Chip detection jig

Abstract

The embodiment of the utility model discloses a chip detection jig, which comprises a first shell, a second shell and a heat dissipation structure, the second shell is used for placing a chip, and the second shell and the first shell have a moving state capable of moving relatively and a locking state capable of being fixed relatively. The heat dissipation structure is movably connected to the first shell in the preset direction, and when the first shell and the second shell are in the locking state, the heat dissipation structure is provided with a clamping position which can abut against the chip so as to fix the chip to the second shell. The assembling structure is fixedly connected to the first shell and comprises an elastic part, the elastic part is located on the moving path of the heat dissipation structure, and the elastic part can abut against the heat dissipation structure so that the heat dissipation structure can tend to move towards the clamping position. Therefore, the chips with different thicknesses can be clamped and fixed by movably arranging the heat dissipation structure and arranging the elastic piece, so that the chip detection jig can be adapted to and clamp the chips with different thicknesses, and the application range is wider.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to a chip detection fixture. Background Art

[0002] The chip test fixture can clamp the chip in order to test the performance of the chip. In a sense, the chip test fixture is a connector to meet certain test requirements of the chip. It is a static connector between the PCB and the IC, which makes the replacement test of the chip more convenient. The shell of the chip test fixture in the related art is divided into two parts, and the chip is placed in one of the shells. The chip can be clamped and fixed through the relative movable clamping position between the two shells.

[0003] In order to better fix the chip, the related art detection fixture is set only for chips of standard thickness, that is, when the two shells move to the clamping position, they can just abut and clamp the chip. However, different chips have different thicknesses, and even the same chip will have size errors during production. The space used for clamping and fixing the chip in the related art fixture is relatively fixed, and it can only adapt to the clamping of chips of one size, so the use of the fixture is greatly limited. Utility Model Content

[0004] Based on this, it is necessary to propose a chip detection fixture that can adapt to and clamp chips of various sizes to address the above problems.

[0005] The present invention provides a chip detection tool, comprising:

[0006] a first shell;

[0007] A second housing is used to place the chip, and the second housing and the first housing have an active state capable of relative movement and a relatively fixed locked state;

[0008] a heat dissipation structure, wherein the heat dissipation structure is movably connected to the first housing along a predetermined direction, and when the first housing and the second housing are in a locked state, the heat dissipation structure has a clamping position capable of abutting against the chip to fix the chip to the second housing;

[0009] And an assembly structure, which is fixedly connected to the first shell, and includes an elastic part, which is located on the movable path of the heat dissipation structure, and the elastic part can abut the heat dissipation structure so that the heat dissipation structure has a tendency to move toward the clamping position.

[0010] In some embodiments, the assembly structure further includes two assembly parts spaced apart, at least one of the elastic parts is connected between the two assembly parts spaced apart, the heat dissipation structure is located between the two assembly parts spaced apart, and the middle position of the elastic part can abut against the heat dissipation structure.

[0011] In some embodiments, the elastic portion includes an abutting end, a transition end connected to both ends of the abutting end, and a connecting end respectively connected to the two transition ends. The elastic portion is respectively connected to the two spaced assembly portions through the two connecting ends. The abutting end can abut on the heat dissipation structure, and the abutting end and the transition end are both configured as elastic structures.

[0012] In some embodiments, the opposite ends of the abutting end are provided with symmetrically arranged bent ends, and a predetermined angle is formed between the bent ends and the abutting ends. The ends of the bent ends facing away from the abutting ends can be connected to the transition end, and a bent structure arranged toward the heat dissipation structure is formed between the transition end, the bent end and the abutting end.

[0013] In some embodiments, a snap-on block is protruding from the first shell, and a snap-on hole is opened on the assembly portion, and the snap-on block can be snapped into the snap-on hole.

[0014] In some embodiments, the heat dissipation structure includes a heat conducting part and a heat dissipating part connected together, the first shell passes through a limiting groove along the predetermined direction, the heat conducting part is plugged and adapted to the limiting groove, and one end of the heat dissipating part facing away from the heat conducting part abuts against the elastic part.

[0015] In some embodiments, the heat dissipation portion is further provided with a first limiting portion and a second limiting portion, and when the elastic portion abuts against the heat dissipation structure, the first limiting portion and the second limiting portion abut against the first shell.

[0016] In some embodiments, the heat dissipation structure further includes a plurality of heat dissipation columns, and the plurality of heat dissipation columns are arranged on the heat dissipation portion in a matrix manner.

