Gluing device for semiconductor wafer

Abstract

The utility model relates to the technical field of wafer manufacturing, in particular to a gluing device for a semiconductor wafer, which comprises a rack structure, a bearing unit, a cleaning mechanism, a spraying mechanism, a vacuum adsorption mechanism and a protection mechanism, the bearing unit is used for bearing a wafer to be cleaned and takes the rack structure as an assembly basis; the vacuum adsorption mechanism is used for forming a negative pressure area on the surface of the bearing unit to adsorb a wafer to be cleaned, and the vacuum adsorption mechanism takes the bearing unit as an assembly basis; the cleaning mechanism and the spraying mechanism are used for spraying water mist to the surface of a wafer to be cleaned so as to clean the wafer and spraying glue to the surface of the wafer so as to form a protective film. Compared with a traditional method, the technical scheme has the advantages that cleaning, spin-drying and photoresist spraying of the wafer are integrated, and spraying can be performed on the surface of the wafer on the basis that efficient cleaning can be performed on the wafer, so that a protective film is formed on the surface of the wafer, and the purpose of protecting the wafer is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, in particular to a glue coating device for semiconductor wafers. Background Art

[0002] In the electronic industry, wafers are used to prepare integrated circuits, and chips are built on their surfaces in the form of a grid. Silicon is purified, melted, and cooled to form a silicon ingot, which is then cut into circles to form wafers. During the cutting and polishing process, a large amount of particulate impurities will inevitably remain on the surface of the finished wafer. Therefore, the wafer surface needs to be cleaned and sprayed. The treatment effect directly affects the quality of chip manufacturing process and integrated circuit characteristics.

[0003] The patent document with the patent announcement number: CN220085991U discloses a wafer cleaning device, including a rack, a wafer carrying unit, a deionized water cleaning unit, an air drying unit, a deflection unit and a wastewater collection unit. The wafer carrying unit uses the rack as the assembly basis. The deionized water cleaning unit is used to atomize the deionized water and spray it in a scattered manner toward the wafer to be cleaned. The air drying unit is used to spray high-pressure gas toward the cleaned wafer. The deflection unit is used in conjunction with the wafer carrying unit, and the deionized water cleaning unit and the air drying unit are integrated and installed thereon at the same time. The wastewater collection unit also uses the rack as the assembly basis. In this way, on the one hand, during the process of the deflection unit taking action, the deionized water cleaning and air drying operations of the wafer can be completed in sequence at the same workstation, and the design structure of the wafer cleaning equipment is effectively simplified; on the other hand, after the deionized water is added with impact kinetic energy, the removal capacity of pollutants or particulate impurities can be effectively improved.

[0004] The above scheme focuses on cleaning the wafer, but the wafer still needs to be sprayed after cleaning. By spraying, a protective film is covered on the surface of the wafer to protect the wafer. The above scheme does not disclose the relevant technical solution. Utility Model Content

[0005] In order to overcome the above technical problems, the purpose of the utility model is to provide a glue coating device for semiconductor wafers, which solves the problem that the current wafers are not sprayed for protection after cleaning.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A glue coating device for semiconductor wafers comprises a frame structure, a carrying unit, a cleaning mechanism, a spraying mechanism, a vacuum adsorption mechanism and a protective mechanism; the carrying unit is used to carry the wafer to be cleaned, and the frame structure is used as an assembly basis; the vacuum adsorption mechanism is used to form a negative pressure area on the surface of the carrying unit to adsorb the wafer to be cleaned, and the vacuum adsorption mechanism is used to the carrying unit as an assembly basis; the cleaning mechanism and the spraying mechanism are used to spray water mist to the surface of the wafer to be cleaned to clean the wafer and spray photoresist to the surface of the wafer to form a protective film, respectively, and the cleaning mechanism, the spraying mechanism and the protective mechanism are all used as an assembly basis for the frame structure; the protective mechanism is used to seal the frame structure during the process of cleaning the wafer to be cleaned and spraying the wafer; during the wafer cleaning process, the carrying unit continuously performs a rotational motion due to the driving force until no moisture remains on the wafer surface.

