Magnetic field enhanced case liquid cooling system and case

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a liquid cooling system of a magnetic field strengthening case and the case, the liquid cooling system of the magnetic field strengthening case comprises a cooling liquid box, a liquid cooling unit, a circulating unit, a heat dissipation unit and a magnetic field generator, the cooling liquid box stores magnetic nano fluid, and the liquid cooling unit is attached to an electronic element. The circulating unit is connected with the cooling liquid tank and the liquid cooling unit and can drive the magnetic nanofluid to circulate between the liquid cooling unit and the cooling liquid tank, and the magnetic nanofluid can absorb heat of the liquid cooling unit when flowing through the liquid cooling unit, so that the temperature of the electronic component is reduced, the heat dissipation unit is connected with the cooling liquid tank, and the magnetic nanofluid can absorb heat of the liquid cooling unit when flowing through the cooling liquid tank. Heat dissipation can be performed through the heat dissipation unit, and the magnetic field generator can enhance the heat absorption effect of the magnetic nanofluid through the magnetic force effect on the magnetic nanofluid flowing through the liquid cooling unit, so that the heat dissipation efficiency of the electronic component is improved, efficient heat dissipation of the electronic component is realized, and the heat dissipation requirement of the case is met.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a magnetic field enhanced chassis liquid cooling system and a chassis. Background Art

[0002] With the upgrade of computer configuration and performance improvement, the heat power density of electronic equipment continues to increase. Traditional air cooling can no longer meet the heat dissipation of high heat flux density electronic equipment, so more efficient heat dissipation technology is needed to ensure the stable operation of the computer. Liquid cooling technology has attracted much attention due to its better thermophysical properties (such as thermal conductivity and specific heat) than gas.

[0003] Liquid can effectively absorb and transfer more heat, so it is more suitable for dissipating the heat generated by high power density from the hot surface of electronic equipment. For example, the liquid-cooled chassis disclosed in the patent document CN203490629U includes a side panel and a bottom panel, a cooling device is provided on the side panel, a circuit board is fixed to the bottom panel, and an electronic component cooled by the cooling device is provided on the circuit board. The cooling device includes a mounting body, a cooling fin group, a fan assembly, a drive assembly, a storage assembly and a cooling assembly. The cooling device drives the coolant to circulate in the cooling fin group and the fan assembly through the drive assembly, thereby cooling the electronic components.

[0004] Although the existing magnetic field enhanced chassis liquid cooling system can provide heat dissipation for electronic components to a certain extent, in fact, the cooling effect of the traditional magnetic field enhanced chassis liquid cooling system is low and can no longer meet the heat dissipation requirements of high-heat electronic equipment. Therefore, in order to achieve the expected efficiency and reliability, it is urgent to develop new heat dissipation methods and cooling efficiency with excellent thermal performance to effectively dissipate the high heat generated by electronic equipment. Utility Model Content

[0005] In view of this, it is necessary to provide a magnetic field enhanced chassis liquid cooling system and chassis to solve the technical problem that the magnetic field enhanced chassis liquid cooling system in the prior art has low heat dissipation efficiency and is difficult to meet the heat dissipation requirements of the chassis.

[0006] In order to achieve the above technical objectives, the technical solution of the utility model provides a magnetic field enhanced chassis liquid cooling system, comprising:

[0007] A coolant tank for storing magnetic nanofluid;

[0008] Liquid cooling unit for bonding electronic components;

[0009] A circulation unit connected to the cooling liquid tank and the liquid cooling unit, and used for driving the magnetic nanofluid to circulate between the liquid cooling unit and the cooling liquid tank;

[0010] a heat dissipation unit connected to the coolant tank and used for dissipating heat from the coolant tank; and

[0011] The magnetic field generator is located outside the liquid cooling unit and is used to form a magnetic field covering the liquid cooling unit.

[0012] In some embodiments, the magnetic field generator includes at least two coils, each of which is coaxially arranged and located on two sides of the liquid cooling unit.

