Battery, power utilization device and energy storage device

Abstract

The utility model discloses a battery, a power utilization device and an energy storage device. The battery comprises: a housing having an accommodation space therein, the accommodation space being used for accommodating a battery cell; the heat exchange assembly is arranged in the accommodating space and is used for exchanging heat with the battery monomers; the equipotential connecting assembly comprises an equipotential connecting layer and a conductive adhesive layer which are communicated with each other, the equipotential connecting assembly is arranged between the shell and the heat exchange assembly, one of the equipotential connecting layer and the conductive adhesive layer is electrically connected with the shell, and the other one of the equipotential connecting layer and the conductive adhesive layer is electrically connected with the heat exchange assembly. According to the battery, the shell and the heat exchange assembly are conducted through the equipotential connecting assembly, equipotential between the shell and the heat exchange assembly is achieved, potential hazards of electrification are reduced, and the structure is simple. The power utilization device adopts the battery disclosed by the utility model, so that the power utilization device has the advantages of small electrified hidden danger and simple structure. The energy storage device provided by the invention adopts the battery provided by the invention, so that the energy storage device has the advantages of small electrified hidden danger and simple structure.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to batteries, electrical devices and energy storage devices. Background Art

[0002] When the battery is working, it will continue to generate heat. The heat accumulates in the battery pack, causing the temperature inside the battery pack to be too high, which is prone to danger. It is necessary to set a heat exchange component between the batteries to control the battery temperature in the battery box through the heat exchange component. Generally, a water cooling plate is used as a heat exchange component in the battery. The water cooling plate is in contact with the battery cell and the outside world respectively, and there is a risk of electrification. Therefore, it is necessary to achieve equal potential between the water cooling plate and the shell to avoid electrification.

[0003] The solution adopted in the related art is: two conductive blocks are provided, a conductive spring is provided between the two conductive blocks for connection, one conductive block abuts against the housing, and the other conductive block abuts against the heat exchange component. The solution structure in the related art is relatively complex and is not suitable for large batteries. How to simplify the equipotential structure is one of the research topics in the industry. Utility Model Content

[0004] In order to solve the above technical problems, the present application provides a battery, an electrical device and an energy storage device, which can simplify the structure of achieving equal potential in the battery.

[0005] In the first aspect, the present application provides a battery, comprising: a shell, the interior of the shell having a accommodating space, the accommodating space being used to accommodate a battery cell; a heat exchange component, the heat exchange component being arranged in the accommodating space and being used to exchange heat with the battery cell; an equipotential connection component, comprising an equipotential connection layer and a conductive adhesive layer that are mutually conductive, the equipotential connection component being arranged between the shell and the heat exchange component, one of the equipotential connection layer and the conductive adhesive layer being electrically connected to the shell, and the other of the equipotential connection layer and the conductive adhesive layer being electrically connected to the heat exchange component.

[0006] In the technical solution of the embodiment of the present application, the battery cell, the heat exchange component and the equipotential connection component are arranged in the accommodating space of the shell, and the battery cell, the heat exchange component and the equipotential connection component inside are protected by the shell. The heat exchange component exchanges heat with the battery cell so that the battery operates at a suitable temperature. The equipotential connection layer and the conductive adhesive layer of the equipotential connection component are electrically connected to the shell, and the other of the equipotential connection layer and the conductive adhesive layer is electrically connected to the heat exchange component, so that the equipotential between the shell and the heat exchange component is achieved, reducing the risk of electrification. Moreover, the equipotential connection is achieved through the layer structure, which has the advantages of reduced number of parts and simple structure.

[0007] In some embodiments, the equipotential connection layer is connected to the heat exchange component, and the conductive adhesive layer is disposed on at least a portion of the equipotential connection layer and is bonded to the shell.

[0008] Since the equipotential connection layer is connected to the heat exchange component, and at least a portion of the equipotential connection layer is provided with a conductive adhesive layer, and the conductive adhesive layer is bonded to the shell, the heat exchange component and the shell are connected through the equipotential connection layer and the conductive adhesive layer, thereby achieving the same potential between the two and reducing the risk of electrification. The conductive adhesive bonds the equipotential connection layer to the shell, so that the equipotential connection layer is fixed on the shell, improving the firmness of the connection between the equipotential connection layer and the shell, and maintaining a stable conductive state between the shell and the equipotential connection layer.

[0009] In some embodiments, the equipotential connection component also includes an elastic support body, which is arranged between the shell and the heat exchange component, at least a portion of the equipotential connection layer is covered on the surface of the support body, and the conductive adhesive layer is provided between the equipotential connection layer and the shell.

[0010] Since the equipotential connection assembly also includes an elastic support body, and the support body is disposed between the shell and the heat exchange assembly, the support body can absorb the installation space tolerance between the shell and the heat exchange assembly, so that the surface of the support body can fit the shell and the heat exchange assembly tightly. Since the surface of the support body fits the shell and the heat exchange assembly tightly, at least a portion of the equipotential connection layer covers the surface of the support body, so the equipotential connection layer is pressed against the shell and the heat exchange assembly by the support body, so that the relative positions of the equipotential connection layer, the shell and the heat exchange assembly are fixed, so that the equipotential connection layer, the shell and the heat exchange assembly maintain a stable conductive state.

[0011] In some embodiments, the equipotential connection layer includes a first connection layer, which is disposed on a surface of the support body close to the heat exchange component, and the first connection layer is electrically connected to the shell via the conductive adhesive layer.

[0012] Since the equipotential connection layer includes a first connection layer, and the first connection layer is disposed on the surface of the support body close to the heat exchange component, the first connection layer is pressed against the heat exchange component by the support body to achieve stable conduction between the first connection layer and the heat exchange component. Since the first connection layer is in conduction with the shell via the conductive adhesive layer, stable conduction between the heat exchange component and the shell can be achieved.

[0013] In some embodiments, the first connection layer extends from the surface of the support body to a position facing the surface of the shell, and a surface of the first connection layer facing the shell is bonded to the shell through the conductive adhesive layer.

[0014] Therefore, stable conduction between the heat exchange component and the shell can be achieved by extending the first connection layer and bonding the extended first connection layer to the shell with a conductive adhesive layer, with a simple structure and a small number of components.

[0015] In some embodiments, the equipotential connection layer also includes a second connection layer connected to the first connection layer, the second connection layer is arranged on the surface of the support body close to the shell and is adjacent to the first connection layer, and the conductive adhesive layer is arranged between the second connection layer and the shell.

[0016] Since the equipotential connection layer includes a second connection layer, and the second connection layer is disposed on the surface of the support body close to the shell, the second connection layer is pressed against the shell by the support body to achieve stable conduction between the second connection layer and the shell. Since the first connection layer and the second connection layer are connected, the heat exchange component is sequentially connected to the shell through the first connection layer and the second connection layer to achieve equipotential between the two. The second connection layer and the shell are connected by a conductive adhesive layer, which improves the firmness of the connection between the second connection layer and the shell, and further improves the stability of the conduction between the second connection layer and the shell.

