Thermal visbreaking heat-conducting adhesive film
By setting a thermally conductive adhesive layer and heat-conducting channel in the adhesive film, combining high-viscosity layer and heat-reducing adhesive, the problems of unstable bonding and poor heat dissipation in the process of heavy industry of electronic products are solved, and the bonding stability is improved and stripping efficiency enhance safety.
Patent Information
- Application Number
- CN202420350608.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-02-26
AI Technical Summary
Traditional tape cannot be peeled off due to its high viscosity performance during the heavy industry of electronic products, and the disassembly and assembly efficiency is low, and residual glue may be left after peeling, which affects product quality, and insufficient heat dissipation and cooling performance, which poses safety hazards.
A thermally detoxified and thermally conductive adhesive film is designed. By setting a thermally conductive adhesive layer and a heat-conducting channel in the high-viscosity layer, heat conduction is achieved, and a rubber groove is set on the bonding surface to accommodate thermally detoxified adhesive, improving bonding stability and peel efficiency.
The adhesive stability and firmness of the adhesive film are achieved, and the efficiency of thermal detachment removal is improved, the risk of damage to components is reduced, and safety is enhanced.
Smart Images
Figure CN222313044U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of adhesive films, in particular to a heat-reducing and heat-conductive adhesive film. Background Art
[0002] With the rapid development of electronic technology, products are gradually tending towards small size and high performance, and their hardware configuration and electronic circuits are gradually developing towards integration. The heat dissipation performance of electronic products has also become an important quality assessment factor. Various types of tapes are used in computers, mobile phones, home appliances and other products to fix internal components. During the production and preparation process or repair and replacement process of electronic products, some electronic components such as chips and batteries need to be reworked, which requires the tape to not only provide thermal conductivity and heat dissipation performance, but also provide re-peeling performance. Traditional tapes generally have high viscosity and cannot be peeled off, and the disassembly and assembly efficiency is low, or after peeling, residual glue will be left on the surface of the adhered object, thus affecting the rework quality of the product; the heat dissipation and cooling performance of the tape is poor, which often damages components and even causes fires, posing a safety hazard.
[0003] In the prior art, patent CN217709295U discloses a thermally conductive protective tape with high and low viscosity functions, including a first release layer, a high viscosity thermally conductive adhesive layer, a thermally reduced viscosity thermally conductive adhesive layer, a low viscosity thermally conductive adhesive layer and a second release layer arranged in sequence from top to bottom. The thermally reduced viscosity thermally conductive adhesive layer is sandwiched between the high viscosity thermally conductive adhesive layer and the low viscosity thermally conductive adhesive layer, which hinders the thermally reduced viscosity thermally conductive adhesive layer from exerting a viscosity reducing effect.
[0004] Therefore, it is necessary to improve the thermal viscosity-reducing adhesive film in the prior art. Utility Model Content
[0005] The purpose of the utility model is to overcome the defects existing in the prior art and provide a heat-reducing and heat-conductive adhesive film, which realizes heat conduction by connecting the high-viscosity adhesive layer and the heat-reducing adhesive through the heat-conducting channel provided in the heat-conductive adhesive layer, thereby achieving the bonding stability and firmness of the adhesive film and the efficiency of the heat-reducing and peeling adhesive film.
[0006] In order to achieve the above technical effects, the technical solution of the utility model is: a heat-reducing and heat-conductive adhesive film, comprising:
[0007] A substrate layer having a first surface and a second surface opposite to each other in a film thickness direction;
[0008] A high-adhesive layer, disposed on the first surface and / or the second surface, having an adhesive surface;
[0009] A heat-conducting adhesive layer, disposed in the high-viscosity adhesive layer, comprising a heat-conducting channel extending to the bonding surface;
[0010] A glue receiving groove, arranged on the bonding surface, having a connection portion connected to the thermally conductive glue layer, and used for receiving the thermally debonding glue;
[0011] The heat-conducting channel is provided with heat-conducting glue.
[0012] A preferred technical solution is that the high-viscosity layer includes a first high-viscosity layer and a second high-viscosity layer, and the thermally conductive adhesive layer includes a thermally conductive core layer sandwiched between the first high-viscosity layer and the second high-viscosity layer, and the thermally conductive core layer penetrates the first high-viscosity layer and the second high-viscosity layer through a thermally conductive channel.
