Test jig assembly for semiconductor package test

Abstract

The utility model discloses a test frame assembly for semiconductor packaging test, which relates to the technical field of semiconductor test and comprises a base. A square shell is fixedly connected to the edge of the top end of the outer wall of the base, and one side of the outer wall of the square shell is open. A tester is arranged at the top end of the outer wall of the base; a motor is fixedly connected to the top end of the outer wall of the square shell; a threaded rotating shaft is arranged at the output end of the motor, and the bottom end of the outer wall of the threaded rotating shaft penetrates through the top end of the outer wall of the square shell and is rotationally connected to the top end of the outer wall of the base; according to the utility model, the motor drives the threaded rotating shaft to rotate, so that the rotation of the threaded rotating shaft enables the placement plate to move downwards, when the placement plate moves downwards, the sliding plate drives the lower pressing plate to move and extrude and fix a semiconductor through the linkage piece, and when the placement plate moves upwards, the lower pressing plate is unfixed through the linkage piece. And the device can automatically fix and unfix the semiconductor in the testing process, so that the semiconductor is more convenient to test.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a test frame component used for semiconductor packaging testing. Background Art

[0002] Semiconductor is a material with an electrical conductivity between that of conductors and insulators. Semiconductor technology is the cornerstone of modern electronic devices. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. During the production and processing of semiconductors, in order to ensure that there are no quality problems, the semiconductors need to be placed on a test rack for testing.

[0003] The semiconductor test rack in the prior art needs to fix the semiconductor during testing, and then release the semiconductor after the test, and then replace the new semiconductor for testing. Therefore, when fixing a large number of semiconductors, it is necessary to continuously perform the operations of fixing, placing, and releasing the semiconductors, which makes the semiconductor testing more cumbersome and time-consuming, thus affecting the work efficiency.

[0004] In view of the above technical problems, this application proposes a solution. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art semiconductor test rack that when testing, the semiconductor needs to be fixed, and then the semiconductor needs to be released after the test, and then a new semiconductor needs to be placed for testing, so that a large number of semiconductors need to be fixed, placed, and released continuously, which makes the semiconductor testing more cumbersome and too time-consuming, thus affecting the work efficiency. A test rack assembly for semiconductor packaging testing is proposed to solve the problem that when testing a semiconductor, the semiconductor needs to be fixed, placed, and released continuously after the test, so that the work efficiency is affected.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A test stand assembly for semiconductor packaging testing comprises a base; a square shell is fixedly connected at the top edge of the outer wall of the base, and one side of the outer wall of the square shell is open; a tester is provided at the top of the outer wall of the base; a motor is fixedly connected to the top of the outer wall of the square shell; a threaded shaft is provided at the output end of the motor, and the bottom end of the outer wall of the threaded shaft passes through the top of the outer wall of the square shell and is rotatably connected to the top of the outer wall of the base; a placement plate is threadedly connected to the outer wall of the threaded shaft, and the outer wall of the placement plate is in contact with the inner wall of the square shell; a placement groove is provided at the top of the outer wall of the placement plate; a probe is provided at the bottom end of the inner wall of the placement groove; a fixing plate is provided at the top of the outer wall of the placement plate; a sliding plate is slidably connected to the outer wall of the fixing plate; a linkage member is provided on one side of the outer wall of the sliding plate; the linkage member comprises a first gear; a lower pressure plate is fixedly connected to the lower end of the outer wall of the sliding plate through a first spring, and the lower pressure plate is located above the placement groove.

[0008] Preferably, one end of the outer wall of the first gear is rotatably connected to one side of the outer wall of the placement plate through a first rotating rod; a gear bar is fixedly connected to one side of the outer wall of the sliding plate through a first square block, and the gear bar is meshed with the first gear; a group of gear grooves are opened on one side of the outer wall of the square shell, and the gear grooves are meshed with the first gear; a square groove is opened on the top of the outer wall of the base, and the square groove matches the gear bar.

[0009] Preferably, the bottom end of the outer wall of the fixed plate is slidably connected to the top end of the outer wall of the placing plate; the top end of the outer wall of the placing plate is threadedly connected to a first threaded rod through a first square plate, and one end of the outer wall of the first threaded rod is rotatably connected to one side of the outer wall of the fixed plate.

[0010] Preferably, a limiting groove is provided on the inner side wall of the placement groove; a pair of adjustment plates are provided on the inner side wall of the limiting groove; opposite sides of the outer walls of a pair of adjustment plates are fixedly connected to the limiting plates by a second spring; the limiting plates are in an inverted V shape, and the turning points of the opposite sides of the outer walls of a pair of limiting plates are both arc-shaped.

