Ultrahigh-precision semiconductor printing machine

Abstract

The utility model relates to an ultrahigh-precision semiconductor printing machine which comprises a working table, supporting legs are fixedly connected to the four corners of the top of the working table, a printing machine is fixedly connected to the top end face of the working table, a control panel is fixedly connected to one side of the printing machine, and a storage box is fixedly connected to the top end face of the working table. The top end face of the material storage box communicates with a material supplementing hopper, the bottom of the material storage box communicates with a telescopic material passing pipe, the inner side of the printing machine is rotationally connected with a driving screw rod, and one side of the workbench is fixedly connected with a driving motor. By means of work of the screw rod structure, translation is conveniently conducted to complete solder paste brushing work, after tin brushing is conducted, residual solder paste on the scraping plate is adjusted to be lower than the cleaning scraping plate, the cleaning scraping plate is attached to the scraping plate, the scraping plate is moved upwards through the electric telescopic rod, and the residual solder paste is scraped off from top to bottom through cleaning of the cleaning scraping plate; and material waste and the like are avoided.

Description

Technical Field

[0001] The utility model relates to an ultra-high precision semiconductor printer, belonging to the technical field of printers. Background Art

[0002] The PCB board in electronic products is generally equipped with many electronic components, such as chips, resistors, capacitors and inductors, in order to form a circuit with specific functions. Therefore, a plurality of soldering points for soldering the above electronic components are set on the PCB board. In order to obtain a better soldering effect and improve the soldering efficiency, a layer of solder paste is first applied on the soldering points of the PCB board. When applying solder paste to the PCB board, a printer is often used.

[0003] After searching, it was found that an electronic semiconductor printer described in the authorization announcement number CN215620775U has the following beneficial effects: by setting up an organic door and a purification cylinder for use in conjunction, the harmful gas generated by the printer during the process of applying solder paste to the PCB board can be purified, thereby avoiding the harmful gas being directly discharged to the outside without being treated and being absorbed by the staff, affecting the health of the staff and avoiding pollution to the environment; by setting up an electric telescopic rod, a support plate, a support rod and a scraper for use in conjunction with each other, the solder paste attached to the scraper can be scraped off conveniently and quickly, the scraper can be cleaned, the waste of materials can be avoided, the production cost of printing can be reduced, and the practicality of the printer can be improved.

[0004] When it is in use, because the scraper is in real-time contact with the scraper, even if the scraper is used to scrape the solder paste, once the solder paste remains on the scraper, it is easy to cause material waste, and it may even fall on the PCB board that has just been brushed with solder paste. The defect is more obvious. In addition, the purification and filtering mechanism is inconvenient to disassemble and assemble, and it is difficult to clean and replace it later. Therefore, an ultra-high precision semiconductor printer is needed for people to use. Utility Model Content

[0005] The utility model aims to provide an ultra-high precision semiconductor printer, which utilizes the working of a screw structure to facilitate translation to complete the work of brushing solder paste. After brushing solder, the residual solder paste on the scraper plate is adjusted to a height lower than that of a cleaning scraper, and then the cleaning scraper is attached to the scraper plate, and the scraper plate is moved up by an electric telescopic rod to scrape off the residual solder paste from top to bottom by cleaning the cleaning scraper, thereby avoiding material waste, etc. In addition, during the printing process, the filtering structure in the processing chassis can be used to purify harmful gases, and the harmful gases generated by the solder paste during the soldering process of the printer can be adsorbed and purified, thereby avoiding the harmful gases from being directly discharged to the outside without being treated and absorbed by the staff, thereby affecting the health of the staff and avoiding pollution to the environment. The filtering structure is easy to disassemble and assemble, and can effectively meet people's use needs to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An ultra-high precision semiconductor printer comprises a workbench, wherein four corner positions of the top of the workbench are fixedly connected to support legs, the top surface of the workbench is fixedly connected to a printer, one side of the printer is fixedly connected to a control panel, the top surface of the workbench is fixedly connected to a material storage box, the top surface of the material storage box is connected to a material replenishing hopper, the bottom of the material storage box is connected to a retractable material passage pipe, the inner side of the printer is rotatably connected to a drive screw, one side of the workbench is fixedly connected to a drive motor, and one end of the drive screw is fixedly connected to the main shaft of the drive motor, and the outer side of the drive screw is spirally connected to a drive kit.