[0013] A preferred technical solution is that the adhesive receiving grooves are distributed in a dotted manner on the bonding surface.
[0014] A preferred technical solution is that the projection contour of the heat conduction channel along the film thickness on the bonding surface is a mesh of interconnected through grooves, or strip-shaped through grooves extending along the first direction, and adjacent strip-shaped through grooves are spaced apart and arranged in parallel.
[0015] The preferred technical solution is that the projected area of the heat conduction channel along the film thickness on the bonding surface accounts for 25% to 35% of the total area of the bonding surface; the projected area of the adhesive receiving groove along the film thickness on the bonding surface accounts for 25% to 35% of the total area of the bonding surface.
[0016] A preferred technical solution is that the materials of the high-viscosity adhesive layer, the thermally conductive adhesive layer and the heat-reducing adhesive are all acrylic adhesive.
[0017] A preferred technical solution is that the material of the substrate layer is PET.
[0018] A preferred technical solution is that the adhesive surface cover is provided with a release film, and the release film is an antistatic release film.
[0019] The advantages and beneficial effects of the utility model are:
[0020] The heat-reducing adhesive film has a reasonable structure, and the substrate layer, the high-viscosity adhesive layer and the thermally conductive adhesive layer are composited to ensure the mechanical strength of the film. The thermal conductive channel provided in the thermally conductive adhesive layer is connected with the high-viscosity adhesive layer and the heat-reducing adhesive to achieve heat conduction, thereby achieving the bonding stability and firmness of the film and the efficiency of the heat-reducing adhesive film peeling. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the single-sided adhesive structure of the heat-reducing and heat-conductive adhesive film of the utility model;
[0022] Figure 2 yes Figure 1 Schematic diagram of the composite adhesive body structure composed of a medium-high viscosity adhesive layer and a thermal conductive adhesive layer;
[0023] Figure 3 yes Figure 1Top view of medium heat reduced viscosity thermally conductive adhesive film;
[0024] Figure 4 yes Figure 1 Another top view of the medium heat reduced viscosity thermally conductive adhesive film;
[0025] Figure 5 It is a schematic diagram of the double-sided adhesive structure of the heat-reducing and heat-conductive adhesive film of the utility model.
[0026] In the figure: 1. substrate layer; 2. high viscosity layer; 3. thermal conductive layer; 4. adhesive receiving groove; 5. release film; 20. bonding surface; 21. first high viscosity layer; 22. second high viscosity layer; 30. thermal conductive core layer; 31. thermal conductive channel; 34. connecting part. DETAILED DESCRIPTION
[0027] The following is a further description of the specific implementation of the present invention in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.
[0028] The “surface” is based on the normal use state of the heat-reducing and thermally conductive adhesive film and is only for the convenience of describing the present invention and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.
[0029] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of the utility model, unless otherwise specified, the meaning of "plurality" is two or more.
[0030] like Figures 1 to 5 As shown, the utility model discloses a heat-reducing and heat-conductive adhesive film, comprising a substrate layer 1, a high-viscosity adhesive layer 2 and a heat-conductive adhesive layer 3, wherein the substrate layer 1 has a first surface and a second surface opposite to each other along a film thickness direction; the high-viscosity adhesive layer 2 is arranged on the first surface and / or the second surface, and has a bonding surface 20; the heat-conductive adhesive layer 3 is arranged in the high-viscosity adhesive layer 2, and comprises a heat-conducting channel 31 extending to the bonding surface 20; a glue accommodating groove 4 is arranged on the bonding surface, and has a connecting portion 34 connected to the heat-conductive adhesive layer 3, and is used to accommodate the heat-reducing and heat-conductive adhesive; the heat-conductive channel 31 is provided with heat-conductive adhesive.
[0031] The thickness of the substrate layer 1 is 20 to 500 um, and the total thickness of the high-viscosity adhesive layer 2 and the thermal conductive adhesive layer 3 is 10 to 1000 um.
[0032] The mechanical properties of the film are improved by setting the substrate layer 1. Furthermore, the material of the substrate layer 1 is polyethylene terephthalate (PET). PET has extremely high tensile strength and good impact resistance, so that it can provide a stable support structure when used as a substrate of the film, and maintain good morphological stability during processing, transportation and use; it has good temperature resistance and can withstand high temperatures of up to about 150°C in a short period of time, and has stable performance at low temperatures and is not easy to become brittle; it also has excellent solvent resistance and corrosion resistance, and has good resistance to a variety of chemicals, ensuring reliability for long-term use under different environmental conditions.