[0011] Preferably, a double-threaded rod is rotatably connected to a corner of one side of the inner wall of the limiting groove, and one end of the outer wall of the double-threaded rod passes through a pair of adjustment plates and the limiting groove, and the double-threaded rod is threadedly connected to the pair of adjustment plates; the outer side walls of the pair of adjustment plates are in contact with the inner side walls of the limiting groove, and the pair of adjustment plates are symmetrical about the center line of the placement groove.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. By rotating the first threaded rod, the first threaded rod moves, and the movement of the first threaded rod will drive the fixed plate to move, so that the fixed plate drives the sliding plate and the gear bar to move, thereby releasing the limit of the gear bar and the sliding plate by the first gear. At this time, by adjusting the position of the sliding plate on the fixed plate, the strength of the elastic force of the first spring of the lower pressure plate when fixing the semiconductor is adjusted, so that the device can adjust the elastic force of the first spring when the lower pressure plate is fixed according to the different semiconductors, so that the lower pressure plate can fix the semiconductor without damaging the semiconductor. After adjusting the position of the sliding plate, reverse the first threaded rod to reset the fixed plate, so that the gear bar and the first gear are in a state of mutual meshing, thereby completing the adjustment operation.

[0014] 2. When the semiconductor is placed in the placement groove, the second spring will drive a pair of limit plates to clamp and fix the semiconductor, so that the semiconductor can be located at the center of the placement groove and the semiconductor can be more stable during testing. The limit plates are in an inverted V shape, and the turning points on the opposite sides of the outer walls of the pair of limit plates are arc-shaped. When the semiconductor is placed, when the semiconductor contacts the limit plate, the semiconductor will first contact the inclined surface of the limit plate, so that the limit plate drives the second spring to contract, making it easier to place the semiconductor. This not only makes the semiconductor more stable during testing, but also makes the placement operation of the semiconductor more convenient and quicker. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0016] Figure 1 It is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the base and the placement plate of the utility model;

[0018] Figure 3 It is a schematic diagram of the exploded structure of the placement plate and the adjustment plate of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the sliding plate and the fixed plate of the utility model;

[0020] Figure 5 It is a cross-sectional view of the placement plate of the utility model;

[0021] In the figure: 1. base; 2. square shell; 3. tester; 4. motor; 5. threaded shaft; 6. placement plate; 7. placement slot; 8. probe; 9. fixing plate; 10. sliding plate; 11. first gear; 12. lower pressure plate; 13. gear bar; 14. gear slot; 15. first threaded rod; 16. limit slot; 17. adjustment plate; 18. limit plate; 19. double threaded rod; 20. square slot. DETAILED DESCRIPTION

[0022] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 5 As shown, a test stand assembly for semiconductor packaging testing comprises a base 1; a square shell 2 is fixedly connected to the top edge of the outer wall of the base 1, and one side of the outer wall of the square shell 2 is open; a tester 3 is provided at the top of the outer wall of the base 1; a motor 4 is fixedly connected to the top of the outer wall of the square shell 2; a threaded shaft 5 is provided at the output end of the motor 4, and the bottom end of the outer wall of the threaded shaft 5 passes through the top of the outer wall of the square shell 2 and is rotatably connected to the top of the outer wall of the base 1; a placement plate 6 is threadedly connected to the outer wall of the threaded shaft 5, and the outer wall of the placement plate 6 is in contact with the inner wall of the square shell 2; a placement groove 7 is provided at the top of the outer wall of the placement plate 6; a probe 8 is provided at the bottom end of the inner wall of the placement groove 7; a fixing plate 9 is provided at the top of the outer wall of the placement plate 6; a sliding plate 10 is slidably connected to the outer wall of the fixing plate 9; a linkage member is provided on one side of the outer wall of the sliding plate 10; the linkage member comprises a first gear 11; a lower pressing plate 12 is fixedly connected to the bottom end of the outer wall of the sliding plate 10 through a first spring, and the lower pressing plate 12 is located above the placement groove 7, by The semiconductor is placed in the placement groove 7 on the placement plate 6, so that the semiconductor is aligned with the probe 8 in the placement groove 7, and then the threaded shaft 5 is driven to rotate by the motor 4. Since the threaded shaft 5 is threadedly connected to the placement plate 6, the rotation of the motor 4 causes the placement plate 6 to move downward, and when the placement plate 6 moves downward, the sliding plate 10 drives the lower pressure plate 12 to move through the linkage, thereby squeezing and fixing the semiconductor; when the placement plate 6 moves to a suitable position, the tester 3 is energized on the semiconductor. The tester 3 and the probe 8 are both prior art and are not described, so as to test the changes of the semiconductor under different voltages and temperatures. After the test is completed, the motor 4 is reversed to move the placement plate 6 upward, disconnect the connection with the tester 3, and when the placement plate 6 moves upward, the lower pressure plate 12 is released through the linkage, so that the device automatically fixes and releases the semiconductor during the test process, thereby making it more convenient to test the semiconductor, and also improving the work efficiency of the staff while reducing the workload of the staff.