[0008] An electric telescopic rod is fixedly connected to one side of the driving kit, a mounting plate is provided at the other end of the electric telescopic rod, a discharge pipe is fixedly connected to the other side of the mounting plate, and the feed pipe is connected to the discharge pipe, a scraper plate is fixedly connected to the bottom of the mounting plate, and a support platform is provided on the inner side of the bottom of the printing machine.

[0009] Furthermore, a limiting support rod is fixedly connected to the inner side of the printing machine, and the driving kit is sleeved on the limiting support rod.

[0010] Furthermore, a collecting box is provided on the inner side of the bottom of the printing machine, a material drop hole is opened on the inner side of the top of the collecting box, an adjustable telescopic rod is fixedly connected to the top of the collecting box, and a cleaning scraper is fixedly connected to one end of the adjustable telescopic rod.

[0011] Furthermore, the cleaning scraper is symmetrically arranged with respect to the blanking hole, and the thickness of the scraper plate is smaller than the inner diameter width of the blanking hole.

[0012] Furthermore, a processing chassis is fixedly connected to one side of the printing machine, air inlet holes are provided inside one side of the printing machine and one side of the processing chassis, an air intake fan is fixedly connected to the inner side of the processing chassis via a bracket, and a filter screen plate and an activated carbon plate are provided on the inner side of the processing chassis.

[0013] Furthermore, one side of the filter plate and the activated carbon plate is fixedly connected to a mounting card, and the mounting card is snap-connected to the top of the processing chassis. An adjustment slot is opened on the inner side of the mounting card, and an adjustment handle is rotatably connected to the inner side of the adjustment slot.

[0014] The beneficial effects of the utility model are:

[0015] By arranging a driving screw, a scraping plate, a cleaning scraper and an installation card plate, etc., the utility model utilizes the work of the screw structure to facilitate translation to complete the work of brushing solder paste. After brushing solder, the residual solder paste on the scraping plate is adjusted to a height lower than the cleaning scraper, and the cleaning scraper is attached to the scraping plate, and the scraping plate is moved up by the electric telescopic rod to scrape the residual solder paste from top to bottom by the cleaning of the cleaning scraper, thereby avoiding material waste, etc. In addition, during the printing process, the filtering structure in the processing chassis can be used to purify harmful gases, and the harmful gases generated by the solder paste during the soldering process of the printing machine can be adsorbed and purified, thereby avoiding the harmful gases from being directly discharged to the outside without being treated and being absorbed by the staff, affecting the health of the staff, and avoiding pollution to the environment. The filtering structure is easy to disassemble and assemble, and can effectively meet people's use needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the specific embodiments of the present invention and do not constitute a limitation to the present invention.

[0017] Figure 1 This is a schematic diagram of the overall structure of an ultra-high precision semiconductor printer of the utility model;

[0018] Figure 2 This is a schematic diagram of the installation structure of a driving screw of an ultra-high precision semiconductor printer of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of a processing chassis of an ultra-high precision semiconductor printer of the utility model;

[0020] Figure 4 This is a schematic diagram of the installation structure of an adjustment handle of an ultra-high precision semiconductor printer of the utility model;

[0021] Numbers in the figure: 1. Workbench; 2. Support legs; 3. Printing machine; 4. Control panel; 5. Storage box; 6. Refilling hopper; 7. Feed pipe; 8. Driving screw; 9. Driving motor; 10. Driving kit; 11. Electric telescopic rod; 12. Discharge pipe; 13. Scraper plate; 14. Support table; 15. Limit support rod; 16. Collecting box; 17. Dropping hole; 18. Adjusting telescopic rod; 19. Cleaning scraper; 20. Processing chassis; 21. Air inlet; 22. Suction fan; 23. Filter screen; 24. Activated carbon plate; 25. Installing card plate; 26. Adjusting card slot; 27. Adjusting handle. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example 1, please refer to Figure 1-Figure 4 , the utility model provides a technical solution:

