Heat dissipation assembly and semiconductor laser assembly

Abstract

The invention discloses a heat dissipation assembly and a semiconductor laser assembly, the heat dissipation assembly comprises a first cover body, a second cover body and a plurality of heat dissipation plates, and the first cover body is used for being connected with an electronic component and performing heat transfer for the electronic component; the multiple heat dissipation plates are arranged between the first cover body and the second cover body in a stacked mode, and the multiple heat dissipation plates are spaced from one another in the stacking direction; the heat dissipation assembly further comprises an inflow channel, an outflow channel and a cooling channel, the inflow channel and the outflow channel penetrate through the second cover body and / or the heat dissipation plates so that cooling liquid can flow, the cooling channel is connected with the inflow channel and the outflow channel, and the cooling channel comprises a plurality of through holes penetrating through the heat dissipation plates. The through holes of the adjacent heat dissipation plates are arranged in a staggered mode. The heat dissipation assembly and the semiconductor laser assembly are used for enhancing the heat dissipation effect of the heat dissipation assembly.

Description

Technical Field

[0001] This invention relates to the field of semiconductor laser technology, and more particularly to a heat dissipation component and a semiconductor laser component. Background Technology

[0002] Electronic components such as chips are used in fields like semiconductor lasers. These components generate heat during operation, and the accumulation of heat causes the component temperature to gradually rise, affecting its lifespan and performance stability, and consequently impacting the performance of the device in which it resides, such as a semiconductor laser assembly. To improve the lifespan and performance stability of electronic components, heat dissipation components are typically installed to cool them and prevent overheating.

[0003] Existing heat dissipation components typically form a continuous flow channel through which coolant flows. During this flow, the coolant absorbs heat from the electronic components and carries it away with the flow, thus achieving heat dissipation. However, the coolant flow in existing components results in weak turbulence, less heat absorption from the electronic components, insufficient heat exchange, and poor heat dissipation. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation component and a semiconductor laser component to enhance the heat dissipation effect of the heat dissipation component.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A heat dissipation component, comprising:

[0007] A first cover is used to connect to electronic components and to transfer heat with said electronic components;

[0008] Second cover;

[0009] Multiple heat dissipation plates are stacked between the first cover and the second cover, and the multiple heat dissipation plates are spaced apart from each other along the stacking direction;

[0010] The heat dissipation assembly further includes an inflow channel, an outflow channel, and a cooling channel connecting the inflow channel and the outflow channel, which pass through the second cover and / or the heat dissipation plate for coolant flow. The cooling channel includes a plurality of through holes penetrating each of the heat dissipation plates, and the through holes of adjacent heat dissipation plates are staggered.

[0011] Preferably, with the stacking direction as the vertical direction, the cooling channel includes a horizontal channel formed between each two adjacent heat dissipation plates and between the heat dissipation plate and the corresponding first cover and second cover for the coolant to flow in the horizontal direction, and a vertical channel that passes through each heat dissipation plate for the coolant to flow in the vertical direction. The horizontal channel and the vertical channel are staggered, and the through hole is formed in the vertical channel.

[0012] Preferably, the projections of the through holes of adjacent heat sinks onto the same plane along the stacking direction are independent of each other, and each vertical channel is formed between two spaced-apart heat sinks or between the first cover and a spaced-apart heat sink or between the second cover and a spaced-apart heat sink and penetrates only one layer of heat sinks.

[0013] Preferably, the heat sink includes a solid portion located outside the through hole, the projection of the solid portion along the stacking direction covering at least a portion of the through hole of the adjacent heat sink;

[0014] The solid portion of the heat sink is provided with heat sink columns protruding toward the through holes of the adjacent heat sinks. The projection of the heat sink column along the stacking direction at least partially overlaps with the corresponding through hole, and the height of the heat sink column is less than the distance between the adjacent heat sinks.

[0015] Preferably, the first cover is provided with a heat dissipation column protruding toward the through hole of the adjacent heat dissipation plate, the projection of the heat dissipation column of the first cover along the stacking direction at least partially overlaps with the corresponding through hole, and the height of the heat dissipation column of the first cover is less than the distance between the first cover and the adjacent heat dissipation plate.

[0016] And / or, the second cover is provided with a heat dissipation column protruding toward the through hole of the adjacent heat dissipation plate, the projection of the heat dissipation column of the second cover along the stacking direction at least partially overlaps with the corresponding through hole, and the height of the heat dissipation column of the second cover is less than the distance between the second cover and the adjacent heat dissipation plate.

[0017] Preferably, a metal layer is provided between the first cover and the heat sink, between the second cover and the heat sink, and between adjacent heat sinks, respectively. The metal layer is used to separate the first cover, the heat sink, and the second cover from each other. The metal layer is disposed at the edge of the heat sink corresponding to the first cover, the second cover, or the edge of the adjacent heat sink.

[0018] Preferably, the metal layers are respectively provided on the side of the first cover facing the heat sink, the side of the second cover facing the heat sink, and the opposite sides of the heat sink along the stacking direction, and the opposite metal layers are welded and fixed by gold-tin alloy layers.

