Extremely-cold-resistant high-reliability neon lamp strip

Abstract

The utility model discloses a neon lamp strip with extremely cold resistance and high reliability. The neon lamp strip comprises a flexible circuit board; the plurality of lamp beads are arranged on the flexible circuit board, and chips of the lamp beads are packaged by adopting a CSP (Chip Scale Package) technology and / or welded on the flexible circuit board in an inverted manner; and the wrapping belt wraps the periphery of the flexible circuit board. According to the neon lamp strip, the plurality of lamp beads are arranged on the flexible circuit board, the chips of the lamp beads are packaged by adopting the CSP technology, and / or the chips are pasted and welded on the flexible circuit board in an inverted mode, and the wrapping strip is arranged to wrap the periphery of the flexible circuit board, so that the application failure rate of the neon lamp strip in an extremely cold environment can be reduced, and the reliability of the neon lamp strip is improved. The reliability of the neon lamp strip in an extremely cold environment can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lamps, in particular to an extreme cold-resistant and high-reliability neon light strip. Background Art

[0002] For conventional neon light strips, the current main application scenarios are indoor places or warm outdoor environments, etc., and they are rarely used in outdoor extremely cold environments. This is because conventional neon light strips are generally prone to high failure rates in outdoor extremely cold environments. The main reason for the high failure rate is that the physical properties of the materials of conventional neon light strips are prone to change under extremely cold conditions, which can cause the components or materials of the neon light strips to fail. For example, in extremely cold environments, the lamp bead brackets and component solder joints of conventional neon light strips will become brittle, making it easier for the neon light strips to break due to stress during installation and construction, resulting in problems such as loose solder joints, poor contact or lamp beads not lighting up.

[0003] Therefore, how to reduce the failure rate of neon light strips in extremely cold environments and improve the reliability of neon light strips in extremely cold environments is a problem to be solved by those skilled in the art. Utility Model Content

[0004] The embodiment of the utility model provides a neon light strip that is extremely cold-resistant and highly reliable, aiming to solve the problems of high failure rate and low reliability of the neon light strip in an extremely cold environment.

[0005] The utility model provides a neon light strip with extreme cold resistance and high reliability, which is characterized by comprising:

[0006] Flexible circuit boards;

[0007] A plurality of lamp beads are arranged on the flexible circuit board, and the chips of the lamp beads are packaged by using CSP technology and / or are soldered on the flexible circuit board by using flip chip method;

[0008] The covering tape is covered around the four sides of the flexible circuit board.

[0009] Preferably, the lamp beads are single-color lamp beads or multi-color lamp beads;

[0010] The monochromatic lamp bead is provided with a chip capable of emitting a single color of light, and the multicolor lamp bead is provided with a chip capable of emitting a plurality of different colors of light.

[0011] Preferably, the covering tape comprises a diffusion layer for guiding light, a light blocking layer for blocking light, and a transparent layer for disassembly and assembly;

[0012] The diffusion layer, the light blocking layer and the transparent layer are surrounded on all sides of the flexible circuit board.

[0013] Preferably, the diffusion layer is arranged in any one or more light emitting directions of the lamp beads, the transparent layer is arranged below the flexible circuit board, and the light blocking layer is arranged between the diffusion layer and the transparent layer.

[0014] Preferably, the lamp bead includes a latex layer formed by a dispensing process.

[0015] Preferably, a protection strip is provided on the back side of the flexible circuit board, and the protection strip and the flexible circuit board are arranged in the covering tape through co-extrusion processing.

[0016] Preferably, the diffusion layer, the light blocking layer and the transparent layer are all formed by silicone extrusion.

[0017] Preferably, waterproof male and female wires are welded at both ends of the flexible circuit board, and both ends of the covering tape and both ends of the flexible circuit board are sealed with hot-pressed plugs.

[0018] Preferably, a control component electrically connected to the lamp bead is also provided on the flexible circuit board for controlling the lamp bead to emit light.

[0019] Preferably, the control component includes a control chip, and resistors and / or capacitors electrically connected to the control chip and the lamp beads respectively, and each of the plurality of lamp beads is provided with the resistors and / or capacitors.