[0013] In some embodiments, the coil is a Helmholtz coil.

[0014] In some embodiments, the liquid cooling unit includes several liquid cooling blocks, each of which is used to fit different electronic components respectively. The circulation unit includes a driving module and several circulation pipelines, one end of each circulation pipeline is connected to the coolant tank, and the other end of each circulation pipeline is respectively connected to each liquid cooling block.

[0015] In some embodiments, the driving module includes several liquid pumps, each of the circulation pipelines includes a liquid inlet pipe and a liquid return pipe, one end of the liquid inlet pipe and the liquid return pipe are connected to the liquid cooling block, the other end of each liquid inlet pipe and each liquid return pipe are respectively connected to the coolant tank and each liquid cooling block, and each liquid pump is respectively connected to each liquid inlet pipe.

[0016] In some embodiments, a plurality of cooling channels arranged at intervals are disposed inside each of the liquid cooling blocks, and each of the cooling channels is connected to the circulation pipeline.

[0017] In some embodiments, the heat dissipation unit includes a heat sink, and the heat sink is attached to the coolant tank.

[0018] The technical solution of the utility model also includes a chassis, including the magnetic field enhanced chassis liquid cooling system.

[0019] In some embodiments, the chassis further includes a case, a processor and a graphics card, the coolant tank, the processor and the graphics card are all installed inside the case, and each of the liquid cooling blocks is respectively attached to the processor and the graphics card.

[0020] In some embodiments, a mounting frame is disposed inside the box, the processor and the graphics card are both mounted on the mounting frame, and each of the coils is located on two sides of the mounting frame and fixed to the box.

[0021] Compared with the prior art, the magnetic field enhanced chassis liquid cooling system and chassis of the utility model have the following beneficial effects: the magnetic field enhanced chassis liquid cooling system is provided with a coolant tank, a liquid cooling unit, a circulation unit, a heat dissipation unit and a magnetic field generator. When the heat dissipation of electronic components is performed, the coolant tank stores magnetic nanofluids, the liquid cooling unit is attached to the electronic components and can absorb the heat of the electronic components, the circulation unit is connected with the coolant tank and the liquid cooling unit, and can drive the magnetic nanofluid to circulate along the liquid cooling unit and the coolant tank. When the magnetic nanofluid flows through the liquid cooling unit, it can absorb the heat of the liquid cooling unit, thereby reducing the temperature of the electronic components, the heat dissipation unit is connected with the coolant tank, and when the magnetic nanofluid flows through the coolant tank, it can dissipate heat through the heat dissipation unit, thereby enabling the electronic components to be effectively dissipated under the circulation of the magnetic nanofluid, and the magnetic field generator can enhance the heat absorption effect of the magnetic nanofluid by exerting a magnetic force on the magnetic nanofluid flowing through the liquid cooling unit, thereby improving the heat dissipation efficiency of the electronic components, achieving efficient heat dissipation of the electronic components, and meeting the heat dissipation requirements of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a magnetic field enhanced chassis liquid cooling system provided by an embodiment of the utility model;

[0023] Figure 2 It is a structural schematic diagram of a chassis provided by an embodiment of the utility model;

[0024] Figure 3 It is another structural schematic diagram of the chassis provided by an embodiment of the utility model.

[0025] Among them, the reference numerals in the figure are:

[0026] 10—Coolant tank 20—Liquid cooling unit 21—Liquid cooling block

[0027] 30—circulation unit 31—driving module 32—circulation pipeline

[0028] 40—heat dissipation unit 41—heat sink 50—magnetic field generator

[0029] 51 - coil 60 - box 61 - mounting frame

[0030] 70—Processor 80—Graphics card 90—Cooling fan

[0031] 211—Cooling channel 311—Liquid pump 321—Liquid inlet pipe

[0032] 322—liquid return pipe 10a—electronic components. DETAILED DESCRIPTION

[0033] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the present application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0034] Since the heat dissipation efficiency of the existing magnetic field enhanced chassis liquid cooling system through the circulation of coolant is low, the embodiment of the utility model provides a magnetic field enhanced chassis liquid cooling system, which adopts a magnetic nanofluid with better heat absorption effect and improves the heat absorption efficiency of the magnetic nanofluid through the action of the magnetic field, thereby enhancing the heat dissipation effect of the liquid cooling device, and solves the technical problem that the heat dissipation efficiency of the magnetic field enhanced chassis liquid cooling system in the prior art is low and it is difficult to meet the heat dissipation requirements of the chassis.