[0019] Preferably, the thickness of the first cover and the second cover is greater than the thickness of the heat sink.

[0020] Preferably, the first cover and the second cover are respectively plated with a circuit layer, and the circuit layer of the first cover is connected to the electronic component;

[0021] And / or, the first cover, the second cover, and the heat sink are all made of ceramic material.

[0022] Preferably, the inflow channel includes an inlet disposed on the second cover, and the outflow channel includes an outlet disposed on the second cover. The inlet and the outlet are disposed on opposite sides of the second cover. The coolant flows into the heat dissipation component from the inlet and flows in the cooling channel, and flows out of the heat dissipation component from the outlet.

[0023] Preferably, the inflow channel further includes first expansion holes disposed on the plurality of heat dissipation plates, and the outflow channel further includes second expansion holes disposed on the plurality of heat dissipation plates. The plurality of first expansion holes and the water inlet are interconnected along the stacking direction, and the plurality of second expansion holes and the water outlet are interconnected along the stacking direction. The cross-sectional area of ​​the first expansion hole is larger than the cross-sectional area of ​​the water inlet, and the cross-sectional area of ​​the second expansion hole is larger than the cross-sectional area of ​​the water outlet.

[0024] A semiconductor laser assembly, comprising:

[0025] In any of the above heat dissipation components, the first cover of the heat dissipation component is provided with a circuit layer;

[0026] Electronic components are connected to the circuit layer of the first cover.

[0027] Compared with the prior art, the beneficial effects of the present invention include at least the following:

[0028] By including several through holes penetrating each heat sink in the cooling channel, and staggering the through holes of adjacent heat sinks, the coolant can not only flow along the surface of the heat sink, but also flow between different heat sinks through the staggered through holes. The coolant can change its flow direction and generate better turbulence, thereby extending the flow time of the coolant in the heat dissipation component, increasing the heat absorption effect of the coolant, improving the heat exchange efficiency, and thus improving the heat dissipation effect of the heat dissipation component. Attached Figure Description

[0029] Figure 1 This is a three-dimensional structural schematic diagram of a heat dissipation component according to an embodiment of the present invention;

[0030] Figure 2This is an exploded view of a heat dissipation component according to an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of the heat sink in a heat dissipation assembly according to an embodiment of the present invention;

[0032] Figure 4 This is a planar schematic diagram of adjacent heat sinks stacked in a heat dissipation assembly according to an embodiment of the present invention;

[0033] Figure 5 This is a partial cross-sectional view of a heat dissipation assembly according to an embodiment of the present invention;

[0034] Figure 6 yes Figure 5 A magnified view of a portion of the image;

[0035] Figure 7 This is a partial cross-sectional view of a heat dissipation assembly according to another embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of a heat dissipation component and an electronic component in another embodiment of the present invention.

[0037] In the diagram: 100, heat dissipation assembly; 1, first cover; 2, second cover; 21, water inlet; 22, water outlet; 3, heat dissipation plate; 31, through hole; 32, solid part; 33, heat dissipation column; 34, first heat dissipation plate; 35, second heat dissipation plate; 36, first expansion hole; 37, second expansion hole; 5, metal layer; 51, gold-tin alloy layer; 6, inflow channel; 7, outflow channel; 8, cooling channel; 81, horizontal channel; 82, vertical channel; 200, electronic component. Detailed Implementation

[0038] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided to make the invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0039] The terms used to express position and direction in this invention are illustrated with reference to the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this invention.

[0040] like Figure 1 and Figure 2 As shown, the present invention provides a heat dissipation assembly 100, including a first cover 1, a second cover 2, and a plurality of heat dissipation plates 3 disposed between the first cover 1 and the second cover 2.

[0041] Reference Figure 8 The first cover 1 is used to connect to and transfer heat between the electronic component 200 and the electronic component 200. A circuit layer may be plated on the side of the first cover 1 facing away from the heat sink 3. The electronic component 200 can be mounted on the circuit layer to connect with the first cover 1. In this case, the heat generated by the electronic component 200 can be conducted to the heat sink 3 through the first cover 1. Specifically, the circuit layer on the first cover 1 can be plated using DPC (Direct Plating Copper), and the circuit layer can be a copper layer. The electronic component 200 connected to the circuit layer can be a chip. The first cover 1 can be made of ceramic material. The difference in thermal expansion coefficient between the ceramic first cover 1 and the electronic component 200 is small, which can reduce or prevent polarization problems caused by excessive difference in thermal expansion coefficients between the first cover 1 and the electronic component 200, thereby improving the performance of the electronic component 200.