[0024] An ultra-high precision semiconductor printer comprises a workbench 1, wherein support legs 2 are fixedly connected at the four corner positions of the top of the workbench 1, a printer 3 is fixedly connected to the top surface of the workbench 1, a control panel 4 is fixedly connected to one side of the printer 3, a material storage box 5 is fixedly connected to the top surface of the workbench 1, a material replenishing hopper 6 is connected to the top surface of the material storage box 5, a retractable material passage pipe 7 is connected to the bottom of the material storage box 5, a driving screw 8 is rotatably connected to the inner side of the printer 3, a driving motor 9 is fixedly connected to one side of the workbench 1, and one end of the driving screw 8 is fixedly connected to the main shaft of the driving motor 9, and a driving kit 10 is spirally connected to the outer side of the driving screw 8.

[0025] As a preferred technical solution of the utility model, one side of the driving kit 10 is fixedly connected to an electric telescopic rod 11, the other end of the electric telescopic rod 11 is provided with a mounting plate, the other side of the mounting plate is fixedly connected to a discharge pipe 12, and the feed pipe 7 is connected to the discharge pipe 12, the bottom of the mounting plate is fixedly connected to a scraper plate 13, the inner side of the bottom of the printing machine 3 is provided with a support platform 14, the inner side of the printing machine 3 is fixedly connected to a limiting support rod 15, and the driving kit 10 is sleeved on the limiting support rod 15; the solder paste on the PCB board is scraped flat, thereby completing the tinning of the PCB board.

[0026] As a preferred technical solution of the utility model, a collecting box 16 is provided on the inner side of the bottom of the printing machine 3, and a blanking hole 17 is opened on the inner side of the top of the collecting box 16. An adjusting telescopic rod 18 is fixedly connected to the top of the collecting box 16, and a cleaning scraper 19 is fixedly connected to one end of the adjusting telescopic rod 18. The cleaning scraper 19 is symmetrically arranged with the blanking hole 17, and the thickness of the scraping plate 13 is smaller than the inner diameter width of the blanking hole 17; after scraping, the scraping plate 13 is moved between the cleaning scrapers 19, and the electric telescopic rod 11 is used to move the scraping plate 13 downward until the residual solder paste on the scraping plate 13 does not exceed the height of the cleaning scraper 19, and then the adjusting telescopic rod 18 is used to move the cleaning scraper 19 to fit the scraping plate 13, and the cleaning work can be completed as the electric telescopic rod 11 moves the scraping plate 13 upward.

[0027] Example 2 Please refer to Figure 3 and 4 The difference between this embodiment and embodiment 1 is that:

[0028] As an optimal technical solution of the utility model, a processing chassis 20 is fixedly connected to one side of the printing machine 3, and an air inlet 21 is provided inside one side of the printing machine 3 and inside one side of the processing chassis 20. An air suction fan 22 is fixedly connected to the inner side of the processing chassis 20 through a bracket. A filter screen plate 23 and an activated carbon plate 24 are fixedly connected to one side of the filter screen plate 23 and the activated carbon plate 24, and a mounting card plate 25 is connected to the top of the processing chassis 20. An adjustment slot 26 is provided on the inner side of the mounting card plate 25, and an adjustment handle 27 is rotatably connected to the inner side of the adjustment slot 26. During the printing process, harmful gases can be sucked into the processing chassis 20. When the harmful gases pass through the filter screen plate 23 and the activated carbon plate 24 in turn, the filter screen plate 23 can filter the harmful gases and filter and intercept the impurities in the harmful gases. At the same time, the activated carbon plate 24 can purify the harmful gases and adsorb and purify the harmful gases generated by the solder paste during the soldering process of the printing machine.