[0020] The utility model embodiment discloses a neon light strip with high reliability and extreme cold resistance, comprising: a flexible circuit board; a plurality of lamp beads, arranged on the flexible circuit board, the chips of the lamp beads are packaged by CSP technology, and / or are soldered on the flexible circuit board by flip-chip method; a covering tape, which is wrapped around the flexible circuit board. The utility model embodiment can reduce the failure rate of the neon light strip in an extremely cold environment and improve the reliability of the neon light strip in an extremely cold environment by arranging a plurality of lamp beads on the flexible circuit board, and encapsulating the chips of the lamp beads by CSP technology, and / or soldering the chips on the flexible circuit board by flip-chip method, and arranging the covering tape to wrap around the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of a neon light strip with extreme cold resistance and high reliability provided by an embodiment of the utility model;

[0023] Figure 2 A schematic diagram of the structure of a flexible circuit board in a neon light strip with extreme cold resistance and high reliability provided by an embodiment of the utility model;

[0024] Figure 3 An example diagram of a lamp bead in a neon light strip with extreme cold resistance and high reliability provided by an embodiment of the utility model;

[0025] Figure 4 Another structural schematic diagram of an extreme cold-resistant and highly reliable neon light strip provided by an embodiment of the utility model;

[0026] Figure 5 An example diagram of an extreme cold-resistant and highly reliable neon light strip provided by an embodiment of the utility model;

[0027] Figure 6 Another example diagram of an extreme cold-resistant and highly reliable neon light strip provided by an embodiment of the utility model;

[0028] Figure 7 This is another example diagram of an extreme cold-resistant and highly reliable neon light strip provided in an embodiment of the utility model.

[0029] Markings in the figure: 10, flexible circuit board; 20, lamp bead; 30, covering tape; 31, diffusion layer; 311, light-emitting surface; 32, light-blocking layer; 33, transparent layer; 40, protective strip; 50, control component; 51, control chip; 52, resistor; 53, capacitor; 60, plug. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0032] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0033] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0034] See below Figure 1 and Figure 2 The present utility model provides an extremely cold-resistant and highly reliable neon light strip, which specifically includes:

[0035] Flexible circuit board 10;

[0036] A plurality of lamp beads 20 are arranged on the flexible circuit board 10, and the chips 21 of the lamp beads 20 are packaged by CSP technology and / or are soldered on the flexible circuit board 10 by flip chip method;

[0037] The covering tape 30 covers the four sides of the flexible circuit board 10 .

[0038] In this embodiment, a covering tape 30 is provided to cover the flexible circuit board 10, and a plurality of lamp beads 20 are provided on the flexible circuit board 10. The chip 21 in the lamp bead 20 can be packaged and soldered based on CSP technology and flip-chip method. For example, the chip 21 is first packaged using CSP (Chip Scale Package) technology, and then flip-chip soldered to the flexible circuit board 10. For another example, only CSP technology is used to package the chip 21, and then it is soldered to the flexible circuit board 10. For another example, any packaging method is used to package the chip 21, and then the chip 21 is flip-chip soldered to the flexible circuit board 10.

[0039] Compared with the prior art, the present embodiment can effectively reduce the failure rate of neon light strips in extremely cold environments and improve the reliability of neon light strips in extremely cold environments. For example, conventional neon light strips are often packaged using SMD (Surface Mounted Devices) technology, and the lamp bead chip is installed in the lamp bead bracket, and then the chip and the circuit board are connected through metal wires. However, when the lamp beads packaged with SMD technology work in an extremely cold environment, the high temperature generated by the operation of the lamp beads and the low temperature of the environment will cause the chip to be constantly impacted by alternating hot and cold, which will cause the metal wires of the chip to break easily, thereby causing the lamp beads to fail. In the present embodiment, after the chip 21 is packaged using CSP technology, the size of the chip 21 is smaller and the structure is more compact, so that the lamp bead 20 can better resist the mechanical stress caused by alternating hot and cold, thereby improving the weather resistance and resistance to hot and cold shocks of the lamp bead 20. At the same time, the present embodiment adopts Flip chip technology, and directly solders the chip 21 on the flexible circuit board 10 by flipping, without connecting the chip 21 and the flexible circuit board 10 by metal wires, which can not only avoid the damage of the metal wires caused by the cold and hot shocks and cause the failure of the lamp beads 20, but also effectively reduce the thermal resistance and improve the heat dissipation effect. In addition, when the prior art uses SMD technology to package the neon light strip, it is necessary to set a silver plating layer on the lamp bead bracket, and if the silver plating layer encounters sulfides in the air, it will produce a sulfide reaction, thereby causing the lamp beads to turn black and cause the lamp beads to fail. In the present embodiment, the chip 21 is directly soldered on the flexible circuit board 10 by flipping, avoiding the setting of the silver plating layer on the flexible circuit board 10, which correspondingly avoids the phenomenon of the lamp beads 20 turning black due to sulfide.