[0042] Reference Figure 2 and Figure 5 The second cover 2 can be disposed below the first cover 1. The second cover 2 is provided with an inlet 21 and an outlet 22. The inlet 21 is used to introduce coolant, so that the coolant can flow into the heat dissipation assembly 100 through the inlet 21 of the second cover 2. After absorbing the heat dissipated by the electronic components 200 in the heat dissipation assembly 100, the coolant can flow out of the heat dissipation assembly 100 through the outlet 22 of the second cover 2. The inlet 21 and the outlet 22 are through holes that penetrate the second cover 2 along the thickness direction of the second cover 2, and the inlet 21 and the outlet 22 can be distributed on opposite sides of the second cover 2. In addition, a circuit layer can be provided on the side of the second cover 2 away from the heat sink 3. Specifically, the circuit layer of the second cover 2 can be plated using the DPC (Direct Plating Copper) method, and the circuit layer can be a copper layer. The second cover 2 can be made of ceramic material so that the difference in thermal expansion coefficient between the second cover 2 and the electronic component 200 is small. This can reduce or prevent polarization problems caused by excessive difference in thermal expansion coefficient between the second cover 2 and the electronic component 200, thereby improving the performance of the electronic component 200.

[0043] Reference Figure 1 and Figure 2 Multiple heat sinks 3 are stacked with the first cover 1 and the second cover 2, and the thickness of any one heat sink 3 is less than the thickness of the first cover 1 or the second cover 2. The heat sinks 3 can be made of ceramic material to minimize the difference in thermal expansion coefficients between the heat sinks 3 and the electronic component 200, thereby reducing or preventing polarization problems caused by excessive differences in thermal expansion coefficients between the heat sinks 3 and the electronic component 200, and improving the performance of the electronic component 200.

[0044] Reference Figures 5 to 8Multiple heat sinks 3, together with the first cover 1 and the second cover 2, form a liquid flow channel for supplying coolant. The liquid flow channel may include an inflow channel 6, an outflow channel 7, and a cooling channel 8 connecting the inflow channel 6 and the outflow channel 7. The starting end of the inflow channel 6 can be the inlet 21 of the second cover 2, allowing coolant to flow into the liquid flow channel through the inflow channel 6. The ending end of the outflow channel 7 can be the outlet 22 of the second cover 2, and the outflow channel 7 can be used to supply coolant to flow out of the liquid flow channel. The cooling channel 8 is used for supplying coolant, and the coolant flowing in the cooling channel 8 can absorb heat dissipated by the electronic component 200 to cool the electronic component 200.

[0045] The cooling channels 8 can be crisscrossed, allowing the coolant to change its flow direction multiple times within them. This creates better turbulence, prolongs the coolant's flow time within the heat dissipation assembly, increases its heat absorption, and improves heat exchange efficiency, thereby enhancing the overall heat dissipation performance of the heat dissipation assembly. Taking a vertical stacking direction as an example, the cooling channels 8 can include multiple vertical channels 82 and multiple horizontal channels 81. The stacking direction refers to the orientation of the first cover 1, the multiple heat sinks 3, and the second cover 2.

[0046] Specifically, multiple heat sinks 3 can be spaced apart from each other along the stacking direction to form a horizontal channel 81 for the coolant to flow perpendicular to the stacking direction. When the coolant flows in the horizontal channel 81, it absorbs the heat generated by the electronic components 200 to dissipate heat from the electronic components 200.

[0047] Reference Figure 3To increase the flow time of the coolant within the cooling channel 8 and enhance its heat absorption effect, the heat sink 3 is also provided with several through holes 31, which are formed within the vertical channel 82. The through holes 31 penetrate the heat sink 3 along the stacking direction. A horizontal channel 81 may be formed on at least one side of the heat sink 3 along the stacking direction. At least a portion of the heat sink 3 may form horizontal channels 81 on opposite sides along the stacking direction. The through hole 31 of the heat sink 3 may communicate with the horizontal channel 81 adjacent to the heat sink 3. For example, when a horizontal channel 81 is formed on one side of the heat sink 3 along the stacking direction, the through hole 31 of the heat sink 3 communicates with the horizontal channel 81 on one side of the heat sink 3, so that the coolant in the horizontal channel 81 can flow into the through hole 31 to change the flow direction. When horizontal channels 81 are formed on opposite sides of the heat sink 3 along the stacking direction, the through hole 31 of the heat sink 3 communicates with the horizontal channels 81 on opposite sides of the heat sink 3 along the stacking direction, so that the coolant in the horizontal channel 81 on one side of the heat sink 3 can change the flow direction to flow into the through hole 31 and then flow into the horizontal channel 81 on the other side of the heat sink 3. When the coolant changes its flow direction at the through-hole 31, turbulence is generated, which reduces the flow velocity of the coolant and allows it to absorb more heat, thereby enhancing the heat absorption efficiency of the coolant and the heat dissipation effect of the heat dissipation component 100. Each through-hole 31 of the heat dissipation plate 3 penetrates the heat dissipation plate 3 along the stacking direction, and the multiple through-holes 31 of each heat dissipation plate 3 are evenly distributed, for example, in a rectangular array.