[0017] In some embodiments, a receiving groove is further provided on the heat dissipation structure, a heating element is arranged in the receiving groove, and a cover plate capable of covering the receiving groove is also connected to the heat dissipation structure.

[0018] In some embodiments, the second shell has an accommodation groove, the chip is located in the accommodation groove, the first shell is rotatably connected to the second shell via a rotating shaft, a fastening piece is also provided at one end of the first shell, and the second shell is also provided with a fastening rod that can be fastened with the fastening piece on the rotation path of the fastening piece.

[0019] The following beneficial effects are achieved by using the embodiments of the present invention:

[0020] According to the chip detection jig in the above embodiment, by setting up a movable heat dissipation structure, the position of the heat dissipation structure can be adjusted along a predetermined direction to adapt to the error of the chip. If the thickness of the chip is smaller than the standard thickness, the heat dissipation structure can be adjusted relatively close to the chip to successfully abut against the chip. If the thickness of the chip is larger than the standard thickness, the heat dissipation structure needs to be adjusted relatively away from the chip so as not to affect the locking of the first shell and the second shell.

[0021] The present application also sets an assembly structure, and the elastic part on the assembly structure can abut against the heat dissipation structure, which can not only provide an elastic fixing force for the heat dissipation structure, but also limit the initial abutment position of the heat dissipation structure. The initial abutment position is the position of the heat dissipation structure when the elastic part just abuts against the heat dissipation structure and no elastic force is applied to the heat dissipation structure. By setting the elastic part, the initial abutment position of the heat dissipation structure can be set to relatively adapt to the chip with a smaller thickness, that is, when the heat dissipation structure is in the initial abutment position, it can just abut against the chip with the minimum thickness within the allowable thickness error. In this way, when clamping other chips with larger thickness, the chip can force the heat dissipation structure to move in a predetermined direction, and can squeeze the elastic part when moving, and the elastic part applies an elastic force to the heat dissipation structure to move toward the chip. Under the action of the elastic force, the heat dissipation structure can clamp the chip on the second shell.

[0022] Therefore, by arranging the heat dissipation structure movably and by arranging the elastic member, it is possible to clamp and fix chips of different thicknesses, so that the chip detection fixture can be adapted to clamp chips of different thicknesses and has a wider range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] in:

[0025] Figure 1 An exploded view of a chip detection jig provided according to the utility model is shown;

[0026] Figure 2 A cross-sectional view of a chip detection jig provided according to the utility model is shown;

[0027] Figure 3 The schematic diagram of the structure of the chip detection fixture provided by the utility model is shown.

[0028] Description of main component symbols:

[0029] 1. First shell; 11. Fastener; 12. Fastener block; 13. Limiting groove; 2. Second shell; 21. Receiving groove; 22. Fastener rod; 3. Heat dissipation structure; 31. Heat conduction part; 32. Heat dissipation part; 321. Second limiting part; 322. First limiting part; 323. Heat dissipation column; 33. Accommodating groove; 4. Assembly structure; 41. Assembly part; 411. Fastener hole; 42. Elastic part; 421. Connecting end; 422. Transition end; 423. Abutting end; 4231. Bending end; 50. Cover plate; 60. Heating element. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] The utility model provides a chip detection fixture, which can clamp the chip so as to detect the performance of the chip. Figures 1 to 3The chip detection fixture includes a first shell 1, a second shell 2 and a heat dissipation structure 3. The first shell 1 and the second shell 2 can form a clamping structure for clamping the chip. Among them, the second shell 2 has a placement groove 21, and the chip is located in the placement groove 21. The first shell 1 is used to cooperate with the second shell 2 to fix the chip. The second shell 2 and the first shell 1 are set to have an active state that can be relatively active and a relatively fixed locking state. It should be noted that the first shell 1 and the second shell 2 are movably connected, so that there is an active state between the first shell 1 and the second shell 2. When both are in the active state, it is more convenient to take or place the chip in the second shell 2. A locking structure (such as a buckle structure, a card interface or directly fixed with a screw or other structure, which structure to use depends on the actual situation) can also be used between the first shell 1 and the second shell 2 to make the first shell 1 and the second shell 2 in a relatively fixed state, that is, a locked state.

[0034] For example, in a specific embodiment, one end of the first housing 1 is rotatably connected to one end of the second housing 2 via a rotating shaft, a buckle 11 is further provided at the end of the first housing 1 away from the connection with the second housing 2, and a buckle rod 22 capable of buckling with the buckle 11 is further provided on the rotation path of the buckle 11 of the second housing 2. The first housing 1 and the second housing 2 can be fixedly connected by the cooperation of the buckle 11 and the buckle rod 22, so that the first housing 1 and the second housing 2 are in a locked state.