[0040] In specific application scenarios, in scenarios where only high requirements are placed on the packaging size, only CSP technology can be used to package the chip 21 of the lamp bead 20, that is, only CSP technology is used to package the chip 21, and then it is soldered on the flexible circuit board 10; and in scenarios where only high requirements are placed on the heat dissipation performance, only flip-chip soldering can be used on the flexible circuit board 10, that is, any packaging method is used to package the chip 21, and then the chip 21 is flip-chip soldered on the flexible circuit board 10; if there are certain requirements for both packaging size and heat dissipation performance, both settings can be used at the same time, that is, first use CSP technology for packaging, and then use flip-chip soldering on the flexible circuit board 10.

[0041] In one embodiment, the lamp bead 20 is a single-color lamp bead or a multi-color lamp bead;

[0042] The monochromatic lamp bead is provided with a chip 21 capable of emitting a single color of light, and the multicolor lamp bead is provided with a chip 21 capable of emitting a plurality of different colors of light.

[0043] In this embodiment, the lamp beads 20 can be divided into monochromatic lamp beads and multicolor lamp beads according to the different chips 21 they contain. Among them, the monochromatic lamp beads refer to the lamp beads provided with chips 21 that can emit a single color of light, and the multicolor lamp beads refer to the lamp beads provided with chips 21 that can emit multiple different colors of light. For example Figure 3 As shown, there is one chip 21 in the monochromatic lamp bead. For example, a chip 21 that can emit red light is provided, so that the monochromatic lamp bead is a lamp bead that can emit red light; there are two chips 21 in the two-color lamp bead. For example, a red chip and a green chip are provided, so that the two-color lamp bead is a lamp bead that can emit red light and green light. In addition, more different-color chips 21 can be provided, and the lamp beads 20 can emit the colors required by users through the mixing of each different-color chip 21. For example, by setting chips 21 of three colors, red, green, and blue, an RGB lamp bead is obtained. Preferably, by adjusting the brightness of the three colors and mixing the light of red, green, and blue, the RGB lamp bead can emit almost all colors of light. Further, chips 21 of four colors, red, green, blue, and white, can be provided to obtain an RGBW lamp bead. In this way, on the basis of the RGB lamp bead, the white lamp bead can be used to improve the light efficiency and brightness.

[0044] In a specific application scenario, different chip arrangement methods can be set according to the number of chips 21 in the lamp beads 20 to achieve a more uniform light-emitting effect. For example Figure 3 As shown, since there is only one chip 21 in the monochromatic lamp bead, the chip 21 can be set at the middle position of the monochromatic lamp bead; since there are two chips 21 in the two-color lamp bead, the two chips 21 can be arranged side by side on the horizontal central axis or the vertical central axis of the two-color lamp bead; since there are three chips 21 in the RGB lamp bead, the three chips 21 can be arranged in a "pin" shape and evenly distributed at the middle position of the RGB lamp bead; since there are four chips 21 in the RGBW lamp bead, the four chips 21 can be arranged in two pairs side by side and set at the middle position of the RGBW lamp bead.

[0045] In one embodiment, the lamp bead 20 includes a latex layer formed by a dispensing process.

[0046] In this embodiment, the lamp bead 20 includes a latex layer formed by a dispensing process, which can achieve the effect of uniformly mixing the light emitted by the chip 21, and can also protect the chip 21 in the lamp bead 20 from being damaged. Specifically, the latex layer is formed by dropping a small drop of milky white diffusing colloid above the chip 21 by dotting, and then heating and curing it so that the milky white diffusing colloid completely covers the chip 21.