[0024] One end of the outer wall of the first gear 11 is rotatably connected to one side of the outer wall of the placement plate 6 through the first rotating rod; a gear bar 13 is fixedly connected to one side of the outer wall of the sliding plate 10 through the first square block, and the gear bar 13 and the first gear 11 are meshed with each other; a group of gear grooves 14 are opened on one side of the outer wall of the square shell 2, and the gear grooves 14 and the first gear 11 are meshed with each other. When the placement plate 6 is downward, a group of gear grooves 14 are opened on one side of the outer wall of the square shell 2, and the gear grooves 14 and the first gear 11 are meshed with each other; a square groove 20 is opened on the top of the outer wall of the base 1, and the square groove 20 matches the gear bar 13, so that the placement plate 6 moves downward, which will cause the first gear 11 to rotate counterclockwise, and because the gear bar 13 and the first gear 11 are meshed with each other When the first gear 11 rotates counterclockwise, it will drive the gear bar 13 to move downward, so that the gear bar 13 drives the sliding plate 10 to move downward through the first block, so that the sliding plate 10 drives the lower pressure plate 12 to move downward, so that the lower plate cooperates with the placement groove 7 and the probe 8 to fix the semiconductor. When the semiconductor test is completed and the placement plate 6 moves upward to disconnect, the upward movement of the placement plate 6 will drive the first gear 11 to rotate clockwise, thereby driving the gear bar 13 to move upward, so that the gear bar 13 drives the sliding plate 10 and the lower pressure plate 12 to move upward, thereby releasing the fixation of the semiconductor, so that the device can automatically fix and release the semiconductor without manual operation, thereby making the operation of the device more convenient.

[0025] A limiting groove 16 is provided on the inner wall of the placement groove 7; a pair of adjusting plates 17 are provided on the inner wall of the limiting groove 16; the outer walls of the pair of adjusting plates 17 are fixedly connected to the limiting plates 18 on opposite sides through a second spring; the limiting plates 18 are in an inverted V shape, and the turning points on the opposite sides of the outer walls of the pair of limiting plates 18 are arc-shaped. When the semiconductor is placed in the placement groove 7, the second spring will drive the pair of limiting plates 18 to clamp and fix the semiconductor, so that the semiconductor can be located at the center position of the placement groove 7, and the semiconductor can be more stable when tested. The limiting plates 18 are in an inverted V shape, and the turning points on the opposite sides of the outer walls of the pair of limiting plates 18 are arc-shaped, so that when the semiconductor is placed, when the semiconductor contacts the limiting plate 18, the semiconductor will first contact the inclined surface of the limiting plate 18, so that the limiting plate 18 drives the second spring to contract, so that the semiconductor is more convenient to place, so that the semiconductor is not only more stable when tested, but also makes the placement operation of the semiconductor more convenient and quicker.

[0026] The bottom end of the outer wall of the fixed plate 9 is slidably connected to the top end of the outer wall of the placement plate 6; the top end of the outer wall of the placement plate 6 is threadedly connected to a first threaded rod 15 through a first square plate, and one end of the outer wall of the first threaded rod 15 is rotatably connected to one side of the outer wall of the fixed plate 9. By rotating the first threaded rod 15, since the first threaded rod 15 is threadedly connected to the first square block, the rotation of the first threaded rod 15 will cause the first threaded rod 15 to move. Since one end of the outer wall of the first threaded rod 15 is rotatably connected to one side of the outer wall of the fixed plate 9, when the first threaded rod 15 moves, it will drive the fixed plate 9 to move, so that the fixed plate 9 drives the sliding plate 10 and the gear bar 13 moves, thereby releasing the limitation of the first gear 11 on the gear bar 13 and the sliding plate 10. At this time, by adjusting the position of the sliding plate 10 on the fixed plate 9, the elastic force of the first spring of the lower pressure plate 12 when fixing the semiconductor is adjusted, so that the device can adjust the elastic force of the first spring when the lower pressure plate 12 is fixed according to the difference of the semiconductor, so that the lower pressure plate 12 can fix the semiconductor without damaging the semiconductor. After adjusting the position of the sliding plate 10, reverse the first threaded rod 15 to reset the fixed plate 9, so that the gear bar 13 and the first gear 11 are in a state of mutual meshing, thereby completing the adjustment operation.