[0008] Furthermore, the frame structure includes an upper frame and a lower frame, and a wastewater collecting mechanism is arranged between the upper frame and the lower frame, and the wastewater collecting mechanism is used to collect and discharge water mist generated when the cleaning mechanism is working.

[0009] Furthermore, the wastewater collection mechanism includes a liquid collecting ring installed at the bottom of the upper frame and a protective cover installed inside the upper frame, the protective cover is arranged on the outside of the carrying unit, a drainage hole is provided at the bottom of the upper frame corresponding to the position of the liquid collecting ring, an annular cavity is formed inside the liquid collecting ring, and a drainage port is provided at the bottom of the liquid collecting ring, water mist enters the cavity of the liquid collecting ring through the drainage hole, is collected, and is discharged through the drainage port.

[0010] Furthermore, with the center of the liquid collecting ring as the axis, a plurality of drainage holes are provided at equal angles on the bottom of the upper frame.

[0011] Furthermore, the carrying unit is a ceramic carrier.

[0012] Furthermore, the vacuum adsorption mechanism includes a plurality of adsorption holes extending downward from the top wall of the carrying unit, and a vacuum generator installed on the lower frame, the vacuum generator draws air from the surface of the carrying unit through each of the adsorption holes to form a negative pressure area, and the drawn air is discharged through an exhaust port installed on the upper frame.

[0013] Furthermore, the cleaning mechanism and the spraying mechanism respectively include a cleaning motor and a spraying motor installed on both sides of the lower frame;

[0014] The output shaft of the cleaning motor is connected to a main shaft 1, the top end of the main shaft 1 extends upward and is connected to the head end of a swing arm 1, the horizontal height of the swing arm 1 is higher than the horizontal height of the wafer to be cleaned placed on the carrying unit, and the end of the swing arm 1 is connected to a nozzle 1, and the nozzle 1 is used to atomize liquid water and spray it toward the wafer to be cleaned in a scattered manner;

[0015] The output shaft of the spraying motor is connected to the second main shaft, the top end of the second main shaft extends upward and is connected to the head end of the second swing arm, the horizontal height of the second swing arm is higher than the horizontal height of the wafer placed on the carrying unit, and the end of the second swing arm is connected to the second nozzle, and the second nozzle is used to evenly spray the photoresist on the surface of the wafer;

[0016] The upper frame is provided with a first mounting hole and a second mounting hole respectively penetrating the positions corresponding to the first spindle and the second spindle.

[0017] Furthermore, a rotating motor and a lifting cylinder are installed in the lower frame, the rotating motor is located in the middle of the carrying unit, and the output end of the rotating motor extends upward and is detachably connected to the carrying unit; there are at least two lifting cylinders, the two lifting cylinders are symmetrically arranged about the center of the carrying unit, and the output ends of the lifting cylinders extend upward and are detachably connected to the carrying unit.

[0018] Furthermore, the protective mechanism includes a fixed frame installed on the top of the upper frame, and a transmission motor installed on the fixed frame, the fixed frame is formed with an avoidance opening at a position corresponding to the load-bearing unit, a waterproof roller curtain is wound on one end of the fixed frame, and transmission components are symmetrically arranged on both sides of the fixed frame about the waterproof roller curtain, the transmission component includes pulleys rotatably arranged at both ends of the fixed frame, and the two pulleys are connected by a transmission belt transmission, wherein the axis of at least one pulley is connected to the output end of the transmission motor, the transmission belt is installed with a slider that moves synchronously therewith, the slider is connected to the outermost layer of the waterproof roller curtain, and the waterproof roller curtain is unfolded layer by layer under the pull of the slider until the avoidance opening is completely closed.