[0033] In order to improve the thermal conductivity efficiency, the thermal conductive adhesive layer 3 is filled with high thermal conductivity fillers, such as aluminum oxide (Al2O3), boron nitride (BN), silicon carbide (SiC), etc. The raw materials of the thermal conductive adhesive layer 3 include 40% to 70% thermal conductive fillers and acrylic glue. The filling of thermal conductive fillers will reduce the viscosity and toughness of the film. Therefore, by setting the high-viscosity adhesive layer 2, not only the bonding firmness is improved, but also the toughness and bending resistance of the film are improved. Furthermore, the raw materials of the high-viscosity adhesive layer 2 include acrylic resin and polyurethane modified acrylic resin. The setting of the heat-conducting channel 31 is conducive to direct contact with the object, not only to quickly conduct the heat dissipation of the object due to the heat, but also to the adhesive film to be heated for viscosity reduction and peeling, reduce the damage of the object to the high temperature, and improve the efficiency of viscosity reduction and peeling.
[0034] The adhesive grooves 31 are distributed in a dotted manner on the bonding surface 20, and the outer contour of the adhesive grooves 31 can be circular or strip-shaped. The raw materials of the thermal conductive adhesive include acrylic resin and expandable microspheres. The expandable microspheres will expand rapidly at a certain temperature, causing the internal volume of the adhesive layer to increase, thereby destroying the continuity and adhesion of the colloid, achieving a viscosity reduction effect.
[0035] The connecting portion 34 refers to the portion where the thermal conductive adhesive and the heat-reducing adhesive are connected. In the process of removing the adhesive film when the object is heated, it can improve the uniformity of heat conduction and dispersion, improve the efficiency of removing the adhesive film from the object, and complete the repair and replacement of the object.
[0036] Among them, the main material of the film is acrylic, which has extremely high initial adhesion and long-lasting retention, and can provide strong adhesion to various material surfaces such as plastic, metal, wood, paper and even some surfaces that are not easy to stick; it has excellent aging resistance, can resist the influence of ultraviolet radiation, humidity changes and extreme temperatures, and can maintain good adhesion performance outdoors and in harsh environmental conditions; it has good resistance to many chemicals, including acid and alkali resistance, oil resistance, solvent resistance and other characteristics, so it shows excellent durability in a variety of industrial applications; it can be used in a wide temperature range, such as -30℃ to 150℃, and can still maintain stable adhesion performance and physical properties within this range. Therefore, when the film's viscosity reduction temperature is not reached, there is local overheating during use. Heat dissipation through the thermal conductive adhesive layer not only reduces the risk of heat damage to the object, but also maintains the stability of the film's bonding and fixation.
[0037] like Figure 1 As shown, in some embodiments, the high-adhesion adhesive layer 2 is disposed on the first surface or the second surface, and the adhesive film is a single-sided adhesive.
[0038] like Figure 5 As shown, in some embodiments, the high-viscosity adhesive layer is disposed on the first surface and the second surface, and the adhesive film is a double-sided adhesive. If the substrate layer 1 is a thermally conductive substrate layer, heat conduction is achieved along the film thickness direction; if the substrate layer 1 does not have thermal conductivity, heat conduction is achieved along the film spreading direction through the thermally conductive adhesive layer.