[0017] In some embodiments, the equipotential connection layer further includes a third connection layer connected to the first connection layer, the third connection layer extends to the shell in a direction away from the support body, and the conductive adhesive layer is provided between the third connection layer and the shell.

[0018] By setting the third connection layer to extend to the shell in a direction away from the support body, the third connection layer can be connected to the shell with a large gap between the support body. Since the first connection layer and the third connection layer are connected, the heat exchange component is connected to the shell through the first connection layer and the third connection layer in turn, and the equipotential between the two is achieved. The third connection layer and the shell are connected by a conductive adhesive layer, so that the third connection layer can be fixed on the shell, and the first connection layer maintains a stable conductive state with the shell through the third connection layer.

[0019] In some embodiments, the equipotential connection layer also includes at least one of a fourth connection layer and a fifth connection layer, the fourth connection layer is arranged on the surface of the support body opposite to the first connection layer and is connected to the second connection layer, the conductive adhesive layer is arranged between the fourth connection layer and the shell, and the fifth connection layer is arranged on the surface of the support body opposite to the second connection layer and is connected to the first connection layer.

[0020] Since the equipotential connection layer also includes a fourth connection layer connected to the second connection layer, the fourth connection layer is arranged on the surface facing the first connection layer and abuts against the shell, therefore, the fourth connection layer is pressed against the shell by the support body to achieve stable conduction between the fourth connection layer and the shell. The fourth connection layer and the shell are connected by a conductive adhesive layer, which improves the firmness of the connection between the fourth connection layer and the shell, and further improves the stability of conduction between the fourth connection layer and the shell. The first connection layer, the second connection layer and the fourth connection layer form a form of semi-enclosing the support body, and the second connection layer and the fourth connection layer are bonded to the shell, so that the position of the support body is fixed and not easy to change. Since the equipotential connection layer also includes a fifth connection layer, the fifth connection layer is arranged on the surface of the support body facing the second connection layer, therefore, the fifth connection layer, the first connection layer and the second connection layer form a form of semi-enclosing the support body, so that the position of the support body is fixed and not easy to change. The first connection layer, the second connection layer, the fourth connection layer and the fifth connection layer together form a form of a fully enclosed support body, which has a wide range of equipotential contact and can be applied to various situations. The support body is firmly bonded to the shell, thereby determining the position of each connection layer provided on the support body, thereby improving the firmness and stability of the overall structure and having a simple structure.

[0021] In some embodiments, a plurality of the heat exchange components are arranged at intervals from each other and disposed in the accommodating space, the support body is configured in a strip shape along the arrangement direction of the heat exchange components, and the first connecting layer is provided along the length direction of the support body.

[0022] Since the heat exchange components are arranged in the accommodation space at intervals, the battery cells can be placed between the heat exchange components to obtain efficient heat exchange. Since the support body is strip-shaped along the arrangement direction of the heat exchange components, the support body can be in contact with multiple or even all heat exchange components. Since the first connection layer is provided along the length direction of the support body, each heat exchange component can contact the first connection layer and be connected to each other through the first connection layer. In addition, the first connection layer and the conductive adhesive layer can realize the equipotential connection between each heat exchange component and the shell, which has a simple structure and can reduce the number of components.

[0023] In some embodiments, the support body comprises foam.

[0024] Since the support body can be foam, foam itself has the advantages of strong elasticity, light weight and reliable performance, therefore, the foam can also play a buffering role between the heat exchange component and the shell.

[0025] In some embodiments, the equipotential connection layer includes a conductive cloth.

[0026] Since the equipotential connection layer can be a conductive cloth, the conductive cloth itself has the characteristics of low cost, easy processing, and small space occupation. Therefore, using conductive cloth for conduction can reduce costs. The conductive cloth can be flexibly arranged according to various layout conditions between the heat exchange component and the shell to achieve efficient conduction, and the structure is simple, which can reduce the number of components.

[0027] In some embodiments, the heat exchange component includes a water-cooled plate and a current collector. A plurality of the water-cooled plates are spaced apart from each other in the accommodating space and in contact with the battery cells. The current collectors are respectively arranged on both sides of the length direction of the water-cooled plate. The current collector on at least one side of the water-cooled plate is in contact with the equipotential connection component.

[0028] Since the heat exchange component includes a water-cooled plate, it can meet the cooling requirements of the battery cells. Since multiple water-cooled plates are provided, the heat exchange effect on the battery cells can be further enhanced. By providing collectors on both sides of the water-cooled plate, the cooling water can be diverted to each water-cooled plate, and the water after heat exchange with the battery cells can also be collected and transported out. Since the collector on at least one side of the water-cooled plate is in contact with the equipotential connection component, each heat exchange component can be in contact with the equipotential component to maintain the same potential, and is connected to the shell through the equipotential component, so that all heat exchange components and the shell maintain the same potential, and the structure is simple.

[0029] In a second aspect, the present application further provides an electrical device, the electrical device comprising the battery as described above, wherein the battery is used to provide electrical energy to the electrical device.

[0030] Since the electrical device includes a battery with a low risk of being charged, when the electrical device uses the battery, adverse effects caused by the battery being charged can be reduced.

[0031] In a third aspect, the present application further provides an energy storage device, which includes the battery as described above, and the battery is capable of storing electrical energy and providing electrical energy.

[0032] Since the energy storage device includes a battery with a low risk of being charged, when the energy storage device uses the battery to store / provide electrical energy, adverse effects caused by the battery being charged can be reduced.

[0033] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0035] Figure 1 A top view of a battery provided for some embodiments of the present application;

[0036] Figure 2 For this application Figure 1 The cross-section along the AA direction;

[0037] Figure 3 For this application Figure 2 A partial enlarged view of part B;

[0038] Figure 4 A schematic diagram of an equipotential connection assembly provided for some embodiments of the present application;

[0039] Figure 5 A top view of a battery provided in some embodiments of the present application using a third connecting layer;

[0040] Figure 6 For this application Figure 5 The cross-section along CC direction;

[0041] Figure 7 For this application Figure 6 A partial enlarged view of part D in the middle;

[0042] Figure 8 For this application Figure 7 Schematic diagram of equipotential bonding components in;

[0043] Fig. 9 A schematic diagram of a first connection layer extending toward a shell provided in some embodiments of the present application.

[0044] Description of Reference Numerals

[0045] 10 shell; 101 bottom plate; 102 outer frame; 11 battery cell; 12 heat exchange component; 121 water cooling plate; 122 current collector; 13 equipotential connection component; 131 equipotential connection layer; 1311 first connection layer; 1312 second connection layer; 1313 third connection layer; 1314 fourth connection layer; 1315 fifth connection layer; 132 conductive adhesive layer; 133 support body. DETAILED DESCRIPTION

[0046] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions.