[0019] Furthermore, a guide roller is rotatably provided at the end of the fixing frame, and the waterproof roller blind passes around the guide roller when being unfolded or rolled up, and the guide roller rotates continuously due to being driven by the waterproof roller blind.

[0020] Beneficial effects of the utility model:

[0021] Compared with traditional methods, this technical solution integrates wafer cleaning, drying and photoresist spraying into one, and can spray the surface of the wafer on the basis of efficient wafer cleaning, thereby forming a protective film on the surface of the wafer, thereby achieving the purpose of protecting the wafer and facilitating the smooth progress of subsequent wafer processing technology; not only that, by setting up wastewater collection and protection mechanisms, the wastewater left over from cleaning can be perfectly treated, and the work team members outside the rack will not be splashed by sewage, which also ensures the cleanliness of the work site. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The utility model is further described below in conjunction with the accompanying drawings.

[0023] Figure 1 It is a three-dimensional view of the utility model;

[0024] Figure 2 It is a three-dimensional view of the internal structure of the lower frame of the utility model;

[0025] Figure 3 It is a three-dimensional view of the internal structure of the upper frame in the utility model;

[0026] Figure 4 It is a three-dimensional view of the bottom of the upper frame in the utility model;

[0027] Figure 5 It is a three-dimensional view of the cleaning mechanism and the spraying mechanism in the utility model;

[0028] Figure 6 It is a three-dimensional view of the protective mechanism in the utility model.

[0029] In the figure: 1. upper frame; 11. liquid collecting ring; 12. protective cover; 13. drain hole; 14. exhaust port; 15. drain port; 16. mounting hole 1; 17. mounting hole 2; 2. lower frame; 21. rotating motor; 22. lifting cylinder; 3. bearing unit; 4. cleaning mechanism; 41. cleaning motor; 42. main shaft 1; 43. swing arm 1; 44. nozzle 1; 5. spraying mechanism; 51. spraying motor; 52. main shaft 2; 53. swing arm 2; 54. nozzle 2; 6. vacuum adsorption mechanism; 61. adsorption hole; 62. vacuum generator; 7. protective mechanism; 71. fixing frame; 72. pulley; 73. transmission belt; 74. slider; 75. guide rail; 76. waterproof roller shutter; 77. guide roller; 78. transmission motor. DETAILED DESCRIPTION

[0030] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] like Figure 1 , Figure 2 As shown, a glue coating device for semiconductor wafers includes a frame structure, a carrying unit 3, a cleaning mechanism 4, a spraying mechanism 5, a vacuum adsorption mechanism 6 and a protection mechanism 7; the carrying unit 3 is used to carry the wafer to be cleaned, and the frame structure is used as an assembly basis; the vacuum adsorption mechanism 6 is used to form a negative pressure area on the surface of the carrying unit 3 to adsorb the wafer to be cleaned, and the vacuum adsorption mechanism 6 is used to be assembled with the carrying unit 3; the cleaning mechanism 4 and the spraying mechanism 5 are used to spray water mist to the surface of the wafer to be cleaned to clean the wafer and spray photoresist to the surface of the wafer to form a protective film, respectively, and the cleaning mechanism 4, the spraying mechanism 5 and the protection mechanism 7 are all assembled with the frame structure; the protection mechanism 7 is used to seal the frame structure during the cleaning of the wafer to be cleaned and the wafer spraying process; and during the wafer cleaning process, the carrying unit 3 continuously performs a rotational motion due to the driving force until no moisture remains on the wafer surface.