[0047] In one embodiment, a control component 50 electrically connected to the lamp bead 20 is further provided on the flexible circuit board 10 for controlling the lamp bead 20 to emit light.

[0048] Furthermore, the control component 50 includes a control chip 51, and a resistor 52 and / or a capacitor 53 electrically connected to the control chip 51 and the lamp bead 20 respectively, and each of the plurality of lamp beads 20 is provided with the resistor 52 and / or the capacitor 53 accordingly.

[0049] In this embodiment, a control component 50 is provided on the flexible circuit board 10, and the control component 50 is electrically connected to the lamp bead 20, so as to control the lamp bead 20 to emit light through the control component 50. Specifically, the control component 50 includes a control chip 51, a resistor 52 and / or a capacitor 53, and the control chip 51, the resistor 52 and the capacitor 53 are all electrically connected to the lamp bead 20, so that the control chip 51 can be used to control the resistor 52, such as adjusting the value of the resistor 52 to change the current size of the chip 21, thereby adjusting the brightness of the chip 21, and the capacitor 53 is used to reduce circuit noise and suppress electromagnetic interference, so as to ensure the stability of the chip 21.

[0050] The number and arrangement positions of the resistors 52 and capacitors 53 can be selected and set according to actual conditions. Figure 2 As shown, the flexible circuit board 10 is provided with lamp beads 20, control chips 51, resistors 52 and capacitors 53 at the same time, and there are multiple lamp beads 20, resistors 52 and capacitors 53. The lamp beads 20 and resistors 52 or capacitors 53 can be alternately arranged on the flexible circuit board 10, two resistors 52 can be arranged on the side of the lamp beads 20, and one resistor 52 and one capacitor 53 can be arranged between two lamp beads 20, and so on.

[0051] In addition, if Figure 2 As shown, in actual applications, the two ends of the flexible circuit board 10 are also provided with other functional connection points, such as a 24V power supply positive connection point (24 + ), negative wiring point (GND), differential positive signal wiring point (A), differential signal negative wiring point (B) and address line wiring point (PI).

[0052] In one embodiment, the covering tape 30 includes a diffusion layer 31 for guiding light, a light blocking layer 32 for blocking light, and a transparent layer 33 for disassembly and assembly;

[0053] The diffusion layer 31 , the light blocking layer 32 and the transparent layer 33 surround the four sides of the flexible circuit board 10 .

[0054] Preferably, the diffusion layer 31 is disposed in any one or more light emitting directions of the lamp bead 20 , the transparent layer 33 is disposed below the flexible circuit board 10 , and the light blocking layer 32 is disposed between the diffusion layer 31 and the transparent layer 33 .

[0055] In this embodiment, the covering tape 30 includes a diffusion layer 31, a light blocking layer 32 and a transparent layer 33, and these three parts are covered around the flexible circuit board 10. Figure 1 and Figure 2 The lamp bead 20 is a hemispherical structure, that is, the lamp bead 20 emits light in multiple directions along the hemispherical shape, and the diffusion layer 31 is arranged in any one or multiple light emitting directions of the lamp bead 20, for example, Figure 1 In the embodiment, the diffusion layer 31 is arranged in the light emitting direction just above the lamp bead 20, and the light emitted by the lamp bead 20 enters from one side of the diffusion layer 31 along the light emitting direction, and then the diffusion layer 31 diffuses and mixes the light emitted by the lamp bead 20 and guides it to the other side of the diffusion layer 31 for light emission. Here, in this embodiment, the light emitting side of the diffusion layer 31 is set as the light emitting surface of the neon light strip (the light emitting surface is marked as 311 here); the transparent layer 33 is arranged below the flexible circuit board 10, specifically, as shown in FIG. Figure 1 As shown, the transparent layer 33 is located directly below the lamp bead 20, and is used to observe the position of the flexible circuit board 10 based on the transparent layer 33 when the neon light strip needs to be disassembled or cut, thereby facilitating the disassembly or cutting; the light-blocking layer 32 is arranged between the diffusion layer 31 and the transparent layer 33, and is used to block the light directed to other directions except the light-emitting surface 311, so that it cannot be emitted from the light-blocking layer 32, ensuring that the neon light strip does not emit light at the position of the light-blocking layer 32 but only emits light at the position of the light-emitting surface 311 of the diffusion layer 31.