[0048] In the description of the embodiments of the present application, the technical terms "first", "second", "third", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0049] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0050] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0051] In the description of the embodiments of the present application, the orientation or position relationship indicated by technical terms such as "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", and "circumferential" are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be understood as limitations on the embodiments of the present application.

[0052] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0053] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the technical term "contact" should be understood in a broad sense, and may be direct contact or contact through an intermediate medium layer. It may be contact with essentially no interaction force between the two contacting parties, or it may be contact with interaction force between the two contacting parties.

[0054] Below, this application is described in detail.

[0055] When the battery is working, it will continue to generate heat. The heat accumulates in the battery pack, causing the temperature inside the battery pack to be too high, which is prone to danger. It is necessary to set a heat exchange component between the batteries to control the battery temperature in the battery box through the heat exchange component. Generally, a water cooling plate is used as a heat exchange component in the battery. The water cooling plate is in contact with the battery cell and the outside world respectively, and there is a risk of electrification. Therefore, it is necessary to achieve equal potential between the water cooling plate and the shell to avoid electrification.

[0056] The solution adopted in the related art is: two conductive blocks are provided, a conductive spring is provided between the two conductive blocks for connection, one conductive block abuts against the housing, and the other conductive block abuts against the heat exchange component. The solution structure in the related art is relatively complex and is not suitable for large batteries. How to simplify the equipotential structure is one of the research topics in the industry.

[0057] The inventor of the present application hopes to develop an equipotential structure with a simpler structure to reduce the cost and assembly difficulty of achieving equipotential.

[0058] Based on such a design concept, the inventor of the present application designed a battery, comprising: a shell having a accommodating space inside, the accommodating space being used to accommodate a battery cell; a heat exchange component, the heat exchange component being arranged in the accommodating space and being used to exchange heat with the battery cell; an equipotential connection component, comprising an equipotential connection layer and a conductive adhesive layer that are electrically connected to each other, the equipotential connection component being arranged between the shell and the heat exchange component, one of the equipotential connection layer and the conductive adhesive layer being electrically connected to the shell, and the other of the equipotential connection layer and the conductive adhesive layer being electrically connected to the heat exchange component.

[0059] The battery cells, heat exchange components and equipotential connection components are arranged in the accommodation space of the shell, and the shell protects the internal battery cells, heat exchange components and equipotential connection components. The heat exchange components exchange heat with the battery cells to make the battery operate at a suitable temperature. The equipotential connection layer and the conductive adhesive layer of the equipotential connection component are electrically connected to the shell, and the other of the equipotential connection layer and the conductive adhesive layer is electrically connected to the heat exchange component, so that the equipotential between the shell and the heat exchange component is achieved, reducing the risk of electrification. Moreover, the equipotential connection is achieved through the layer structure, which has the advantages of reduced number of parts and simple structure.

[0060] In the embodiment of the present application, the battery may be a battery module or a battery pack.

[0061] In the embodiments of the present application, the battery cell may be a secondary battery, which refers to a battery cell that can be continuously used by activating the active material by charging after the battery cell is discharged. The battery cell may be a lithium ion battery, a sodium ion battery, a sodium lithium ion battery, a lithium metal battery, a sodium metal battery, a lithium sulfur battery, a magnesium ion battery, a nickel hydrogen battery, a nickel cadmium battery, a lead storage battery, etc., and the embodiments of the present application do not limit this.

[0062] In the embodiments of the present application, the battery can be used, but is not limited to, in power storage systems, vehicles, ships, aircraft and other electrical devices.

[0063] An embodiment of the present application provides an electrical device, which includes a battery for providing electrical energy in the embodiment of the present application.

[0064] An embodiment of the present application provides an energy storage device, which includes a battery for storing electrical energy in an embodiment of the present application.

[0065] In the embodiment of the present application, the electric device may be, but is not limited to, a mobile phone, a tablet, a laptop computer, an electric toy, an electric tool, a battery car, an electric car, a ship, a spacecraft, etc. The energy storage device may be used for, but is not limited to, a mobile phone, a tablet, a laptop computer, an electric toy, an electric tool, a battery car, an electric car, a ship, a spacecraft, etc. Among them, the electric toy may include a fixed or mobile electric toy, for example, a game console, an electric car toy, an electric ship toy, an electric airplane toy, etc. The spacecraft may include an airplane, a rocket, a space shuttle, a spacecraft, etc.

[0066] The following is a description with reference to the accompanying drawings.

[0067] Figure 1 A top view of a battery provided for some embodiments of the present application; Figure 2 For this application Figure 1 The cross-section along the AA direction; Figure 3 For this application Figure 2A partial enlarged view of part B; Figure 4 A schematic diagram of an equipotential connection assembly provided for some embodiments of the present application; Figure 5 A top view of a battery provided in some embodiments of the present application using a third connecting layer; Figure 6 For this application Figure 5 The cross-section along CC direction; Figure 7 For this application Figure 6 A partial enlarged view of part D in the middle; Figure 8 For this application Figure 7 Schematic diagram of equipotential bonding components in; Fig. 9 A schematic diagram of a first connection layer extending toward a shell provided in some embodiments of the present application.

[0068] In a first aspect, the present application provides a battery. Figures 1 to 4 As shown, the battery includes: a shell 10, the interior of the shell 10 has a accommodating space, and the accommodating space is used to accommodate a battery cell 11; a heat exchange component 12, the heat exchange component 12 is arranged in the accommodating space, and is used to exchange heat with the battery cell 11; an equipotential connection component 13, including an equipotential connection layer 131 and a conductive adhesive layer 132 that are connected to each other, the equipotential connection component 13 is arranged between the shell 10 and the heat exchange component 12, one of the equipotential connection layer 131 and the conductive adhesive layer 132 is electrically connected to the shell 10, and the other of the equipotential connection layer 131 and the conductive adhesive layer 132 is electrically connected to the heat exchange component 12.

[0069] like Figure 2 As shown, the housing 10 at least includes a bottom plate 101 for carrying a battery cell 11 and an outer frame 102 arranged around the battery cell 11. The bottom plate 101 and the outer frame 102 form a storage space, and at least one battery cell 11 is placed on the bottom plate 101 and is limited by the outer frame 102 or the crossbeam. Optionally, the housing 10 includes an upper shell and a lower shell, and the upper shell and the lower shell are abutted and connected to each other to form a storage space for placing the battery cell 11, and the battery cell 11 in the storage space is surrounded and protected. Also optionally, the housing 10 is constructed as a semi-open shell for accommodating the battery cell 11.

[0070] The heat exchange assembly 12 is placed on the bottom plate 101 of the housing 10 and abuts against the battery cells 11. When there are multiple battery cells 11, the heat exchange assembly 12 is placed between the battery cells 11 so that both sides of the heat exchange assembly 12 abut against adjacent battery cells 11. There is a flowing coolant in the heat exchange assembly 12, and the coolant is used to exchange heat with the battery cells 11.