[0048] Furthermore, the through holes 31 of adjacent heat sinks 3 can be staggered, meaning that the projections of the through holes 31 of adjacent heat sinks 3 onto the same plane along the stacking direction are independent of each other or do not completely overlap. Specifically, the heat sink 3 includes a solid portion 32 formed between adjacent through holes 31, that is, the solid portion 32 is located outside the through holes 31 on the heat sink 3. The through holes 31 are cylindrical holes penetrating the heat sink 3, and the solid portion 32 can be used to separate adjacent through holes 31. The projection of the solid portion 32 of one heat sink 3 along the stacking direction covers at least a portion of the through holes 31 of the adjacent heat sink 3, so that the projections of the through holes 31 of the adjacent heat sink 3 along the stacking direction do not completely overlap. Therefore, a vertical channel 82 can be formed between two heat sinks 3 that are spaced apart. Two heat sinks 3 that are spaced apart means that one heat sink 3 is provided between the two heat sinks 3. The vertical channel 82 extends along the stacking direction from the solid portion 32 of one heat sink 3 to the solid portion 32 of the other heat sink 3. Specifically, the vertical channel 82 includes a through hole 31 in the heat sink 3 located between two spaced heat sinks 3, and a portion extending from the through hole 31 along the stacking direction to the solid portion 32 of the two spaced heat sinks 3. The number of vertical channels 82 between the two spaced heat sinks 3 can be the same as the number of through holes 31 in the heat sink 3 located between the two spaced heat sinks 3, and each vertical channel 82 includes one through hole 31.

[0049] The vertical channel 82 can communicate with the horizontal channel 81 formed by two spaced-apart heat sinks 3 and the heat sink 3 located between the two spaced-apart heat sinks 3, so that the vertical channel 82 and the horizontal channel 81 can together form a tortuous cooling channel 8. When the coolant flows in the cooling channel 8, it can flow from the horizontal channel 81 to the vertical channel 82 connected to the horizontal channel 81, and / or from the vertical channel 82 to the horizontal channel 81 connected to the vertical channel 82. The coolant can flow along a tortuous path in the cooling channel 8 and change its flow direction multiple times. When the coolant changes its flow direction, the turbulence effect of the coolant is enhanced, thereby further increasing the heat absorption efficiency of the coolant and the heat dissipation effect of the heat dissipation component 100.

[0050] When the coolant flows within the cooling channels 8, whenever it flows from the horizontal channel 81 to the vertical channel 82 connected to it, a portion of the coolant can flow into the vertical channel 82 and then into another horizontal channel 81, while the remaining portion continues to flow within the horizontal channel 81. The coolant flows in a tortuous pattern within the crisscrossing cooling channels 8, formed by multiple vertical channels 82 and multiple horizontal channels 81, thereby extending its flow time within the heat dissipation assembly. This allows the coolant to absorb more heat from the electronic components, improving the heat dissipation effect of the heat dissipation assembly.

[0051] Please see Figure 8 When the projection portions of the through holes 31 of adjacent heat sinks 3 onto the same plane along the stacking direction overlap, the two adjacent vertical channels 82 along the stacking direction will also partially overlap. In the stacking direction, the overlapping portions of the two adjacent vertical channels 82 will connect and form a through straight flow channel.

[0052] When the coolant flows in the cooling channel 8, although some of the coolant flows in a straight line through the through-flow channel formed by the overlapping part of two adjacent vertical channels 82 in the stacking direction, the resistance is smaller and the flow velocity is faster when the coolant flows in a straight line, and the flow path is smaller, which will affect the turbulence effect of the coolant in the cooling channel 8. However, some of the coolant flows to the bend of the cooling channel 8, changes the flow direction and generates turbulence, increases the flow path and flow time of this part of the coolant in the heat dissipation component, and can still improve the heat dissipation effect of the heat dissipation component.

[0053] Reference Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure when three adjacent heat sinks are stacked. Figure 4The dashed line represents the outline of the blocked through-holes 31 in the blocked heat sink 3. To further enhance the heat absorption effect of the coolant, the projections of the through-holes 31 of adjacent heat sinks onto the same plane along the stacking direction are preferably independent of each other, that is, the projections of the through-holes 31 of adjacent heat sinks onto the same plane along the stacking direction are completely misaligned and do not overlap. Specifically, the heat sink 3 includes a solid portion 32 formed between adjacent through-holes 31, which is used to separate adjacent through-holes 31. The projection of the solid portion 32 of one heat sink 3 along the stacking direction completely covers the through-holes 31 of adjacent heat sinks 3, so that the projections of the through-holes 31 of adjacent heat sinks 3 along the stacking direction are independent of each other. At this time, two adjacent vertical channels 82 along the stacking direction do not overlap and are independent of each other. Each vertical channel 82 only penetrates one layer of heat sink 3 and does not connect with other vertical channels 82. Therefore, each vertical channel 82 does not directly connect to the first cover 1 and the second cover 2 of the heat dissipation assembly, compared to Figure 8 The heat dissipation assembly shown in this embodiment maximizes the flow path of all coolant in the cooling channel 8. All coolant in a vertical channel 82 flows into a horizontal channel 81 connected to the vertical channel 82 and changes its flow direction, allowing for full flow to remove as much heat as possible from the heat sink 3, further improving heat exchange efficiency, enhancing the turbulence effect of the coolant, and thus enhancing the heat absorption effect of the coolant and the heat dissipation effect of the heat dissipation assembly 100.