[0035] like Figure 1-2 As shown, the magnetic field enhanced chassis liquid cooling system of the embodiment of the utility model includes a coolant tank 10, a liquid cooling unit 20, a circulation unit 30, a heat dissipation unit 40 and a magnetic field generator 50, wherein the coolant tank 10 is used to store magnetic nanofluids; the liquid cooling unit 20 is used to fit electronic components 10a; the circulation unit 30 is connected to the coolant tank 10 and the liquid cooling unit 20, and is used to drive the magnetic nanofluid to circulate between the liquid cooling unit 20 and the coolant tank 10; the heat dissipation unit 40 is connected to the coolant tank 10, and is used to dissipate heat from the coolant tank 10; the magnetic field generator 50 is located on the outside of the liquid cooling unit 20, and is used to form a magnetic field covering the liquid cooling unit 20.

[0036] Specifically, the magnetic field enhanced chassis liquid cooling system is provided with a cooling liquid tank 10, a liquid cooling unit 20, a circulation unit 30, a heat dissipation unit 40 and a magnetic field generator 50. When the electronic component 10a is dissipated, the cooling liquid tank 10 stores the magnetic nanofluid, the liquid cooling unit 20 is attached to the electronic component 10a, and can absorb the heat of the electronic component 10a. The circulation unit 30 is connected with the cooling liquid tank 10 and the liquid cooling unit 20, and can drive the magnetic nanofluid to circulate along the liquid cooling unit 20 and the cooling liquid tank 10. When the magnetic nanofluid flows through the liquid cooling unit 20, it can absorb the heat of the liquid cooling unit 20, thereby reducing the temperature of the electronic component 10a and dissipating the heat. The unit 40 is connected to the cooling liquid tank 10. When the magnetic nanofluid flows through the cooling liquid tank 10, the heat can be dissipated through the heat dissipation unit 40, so that the electronic component 10a can be effectively cooled under the circulation of the magnetic nanofluid. Since the magnetic nanofluid contains magnetism, the magnetic field generator 50 can control the flow of the magnetic nanofluid through the magnetic force of the magnetic nanofluid flowing through the liquid cooling unit 20, so that the magnetic nanofluid flowing through the liquid cooling unit 20 forms a turbulent flow, which can enhance the heat absorption effect of the magnetic nanofluid, thereby improving the heat dissipation efficiency of the electronic component 10a, achieving efficient heat dissipation of the electronic component 10a, and meeting the heat dissipation requirements of the chassis.

[0037] In this embodiment, the magnetic nanofluid is prepared by adding magnetic nanoparticles to the refrigerant. The magnetic nanoparticles are usually prepared from metals (ferromagnetic materials) such as cobalt, iron, nickel and their oxides (such as ferroferric oxide). The magnetic nanoparticles have good thermal conductivity and magnetic responsiveness, can quickly absorb and transfer heat, and can control the movement of the magnetic nanoparticles through an external magnetic field to improve the heat exchange of the magnetic nanoparticles, thereby enhancing the heat absorption effect of the magnetic nanofluid, effectively improving the heat dissipation efficiency, and ensuring that the electronic components of the chassis operate stably at a good working temperature.

[0038] It can be understood that the magnetic field enhanced chassis liquid cooling system can be a heat transfer structure such as a cooling box, cooling pipe, etc. that can be attached to one or more electronic components and can allow magnetic nanofluids to flow and absorb heat from the electronic components.