[0027] A double-threaded rod 19 is rotatably connected at a corner of one side of the inner wall of the limiting groove 16, and one end of the outer wall of the double-threaded rod 19 passes through a pair of adjustment plates 17 and the limiting groove 16, and the double-threaded rod 19 is threadedly connected to the pair of adjustment plates 17; the outer side walls of the pair of adjustment plates 17 are in contact with the inner side walls of the limiting groove 16, and the pair of adjustment plates 17 are symmetrical about the center line of the placement groove 7. By rotating the double-threaded rod 19, the double-threaded rod 19 is threadedly connected to the pair of adjustment plates 17, so that the double-threaded rod 19 rotates, which drives the pair of adjustment plates 17 to move toward the center or both sides at the same time, and the outer side walls of the pair of adjustment plates 17 are in contact with the inner side walls of the limiting groove 16. The rotation of 9 will only drive the adjustment plate 17 to move but not drive the adjustment plate 17 to rotate, so that when the adjustment plate 17 moves, it will drive the second spring and the limit plate 18 to move, so that the squeezing force of the limit plate 18 on the semiconductor can be adjusted, and when the second spring is used for a long time and the elastic force is insufficient, the position of the second spring and the limit plate 18 can be moved so that the second spring has sufficient elastic force to clamp and fix the semiconductor, so that the device can not only adjust the clamping force of the limit plate 18 according to the different semiconductors, but also restore the elastic force of the second spring by moving the adjustment plate 17, so that the service life of the device is increased.

[0028] Working principle: Place the semiconductor in the placement groove 7 on the placement plate 6, align the semiconductor with the probe 8 in the placement groove 7, and then drive the threaded shaft 5 to rotate through the motor 4. Since the threaded shaft 5 is threadedly connected to the placement plate 6, the rotation of the motor 4 causes the placement plate 6 to move downward. When the placement plate 6 moves downward, a group of gear grooves 14 are provided on one side of the outer wall of the square shell 2, and the gear grooves 14 are meshed with the first gear 11, so that the placement plate 6 moves downward and the first gear 11 rotates counterclockwise. Since the gear bar 13 is meshed with the first gear 11, the first gear 11 rotates counterclockwise and drives the gear bar 13 to move downward, so that the gear bar 13 drives the sliding plate 10 to move downward through the first block, so that the sliding plate 10 drives the lower pressing plate 12 The semiconductor is fixed to the tester 3 at different voltages and temperatures. After the test is completed, the motor 4 is reversed to make the placement plate 6 move upward to disconnect the tester 3. The upward movement of the placement plate 6 drives the first gear 11 to rotate clockwise, thereby driving the gear bar 13 to move upward, so that the gear bar 13 drives the sliding plate 10 and the lower pressure plate 12 to move upward, thereby releasing the fixation of the semiconductor. The device can automatically fix and release the semiconductor without manual operation, thereby making the operation of the device more convenient and making it more convenient to test the semiconductor. The work efficiency of the staff is improved while the workload of the staff is reduced. By rotating the first threaded rod 15, since the first threaded rod 15 is threadedly connected to the first block, the rotation of the first threaded rod 15 will cause the first threaded rod 15 to move. Since one end of the outer wall of the first threaded rod 15 is rotatably connected to one side of the outer wall of the fixed plate 9, the first threaded rod 15 will drive the fixed plate 9 to move when it moves, so that the fixed plate 9 drives the sliding plate 10 and the gear bar 13 to move, thereby releasing the limit of the gear bar 13 and the sliding plate 10 by the first gear 11. At this time, by adjusting the position of the sliding plate 10 on the fixed plate 9, the elastic force of the first spring of the lower pressure plate 12 when fixing the semiconductor is adjusted, so that the device can be adjusted according to the different semiconductors. The elastic force of the first spring is adjusted when the lower pressing plate 12 is fixed, so that the lower pressing plate 12 can fix the semiconductor without damaging the semiconductor. After adjusting the position of the sliding plate 10, the first threaded rod 15 is reversed to reset the fixing plate 9, so that the gear bar 13 and the first gear 11 are in a state of mutual meshing, thereby completing the adjustment operation. When the semiconductor is placed in the placement groove 7, the second spring will drive a pair of limit plates 18 to clamp and fix the semiconductor, so that the semiconductor can be located at the center position of the placement groove 7, and the semiconductor can be more stable during testing. The limit plates 18 are in an inverted V shape, and the turning points on the opposite sides of the outer walls of the pair of limit plates 18 are arc-shaped, so that when the semiconductor is placed, when the semiconductor contacts the limit plates 18,The semiconductor will first contact the inclined surface of the limit plate 18, so that the limit plate 18 drives the second spring to contract, so that the semiconductor is more convenient to place, so that the semiconductor is not only more stable when being tested, but also makes the placement operation of the semiconductor more convenient and quick. By rotating the double-threaded rod 19, because the double-threaded rod 19 is threadedly connected with a pair of adjustment plates 17, the double-threaded rod 19 will drive the pair of adjustment plates 17 to move toward the center or both sides at the same time, so that when the adjustment plate 17 moves, it will drive the second spring and the limit plate 18 to move, so that when the device tests different semiconductors, the extrusion force of the limit plate 18 on the semiconductor can be adjusted, so that the semiconductor is not easily damaged while the semiconductor is clamped. When the second spring is used for a long time and the elastic force is insufficient, the position of the second spring and the limit plate 18 can be moved so that the second spring has sufficient elastic force to clamp and fix the semiconductor. Therefore, the device can not only adjust the clamping force of the limit plate 18 according to the difference of the semiconductor, but also restore the elastic force of the second spring by moving the adjustment plate 17, so that the service life of the device is increased.

