Sputtering machine table sheet clamp capable of improving uniformity of chip metal
By designing a beveled surface fixing ring in the sputtering machine clip, the shielding area on the silicon wafer is reduced, and the problem of poor uniformity of metal films in the prior art is solved, and better uniformity of metal films is achieved.
Patent Information
- Application Number
- CN202420765314.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-15
AI Technical Summary
The side walls of the upper clamp of the existing sputtering machine clips are thicker, which causes some silicon wafer sputtering areas to be blocked when sputtering the metal film, resulting in poor uniformity of the metal film.
A clip consisting of a base plate, a fixing plate, a support column, a mounting base, a positioning rod, a rotating groove, a fixing ring and a limiting ring is designed. The beveled surface design of the fixing ring reduces the shading area of the silicon wafer, making the metal thin film The sputtering is more even.
By reducing the shielding area of the fixed ring on the silicon wafer, the uniformity of the metal film sputtered out of the silicon wafer is improved and the quality of the chip metal film is improved.
Smart Images
Figure CN222313269U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sputtering machines, in particular to a table chip clamp for a sputtering machine which can improve the metal uniformity of a chip. Background Art
[0002] In semiconductor manufacturing, sputtering is required to make metal films on chips. The equipment used is a sputtering machine. The structure used by the sputtering machine to clamp the chip is called a chip clamp, which is used to clamp the chip for transmission and sputtering.
[0003] The commonly used sputtering machine wafer clamps now include an upper clamp and a lower clamp. The lower clamp is provided with a fixing structure for fixing the silicon wafer, and the fixing structure is connected to the upper clamp. The silicon wafer is placed on the upper clamp, and the fixing mechanism is started. The fixing mechanism fixes the silicon wafer. A circular hole for sputtering is opened on the upper clamp, and the size of the circular hole is consistent with the size of the area of the silicon wafer to be sputtered.
[0004] Regarding the above technical conditions, there is still a problem that the side wall of the circular hole in the upper clamp of the current sputtering machine is relatively thick. When sputtering the metal film, the side wall of the circular hole will block part of the sputtering area of the silicon wafer, resulting in the defect that the uniformity of the metal film sputtered from the silicon wafer is not good enough.
[0005] Based on this, the utility model designs a chip holder for a sputtering machine which can improve the metal uniformity of a chip to solve the above-mentioned problem. Utility Model Content
[0006] The utility model aims to provide a chip holder for a sputtering machine which can improve the uniformity of chip metal so as to solve the above technical problems.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a film clamp for a sputtering machine that can improve the metal uniformity of a chip, comprising a film clamp of a sputtering machine, the film clamp comprising a base plate and a fixed plate, a support column is fixedly arranged on the base plate, the fixed plate is fixedly connected to the support column, a mounting seat is arranged on the base plate, a positioning rod is rotatably arranged on the mounting seat, a rotating groove is provided on the fixed plate, the positioning rod is located in the rotating groove, a fixing ring is fixedly connected to the base plate, the fixing ring is integrally formed with the base plate, and a chamfer is arranged on the side of the fixing ring away from the fixing plate.
[0008] Preferably, the cross section of the fixing ring is a right-angled trapezoid, and the cross section of the fixing ring includes a hypotenuse, a short side, a long side and a straight side, and the hypotenuse is a chamfered surface provided on the fixing ring.
[0009] Preferably, the short side is 0.5 mm long.
[0010] Preferably, the straight side is 6.5 mm long.
[0011] Preferably, the long side is 3 mm long.
[0012] Preferably, the included angle between the hypotenuse and the straight edge is 21°.
[0013] Preferably, a limiting ring is fixedly provided on one side of the bottom plate close to the fixing plate, and the limiting ring is between the positioning rod and the bottom plate.
[0014] Preferably, a buffer layer is fixedly provided on the positioning rod.
[0015] In summary, the present application has the following beneficial technical effects: when the wafer clamp of the sputtering machine clamps the silicon wafer for sputtering, the silicon wafer is placed in the limit ring from one side of the fixed plate, the silicon wafer contacts the bottom plate, and the positioning rod is rotated. The positioning rod stabilizes the silicon wafer on the bottom plate. At this time, the opening size of the bottom plate fixing ring is the size of the silicon wafer area to be sputtered. Because a beveled surface is provided on the side of the fixing ring away from the fixed plate, when the metal film is sputtered on the silicon wafer, the blocking area of the silicon wafer by the fixing ring is smaller, and the uniformity of the metal film sputtered from the silicon wafer is better, thereby achieving the effect of improving the uniformity of the metal film sputtered on the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 Schematic diagram of the structure of the sheet clip of this embodiment;
[0018] Figure 2 Schematic diagram of the structure of the sheet clip of this embodiment;
[0019] Figure 3 Schematic diagram of the installation structure of the sheet clip of this embodiment;
[0020] Figure 4 Schematic diagram of the cross-sectional structure of the sheet clip of this embodiment;
[0021] Figure 5 Schematic diagram of the cross-sectional structure of the fixing ring of this embodiment.
[0022] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0023] 1. Positioning rod; 2. Fixing ring; 3. Fixing plate; 4. Rotating groove; 5. Bottom plate; 6. Mounting seat; 7. Limiting ring; 8. Support column; 9. Straight edge; 10. Short edge; 11. Bevel edge; 12. Long edge; 13. Buffer layer. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] The following is combined with Figure 1-5 This application is described in further detail.