[0039] In one embodiment, if Figure 1-2 As shown, the liquid cooling unit 20 includes a plurality of liquid cooling blocks 21, each of which is used to fit different electronic components 10a, and the circulation unit 30 includes a driving module 31 and a plurality of circulation pipelines 32, one end of each circulation pipeline 32 is connected to the cooling liquid tank 10, and the other end of each circulation pipeline 32 is respectively connected to each liquid cooling block 21. Specifically, the liquid cooling unit 20 is connected to different electronic components 10a through the connection of each liquid cooling block 21, so as to achieve the bonding with each electronic component 10a, and the driving module 31 drives the magnetic nanofluid of the cylinder to circulate through each circulation pipeline 32 to each liquid cooling block 21, so that each liquid cooling block 21 absorbs heat from the electronic component 10a, thereby achieving the heat dissipation of multiple different types of electronic components 10a.

[0040] In one embodiment, if Figure 1 As shown, each liquid cooling block 21 is provided with a plurality of cooling channels 211 arranged at intervals, and each cooling channel 211 is connected to the circulation pipeline 32. Specifically, when the magnetic nanofluid flows through the liquid cooling block 21, it can be diverted to each cooling channel 211, so that the cooling block can be better absorbed and the heat dissipation efficiency of the electronic component 10a can be improved.

[0041] In one embodiment, if Figure 1-2 As shown, the driving module 31 includes a plurality of liquid pumps 311, and each circulation pipeline 32 includes a liquid inlet pipe 321 and a liquid return pipe 322. One end of the liquid inlet pipe 321 and the liquid return pipe 322 are connected to the liquid cooling block 21, and the other end of each liquid inlet pipe 321 and each liquid return pipe 322 are respectively connected to the cooling liquid tank 10 and each liquid cooling block 21, and each liquid pump 311 is respectively connected to each liquid inlet pipe 321. Specifically, the liquid pump 311 drives the magnetic nanofluid to enter the liquid inlet pipe 321, and then enters the liquid cooling block 21 through the liquid inlet pipe 321 to absorb heat, and then enters the liquid return pipe 322 from the liquid cooling block 21, and then enters the cooling liquid tank 10 from the liquid return pipe 322.

[0042] It can be understood that the magnetic field generator 50 can be any magnetic component such as a permanent magnet that can generate a magnetic field covering the liquid cooling unit 20 .

[0043] In one embodiment, if Figure 1-3 As shown, the magnetic field generator 50 includes at least two coils 51, each coil 51 is coaxially arranged and respectively located on both sides of the liquid cooling unit 20. Specifically, when the coil 51 is energized, an axial magnetic field can be generated, thereby realizing the control of the flow of the magnetic nanofluid, and the magnetic field strength acting on the liquid cooling unit 20 can be adjusted according to demand, thereby adapting to the heat dissipation of the electronic component 10a.

[0044] In this embodiment, the number of the coils 51 is two, and the two magnetic fields are respectively located on two sides of each liquid cooling block 21 .

[0045] In one embodiment, the coil 51 is a Helmholtz coil 51 .

[0046] Specifically, when the Helmholtz coil 51 is powered on and applies a uniform external magnetic field to the magnetic nanofluid, the magnetic nanoparticles of the magnetic nanofluid will be arranged in the direction of the magnetic field. By adjusting the strength and direction of the magnetic field of the Helmholtz coil 51, the flow and heat transfer performance of the magnetic nanofluid can be effectively controlled, thereby achieving efficient heat dissipation of the electronic component 10a. In addition, the temperature distribution can also be controlled to be more uniform, achieving precise control of the temperature inside the chassis.

[0047] like Figure 2-3 As shown, an embodiment of the utility model further provides a chassis, including a magnetic field enhanced chassis liquid cooling system.

[0048] Specifically, the chassis can achieve efficient heat dissipation of the electronic components 10a in the chassis by setting up a magnetic field-enhanced chassis liquid cooling system, thereby meeting the heat dissipation requirements of the chassis.