[0029] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A test stand assembly for semiconductor packaging testing, comprising a base (1); a square shell (2) is fixedly connected to the top edge of the outer wall of the base (1), and one side of the outer wall of the square shell (2) is open; a tester (3) is provided at the top of the outer wall of the base (1); characterized in that: The top of the outer wall of the square shell (2) is fixedly connected with a motor (4); the output end of the motor (4) is provided with a threaded shaft (5), and the bottom end of the outer wall of the threaded shaft (5) penetrates the top of the outer wall of the square shell (2) and is rotatably connected to the top of the outer wall of the base (1); the outer wall of the threaded shaft (5) is threadedly connected with a placement plate (6), and the outer wall of the placement plate (6) is in contact with the inner wall of the square shell (2); the top of the outer wall of the placement plate (6) is provided with a placement groove (7); the bottom end of the inner wall of the placement groove (7) is provided with a probe (8); the top of the outer wall of the placement plate (6) is provided with a fixed plate (9); the outer wall of the fixed plate (9) is slidably connected with a sliding plate (10); a linkage member is provided on one side of the outer wall of the sliding plate (10); the linkage member includes a first gear (11); the bottom end of the outer wall of the sliding plate (10) is fixedly connected with a lower pressure plate (12) through a first spring, and the lower pressure plate (12) is located above the placement groove (7).

2. The test rack assembly for semiconductor packaging testing according to claim 1, characterized in that: One end of the outer wall of the first gear (11) is rotatably connected to one side of the outer wall of the placement plate (6) through a first rotating rod; a gear bar (13) is fixedly connected to one side of the outer wall of the sliding plate (10) through a first square block, and the gear bar (13) and the first gear (11) are meshed with each other; a group of gear grooves (14) are opened on one side of the outer wall of the square shell (2), and the gear grooves (14) and the first gear (11) are meshed with each other; a square groove (20) is opened on the top of the outer wall of the base (1), and the square groove (20) matches the gear bar (13).

3. The test rack assembly for semiconductor packaging testing according to claim 2, characterized in that: The bottom end of the outer wall of the fixing plate (9) is slidably connected to the top end of the outer wall of the placement plate (6); the top end of the outer wall of the placement plate (6) is threadedly connected to a first threaded rod (15) via a first square plate, and one end of the outer wall of the first threaded rod (15) is rotatably connected to one side of the outer wall of the fixing plate (9).

4. The test rack assembly for semiconductor packaging testing according to claim 3, characterized in that: The inner side wall of the placement groove (7) is provided with a limiting groove (16); the inner side wall of the limiting groove (16) is provided with a pair of adjustment plates (17); the outer walls of the pair of adjustment plates (17) are fixedly connected to the limiting plates (18) on opposite sides via a second spring; the limiting plates (18) are in an inverted V shape, and the turning points of the outer walls of the pair of limiting plates (18) on opposite sides are both in an arc shape.

5. The test rack assembly for semiconductor packaging testing according to claim 4, characterized in that: A double threaded rod (19) is rotatably connected at a corner of one side of the inner wall of the limiting groove (16), and one end of the outer wall of the double threaded rod (19) passes through a pair of adjustment plates (17) and the limiting groove (16), and the double threaded rod (19) is threadedly connected to the pair of adjustment plates (17); the outer side walls of the pair of adjustment plates (17) are in contact with the inner side walls of the limiting groove (16), and the pair of adjustment plates (17) are symmetrical about the center line of the placement groove (7).

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