[0026] A film clamp for a sputtering machine capable of improving the metal uniformity of a chip includes a film clamp for the sputtering machine, the film clamp includes a base plate 5 and a fixed plate 3, a support column 8 is fixedly arranged on the base plate 5, a plurality of support columns 8 are arranged on the base plate 5, the fixed plate 3 is fixedly arranged on the support column 8, and the support column 8 is between the base plate 5 and the fixed plate 3.
[0027] A mounting seat 6 is provided on one side of the bottom plate 5 close to the fixed plate 3. A plurality of mounting seats 6 are provided on the bottom plate 5. A positioning rod 1 is rotatably provided on the mounting seat 6. A rotating groove 4 is provided on the fixed plate 3. The positioning rod 1 is located in the rotating groove 4. A fixing ring 2 is fixedly connected to the bottom plate 5. The fixing ring 2 is integrally formed with the bottom plate 5. A chamfered surface is provided on the side of the fixing ring 2 away from the fixed plate 3.
[0028] The cross section of the fixing ring 2 is a right-angled trapezoid, and the cross section of the fixing ring 2 includes a hypotenuse 11, a straight side 9, a short side 10 and a long side 12. The hypotenuse 11 is the chamfered surface of the fixing ring 2, the straight side 9 is the side of the fixing ring 2 close to the fixing plate 3, the short side 10 is the side of the fixing ring 2 away from the bottom plate 5, and the long side 12 is the side of the fixing ring 2 close to the bottom plate 5. The short side 10 is 0.5 mm long, the straight side 9 is 6.5 mm long, the long side 12 is 3 mm long, and the angle between the hypotenuse 11 and the straight side 9 is 21°.
[0029] A limit ring 7 is fixedly provided on one side of the base plate 5 close to the fixed plate 3, and the limit ring 7 is between the positioning rod 1 and the base plate 5. The wafer clamp is set on the sputtering machine platform, and the robot on the platform clamps the silicon wafer and places it in the limit ring 7, and the limit ring 7 plays a limiting role.
[0030] A buffer layer 13 is fixedly provided on one side of the positioning rod 1 close to the bottom plate 5. When the ghost chip is located in the limiting ring 7, the positioning rod 1 is rotated and pressed against the silicon chip. The buffer layer 13 protects the silicon chip and prevents the silicon chip from being damaged by the positioning rod 1.
[0031] The implementation principle of this embodiment is: when the wafer clamp of the sputtering machine clamps the silicon wafer for sputtering, the silicon wafer is placed in the limiting ring 7 from one side of the fixed plate 3, the silicon wafer contacts the bottom plate 5, and the positioning rod 1 is rotated. The positioning rod 1 stabilizes the silicon wafer on the bottom plate 5. At this time, the opening size of the fixed ring 2 of the bottom plate 5 is the size of the area to be sputtered of the silicon wafer. Because a chamfered surface is provided on the side of the fixed ring 2 away from the fixed plate 3, when the metal film is sputtered on the silicon wafer, the shielding area of the fixed ring 2 on the silicon wafer is smaller, and the uniformity of the metal film sputtered from the silicon wafer is better, thereby achieving the effect of improving the uniformity of the metal film sputtered on the silicon wafer.
[0032] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0033] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.
[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A sputtering machine chip holder capable of improving chip metal uniformity, comprising a sputtering machine chip holder, characterized in that: The sheet clamp comprises a base plate (5) and a fixed plate (3), a support column (8) being fixedly arranged on the base plate (5), the fixed plate (3) being fixedly connected to the support column (8), a mounting seat (6) being arranged on the base plate (5), a positioning rod (1) being rotatably arranged on the mounting seat (6), a rotation groove (4) being provided on the fixed plate (3), the positioning rod (1) being located in the rotation groove (4), a fixing ring (2) being fixedly connected to the base plate (5), the fixing ring (2) being integrally formed with the base plate (5), and a chamfered surface being arranged on a side of the fixing ring (2) away from the fixing plate (3).
2. The chip holder for a sputtering machine capable of improving the metal uniformity of a chip according to claim 1, characterized in that: The cross section of the fixing ring (2) is a right-angled trapezoid, and the cross section of the fixing ring (2) comprises a hypotenuse (11), a short side (10), a long side (12) and a straight side (9), and the hypotenuse (11) is a chamfered surface provided on the fixing ring (2).
3. The chip holder for a sputtering machine capable of improving the metal uniformity of a chip according to claim 2, characterized in that: The short side (10) is 0.5 mm long.
4. The chip holder for a sputtering machine capable of improving the uniformity of chip metal according to claim 2, characterized in that: The straight edge (9) is 6.5 mm long.
5. The chip holder for a sputtering machine capable of improving the uniformity of chip metal according to claim 2, characterized in that: The long side (12) is 3 mm long.
6. The chip holder for a sputtering machine capable of improving the metal uniformity of a chip according to claim 2, characterized in that: The included angle between the oblique edge (11) and the straight edge (9) is 21°.
7. The chip holder for a sputtering machine capable of improving the uniformity of chip metal according to claim 1, characterized in that: A limiting ring (7) is fixedly provided on one side of the bottom plate (5) close to the fixing plate (3), and the limiting ring (7) is between the positioning rod (1) and the bottom plate (5).
8. The chip holder for a sputtering machine capable of improving the metal uniformity of a chip according to claim 1, characterized in that: A buffer layer (13) is fixedly arranged on the positioning rod (1).