[0071] An equipotential connection component 13 is provided between the heat exchange component 12 and the housing 10. The equipotential connection component 13 includes an equipotential connection layer 131 and a conductive adhesive layer 132. At least a portion of the equipotential connection layer 131 is connected to the conductive adhesive layer 132. For example, at least a portion of the conductive adhesive layer 132 covers at least a portion of the equipotential connection layer 131, so that the equipotential connection layer 131 and the conductive adhesive layer 132 are mutually conductive. The equipotential connection component 13 is provided along the layout direction of the heat exchange component 12, and all the heat exchange components 12 are electrically connected to the equipotential connection component 13.

[0072] like Figure 3 As shown, optionally, a portion of the equipotential connection layer 131 contacts the heat exchange component 12, so that the equipotential connection layer 131 and the heat exchange component 12 are electrically connected; a conductive adhesive layer 132 is provided on the surface of the housing 10, so that the housing 10 and the conductive adhesive layer 132 are electrically connected. A portion of the equipotential connection layer 131 that is not in contact with the heat exchange component 12 contacts and adheres to the conductive adhesive layer 132, so that the equipotential connection layer 131 and the conductive adhesive layer 132 are conductive, thereby achieving equipotential connection between the housing 10 and the heat exchange component 12.

[0073] Similarly, optionally, a portion of the equipotential connection layer 131 contacts the housing 10, so that the equipotential connection layer 131 is electrically connected to the housing 10; a conductive adhesive layer 132 is provided on the surface of the heat exchange component 12, so that the heat exchange component 12 is electrically connected to the conductive adhesive layer 132. A portion of the equipotential connection layer 131 that is not in contact with the housing 10 contacts and adheres to the conductive adhesive layer 132, so that the equipotential connection layer 131 and the conductive adhesive layer 132 are connected, thereby achieving equipotential connection between the housing 10 and the heat exchange component 12.

[0074] In the technical solution of the embodiment of the present application, the battery cell 11, the heat exchange component 12 and the equipotential connection component 13 are arranged in the accommodating space of the shell 10, and the shell 10 protects the internal battery cell 11, the heat exchange component 12 and the equipotential connection component 13. The heat exchange component 12 exchanges heat with the battery cell 11 to make the battery operate at a suitable temperature. The equipotential connection component 13 is electrically connected to the shell 10 through one of the equipotential connection layer 131 and the conductive adhesive layer 132, and the other of the equipotential connection layer 131 and the conductive adhesive layer 132 is electrically connected to the heat exchange component 12, so that the equipotential between the shell 10 and the heat exchange component 12 is achieved, reducing the risk of electrification. Moreover, the equipotential connection is achieved through the layer structure, which has the advantages of reduced number of parts and simple structure.

[0075] like Figure 3 As shown, in some embodiments, the equipotential connection layer 131 is connected to the heat exchange component 12 , and the conductive adhesive layer 132 is disposed on at least a portion of the equipotential connection layer 131 and bonded to the housing 10 .

[0076] The equipotential connection layer 131 is connected to the heat exchange component 12 and extends from the heat exchange component 12 to the housing 10. The conductive adhesive layer 132 is disposed between the housing 10 and the equipotential connection layer 131, one side of the conductive adhesive layer 132 is bonded to the housing 10, and the other side of the conductive adhesive layer 132 is bonded to the equipotential connection layer 131. Optionally, the conductive adhesive layer 132 is also disposed between the equipotential connection layer 131 and the heat exchange component 12, so that the equipotential connection layer 131 is bonded to the heat exchange component 12.

[0077] Since the equipotential connection layer 131 is connected to the heat exchange component 12, and at least a portion of the equipotential connection layer 131 is provided with a conductive adhesive layer 132, and the conductive adhesive layer 132 is bonded to the housing 10, the heat exchange component 12 and the housing 10 are connected through the equipotential connection layer 131 and the conductive adhesive layer 132, thereby achieving the same potential between the two and reducing the risk of electrification. The conductive adhesive is bonded to the housing 10, so that the equipotential connection layer 131 is fixed on the housing 10, improving the firmness of the connection between the equipotential connection layer 131 and the housing 10, so that the housing 10 and the equipotential connection layer 131 maintain a stable conductive state.

[0078] In some embodiments, Figure 4 and Figure 8 As shown, the equipotential connection component 13 also includes an elastic support body 133, which is arranged between the shell 10 and the heat exchange component 12, at least a portion of the equipotential connection layer 131 is covered on the surface of the support body 133, and a conductive adhesive layer 132 is provided between the equipotential connection layer 131 and the shell 10.

[0079] The equipotential connection assembly 13 further includes an elastic support body 133. The support body 133 is disposed in the gap between the housing 10 and the heat exchange assembly 12 to fill the gap. Figure 4 and Figure 8 The cross-sectional configuration of the support body 133 shown in FIG is a rectangle. In actual use, the support body 133 can be configured in a rectangular, circular, diamond, etc., or in an irregular shape according to the shape of the gap. The present application does not impose any special limitation on the cross-sectional shape of the support body 133.

[0080] like Figure 3As shown, specifically, the battery cell 11 and the heat exchange component 12 are accommodated in the accommodation space, and the conductive part of the heat exchange component 12 is at a certain distance from the shell 10, that is, there is a gap between the conductive part of the heat exchange component 12 and the shell 10. A support body 133 with a size larger than the gap is provided at the gap, and the support body 133 is compressed and fixed by the heat exchange component 12 and the shell 10. The surface of the support body 133 close to the heat exchange component 12 is covered with a part of the equipotential connection layer 131, and the part of the equipotential connection layer 131 is pressed by the support body 133 toward the heat exchange and is conductive with the heat exchange component 12. Another part of the equipotential connection layer 131 is provided on the surface of the heat exchange component 12 close to the shell 10, and is bonded to the shell 10 by conductive glue, and one side of the part of the equipotential connection layer 131 contacts the support body 133, and the other side contacts the conductive glue layer 132 on the shell 10.

[0081] like Figure 7 As shown, when the heat exchange component 12 is small in size, the conductive part of the heat exchange component 12 is far away from the outer frame 102 of the shell 10. For cost considerations, the height of the support body 133 is only set to be greater than the distance between the conductive part of the heat exchange component 12 and the bottom plate 101 of the shell 10. A part of the equipotential connection layer 131 is covered on the surface of the support body 133 close to the heat exchange component 12, and another part of the equipotential connection layer 131 spans the gap between the support body 133 and the outer frame 102 and is adhered to the shell 10 by conductive adhesive.