[0054] Reference Figure 8 In some specific embodiments, the heat dissipated by the electronic component 200 mainly propagates along the stacking direction into the heat dissipation assembly 100. To effectively absorb the heat dissipated by the electronic component 200, the projections of multiple heat sinks 3 along the stacking direction overlap with the electronic component 200. The cooling channel 8 formed by the multiple heat sinks 3, the first cover 1, and the second cover 2 also overlaps with the electronic component 200 along the stacking direction. Therefore, the heat dissipated by the electronic component 200 can mainly propagate to the cooling channel 8, so that the coolant in the cooling channel 8 can effectively absorb the heat dissipated by the electronic component 200. Preferably, the electronic component 200 and the multiple heat sinks 3 are centrally located, with the electronic component 200 positioned above the multiple heat sinks 3.

[0055] Reference Figure 7In some specific embodiments, to further improve the heat absorption effect of the coolant, the solid part 32 of the heat sink 3 can be provided with heat sink columns 33 protruding towards the through holes 31 of the adjacent heat sink 3. The heat sink columns 33 can be formed between a pair of heat sinks, and the height of the heat sink columns 33 is less than the distance between the adjacent heat sinks 3, preferably less than 2 / 3 of the distance between the adjacent heat sinks 3. When the coolant flows in the horizontal channel 81, the coolant will contact the heat sink columns 33 and generate a flow around them due to the obstruction of the heat sink columns 33, thereby slowing down the flow speed of the coolant, increasing the contact time and contact area between the coolant and the heat sink 3, enhancing the heat absorption effect of the coolant and the heat dissipation effect of the heat dissipation component 100. Specifically, the heat sink columns 33 can be metal columns, which are fixed to or plated onto the heat sink 3. When the main body of the heat sink 3 is made of non-metallic material, the thermal conductivity of the metal heat sink columns 33 is relatively higher, and the coolant can carry away more heat from the heat sink columns 33, further improving the heat exchange efficiency. Furthermore, the projection of the heat dissipation column 33 along the stacking direction at least partially overlaps with the corresponding through hole 31, so that when the coolant flows in the vertical channel 82 corresponding to the through hole 31, it will contact the corresponding heat dissipation column 33 and generate a flow around it, further enhancing the heat absorption effect of the coolant and the heat dissipation effect of the heat dissipation assembly 100. The number of heat dissipation columns 33 on a heat dissipation plate 3 can be the same as the number of through holes 31 on adjacent heat dissipation plates 3 and correspond one-to-one. Preferably, the heat dissipation column 33 is directly aligned with the corresponding through hole 31, that is, the axis of the heat dissipation column 33 and the corresponding through hole 31 coincide.

[0056] Reference Figure 5 and Figure 8 In some specific embodiments, the first cover 1 and the adjacent heat sink 3 can be spaced apart along the stacking direction to form a horizontal channel 81 between the first cover 1 and the adjacent heat sink 3. A vertical channel 82 is formed between the first cover 1 and the spaced-apart heat sink 3, where the spaced-apart heat sink 3 refers to a heat sink 3 spaced apart from the first cover 1. The vertical channel 82 extends along the stacking direction from the first cover 1 to the solid portion 32 of the heat sink 3 spaced apart from the first cover 1. Specifically, the vertical channel 82 includes a through hole 31 in the heat sink 3 adjacent to the first cover 1, and a portion extending from the through hole 31 along the stacking direction to the first cover 1 and the solid portion 32 of the heat sink 3 spaced apart from the first cover 1. The number of vertical channels 82 between the first cover 1 and the spaced-apart heat sink 3 can be the same as the number of through holes 31 in the adjacent heat sink 3, and each vertical channel 82 includes one through hole 31. The vertical channel 82 and the horizontal channel 81 between the first cover 1 and the adjacent heat sink 3, as well as the horizontal channel 81 between the adjacent heat sink 3 and the heat sink 3 separated by a distance, are connected.

[0057] A portion of the coolant can flow within the horizontal channel 81 formed between the first cover 1 and the adjacent heat sink 3, and this portion of coolant can flow to another horizontal channel 81 through a vertical channel 82 connected to the horizontal channel 81; another portion of the coolant can continue to flow within the horizontal channel 81 formed between the first cover 1 and the heat sink 3. Alternatively, a portion of the coolant can flow within the horizontal channel 81 formed between the heat sink 3 adjacent to and separated from the first cover 1, and this portion of coolant can flow to another horizontal channel 81 through a vertical channel 82 connected to the horizontal channel 81; another portion of the coolant can continue to flow within the horizontal channel 81 formed between the heat sink 3 adjacent to and separated from the first cover 1.