[0035] The heat dissipation structure 3 is movably connected to the first housing 1 along a predetermined direction. When the first housing 1 and the second housing 2 are in a locked state, the heat dissipation structure 3 has a clamping position capable of abutting against the chip to fix the chip to the second housing 2 .

[0036] It should be noted that, since the first shell 1 and the second shell 2 are movable, and the heat dissipation structure 3 and the first shell 1 are also movable, and the movable mode between the first shell 1 and the second shell 2 is uncertain, such as translation or rotation, the predetermined direction is determined according to different states. For example, the heat dissipation structure 3 of the present application participates in fixing the chip, and the first shell 1 and the second shell 2 need to be in a locked state when fixing the chip. Therefore, the predetermined direction in the present application is based on the direction when the heat dissipation structure 3 moves toward or away from the chip when the first shell 1 and the second shell 2 are in a locked state. In this direction, the heat dissipation structure 3 can move to abut the chip, or detach from the chip.

[0037] The assembly structure 4 is fixedly connected to the first housing 1, and includes an elastic part 42, which is located on the active path of the heat dissipation structure 3. The elastic part 42 can abut against the heat dissipation structure 3, so that the heat dissipation structure 3 has a tendency to move toward the clamping position. In other words, the elastic part 42 can force the heat dissipation structure 3 to be located at the clamping position, and when the heat dissipation structure 3 is driven by an external force to leave the clamping position, the elastic part can provide an elastic force for the heat dissipation structure 3 to return to its original position.

[0038] It should be noted that the elastic portion 42 in the present application is located on the path when the heat dissipation structure 3 moves away from the chip, that is, when the first shell 1 and the second shell 2 are in a locked state, the heat dissipation structure 3 abuts against the chip, and the elastic portion 42 abuts against the heat dissipation structure 3 and is located on the path when the heat dissipation structure 3 moves away from the chip. Such a structure enables the heat dissipation structure 3 to be clamped between the elastic portion 42 and the chip.

[0039] During actual production and processing, the thickness of the chip (the dimension between the heat dissipation structure 3 and the second shell 2) may actually be different in size due to processing errors. As a result, when different chips are clamped by the same fixture, if there is an error in the thickness of these chips, two situations may occur easily. One is that when the first shell 1 and the second shell 2 are locked, the heat dissipation structure 3 may not be able to abut against the chip, resulting in the chip not being fixed. The other situation is that because the chip is too thick, the heat dissipation structure 3 has already abutted against the chip before the first shell 1 moves to the locked position with the second shell 2, resulting in the first shell 1 and the second shell 2 being unable to continue to move to the locked position.

[0040] The present application sets up an active heat dissipation structure 3, and the position of the heat dissipation structure 3 can be adjusted along a predetermined direction to adapt to the error of the chip. If the thickness of the chip is smaller than the standard thickness, the heat dissipation structure 3 can be adjusted relatively close to the chip to successfully abut against the chip. If the thickness of the chip is larger than the standard thickness, the heat dissipation structure 3 needs to be adjusted relatively away from the chip so as not to affect the locking of the first shell 1 and the second shell 2.

[0041] The present application also sets an assembly structure 4, and the elastic part 42 on the assembly structure 4 can abut against the heat dissipation structure 3, which can not only provide an elastic fixing force for the heat dissipation structure 3, but also limit the initial abutment position of the heat dissipation structure 3. The initial abutment position is the position where the elastic part 42 just abuts against the heat dissipation structure 3 and no elastic force is applied to the heat dissipation structure 3. By setting the elastic part 42, the initial abutment position of the heat dissipation structure 3 can be set to be relatively suitable for a chip with a smaller thickness, that is, when the heat dissipation structure 3 is located at the initial abutment position, it can just abut against a chip with the minimum thickness within the allowable thickness error. In this way, when clamping other chips with larger thickness, the chip can force the heat dissipation structure 3 to move in a predetermined direction, and can squeeze the elastic part 42 when moving, and the elastic part 42 applies an elastic force to the heat dissipation structure 3 to move toward the chip. Under the action of the elastic force, the heat dissipation structure can clamp the chip on the second housing 2.

[0042] Therefore, by arranging the heat dissipation structure 3 movably and by arranging the elastic member, it is possible to clamp and fix chips of different thicknesses, so that the chip detection fixture can be adapted to clamp chips of different thicknesses, and has a wider range of applications.

