substrate to reciprocate relative to the frame along a first direction.

6. The chip flipping device according to claim 5, characterized in that: A second positioning portion is provided on the second rotating shaft, and the second positioning portion rotates synchronously with the second rotating shaft. A third detection portion is provided on the fixing seat, and the third detection portion is arranged corresponding to the second positioning portion. The fixing seat is used to support the second rotating shaft, the second rotating shaft is used to drive the flip frame to rotate, and the third detection part can detect the position of the second positioning part.

7. The chip flipping device according to claim 1, characterized in that: The supporting module also includes a supporting seat, which is connected to the lifting member. Along the second direction, the supporting seat is located below the supporting member. A positioning member is movably connected to the supporting seat. The positioning member protrudes from the surface of the supporting seat and can form a placement area for placing the chip around the surface of the supporting seat. The positioning member is used to abut the edge of the chip.

8. The chip flipping device according to claim 1, characterized in that: The plurality of carrying modules are configured to be spaced apart along the second direction, and each of the carrying modules further comprises a carrying seat, adjacent carrying seats are connected to each other, and the carrying seats are movably connected to the frame, the carrying seat is connected to the lifting member, along the second direction, the carrying seat is located below the carrying member, the carrying seat can reciprocate relative to the frame along the second direction, and the carrying seat and the lifting member are used to jointly drive each of the carrying members to move up and down along the second direction.

9. The chip flipping device according to claim 1, characterized in that: The carrying module also includes a carrying seat, the lifting member is connected to the frame via the carrying seat, and an adsorption portion is provided on the carrying member, and the adsorption portion is used to adsorb the chip.

10. The chip flipping device according to claim 1, characterized in that: The chip flipping device further includes a code scanning module, which is located above the first position along the second direction, and can scan codes when the chip is flipped.

11. A chip testing device, characterized in that: include: A chip testing device, used for testing the chip; The chip flipping device according to any one of claims 1 to 10, used for flipping the chip; The transfer device is configured to transfer the chip between the chip testing device and the chip flipping device.

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