[0049] In one embodiment, if Figure 2 As shown, the case further includes a case body 60, a processor 70 and a graphics card 80. The coolant tank 10, the processor 70 and the graphics card 80 are all installed inside the case body 60, and each liquid cooling block 21 is respectively attached to the processor 70 and the graphics card 80. Specifically, the liquid cooling block 21 can achieve efficient heat dissipation of the processor 70 and the graphics card 80 of the case by attaching the processor 70 and the graphics card 80, so that the processor 70 and the graphics card 80 can work stably.

[0050] In one embodiment, if Figure 2As shown, a mounting frame 61 is provided inside the box 60, the processor 70 and the graphics card 80 are both mounted on the mounting frame 61, and each coil 51 is respectively located on both sides of the mounting frame 61 and fixed to the box 60. Specifically, the mounting frame 61 can be used to fix the graphics card 80 and the processor 70, and it is convenient for the coil 51 to form a magnetic field covering the cooling unit.

[0051] In one embodiment, if Figure 3 As shown, the chassis further includes a cooling fan 90 , which is installed inside the box body 60 to dissipate heat inside the box body 60 .

[0052] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present invention should be included in the protection scope of the present invention.

Claims

1. A magnetic field enhanced chassis liquid cooling system, characterized in that: include: A coolant tank for storing magnetic nanofluid; Liquid cooling unit for bonding electronic components; a circulation unit connected to the cooling liquid tank and the liquid cooling unit, and used for driving the magnetic nanofluid to circulate between the liquid cooling unit and the cooling liquid tank; a heat dissipation unit connected to the coolant tank and used for dissipating heat from the coolant tank; and The magnetic field generator is located outside the liquid cooling unit and is used to form a magnetic field covering the liquid cooling unit.

2. The magnetic field enhanced chassis liquid cooling system according to claim 1, characterized in that: The magnetic field generator comprises at least two coils, each of which is coaxially arranged and respectively located on two sides of the liquid cooling unit.

3. The magnetic field enhanced chassis liquid cooling system according to claim 2, characterized in that: The coil is a Helmholtz coil.

4. The magnetic field enhanced chassis liquid cooling system according to any one of claims 1 to 3, characterized in that: The liquid cooling unit includes a plurality of liquid cooling blocks, each of which is used to fit different electronic components respectively. The circulation unit includes a driving module and a plurality of circulation pipelines, one end of each of the circulation pipelines is connected to the coolant tank, and the other end of each of the circulation pipelines is respectively connected to each liquid cooling block.

5. The magnetic field enhanced chassis liquid cooling system according to claim 4, characterized in that: The driving module includes several liquid pumps, and each of the circulation pipelines includes a liquid inlet pipe and a liquid return pipe. One end of the liquid inlet pipe and the liquid return pipe are connected to the liquid cooling block, and the other end of each liquid inlet pipe and each liquid return pipe is respectively connected to the coolant tank and each liquid cooling block, and each liquid pump is respectively connected to each liquid inlet pipe.

6. The magnetic field enhanced chassis liquid cooling system according to claim 4, characterized in that: A plurality of cooling channels arranged at intervals are arranged inside each of the liquid cooling blocks, and each of the cooling channels is connected to the circulation pipeline.

7. The magnetic field enhanced chassis liquid cooling system according to any one of claims 1 to 3, characterized in that: The heat dissipation unit includes a heat sink, and the heat sink is attached to the coolant tank.

8. A chassis, characterized in that: A magnetic field enhanced chassis liquid cooling system comprising the magnetic field enhanced chassis liquid cooling system as described in any one of claims 1-6.

9. The chassis according to claim 8, characterized in that: The chassis also includes a case body, a processor and a graphics card. The coolant tank, the processor and the graphics card are all installed inside the case body, and each liquid cooling block is respectively attached to the processor and the graphics card.

10. The chassis according to claim 9, characterized in that: A mounting frame is arranged inside the box, the processor and the graphics card are both mounted on the mounting frame, and each of the coils is respectively located on two sides of the mounting frame and fixed to the box.

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