[0056] In a specific embodiment, one or more light emitting surfaces 311 may be provided. When only one light emitting surface 311 is provided, the neon light strip may be divided into two types: top bend and side bend according to the different setting positions of the diffusion layer 31 in the covering strip 30. Figure 1 As shown, in the top-bend type neon light strip, the light-emitting surface 311 is directly opposite to the lamp bead 20. At this time, the neon light strip will bend in the opposite direction of the diffusion layer 31 along the surface where the transparent layer 33 is located, so that the diffusion layer 31 is in an arc top shape, which is a top bend; Figure 4 As shown, in the side-bending type neon light strip, the light-emitting surface 311 is perpendicular to the surface of the flexible circuit board 10 to which the lamp beads 20 are soldered. At this time, the neon light strip will also bend along the surface where the transparent layer 33 is located, but the bending direction is toward the surface perpendicular to the light-emitting surface 311, which is a side bend. It should be noted that even if the neon light strip has multiple light-emitting surfaces 311, the neon light strip is still bent along the surface where the transparent layer 33 is located.

[0057] In one embodiment, a protection strip 40 is disposed on the back of the flexible circuit board 10 , and the protection strip 40 and the flexible circuit board 10 are arranged in the covering tape 30 by co-extrusion.

[0058] In this embodiment, a protective strip 40 is provided on the back of the flexible circuit board 10. The protective strip 40 and the flexible circuit board 10 are arranged together in the covering tape 30 in a coaxial co-extrusion process, so that the protective strip 40 can be used to prevent the flexible circuit board 10 from being pulled or twisted off by external forces during the installation process or the practical process. The protective strip 40 can improve the anti-twisting and anti-stretching properties of the neon light strip. Specifically, the protective strip 40 can be made of PC (polycarbonate). The flexibility and strength of the protective strip 40 made of PC material are higher than those of the flexible circuit board 10. By setting the protective strip 40 on one side of the flexible circuit board 10, the anti-twisting and anti-stretching properties of the neon light strip can be improved. Of course, the material of the protective strip 40 is not limited to PC material, and other materials with better anti-twisting and anti-stretching properties can also be used.

[0059] Preferably, the diffusion layer 31, the light blocking layer 32 and the transparent layer 33 are all formed by silicone extrusion.

[0060] In this embodiment, the diffusion layer 31 , the light blocking layer 32 and the transparent layer 33 in the covering tape 30 are all formed by extrusion of silicone.

[0061] In a specific application scenario, the coating tape 30 is extruded by a mold, and the mold is provided with three extrusion ports. The shapes corresponding to the three extrusion ports and the input materials are all different. The three extrusion ports extrude the diffusion layer 31, the light-blocking layer 32 and the transparent layer 33 respectively, and then the diffusion layer 31, the light-blocking layer 32 and the transparent layer 33 are surrounded to form the coating tape 30. Among them, the shapes corresponding to the three extrusion ports are set according to the actual space requirements of the coating tape 30. The basic materials of the diffusion layer 31, the light-blocking layer 32 and the transparent layer 33 are all transparent silicone, and the transparent layer 33 is extruded from the transparent silicone, and then color powder is added to the silicone to achieve the color required for the light-blocking layer 32, and the light-blocking layer 32 is extruded, or diffusion powder is added to the silicone to achieve the diffusion and light mixing requirements of the diffusion layer 31, and the diffusion layer 31 is extruded, so that the diffusion layer 31 can also mix the light to make the light more uniform. In other embodiments, the corresponding diffusion layer 31, the light-blocking layer 32 and the transparent layer 33 can also be produced by other materials that can achieve the same effect, and are not limited to silicone. In addition, in a specific production scenario, the flexible circuit board 10 and the protection strip 40 are placed flat and then co-extruded with the covering tape 30 through a mold.

[0062] Combination Figure 5 to Figure 7 As shown, in one embodiment, waterproof male and female wires are welded at both ends of the flexible circuit board 10 , and both ends of the covering tape 30 and both ends of the flexible circuit board 10 are sealed with hot-pressed plugs 60 .