[0032] The working principle of the semiconductor wafer coating device is as follows: the wafer to be cleaned is placed on the carrier unit 3, and then the vacuum adsorption mechanism 6 forms a negative pressure area on the surface of the carrier unit 3, so that the wafer to be cleaned is firmly adsorbed on the carrier unit 3, and the cleaning mechanism 4 is then started to spray water mist toward the surface of the wafer to be cleaned for a set time, and during the period from the start of cleaning to the end of cleaning, the carrier unit 3 always maintains a high-speed circumferential rotation state, which is beneficial to the quality of wafer cleaning. After the cleaning is completed, the carrier unit 3 still rotates at a high speed for a period of time until there is no water stain on the surface of the wafer, and then the spraying mechanism 5 can perform the photoresist spraying operation, and the spraying mechanism 5 continuously reciprocates over the top of the wafer to evenly spray the photoresist on the surface of the wafer. After the spraying is completed, the wafer can be taken out and the next wafer to be cleaned can be placed on the carrier unit 3; and before the entire cleaning and spraying occurs, the protection mechanism 7 is started to close the rack structure, which can effectively collect the waste water generated by the cleaning and discharge the waste water.

[0033] This solution integrates the cleaning, drying and photoresist spraying of the wafer into one, and can spray the surface of the wafer on the basis of efficient cleaning of the wafer, thereby forming a protective film on the surface of the wafer, thereby achieving the purpose of protecting the wafer, which is conducive to the smooth progress of the subsequent wafer processing technology; not only that, by setting up a wastewater collection mechanism and a protection mechanism 7, the wastewater left over from cleaning can be fully processed, and the work team members outside the rack structure will not be splashed by sewage, which also ensures the cleanliness of the work site.

[0034] As a further refinement of the above technical solution, Figure 1 , Figure 2 As shown, the frame structure includes an upper frame 1 and a lower frame 2, both of which are rectangular three-dimensional structures, and a wastewater collection mechanism is provided between the upper frame 1 and the lower frame 2, and the wastewater collection mechanism is used to collect and discharge the water mist generated when the cleaning mechanism 4 is working;

[0035] like Figure 3 , Figure 4 As shown, the wastewater collection mechanism includes a liquid collecting ring 11 installed at the bottom of the upper frame 1 and a protective cover 12 installed inside the upper frame 1, a through hole is opened at the bottom of the upper frame 1 corresponding to the middle of the liquid collecting ring 11, and a square opening is opened at the top of the upper frame 1; the bottom of the protective cover 12 is connected to the bottom of the upper frame 1, the top of the protective cover 12 shrinks inward and opens a circular opening, and the carrying unit 3 is arranged inside the protective cover 12; a drainage hole 13 is opened at the bottom of the upper frame 1 corresponding to the position of the liquid collecting ring 11, an annular cavity is formed inside the liquid collecting ring 11, and a drainage port 15 is opened at the bottom of the liquid collecting ring 11; when the cleaning mechanism 4 sprays water mist toward the wafer placed on the carrying unit 3 for cleaning, the water mist will flow into the cavity of the liquid collecting ring 11 through the drainage hole 13 at the bottom of the upper frame 1, and then the accumulated wastewater will be discharged through the drainage port 15.

[0036] In this solution, with the center of the liquid collecting ring 11 as the axis, multiple drainage holes 13 are opened at equal angles at the bottom of the upper frame 1. The multiple drainage holes 13 can speed up the speed at which wastewater flows into the liquid collecting ring 11, speeding up the collection and discharge of wastewater.

[0037] In this solution, the carrying unit 3 is a ceramic carrier, which has high electrical insulation and can effectively prevent charge accumulation between the wafer surface and the carrying unit 3, avoiding discharge, thereby improving the quality and reliability of wafer processing. Ceramic materials generally have good chemical stability and corrosion resistance, which allows them to be used in harsh chemical environments without being damaged.

[0038] like Figure 4 , Figure 5As shown, the vacuum adsorption mechanism 6 includes a plurality of adsorption holes 61 extending downward from the top wall of the carrier unit 3, and a vacuum generator 62 installed on the lower frame 2. Before the wafer is placed on the carrier unit 3 and is not cleaned, the vacuum generator 62 is lifted and started. At this time, the air on the surface of the carrier unit 3 is extracted by each adsorption hole 61 to form a negative pressure area. The extracted air is discharged through the exhaust port 14 installed on the upper frame 1, so that the wafer to be cleaned can be stably and reliably adsorbed on the upper plane of the carrier unit 3 under the action of the negative pressure effect.