[0043] In one embodiment, see Figures 1 to 3 The assembly structure 4 also includes assembly parts 41 arranged at intervals. In the present application, the assembly structure 4 has two assembly parts 41, and the two assembly parts 41 are respectively connected to the opposite sides of the first shell 1, and the elastic part 42 is connected between the two assembly parts 41, and at least one elastic part 42 is connected between the spaced assembly parts 41. The number of elastic parts 42 is not limited, and can be one, two or three. The present application takes the setting of three elastic parts 42 as an example for explanation.

[0044] After the assembly structure 4 is installed on the first housing 1 , the heat dissipation structure 3 can be located between the spaced assembly portions 41 , and the middle position of the elastic portion 42 can abut against the heat dissipation structure 3 .

[0045] The specific structure of each elastic part 42 is completely the same. Specifically, the elastic part 42 includes an abutting end 423, transition ends 422 connected to both ends of the abutting end 423, and connecting ends 421 respectively connected to the two transition ends 422. The elastic part 42 is respectively connected to the spaced assembly parts 41 through the two connecting ends 421. It can be understood that the elastic part 42 is a structure formed by connecting "connecting end 421-transition end 422-abutting end 423-transition end 422-connecting end 421" in sequence.

[0046] The abutting end 423 can abut against the heat dissipation structure 3, and in order to achieve the elastic effect, at least the abutting end 423 and the transition end 422 are made of elastic material. In a preferred embodiment, the abutting end 423, the transition end 422 and the connecting end 421 are all made of elastic material. The elastic material is preferably elastic plastic.

[0047] It should also be noted that, in order to ensure force balance at various locations of the elastic portion 42 , the two transition ends 422 are preferably symmetrically arranged relative to the middle position of the abutting end 423 , and the two connecting ends 421 are also symmetrical relative to the middle position of the abutting end 423 .

[0048] In a specific embodiment, the two opposite ends of the abutting end 423 are provided with symmetrically arranged bent ends 4231, and there is a predetermined angle between the bent end 4231 and the abutting end 423, and the angle of the angle can be a right angle, an obtuse angle or an acute angle, depending on the actual situation, and is not limited here. The end of the bent end 4231 facing away from the abutting end 423 can be connected to the transition end 422, and a bent structure arranged toward the heat dissipation structure 3 is formed between the transition end 422, the bent end 4231 and the abutting end 423. That is, the bent end 4231 is bent toward the heat dissipation structure 3 relative to the transition end 422.

[0049] It should be noted that the connecting end 421, the abutting end 423, the transition end 422 and the bent end 4231 are all flat plate structures, and the transition end 422 and the abutting end 423 are arranged in parallel, and the transition end 422 and the connecting end 421 are arranged vertically. In order to ensure the life of the elastic part 42, the connecting position between the transition end 422, the connecting end 421, the abutting end 423 and the bent end 4231 is also set to a rounded structure.

[0050] In addition, the shapes of the transition end 422 and the bent end 4231 are not limited, and can be the above-mentioned flat plate structure, or a curved structure, such as an arc-shaped curved structure, or a wavy structure composed of multiple arc-shaped curved structures, or a curved structure composed of multiple angled structures. Alternatively, the transition end 422 and / or the bent end 4231 can also be a spring.

[0051] In one embodiment, see Figures 1 to 3 In order to ensure the stable connection between the assembly structure 4 and the first shell 1, buckle blocks 12 are protruding on the opposite sides of the first shell 1, and the distance between the two spaced assembly parts 41 is adapted to the distance between the opposite sides of the first shell 1, so that the two assembly parts 41 can be respectively attached to the opposite sides of the first shell 1. Buckle holes 411 are opened at the positions of the assembly parts 41 corresponding to the buckle blocks 12, and the buckle blocks 12 can be buckled in the buckle holes 411 to fix the assembly structure 4 on the first shell 1.

[0052] In one embodiment, the heat dissipation structure 3 includes a heat conducting portion 31 and a heat dissipation portion 32 connected together, the first housing 1 penetrates the limiting groove 13 along a predetermined direction, the heat conducting portion 31 is plugged and adapted to the limiting groove 13, and the heat dissipation portion 32 abuts against the elastic portion 42 at one end facing away from the heat conducting portion 31. By providing the heat conducting portion 31, the heat conducting portion 31 can be made of a material with good heat conduction effect, and the heat conducting portion 31 is used to directly abut against the chip, and is used to fix the chip on one side and conduct the heat on the chip to the heat dissipation portion 32 on the other side to achieve heat dissipation.