[0029] The working principle of the utility model is as follows: when in use, the driving motor 9 is used to rotate the driving screw 8 to move the driving kit 10 of the outer spiral, and the electric telescopic rod 11 is used to move the scraping plate 13 and the discharge pipe 12 downward, the discharge pipe 12 discharges the material, and as the screw structure works, the scraping plate 13 can scrape the discharged solder paste flat, so that the tin brushing of the PCB board can be completed. After scraping, the scraping plate 13 is moved between the cleaning scraper 19, and the electric telescopic rod 11 is used to move the scraping plate 13 downward until the residual solder paste on the scraping plate 13 does not exceed the height of the cleaning scraper 19, and then the adjusting telescopic rod 18 is used to move the cleaning scraper 19 to fit the scraping plate 13, and as the electric telescopic rod 11 moves the scraping plate 13 upward, the scraping plate 13 can be completed. In addition, during the printing process, the harmful gas can be sucked into the processing box 20 by using the suction fan 22. When the harmful gas passes through the filter plate 23 and the activated carbon plate 24 in turn, the filter plate 23 can filter the harmful gas and filter out the impurities in the harmful gas. At the same time, the activated carbon plate 24 can purify the harmful gas and adsorb and purify the harmful gas generated by the solder paste during the soldering process of the printing machine to avoid the harmful gas being directly discharged to the outside without being treated and absorbed by the staff, affecting the health of the staff and avoiding pollution to the environment. In the later stage, the filter structure can be directly taken out by adjusting the handle 27, so that people can quickly disassemble and assemble, which is convenient to use.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An ultra-high precision semiconductor printing machine, comprising a workbench (1), characterized in that: The top four corners of the workbench (1) are fixedly connected to support legs (2), the top surface of the workbench (1) is fixedly connected to a printing machine (3), one side of the printing machine (3) is fixedly connected to a control panel (4), the top surface of the workbench (1) is fixedly connected to a material storage box (5), the top surface of the material storage box (5) is connected to a material supply hopper (6), the bottom of the material storage box (5) is connected to a retractable material passage pipe (7), the inner side of the printing machine (3) is rotatably connected to a drive screw (8), one side of the workbench (1) is fixedly connected to a drive motor (9), one end of the drive screw (8) is fixedly connected to the main shaft of the drive motor (9), and the outer side of the drive screw (8) is spirally connected to a drive kit (10).

2. The ultra-high precision semiconductor printer according to claim 1, characterized in that: An electric telescopic rod (11) is fixedly connected to one side of the driving kit (10), a mounting plate is provided at the other end of the electric telescopic rod (11), a discharge pipe (12) is fixedly connected to the other side of the mounting plate, and the feed pipe (7) is connected to the discharge pipe (12), a scraper plate (13) is fixedly connected to the bottom of the mounting plate, and a support platform (14) is provided on the inner side of the bottom of the printing machine (3).

3. The ultra-high precision semiconductor printer according to claim 1, characterized in that: The inner side of the printing machine (3) is fixedly connected to a limit support rod (15), and the drive kit (10) is sleeved on the limit support rod (15).

4. The ultra-high precision semiconductor printer according to claim 2, characterized in that: A collecting box (16) is provided on the inner side of the bottom of the printing machine (3); a material drop hole (17) is provided on the inner side of the top of the collecting box (16); an adjustable telescopic rod (18) is fixedly connected to the top of the collecting box (16); and a cleaning scraper (19) is fixedly connected to one end of the adjustable telescopic rod (18).

5. The ultra-high precision semiconductor printer according to claim 4, characterized in that: The cleaning scraper (19) is symmetrically arranged with respect to the blanking hole (17), and the thickness of the scraper plate (13) is smaller than the inner diameter width of the blanking hole (17).

6. The ultra-high precision semiconductor printer according to claim 1, characterized in that: A processing box (20) is fixedly connected to one side of the printing machine (3), an air inlet hole (21) is provided inside one side of the printing machine (3) and inside one side of the processing box (20), an air suction fan (22) is fixedly connected to the inside of the processing box (20) via a bracket, and a filter screen plate (23) and an activated carbon plate (24) are provided inside the processing box (20).

7. The ultra-high precision semiconductor printer according to claim 6, characterized in that: A mounting card plate (25) is fixedly connected to one side of the filter screen plate (23) and the activated carbon plate (24), and the mounting card plate (25) is snap-connected to the top of the processing chassis (20). An adjustment card slot (26) is provided on the inner side of the mounting card plate (25), and an adjustment handle (27) is rotatably connected to the inner side of the adjustment card slot (26).

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