[0039] like Figure 2 , Figure 5 As shown, a rotating motor 21 and a lifting cylinder 22 are installed in the lower frame 2. The rotating motor 21 is located in the middle of the carrying unit 3. The output end of the rotating motor 21 extends upward and is detachably connected to the carrying unit 3. There are at least two lifting cylinders 22, and the two lifting cylinders 22 are symmetrically arranged about the center of the carrying unit 3. The output end of the lifting cylinder 22 extends upward and is detachably connected to the carrying unit 3. Before cleaning, the lifting cylinder 22 is started, and the output end of the lifting cylinder 22 extends out. At this time, the entire carrying unit 3 is lifted until it is higher than the upper frame 1, which is convenient for the staff to place the wafer to be cleaned on the carrying unit 3, and then the output end of the lifting cylinder 22 can be controlled to retract until it is higher than the upper frame 1. Until the carrying unit 3 moves and resets into the protective cover 12, during this process, the carrying unit 3 contacts the output end of the rotating motor 21, and the output end of the lifting cylinder 22 is separated from the carrying unit 3. For safety purposes, the output end of the lifting cylinder 22 continues to descend a part of the way, and at the same time, the output end of the rotating motor 21 is connected to the carrying unit 3. When cleaning, start the rotating motor 21, and the output end of the rotating motor 21 drives the entire carrying unit 3 to rotate at high speed. When the carrying unit 3 does not need to rotate, the output end of the rotating motor 21 is separated from the carrying unit 3, and the output end of the lifting cylinder 22 rises and is reconnected to the carrying unit 3 to realize the rising or falling action of the carrying unit 3.

[0040] like Figure 2 , Figure 4 , Figure 5 As shown, the cleaning mechanism 4 and the spraying mechanism 5 respectively include a cleaning motor 41 and a spraying motor 51 installed on both sides of the lower frame 2; the output shaft of the cleaning motor 41 is connected to a main shaft 42, the top end of the main shaft 42 extends upward and is connected to the head end of a swing arm 43, the horizontal height of the swing arm 43 is higher than the horizontal height of the wafer to be cleaned placed on the carrying unit 3, and the end of the swing arm 43 is connected to a nozzle 44, which is used to atomize liquid water and spray it in a scattered manner toward the wafer to be cleaned;

[0041] The output shaft of the spray motor 51 is connected to the main shaft 52, the top of the main shaft 52 extends upward and is connected to the head end of the swing arm 53, the horizontal height of the swing arm 53 is higher than the horizontal height of the wafer placed on the supporting unit 3, and the end of the swing arm 53 is connected to the nozzle 54, which is used to evenly spray the photoresist on the surface of the wafer; and the upper frame 1 is respectively penetrated by the positions corresponding to the main shaft 42 and the main shaft 52, with the mounting hole 16 and the mounting hole 17.

[0042] When the wafer has been vacuum-adsorbed on the upper surface of the carrier unit 3, the cleaning motor 41 can be started, and the output end of the cleaning motor 41 drives the main shaft 42 to rotate, and the swing arm 43 connected to the main shaft 42 drives the nozzle 44 to move. By setting the rotation direction and output power of the cleaning motor 41, the swing arm 43 and the nozzle 44 can be reciprocated and continuously swept over the wafer to continuously clean the surface to be cleaned of the wafer; and after the cleaning is completed, since the operating principle of the spraying mechanism 5 is similar to that of the cleaning mechanism 4, the nozzle 2 54 can be reciprocated and continuously swept over the wafer to spray photoresist on the surface of the wafer. The cleaning mechanism 4 and the spraying mechanism 5 are arranged relative to each other, and the two are respectively located at the two end corners of the upper frame 1, and the arm spans of the swing arm 43 and the swing arm 2 53 are larger than the diameter of the wafer, so the wafer can be completely covered during the movement.