[0058] Reference Figure 5 and Figure 8 The first cover 1 may be provided with heat dissipation columns 33 protruding from the through holes 31 of the adjacent heat dissipation plates 3. The height of the heat dissipation columns 33 of the first cover 1 is less than the distance between the first cover 1 and the adjacent heat dissipation plates 3, preferably less than 2 / 3 of the distance between the first cover 1 and the adjacent heat dissipation plates 3. When the coolant flows in the horizontal channel 81 formed by the first cover 1 and the heat dissipation plates 3, it will contact the heat dissipation columns 33 of the first cover 1 to form a flow around them, thereby enhancing the heat absorption effect of the coolant and the heat dissipation effect of the heat dissipation assembly 100. Specifically, the heat dissipation columns 33 on the first cover 1 can be metal columns, which are fixed to the first cover 1. In addition, the projection of the heat dissipation columns 33 of the first cover 1 along the stacking direction can at least partially overlap with the corresponding through holes 31, so that when the coolant flows in the vertical channel 82 corresponding to the through hole 31, it will contact the corresponding heat dissipation columns 33 in the first cover 1 and generate a flow around them, further enhancing the heat absorption effect of the coolant and the heat dissipation effect of the heat dissipation assembly 100. The number of heat dissipation columns 33 on the first cover 1 can be the same as the number of through holes 31 on the corresponding heat dissipation plate 3, and they correspond one-to-one. The heat dissipation columns 33 on the first cover 1 are directly opposite the corresponding through holes 31, that is, the axes of the heat dissipation columns 33 on the first cover 1 and the corresponding through holes 31 are coincident.

[0059] Reference Figure 5 and Figure 8In some specific embodiments, the second cover 2 and the adjacent heat sink 3 can be spaced apart along the stacking direction to form a horizontal channel 81 between the second cover 2 and the adjacent heat sink 3. A vertical channel 82 is formed between the second cover 2 and the spaced-apart heat sink 3, where the spaced-apart heat sink 3 refers to a heat sink 3 spaced apart from the second cover 2. The vertical channel 82 extends along the stacking direction from the second cover 2 to the solid portion 32 of the heat sink 3 spaced apart from the second cover 2. Specifically, the vertical channel 82 includes a through hole 31 in the heat sink 3 adjacent to the second cover 2, and a portion extending from the through hole 31 along the stacking direction to the second cover 2 and the solid portion 32 of the heat sink 3 spaced apart from the second cover 2. The number of vertical channels 82 between the second cover 2 and the spaced-apart heat sink 3 can be the same as the number of through holes 31 in the adjacent heat sink 3, and each vertical channel 82 includes one through hole 31. The vertical channel 82 and the horizontal channel 81 between the second cover 2 and the adjacent heat sink 3, as well as the horizontal channel 81 between the adjacent heat sink 3 and the heat sink 3 separated by a gap, are connected.

[0060] A portion of the coolant can flow within the horizontal channel 81 formed between the second cover 2 and the adjacent heat sink 3, and this portion of coolant can flow to another horizontal channel 81 through a vertical channel 82 connected to the horizontal channel 81; another portion of the coolant can continue to flow within the horizontal channel 81 formed between the second cover 2 and the heat sink 3. Alternatively, a portion of the coolant can flow within the horizontal channel 81 formed between the adjacent heat sink 3 and the heat sink 3 separated from the second cover 2, and this portion of coolant can flow to another horizontal channel 81 through a vertical channel 82 connected to the horizontal channel 81; another portion of the coolant can continue to flow within the horizontal channel 81 formed between the adjacent heat sink 3 and the heat sink 3 separated from the second cover 2.

[0061] The second cover 2 may be provided with heat dissipation columns 33 protruding from the through holes 31 of the adjacent heat dissipation plate 3, and the height of the heat dissipation columns 33 of the second cover 2 is less than the distance between the second cover 2 and the adjacent heat dissipation plate 3, preferably less than 2 / 3 of the distance between the second cover 2 and the adjacent heat dissipation plate 3. When the coolant flows in the horizontal channel 81 formed by the second cover 2 and the heat dissipation plate 3, it will contact the heat dissipation columns 33 of the second cover 2 to form a flow around them, thereby enhancing the heat absorption effect of the coolant and the heat dissipation effect of the heat dissipation assembly 100. Specifically, the heat dissipation columns 33 on the second cover 2 can be metal columns, which are fixed to the second cover 2. In addition, the projection of the heat dissipation columns 33 of the second cover 2 along the stacking direction can at least partially overlap with the corresponding through holes 31, so that when the coolant flows in the vertical channel 82 corresponding to the through holes 31, it will contact the corresponding heat dissipation columns 33 in the second cover 2 and generate a flow around them, further enhancing the heat absorption effect of the coolant and the heat dissipation effect of the heat dissipation assembly 100. The number of heat dissipation columns 33 on the second cover 2 can be the same as the number of through holes 31 on the corresponding heat dissipation plate 3, and they correspond one-to-one. The heat dissipation columns 33 on the second cover 2 are directly opposite the corresponding through holes 31, that is, the axes of the heat dissipation columns 33 on the second cover 2 and the corresponding through holes 31 are coincident.

[0062] Reference Figure 2 , Figure 5 and Figure 8 In some specific embodiments, multiple heat sinks 3 may each be provided with a first expansion hole 36 and a second expansion hole 37. The multiple first expansion holes 36 provided on the multiple heat sinks 3 are interconnected with the water inlet 21 provided on the second cover 2 and together form an inflow channel 6. Specifically, the multiple first expansion holes 36 of the multiple heat sinks and the water inlet 21 are arranged sequentially along the stacking direction and are interconnected. At the same time, the first expansion holes 36 can also be connected to the horizontal channels 81 on both sides of the heat sink 3 that form the first expansion holes 36, so that the inflow channel 6 is connected to the cooling channel 8.