[0053] Specifically, a first limiting portion 322 and a second limiting portion 321 are also provided on the heat dissipation portion 32. When the heat conducting portion 31 moves in the limiting groove 13, the first limiting portion 322 and the second limiting portion 321 can abut against the first shell 1. At this time, the heat dissipation structure 3 is located at an initial abutting position. The first limiting portion 322 and the second limiting portion 321 abut against the first shell 1 to limit the movement of the heat conducting portion 31 toward the chip, and at this time, the end surface of the heat dissipation portion 32 facing away from the heat conducting portion 31 can just abut against the elastic portion 42.

[0054] It should be noted that the heat dissipation structure 3 further includes a plurality of heat dissipation columns 323, which are arranged in a matrix on the heat dissipation portion 32. By providing a plurality of heat dissipation columns 323, the contact area with the air can be increased, thereby increasing the heat dissipation effect of the heat dissipation portion 32.

[0055] In one embodiment, a receiving groove 33 is further provided on the heat dissipation structure 3, a heating element 60 is provided in the receiving groove 33, and a cover plate 50 is further connected to the heat dissipation structure 3 to cover the receiving groove 33. By providing the heating element 60, the chip can be heated to a predetermined temperature range.

[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A chip detection fixture, characterized in that: include: a first shell; A second housing is used to place the chip, and the second housing and the first housing have an active state capable of relative movement and a relatively fixed locked state; a heat dissipation structure, wherein the heat dissipation structure is movably connected to the first housing along a predetermined direction, and when the first housing and the second housing are in a locked state, the heat dissipation structure has a clamping position capable of abutting against the chip to fix the chip to the second housing; And an assembly structure, which is fixedly connected to the first shell, and includes an elastic part, which is located on the movable path of the heat dissipation structure, and the elastic part can abut the heat dissipation structure so that the heat dissipation structure has a tendency to move toward the clamping position.

2. The chip detection fixture according to claim 1, characterized in that: The assembly structure further comprises two assembly parts which are spaced apart from each other, at least one of the elastic parts is connected between the two assembly parts which are spaced apart from each other, the heat dissipation structure is located between the two assembly parts which are spaced apart from each other, and the middle position of the elastic part can abut against the heat dissipation structure.

3. The chip detection jig according to claim 2, characterized in that: The elastic portion includes an abutting end, transition ends connected to both ends of the abutting end, and connecting ends respectively connected to the two transition ends. The elastic portion is respectively connected to the two spaced assembly portions through the two connecting ends. The abutting end can abut on the heat dissipation structure. The abutting end and the transition end are both configured as elastic structures.

4. The chip detection jig according to claim 3, characterized in that: The opposite ends of the abutting end are provided with symmetrically arranged bent ends, and a predetermined angle is formed between the bent ends and the abutting end. The end of the bent end facing away from the abutting end can be connected to the transition end, and a bent structure arranged toward the heat dissipation structure is formed between the transition end, the bent end and the abutting end.

5. The chip detection jig according to claim 4, characterized in that: A buckle block is protruding from the first shell, and a buckle hole is opened on the assembly portion, and the buckle block can be buckled in the buckle hole.

6. The chip detection jig according to claim 1, characterized in that: The heat dissipation structure includes a heat conducting part and a heat dissipating part connected together, the first shell passes through a limiting groove along the predetermined direction, the heat conducting part is plugged and adapted to the limiting groove, and one end of the heat dissipating part facing away from the heat conducting part abuts against the elastic part.

7. The chip detection jig according to claim 6, characterized in that: The heat dissipation portion is further provided with a first limiting portion and a second limiting portion. When the elastic portion abuts against the heat dissipation structure, the first limiting portion and the second limiting portion abut against the first shell.

8. The chip detection jig according to claim 7, characterized in that: The heat dissipation structure further includes a plurality of heat dissipation columns, and the plurality of heat dissipation columns are arranged on the heat dissipation portion in a matrix manner.

9. The chip detection jig according to claim 1, characterized in that: The heat dissipation structure is also provided with a receiving groove, in which a heating element is arranged, and the heat dissipation structure is also connected with a cover plate capable of covering the receiving groove.

10. The chip detection jig according to claim 1, characterized in that: The second shell has an accommodation groove, the chip is located in the accommodation groove, the first shell is rotatably connected to the second shell via a rotating shaft, a buckle is also provided at one end of the first shell, and the second shell is also provided with a buckle rod capable of buckling with the buckle on the rotation path of the buckle.

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