[0043] like Figure 1 , Figure 6 As shown, the protection mechanism 7 includes a fixing frame 71 installed on the top of the upper frame 1, and a transmission motor 78 installed on the fixing frame 71. The fixing frame 71 is formed with an escape opening at a position corresponding to the carrying unit 3, and the escape opening corresponds to the square opening opened on the top of the upper frame 1. A waterproof roller curtain 76 is wound around one end of the fixing frame 71, and transmission components are symmetrically arranged on both sides of the fixing frame 71 about the waterproof roller curtain 76. The transmission component includes pulleys 72 rotatably arranged at both ends of the fixing frame 71, and the two pulleys 72 are connected by a transmission belt 73, wherein at least one of the pulleys 72 is connected to the transmission shaft. The output end of the motor 78 is connected, and the transmission belt 73 is equipped with a slider 74 that moves synchronously with it, and the slider 74 is connected to the outermost layer of the waterproof roller curtain 76; before cleaning and spraying, the transmission motor 78 can be started to drive the pulley 72 to rotate, and the transmission belt 73 will roll accordingly, and the slider 74 will be driven to move with the transmission belt 73. The waterproof roller curtain 76 is unfolded layer by layer under the pull of the slider 74 until the slider 74 slides from one end of the fixed frame 71 to the other end, and the waterproof roller curtain 76 will also completely close the avoidance port, thereby effectively isolating water mist and wastewater without affecting external staff.

[0044] In other embodiments, a guide roller 77 is rotatably provided at the end of the fixed frame 71, and the waterproof roller curtain 76 passes around the guide roller 77 when unfolding or reeling. The guide roller 77 rotates continuously due to the drive of the waterproof roller curtain 76. The guide roller 77 can guide the unfolding and reeling direction of the waterproof roller curtain 76 to avoid friction and conflict between the waterproof roller curtain 76 and the fixed frame 71 or other components.

[0045] In other embodiments, guide rails 75 are further provided on both sides of the fixing frame 71 at positions corresponding to the transmission belt 73 , and the guide rails 75 are slidably connected to the slider 74 , thereby providing support for the slider 74 when it moves, making the sliding more stable and quick.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0047] The above contents are merely examples and explanations of the present utility model. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of the present utility model.

Claims

1. A glue coating device for semiconductor wafers, characterized in that: It includes a frame structure, a carrying unit, a cleaning mechanism, a spraying mechanism, a vacuum adsorption mechanism and a protection mechanism; the carrying unit is used to carry the wafer to be cleaned, and the frame structure is used as an assembly basis; The vacuum adsorption mechanism is used to form a negative pressure area on the surface of the carrier unit to adsorb the wafer to be cleaned, and the vacuum adsorption mechanism uses the carrier unit as an assembly basis; The cleaning mechanism and the spraying mechanism are used to spray water mist onto the surface of the wafer to be cleaned to clean the wafer and to spray photoresist onto the surface of the wafer to form a protective film, respectively. The cleaning mechanism, the spraying mechanism and the protective mechanism are all assembled based on the frame structure. The protective mechanism is used to close the frame structure during the cleaning of the wafer to be cleaned and the spraying of the wafer. During the wafer cleaning process, the carrying unit continuously performs rotational motion due to the driving force until no moisture remains on the surface of the wafer.

2. The glue coating device for semiconductor wafer according to claim 1, characterized in that: The frame structure comprises an upper frame and a lower frame, and a wastewater collecting mechanism is arranged between the upper frame and the lower frame. The wastewater collecting mechanism is used to collect and discharge the water mist generated when the cleaning mechanism is working.