[0063] Multiple second expansion holes 37 on multiple heat sinks 3 are interconnected with water outlets 22 and together form an outflow channel 7. Specifically, the multiple second expansion holes 37 and water outlets 22 on multiple heat sinks 3 are arranged sequentially along the stacking direction and are interconnected. At the same time, the second expansion holes 37 can also be connected to the horizontal channels 81 on both sides of the heat sink 3 forming the second expansion holes 37, so that the outflow channel 7 is connected to the cooling channel 8. Among them, the cross-sectional area of ​​the first expansion hole 36 is larger than the cross-sectional area of ​​the water inlet 21, and the cross-sectional area of ​​the second expansion hole 37 is larger than the cross-sectional area of ​​the water outlet 22. When the coolant enters the heat dissipation assembly 100 from the water inlet 21, the coolant will flow sequentially to the multiple first expansion holes 36, and then flow through the first expansion holes 36 to the horizontal channel 81 connected to the first expansion holes 36. The coolant flows in a tortuous manner in the cooling channel 8, and then flows to the outflow channel 7 connected to the cooling channel 8, and is discharged from the heat dissipation assembly 100 through the water outlet 22 of the outflow channel 7.

[0064] In some specific embodiments, metal layers 5 are respectively provided between the first cover 1 and the heat sink 3, between the second cover 2 and the heat sink 3, and between adjacent heat sinks 3. The metal layers 5 are used to separate the first cover 1, the heat sink 3, and the second cover 2 from each other. The metal layers 5 can be located at the edge of the heat sink 3 corresponding to the first cover 1, the second cover 2, or the adjacent heat sink 3 to avoid affecting the flow of coolant.

[0065] Specifically, metal layers 5 are respectively provided on the side of the first cover 1 facing the heat sink 3, the side of the second cover 2 facing the heat sink 3, and the opposite sides of the heat sink 3 along the stacking direction. The metal layer 5 on the side of the first cover 1 facing the heat sink 3 is stacked opposite to the metal layer 5 of the corresponding heat sink 3 facing the first cover 1 to jointly separate the first cover 1 and the heat sink 3. The metal layer 5 on the side of the second cover 2 facing the heat sink 3 is stacked opposite to the metal layer 5 of the corresponding heat sink 3 facing the second cover 2 to jointly separate the second cover 2 and the heat sink 3. In two adjacent heat sinks 3, the metal layer 5 of one heat sink 3 facing the other heat sink 3 is stacked opposite to the metal layer 5 of the other heat sink 3 facing the first heat sink 3 to jointly separate the two adjacent heat sinks 3.

[0066] In this configuration, opposing metal layers 5 are fixedly connected so that when stacked, they form a whole and together serve to separate the first cover 1 from the heat sink 3, or the second cover 2 from the heat sink 3, or adjacent heat sinks 3. The opposing metal layers 5 can be fixedly connected by incorporating at least one gold-tin alloy layer 51 in each of the opposing metal layers 5, followed by eutectic bonding through the gold-tin alloy layer 51 after stacking. Specifically, the metal layers 5 can be deposited on the first cover 1, the heat sink 3, and the second cover 2 using a DPC (Direct Plating Copper) method.

[0067] In some specific embodiments, the plurality of heat sinks 3 include at least one first heat sink 34 and at least one second heat sink 35. The first heat sink 34 and the second heat sink 35 are staggered and stacked, and the two heat sinks 3 that are spaced apart are the two closest first heat sinks 34 or the two closest second heat sinks 35, and the through holes 31 of the first heat sink 34 and the through holes 31 of the second heat sink 35 are misaligned. The first heat sink 34 and the adjacent second heat sink 35 are spaced apart and form a horizontal channel 81. The two heat sinks 3 on opposite sides of a heat sink 3 can have the same structure, that is, both are first heat sinks 34 or second heat sinks 35. For example, the first heat sink 34 is located between two second heat sinks 35, or the second heat sink 35 is located between two first heat sinks 34. The plurality of heat sinks 3 are composed of first heat sinks 34 and second heat sinks 35, and there can be multiple first heat sinks 34 and multiple second heat sinks 35. When processing the heat sink 3, only two types of heat sink 3 need to be processed, namely the first heat sink 34 and the second heat sink 35. Then, the first heat sink 34 and the second heat sink 35 are stacked alternately to form multiple heat sinks 3, which facilitates the processing of the heat sink 3.

[0068] It should be noted that this embodiment is described using a vertical stacking direction as an example. The horizontal channel 81 is for horizontal flow of coolant, and the vertical channel 82 is for vertical flow of coolant. In other embodiments, if the stacking direction is not vertical, the horizontal channel 81 can also be configured to allow coolant to flow in a direction perpendicular or approximately perpendicular to the stacking direction, and is not limited to horizontal flow; similarly, the vertical channel 82 can also be configured to allow coolant to flow in a direction horizontal or approximately horizontal to the stacking direction, and is not limited to vertical flow.