[0039] like Figure 2 As shown, the high-viscosity layer 2 includes a first high-viscosity layer 21 and a second high-viscosity layer 22, and the thermally conductive adhesive layer 3 includes a thermally conductive core layer 30 sandwiched between the first high-viscosity layer 21 and the second high-viscosity layer 22, and the thermally conductive core layer 30 penetrates the first high-viscosity layer 21 and the second high-viscosity layer 22 through a thermally conductive channel 31. The thermally conductive adhesive layer 3 is obtained by coating a thermally conductive adhesive liquid on a release film with a concave-convex surface and curing it to obtain a unit thermally conductive core layer with a convex portion, and then combining the surfaces of the two unit thermally conductive core layers away from the convex portion to form a thermally conductive adhesive layer 3 with convex portions on both sides; similarly, the first high-viscosity layer 21 or the second high-viscosity layer 22 with a concave portion is obtained by coating a high-viscosity adhesive liquid on a release film with a concave-convex surface and curing it; then the first high-viscosity layer 21 and the second high-viscosity layer 22 are matched with the thermally conductive adhesive layer 3 in a concave-convex manner to obtain a composite adhesive embryo. Among them, the concave-convex matching surface of the first high-viscosity adhesive layer 21 and the thermally conductive adhesive layer 3 is a bonding surface 20, the bottom area of the concave part of the first high-viscosity adhesive layer 21 is larger than the top area of the convex part of the thermally conductive adhesive layer 3, and a glue receiving groove 4 is arranged between the two; similarly, a heat-reducing viscosity-reducing adhesive layer with a concave part is obtained by coating a heat-reducing viscosity-reducing adhesive liquid on a release film with a concave-convex surface and curing it, and the heat-reducing viscosity-reducing adhesive layer is then matched with the concave-convex receiving groove 4 of the composite adhesive embryo body obtained above, and a heat-reducing viscosity-reducing thermally conductive adhesive film is obtained.
[0040] like Figures 2-3 As shown, the raised portion is a heat conduction channel 31, and the projection contour of the heat conduction channel 31 along the film thickness on the bonding surface 20 is a mesh-shaped and interconnected through groove, or a strip-shaped through groove extending along the first direction, and adjacent strip-shaped through grooves are spaced and arranged in parallel. Further, the projection area of the heat conduction channel 31 along the film thickness on the bonding surface 20 accounts for 25% to 35% of the total area of the bonding surface 20; the projection area of the adhesive groove 4 along the film thickness on the bonding surface 20 accounts for 25% to 35% of the total area of the bonding surface 20. The first direction is an arbitrary direction.
[0041] The adhesive surface 20 is covered with a release film 5. In order to prevent the release film 5 from absorbing dust due to static electricity when being peeled off, which results in poor adhesive performance of the adhesive film, the release film 5 is an antistatic release film.
[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A heat-reducing and heat-conductive adhesive film, characterized in that: include, A substrate layer having a first surface and a second surface opposite to each other in a film thickness direction; A high-adhesive layer, disposed on the first surface and / or the second surface, having an adhesive surface; A heat-conducting adhesive layer, disposed in the high-viscosity adhesive layer, comprising a heat-conducting channel extending to the bonding surface; A glue receiving groove, arranged on the bonding surface, having a connection portion connected to the thermally conductive glue layer, and used for receiving the thermally debonding glue; The heat-conducting channel is provided with heat-conducting glue.
2. The heat-reducing and heat-conductive adhesive film according to claim 1, characterized in that: The high-viscosity layer includes a first high-viscosity layer and a second high-viscosity layer, and the thermally conductive layer includes a thermally conductive core layer sandwiched between the first high-viscosity layer and the second high-viscosity layer, and the thermally conductive core layer penetrates the first high-viscosity layer and the second high-viscosity layer through a thermally conductive channel.
3. The heat-reducing and heat-conductive adhesive film according to claim 2, characterized in that: The adhesive receiving grooves are distributed in a dotted manner on the bonding surface.
4. The heat-reducing and heat-conductive adhesive film according to claim 2, characterized in that: The projection contour of the heat conduction channel along the film thickness on the bonding surface is a mesh-shaped and interconnected through grooves, or a strip-shaped through grooves extending along the first direction, and adjacent strip-shaped through grooves are spaced apart and arranged in parallel.
5. The heat-reducing and heat-conductive adhesive film according to claim 2, characterized in that: The projected area of the heat conduction channel along the film thickness on the bonding surface accounts for 25% to 35% of the total area of the bonding surface; the projected area of the adhesive receiving groove along the film thickness on the bonding surface accounts for 25% to 35% of the total area of the bonding surface.
6. The heat-reducing and heat-conductive adhesive film according to claim 1, characterized in that: The materials of the high-viscosity adhesive layer, the thermal conductive adhesive layer and the thermally-reduced viscosity adhesive are all acrylic adhesive.
7. The heat-reducing and heat-conductive adhesive film according to claim 1, characterized in that: The material of the substrate layer is PET.
8. The heat-reducing and heat-conductive adhesive film according to claim 1, characterized in that: The adhesive surface cover is provided with a release film, and the release film is an antistatic release film.