3. The glue coating device for semiconductor wafer according to claim 2, characterized in that: The wastewater collection mechanism includes a liquid collecting ring installed at the bottom of the upper frame and a protective cover installed inside the upper frame. The protective cover is arranged on the outside of the carrying unit. A drainage hole is provided at the bottom of the upper frame corresponding to the position of the liquid collecting ring. An annular cavity is formed inside the liquid collecting ring. A drainage port is provided at the bottom of the liquid collecting ring. Water mist enters the cavity of the liquid collecting ring through the drainage hole and is collected and discharged through the drainage port.

4. The glue coating device for semiconductor wafer according to claim 3, characterized in that: Taking the center of the liquid collecting ring as the axis, a plurality of drainage holes are provided at equal angles at the bottom of the upper frame.

5. The glue coating device for semiconductor wafer according to claim 1, characterized in that: The carrying unit is a ceramic carrier.

6. The glue coating device for semiconductor wafer according to claim 2, characterized in that: The vacuum adsorption mechanism includes a plurality of adsorption holes extending downward from the top wall of the carrying unit, and a vacuum generator installed on the lower frame. The vacuum generator draws air from the surface of the carrying unit through each of the adsorption holes to form a negative pressure area, and the drawn air is discharged through an exhaust port installed on the upper frame.

7. The glue coating device for semiconductor wafer according to claim 2, characterized in that: The cleaning mechanism and the spraying mechanism respectively include a cleaning motor and a spraying motor installed on both sides of the lower frame; The output shaft of the cleaning motor is connected to a main shaft 1, the top end of the main shaft 1 extends upward and is connected to the head end of a swing arm 1, the horizontal height of the swing arm 1 is higher than the horizontal height of the wafer to be cleaned placed on the carrying unit, and the end of the swing arm 1 is connected to a nozzle 1, and the nozzle 1 is used to atomize liquid water and spray it toward the wafer to be cleaned in a scattered manner; The output shaft of the spraying motor is connected to the second main shaft, the top end of the second main shaft extends upward and is connected to the head end of the second swing arm, the horizontal height of the second swing arm is higher than the horizontal height of the wafer placed on the carrying unit, and the end of the second swing arm is connected to the second nozzle, and the second nozzle is used to evenly spray the photoresist on the surface of the wafer; The upper frame is provided with a first mounting hole and a second mounting hole respectively penetrating the positions corresponding to the first spindle and the second spindle.

8. The glue coating device for semiconductor wafer according to claim 2, characterized in that: A rotating motor and a lifting cylinder are installed in the lower frame. The rotating motor is located in the middle of the carrying unit, and the output end of the rotating motor extends upward and is detachably connected to the carrying unit. There are at least two lifting cylinders, which are symmetrically arranged about the center of the carrying unit, and the output ends of the lifting cylinders extend upward and are detachably connected to the carrying unit.

9. The glue coating device for semiconductor wafer according to claim 2, characterized in that: The protection mechanism includes a fixed frame installed on the top of the upper frame, and a transmission motor installed on the fixed frame, the fixed frame is formed with an avoidance opening at a position corresponding to the load-bearing unit, a waterproof roller curtain is wound on one end of the fixed frame, and transmission components are symmetrically arranged on both sides of the fixed frame about the waterproof roller curtain, the transmission component includes pulleys rotatably arranged on both ends of the fixed frame, and the two pulleys are connected by a transmission belt transmission, wherein the axis of at least one pulley is connected to the output end of the transmission motor, the transmission belt is installed with a slider that moves synchronously therewith, the slider is connected to the outermost layer of the waterproof roller curtain, and the waterproof roller curtain is unfolded layer by layer under the pull of the slider until the avoidance opening is completely closed.

10. The glue coating device for semiconductor wafer according to claim 9, characterized in that: A guide roller is rotatably provided at the end of the fixing frame. The waterproof roller blind passes around the guide roller when being unfolded or rolled up. The guide roller rotates continuously due to being driven by the waterproof roller blind.

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