[0082] Since the equipotential connection component 13 also includes an elastic support body 133, and the support body 133 is disposed between the shell 10 and the heat exchange component 12, the support body 133 can absorb the installation space tolerance between the shell 10 and the heat exchange component 12, so that the surface of the support body 133 can fit tightly to the shell 10 and the heat exchange component 12. Since the surface of the support body 133 fits tightly to the shell 10 and the heat exchange component 12, at least a portion of the equipotential connection layer 131 covers the surface of the support body 133, so that the equipotential connection layer 131 is pressed against the shell 10 and the heat exchange component 12 by the support body 133, so that the relative positions of the equipotential connection layer 131, the shell 10 and the heat exchange component 12 are fixed, so that the equipotential connection layer 131, the shell 10 and the heat exchange component 12 maintain a stable conductive state.

[0083] In some embodiments, Figure 4 As shown, the equipotential connection layer 131 includes a first connection layer 1311 . The first connection layer 1311 is disposed on a surface of the support body 133 close to the heat exchange component 12 . The first connection layer 1311 is connected to the housing 10 via a conductive adhesive layer 132 .

[0084] The equipotential connection layer 131 includes a first connection layer 1311. The first connection layer 1311 is disposed on the surface of the support body 133 close to the heat exchange component 12, and is pressed against the heat exchange component 12 by the support body 133. Adhesive may be applied between the equipotential connection layer 131 and the support body 133, or a conductive adhesive layer 132 may be disposed between the equipotential connection layer 131 and the support body to reinforce the connection between the equipotential connection layer 131 and the support body 133; a conductive adhesive layer 132 may also be disposed between the equipotential connection layer 131 and the heat exchange component 12 to reinforce the connection between the equipotential connection layer 131 and the heat exchange component 12. The conductive adhesive layer 132 may be disposed to extend from the first connection layer 1311 to the housing 10, for example, the conductive adhesive layer 132 may be disposed on the surface of the support body 133 in contact with the first connection layer 1311 and the surface adjacent to the surface, and the conductive adhesive layers 132 on the two surfaces are mutually conductive, so that the first connection layer 1311 is conductive with the housing 10.

[0085] Since the equipotential connection layer 131 includes the first connection layer 1311, and the first connection layer 1311 is disposed on the surface of the support body 133 close to the heat exchange component 12, the first connection layer 1311 is pressed against the heat exchange component 12 by the support body 133, thereby achieving stable conduction between the first connection layer 1311 and the heat exchange component 12. Since the first connection layer 1311 is in conduction with the housing 10 via the conductive adhesive layer 132, stable conduction between the heat exchange component 12 and the housing 10 can be achieved.

[0086] like Fig. 9 As shown, in some embodiments, the first connection layer 1311 extends from the surface of the support body 133 to a position facing the surface of the shell 10 , and the surface of the first connection layer 1311 facing the shell 10 is bonded to the shell 10 through the conductive adhesive layer 132 .

[0087] The first connection layer 1311 is constructed as a complete layer without bending, and the first connection layer 1311 covers the surface of the support body 133 and extends from the surface toward the housing 10 along its own extension direction, and a conductive adhesive layer 132 is provided between the first connection layer 1311 and the housing 10. One end of the first connection layer 1311 is bonded to the surface of the support body 133 through the conductive adhesive layer 132, and the other end of the first connection layer 1311 is bonded to the housing 10 through the conductive adhesive layer 132.

[0088] Specifically, a portion of the surface of the first connection layer 1311 contacts and fits with the support body 133, and a conductive adhesive layer 132 is disposed between the two to bond them. The conductive adhesive layer 132 is disposed on the surface of the first connection layer 1311 close to the housing 10, and the first connection layer 1311 is bonded to the housing 10 through the conductive adhesive layer 132.

[0089] Therefore, by extending the first connection layer and bonding the extended first connection layer 1311 to the shell 10 through the conductive adhesive layer 132, stable conduction between the heat exchange component 12 and the shell 10 can be achieved, with a simple structure and a small number of components.

[0090] In some embodiments, see Figure 4 The equipotential connection layer 131 also includes a second connection layer 1312 connected to the first connection layer 1311. The second connection layer 1312 is arranged on the surface of the support body 133 close to the shell 10 and is adjacent to the first connection layer 1311. A conductive adhesive layer 132 is provided between the second connection layer 1312 and the shell 10.

[0091] like Figure 2 and Figure 3 As shown, the equipotential connection layer 131 also includes a second connection layer 1312, and the second connection layer 1312 is connected to the first connection layer 1311. The second connection layer 1312 is arranged on the surface of the support body 133 close to the outer frame 102, that is, it is arranged on the adjacent surface of the support body 133 where the first connection layer 1311 is arranged. The second connection layer 1312 and the first connection layer 1311 are covered on the surface of the support body 133 in an "L" shape, and the second connection layer 1312 is pressed toward the outer frame 102 by the support body 133. The surface of the second connection layer 1312 close to the outer frame 102 is provided with a conductive adhesive layer 132, and is bonded to the outer frame 102 of the housing 10 through the conductive adhesive layer 132. This arrangement consumes less material and can effectively reduce costs. Optionally, adhesive is applied to the second connection layer 1312 and the support body 133 to strengthen the connection between the second connection layer 1312 and the support body 133.

[0092] Since the equipotential connection layer 131 includes the second connection layer 1312, and the second connection layer 1312 is disposed on the surface of the support body 133 close to the housing 10, the second connection layer 1312 is pressed against the housing 10 by the support body 133, thereby achieving stable conduction between the second connection layer 1312 and the housing 10. Since the first connection layer 1311 and the second connection layer 1312 are connected, the heat exchange component 12 is sequentially connected to the housing 10 through the first connection layer 1311 and the second connection layer 1312, thereby achieving equipotential between the two. The second connection layer 1312 and the housing 10 are connected through the conductive adhesive layer 132, thereby improving the firmness of the connection between the second connection layer 1312 and the housing 10, and further improving the stability of the conduction between the second connection layer 1312 and the housing 10.

[0093] In some embodiments, Figures 5 to 8 As shown, the equipotential connection layer 131 further includes a third connection layer 1313 connected to the first connection layer 1311 . The third connection layer 1313 extends to the housing 10 in a direction away from the support body 133 . A conductive adhesive layer 132 is provided between the third connection layer 1313 and the housing 10 .

[0094] The equipotential connection layer 131 also includes a third connection layer 1313. One end of the third connection layer 1313 is connected to the first connection layer 1311, and the other end of the third connection layer 1313 is connected to the housing 10 through the conductive adhesive layer 132. The extension direction of the third connection layer 1313 intersects with the extension direction of the first connection layer 1311. When there is a gap between the support body 133 and the outer frame 102 of the housing 10, the third connection layer 1313 can be arranged to span the gap, and the outer frame 102 and the first connection layer 1311 located on both sides of the gap are connected. When the shape of the outer frame 102 is irregular, there may be a problem that the contact area between the second connection layer 1312 located on the surface of the support body 133 and the outer frame 102 is too small, resulting in a poor conduction effect. In order to increase the contact area, the third connection layer 1313 can also be arranged, and the third connection layer 1313 is closely attached to the undulations of the outer frame 102 through the conductive adhesive layer 132.