[0063] In this embodiment, waterproof male and female wires are welded at both ends of the flexible circuit board 10, and the power supply of the flexible circuit board 10 is achieved through the waterproof male and female wires. At the same time, the covering tape 30 and the two ends of the flexible circuit board 10 are sealed by hot-pressing the plugs 60, which are directly wrapped around the two ends of the covering tape 30 and the flexible circuit board 10 through a mold, and the plugs 60 are obtained by hot-pressing the material to achieve sealing.

[0064] In actual application scenarios, the wiring methods at both ends of the neon light strip can be set according to different installation requirements, such as Figure 5 As shown, the outlet mode of the two ends of the neon light strip can be set to top outlet, that is, the outlet direction and the neon light strip are on the same horizontal line; for example Figure 6 As shown, the wire outlets at both ends of the neon light strip can also be set to bottom outlets, with the outlet direction being opposite to the direction of the light-emitting surface 311; or as shown in FIG. Figure 7 As shown, the wire outlets at both ends of the neon strip can also be set as side outlets, that is, the wire outlet direction is perpendicular to the direction of the light-emitting surface 311 and is also perpendicular to the horizontal line where the neon strip is located. In addition, in the actual production process, the external wiring and the end of the flexible circuit board 10 need to be connected first, and then the coating tape 30 is extruded by the mold to cover the outside of the flexible circuit board 10, and the plug 60 is hot-pressed to seal it, so the coating tape 30 and the plug 60 are both formed with wiring holes for external wiring.

[0065] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

[0066] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

Claims

1. A neon light strip with extreme cold resistance and high reliability, characterized in that: include: Flexible circuit boards; A plurality of lamp beads are arranged on the flexible circuit board, and the chips of the lamp beads are packaged by using CSP technology and / or are soldered on the flexible circuit board by using flip chip method; The covering tape is covered around the four sides of the flexible circuit board.

2. The extremely cold-resistant and highly reliable neon light strip according to claim 1, characterized in that: The lamp beads are single-color lamp beads or multi-color lamp beads; The monochromatic lamp bead is provided with a chip capable of emitting a single color of light, and the multicolor lamp bead is provided with a chip capable of emitting a plurality of different colors of light.

3. The extremely cold-resistant and highly reliable neon light strip according to claim 1, characterized in that: The covering tape comprises a diffusion layer for guiding light, a light blocking layer for blocking light, and a transparent layer for disassembly and assembly; The diffusion layer, the light blocking layer and the transparent layer are surrounded on all sides of the flexible circuit board.

4. The extremely cold-resistant and highly reliable neon light strip according to claim 3, characterized in that: The diffusion layer is arranged in any one or more light emitting directions of the lamp beads, the transparent layer is arranged below the flexible circuit board, and the light blocking layer is arranged between the diffusion layer and the transparent layer.

5. The extremely cold-resistant and highly reliable neon light strip according to claim 3, characterized in that: The lamp bead includes a latex layer formed by a dispensing process.

6. The extremely cold-resistant and highly reliable neon light strip according to claim 1, characterized in that: A protection strip is arranged on the back of the flexible circuit board, and the protection strip and the flexible circuit board are arranged in the covering tape through co-extrusion processing.

7. The extremely cold-resistant and highly reliable neon light strip according to claim 3, characterized in that: The diffusion layer, the light blocking layer and the transparent layer are all formed by extrusion of silicone.

8. The extremely cold-resistant and highly reliable neon light strip according to claim 1, characterized in that: Waterproof male and female wires are welded at both ends of the flexible circuit board, and both ends of the covering tape and the flexible circuit board are sealed by hot-pressed plugs.

9. The extremely cold-resistant and highly reliable neon light strip according to claim 1, characterized in that: The flexible circuit board is also provided with a control component electrically connected to the lamp bead for controlling the lamp bead to emit light.

10. The extremely cold-resistant and highly reliable neon light strip according to claim 9, characterized in that: The control component includes a control chip, and resistors and / or capacitors electrically connected to the control chip and the lamp beads respectively, and each of the plurality of lamp beads is provided with the resistors and / or capacitors.

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