[0095] By setting the third connection layer 1313 to extend to the housing 10 in a direction away from the support body 133, the third connection layer 1313 can be connected to the housing 10 with a large gap between the support body 133. Since the first connection layer 1311 and the third connection layer 1313 are connected, the heat exchange component 12 is connected to the housing 10 through the first connection layer 1311 and the third connection layer 1313 in sequence, so that the equipotential between the two is achieved. The third connection layer 1313 and the housing 10 are connected through the conductive adhesive layer 132, so that the third connection layer 1313 can be fixed on the housing 10, so that the first connection layer 1311 maintains a stable conductive state with the housing 10 through the third connection layer 1313.

[0096] In some embodiments, Figure 4 As shown, the equipotential connection layer 131 also includes at least one of a fourth connection layer 1314 and a fifth connection layer 1315. The fourth connection layer 1314 is arranged on the surface of the support body 133 opposite to the first connection layer 1311 and is connected to the second connection layer 1312. A conductive adhesive layer 132 is provided between the fourth connection layer 1314 and the shell 10. The fifth connection layer 1315 is arranged on the surface of the support body 133 opposite to the second connection layer 1312 and is connected to the first connection layer 1311.

[0097] Optionally, the equipotential connection layer 131 further includes a fourth connection layer 1314, and the fourth connection layer 1314 is connected to the second connection layer 1312. The fourth connection layer 1314 is disposed on the surface of the support 133 close to the bottom plate 101, that is, the surface of the support 133 facing the first connection layer 1311. The first connection layer 1311, the second connection layer 1312, and the fourth connection layer 1314 are covered on the surface of the support 133 in a "C" shape. A conductive adhesive layer 132 is provided between the fourth connection layer 1314 and the bottom plate 101 of the housing 10 to fix the fourth connection layer 1314. Optionally, the fourth connection layer 1314 is bonded to the support 133.

[0098] Optionally, the equipotential connection layer 131 further includes a fifth connection layer 1315, and the fifth connection layer 1315 is connected to the first connection layer 1311. The fifth connection layer 1315 is disposed on the surface of the support 133 away from the outer frame 102, that is, the surface of the support 133 facing the second connection layer 1312. The first connection layer 1311, the second connection layer 1312, and the fifth connection layer 1315 are covered on the surface of the support 133 in a "C" shape. Optionally, both the second connection layer 1312 and the fifth connection layer 1315 extend toward the bottom plate 101 and are fixed to the bottom plate 101 by an adhesive, further limiting the support 133 by the equipotential connection layer 131. Also optionally, if the fifth connection layer 1315 abuts against the heat exchange component 12, a conductive adhesive layer 132 can be provided between the fifth connection layer 1315 and the heat exchange component 12 to bond the fifth connection layer 1315 to the heat exchange component 12. Optionally, the fifth connection layer 1315 is bonded to the support 133.

[0099] Also optionally, a fourth connection layer 1314 and a fifth connection layer 1315 are further provided on the surface of the support 133, and the fourth connection layer 1314 and the fifth connection layer 1315 are connected. The first connection layer 1311, the second connection layer 1312, the fourth connection layer 1314, and the fifth connection layer 1315 cover the surface of the support 133 in a "square" shape. The support 133 is limited by the equipotential connection layer 131 and is fixed to the housing 10 through the conductive adhesive layer 132 on the second connection layer 1312 and the fourth connection layer 1314. Optionally, a conductive adhesive layer 132 can be provided on the first connection layer 1311 and / or the fifth connection layer 1315 to bond it to the heat exchange component 12.

[0100] Since the equipotential connection layer 131 also includes a fourth connection layer 1314 connected to the second connection layer 1312, the fourth connection layer 1314 is arranged on the surface facing the first connection layer 1311 and abuts against the housing 10, therefore, the fourth connection layer 1314 is pressed against the housing 10 by the support body 133, so as to achieve stable conduction between the fourth connection layer 1314 and the housing 10. The fourth connection layer 1314 and the housing 10 are connected through the conductive adhesive layer 132, so as to improve the firmness of the connection between the fourth connection layer 1314 and the housing 10, and further improve the stability of the conduction between the fourth connection layer 1314 and the housing 10. The first connection layer 1311, the second connection layer 1312 and the fourth connection layer 1314 form a form of semi-enclosing the support body 133, and the second connection layer 1312 and the fourth connection layer 1314 are bonded to the housing 10, so that the position of the support body 133 is fixed and not easy to change. Since the equipotential connection layer 131 also includes the fifth connection layer 1315, the fifth connection layer 1315 is arranged on the surface of the support body 133 directly opposite to the second connection layer 1312, therefore, the fifth connection layer 1315, the first connection layer 1311 and the second connection layer 1312 form a form of semi-enclosing the support body 133, so that the position of the support body 133 is fixed and not easy to change. The first connection layer 1311, the second connection layer 1312, the fourth connection layer 1314 and the fifth connection layer 1315 together form a form of fully enclosing the support body 133, having a wide range of equipotential contact, and can be applied to various situations, so that the support body 133 is firmly bonded to the housing 10, so that the position of each connection layer arranged on the support body 133 is determined, and the firmness and stability of the overall structure are improved.

[0101] In some embodiments, Figure 1 and Figure 5 As shown, a plurality of heat exchange components 12 are arranged at intervals from each other and disposed in the accommodation space, the support body 133 is strip-shaped along the arrangement direction of the heat exchange components 12 , and a first connecting layer 1311 is provided along the length direction of the support body 133 .

[0102] There are multiple heat exchange components 12, and the multiple heat exchange components 12 are arranged in the accommodation space at intervals, and the space between the heat exchange components 12 is used to place the battery cells 11. The support body 133 is arranged to extend from the heat exchange component 12 located on one side of the accommodation space to the heat exchange component 12 located on the other side of the accommodation space, so that the support body 133 is in a strip shape, and each heat exchange component 12 is in contact with the support body 133. The first connection layer 1311 fully covers the surface of the support body 133 close to the heat exchange component 12, and all the heat exchange components 12 are connected. A part of the support body 133 is provided with a second connection layer 1312, so that the heat exchange component 12 and the housing 10 are connected.

[0103] Optionally, the second connection layer 1312 completely covers the surface of the support body 133, forming an "L" shape with the first connection layer 1311. Furthermore, since the equipotential connection layer 131 located at the edge of the support body 133 is easy to fall off, the fourth connection layer 1314 and the fifth connection layer 1315 are arranged at both ends close to the support body 133 to increase the conduction area and reinforce it at the same time. At least one of the fourth connection layer 1314 and the fifth connection layer 1315 can also be arranged at a location where it is easy to fall off or where poor contact is easy to occur. The specific arrangement positions of the fourth connection layer 1314 and the fifth connection layer 1315 are not particularly limited in the present application. Also optionally, the first connection layer 1311, the second connection layer 1312, the fourth connection layer 1314 and the fifth connection layer 1315 are respectively completely covered on the surface of the support body 133, forming a "mouth" shape.

[0104] Since the heat exchange components 12 are arranged in the accommodation space at intervals from each other, the battery cells 11 can be placed between the heat exchange components 12 to obtain efficient heat exchange. Since the support body 133 is constructed in a strip shape along the arrangement direction of the heat exchange components 12, the support body 133 can be in contact with multiple or even all heat exchange components 12. Since the first connection layer 1311 is provided along the length direction of the support body 133, each heat exchange component 12 can contact the first connection layer 1311 and be connected to each other through the first connection layer 1311. In addition, the equipotential connection between each heat exchange component 12 and the housing 10 can be achieved through the first connection layer 1311 and the conductive adhesive layer 132, which has a simple structure and can reduce the number of components.

[0105] In some embodiments, a portion of the support body 133 where the second connection layer 1312 is not provided is provided with a third connection layer 1313 .

[0106] A third connection layer 1313 is provided on a portion of the support body 133, and a second connection layer 1312 is provided on another portion of the support body 133. Specifically, the second connection layer 1312, the fourth connection layer 1314, and the fifth connection layer 1315 are provided at positions on the support body 133 where the equipotential connection layer 131 is prone to fall off or poor contact, and the third connection layer 1313 is provided at the remaining positions.

[0107] Optionally, the first connection layer 1311 completely covers the surface of the support body 133 close to the heat exchange component 12, and at least a portion of the support body 133 is provided with a third connection layer 1313, such as being provided in the middle portion of the support body. The heat exchange component 12 and the housing 10 are only equipotentially connected through the first connection layer 1311 and the third connection layer 1313.

[0108] Since the third connection layer 1313 is disposed on the portion of the support body 133 where the second connection layer 1312 is not disposed, the support body 133 can be applied to a situation where there is a large gap between the support body 133 and the housing 10 .

[0109] In some embodiments, the support body 133 includes foam.

[0110] Since the support body 133 can be foam, the foam itself has the advantages of strong elasticity, light weight and reliable performance, so the foam can also play a buffering role between the heat exchange component 12 and the shell 10. In addition, the foam itself can have a V0 flame retardant grade.

[0111] In some embodiments, the equipotential connection layer 131 includes a conductive cloth.

[0112] The conductive cloth covers the foam or extends outward from the foam to form an equipotential connection layer 131. Conductive glue is applied to the surface of the conductive cloth away from the support 133 to form a conductive glue layer 132, so that the conductive cloth is connected to the housing 10 or the heat exchange component 12. Optionally, adhesive is applied to the surface of the conductive cloth close to the support 133 to connect the conductive cloth to the support 133.

[0113] Since the equipotential connection layer 131 can be a conductive cloth, the conductive cloth itself has the characteristics of low cost, easy processing, and small space occupation. Therefore, using conductive cloth for conduction can reduce costs. The conductive cloth can be flexibly arranged according to various layout conditions between the heat exchange component 12 and the shell 10 to achieve efficient conduction, and the structure is simple, which can reduce the number of components.

[0114] In some embodiments, Figure 5 As shown, the heat exchange component 12 includes a water-cooled plate 121 and a current collector 122. A plurality of water-cooled plates 121 are spaced apart from each other in the accommodating space and are in contact with the battery cell 11. Current collectors 122 are respectively arranged on both sides of the length direction of the water-cooled plate 121. The current collector 122 on at least one side of the water-cooled plate 121 abuts against the equipotential connection component 13.

[0115] There are multiple water-cooling plates 121, and the extension directions of each water-cooling plate 121 are parallel to each other. The water-cooling plates 121 are arranged in the accommodation space at intervals, and the battery cells 11 are placed between the water-cooling plates 121. There is a current collector 122 on each side of the extension direction of the water-cooling plate 121. The water-cooling plate 121 obtains the cooling medium through the current collector 122 on one side, and outputs the cooling medium after heat exchange from the current collector 122 on the other side. The current collector 122 is the conductive part of the heat exchange component 12. An equipotential connection component 13 is provided corresponding to the current collector 122 located on one side of the water-cooling plate 121. The equipotential connection component 13 is provided between the current collector 122 and the bottom plate 101 of the shell 10 to conduct the current collector 122 and the shell 10. Optionally, an equipotential connection component 13 is provided under the current collector 122 located on the other side of the water-cooling plate 121.

[0116] The current collector 122 in the heat exchange component 12 is in direct contact with the support body 133, which causes the support body 133 to deform and makes the equipotential connection layer 131 easy to fall off. The first connection layer 1311, the second connection layer 1312, the fourth connection layer 1314 and the fifth connection layer 1315 can be set on the support body 133 corresponding to the position of the current collector 122, and only the first connection layer 1311 and the second connection layer 1312 are set at the rest of the support body 133, or the first connection layer 1311 and the third connection layer 1313 are set at the rest of the support body 133.

[0117] Since the heat exchange component 12 includes a water-cooled plate 121, it can meet the cooling requirements of the battery cell 11. Since multiple water-cooled plates 121 are provided, the heat exchange effect on the battery cell 11 can be further enhanced. By providing a current collector 122 on both sides of the water-cooled plate 121, the cooling water can be diverted to each water-cooled plate 121, and the water after heat exchange with the battery cell 11 can also be collected and transported out. Since the current collector 122 on at least one side of the water-cooled plate 121 is in contact with the equipotential connection component 13, each heat exchange component 12 can be in contact with the equipotential component to maintain the same potential, and is connected to the shell 10 through the equipotential component, so that all heat exchange components 12 and the shell 10 maintain the same potential, and the structure is simple.

[0118] In a second aspect, the present application further provides an electrical device, the electrical device comprising a battery, and the battery is used to provide electrical energy to the electrical device.

[0119] Since the electrical device includes a battery with a low risk of being charged, when the electrical device uses the battery, adverse effects caused by the battery being charged can be reduced.

[0120] In a third aspect, the present application also provides an energy storage device, which includes a battery, and the battery can store electrical energy and provide electrical energy.

[0121] Since the energy storage device includes a battery with a low risk of being charged, when the energy storage device uses the battery to store / provide electrical energy, adverse effects caused by the battery being charged can be reduced.

[0122] The equipotential connection structure in the present application generally includes a supporting body (support body 133), an equipotential connection layer 131 and a conductive adhesive layer 132. These three can be freely adjusted to maximize efficiency, and the deployment of the equipotential connection layer 131 and the conductive adhesive layer 132 needs to be able to connect the box and the cold plate to achieve the purpose of equipotential for the overall structure.

[0123] The supporting body (support body 133) of the equipotential structure in the present application is an elastic structure, and its main purpose is to absorb the tolerance between installations and ensure that the equipotential connection layer 131 can effectively contact the parts to be connected. The equipotential connection layer 131 structure is the main structure for equipotential, and it needs to be in direct contact, or through conductive adhesive to contact the interface that needs to maintain equipotential. The conductive adhesive structure can be added selectively, and its main purpose is to fix the overall structure and ensure that the equipotential connection layer 131 structure is connected to the interface that needs to maintain equipotential.

[0124] The equipotential structure used in this solution can have a variety of layout forms, for example, it can be an integral connection box and a cold plate, but according to needs, it can also be disassembled into multiple equipotential structures at some locations, or even different forms of equipotential structures, to meet requirements such as edge contact or not easy to fall off.

[0125] According to the requirements of actual application, the equipotential structure can be freely arranged. For example, in the middle part of the water cooling component (a type of heat exchange component 12), an L-shaped equipotential connection layer 131 structure formed by the first connection layer 1311 and the second connection layer 1312 or an independently extended equipotential connection layer 131 structure formed by the extended first connection layer 1311 is used to save the overall material cost. In places where poor contact or easy to fall off is likely to be used on both sides, a ring-shaped equipotential connection layer 131 structure formed by the first connection layer 1311, the second connection layer 1312, the fourth connection layer 1314 and the fifth connection layer 1315 is used in combination with multi-sided conductive adhesive to stabilize the structure.

[0126] Specifically, the solution of setting the first connection layer 1311, the second connection layer 1312, the fourth connection layer 1314 and the fifth connection layer 1315 on the support body 133 has the largest range of equipotential contact and can be used in almost any position, but the cost is relatively high. The solution of setting the first connection layer 1311 and the second connection layer 1312 on the support body 133 is suitable for use when the heat exchange component 12 is close to the side of the box. The solution of setting the first connection layer 1311 and the third connection layer 1313 on the support body 133 is suitable for matching with special structural designs and being pulled out separately to perform equipotential connection at the required positions.

[0127] Different positions on the support body 133 can adopt different layout schemes. For example, in order to maximize the use of materials, the middle part of the support body 133 adopts a scheme in which the first connection layer 1311 and the second connection layer 1312 are arranged on the support body 133, and the second connection layer 1312 on the side is in contact with and fixed to the box through the conductive adhesive layer 132. Since the end part of the support body 133 is close to the welding seam, the requirements for bonding reliability and equipotential contact are improved. The ring-shaped scheme of arranging the first connection layer 1311, the second connection layer 1312, the fourth connection layer 1314 and the fifth connection layer 1315 on the support body 133 is adopted. The second connection layer 1312 contacts the box through the conductive adhesive layer 132 on the side, and the fourth connection layer 1314 also contacts the box through the conductive adhesive layer 132 at the bottom to increase reliability.

[0128] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.

Claims

1. A battery, characterized in that: include: A housing, wherein the housing has a receiving space inside, and the receiving space is used to receive a battery cell; a heat exchange component, the heat exchange component being disposed in the accommodation space and being used for exchanging heat with the battery cell; The equipotential connection component comprises an equipotential connection layer and a conductive adhesive layer which are electrically connected to each other. The equipotential connection component is arranged between the shell and the heat exchange component. One of the equipotential connection layer and the conductive adhesive layer is electrically connected to the shell, and the other of the equipotential connection layer and the conductive adhesive layer is electrically connected to the heat exchange component.

2. The battery according to claim 1, characterized in that The equipotential connection layer is connected to the heat exchange component, and the conductive adhesive layer is arranged on at least a part of the equipotential connection layer and is bonded to the shell.

3. The battery according to claim 2, characterized in that The equipotential connection component also includes an elastic support body, which is arranged between the shell and the heat exchange component. At least a part of the equipotential connection layer is covered on the surface of the support body, and the conductive adhesive layer is arranged between the equipotential connection layer and the shell.

4. The battery according to claim 3, characterized in that The equipotential connection layer includes a first connection layer, which is disposed on a surface of the support body close to the heat exchange component, and the first connection layer is electrically connected to the shell via the conductive adhesive layer.

5. The battery according to claim 4, characterized in that The first connection layer extends from the surface of the support body to a position facing the surface of the shell, and a surface of the first connection layer facing the shell is bonded to the shell through the conductive adhesive layer.

6. The battery according to claim 4, characterized in that The equipotential connection layer also includes a second connection layer connected to the first connection layer. The second connection layer is arranged on a surface of the support body close to the shell and adjacent to the first connection layer. The conductive adhesive layer is arranged between the second connection layer and the shell.

7. The battery according to claim 5, characterized in that The equipotential connection layer also includes a second connection layer connected to the first connection layer. The second connection layer is arranged on a surface of the support body close to the shell and adjacent to the first connection layer. The conductive adhesive layer is arranged between the second connection layer and the shell.

8. The battery according to any one of claims 4 to 7, characterized in that The equipotential connection layer further includes a third connection layer connected to the first connection layer, the third connection layer extends to the shell in a direction away from the support body, and the conductive adhesive layer is provided between the third connection layer and the shell.

9. The battery according to claim 6 or 7, characterized in that: The equipotential connection layer further includes at least one of a fourth connection layer and a fifth connection layer. The fourth connection layer is arranged on the surface of the support body facing the first connection layer and connected to the second connection layer. The conductive adhesive layer is arranged between the fourth connection layer and the housing. The fifth connection layer is disposed on a surface of the support body facing the second connection layer and is connected to the first connection layer.

10. The battery according to claim 9, characterized in that The equipotential connection layer further includes a third connection layer connected to the first connection layer, the third connection layer extends to the shell in a direction away from the support body, and the conductive adhesive layer is provided between the third connection layer and the shell.

11. The battery according to any one of claims 4 to 7, characterized in that The plurality of heat exchange components are arranged at intervals from each other and are disposed in the accommodating space. The support body is strip-shaped along the arrangement direction of the heat exchange components, and the first connecting layer is disposed along the length direction of the support body.

12. The battery according to any one of claims 3 to 7, characterized in that The support body includes foam.

13. The battery according to any one of claims 1 to 7, characterized in that The equipotential connection layer includes a conductive cloth.

14. The battery according to any one of claims 1 to 7, characterized in that The heat exchange component includes a water-cooling plate and a current collector. A plurality of the water-cooling plates are arranged in the accommodating space at intervals and in contact with the battery cells. The current collectors are respectively arranged on both sides of the length direction of the water-cooling plate. The current collector on at least one side of the water-cooling plate abuts against the equipotential connection component.

15. An electrical device, characterized in that: The battery comprises the battery according to any one of claims 1 to 14, wherein the battery is used to provide electrical energy to the electrical device.

16. An energy storage device, characterized in that: A battery comprising any one of claims 1 to 14, wherein the battery is capable of storing electrical energy and providing electrical energy.

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