[0069] Reference Figure 8The present invention also provides a semiconductor laser assembly, including the aforementioned heat dissipation assembly 100 and electronic component 200. The electronic component 200 may be, for example, a chip, mounted on the circuit layer of the first cover 1 of the heat dissipation assembly 100, and the electronic component 200 dissipates heat through the heat dissipation assembly 100. The electronic component 200 may be mounted in the center of the first cover 1 and centrally aligned with a plurality of heat sinks 3 in the heat dissipation assembly 100.

[0070] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the invention without departing from the principles and spirit of the invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. A heat dissipation component, characterized in that, include: A first cover (1) is used to connect to an electronic component (200) and to transfer heat to the electronic component (200); Second cover (2); Multiple heat dissipation plates (3) are stacked between the first cover (1) and the second cover (2), and the multiple heat dissipation plates (3) are spaced apart from each other along the stacking direction; The heat dissipation assembly further includes an inflow channel (6) and an outflow channel (7) that pass through the second cover (2) and / or the heat dissipation plate (3) for coolant flow, and a cooling channel (8) that connects the inflow channel (6) and the outflow channel (7). The cooling channel (8) includes a plurality of through holes (31) penetrating each of the heat dissipation plates (3), and the through holes (31) of adjacent heat dissipation plates (3) are staggered.

2. The heat dissipation assembly according to claim 1, characterized in that, With the stacking direction as the vertical direction, the cooling channel (8) includes a horizontal channel (81) formed between each two adjacent heat dissipation plates (3) and between the heat dissipation plate (3) and the corresponding first cover (1) and second cover (2) for the coolant to flow in the horizontal direction, and a vertical channel (82) that passes through each heat dissipation plate (3) for the coolant to flow in the vertical direction. The horizontal channel (81) and the vertical channel (82) are arranged to intersect each other, and the through hole (31) is formed in the vertical channel (82).

3. The heat dissipation assembly according to claim 2, characterized in that, The projections of the through holes (31) of adjacent heat sinks (3) onto the same plane along the stacking direction are independent of each other. Each vertical channel (82) is formed between two spaced heat sinks (3) or the first cover (1) and the spaced heat sink (3) or the second cover (2) and the spaced heat sink (3), and penetrates only one heat sink (3).

4. The heat dissipation assembly according to claim 1, characterized in that, The heat sink (3) includes a solid portion (32) located outside the through hole (31). The projection of the solid portion (32) along the stacking direction covers at least a portion of the through hole (31) of the adjacent heat sink (3). The solid portion (32) of the heat sink (3) is provided with a heat sink column (33) protruding toward the through hole (31) of the adjacent heat sink (3). The projection of the heat sink column (33) along the stacking direction overlaps at least partially with the corresponding through hole (31), and the height of the heat sink column (33) is less than the distance between the adjacent heat sinks (3).

5. The heat dissipation assembly according to claim 1, characterized in that, The first cover (1) is provided with a heat dissipation column (33) protruding toward the through hole (31) of the adjacent heat dissipation plate (3). The projection of the heat dissipation column (33) of the first cover (1) along the stacking direction at least partially overlaps with the corresponding through hole (31), and the height of the heat dissipation column (33) of the first cover (1) is less than the distance between the first cover (1) and the adjacent heat dissipation plate (3). And / or, the second cover (2) is provided with a heat dissipation column (33) protruding toward the through hole (31) of the adjacent heat dissipation plate (3), the projection of the heat dissipation column (33) of the second cover (2) along the stacking direction at least partially overlaps with the corresponding through hole (31), and the height of the heat dissipation column (33) of the second cover (2) is less than the distance between the second cover (2) and the adjacent heat dissipation plate (3).

6. The heat dissipation assembly according to claim 1, characterized in that, A metal layer (5) is provided between the first cover (1) and the heat sink (3), between the second cover (2) and the heat sink (3), and between adjacent heat sinks (3). The metal layer (5) separates the first cover (1), the heat sink (3), and the second cover (2) from each other. The metal layer (5) is provided at the edge position of the heat sink (3) corresponding to the first cover (1), the second cover (2), or the adjacent heat sink (3).

7. The heat dissipation assembly according to claim 6, characterized in that, The first cover (1) facing the heat sink (3), the second cover (2) facing the heat sink (3), and the opposite sides of the heat sink (3) along the stacking direction are respectively provided with the metal layer (5), and the opposite metal layer (5) is welded and fixed by a gold-tin alloy layer (51).

8. The heat dissipation assembly according to claim 1, characterized in that, The thickness of the first cover (1) and the second cover (2) is greater than the thickness of the heat sink (3).

9. The heat dissipation assembly according to claim 1, characterized in that, The first cover (1) and the second cover (2) are respectively plated with a circuit layer, and the circuit layer of the first cover (1) is connected to the electronic component (200); And / or, the first cover (1), the second cover (2) and the heat sink (3) are respectively made of ceramic material.

10. The heat dissipation assembly according to claim 1, characterized in that, The inflow channel (6) includes an inlet (21) disposed on the second cover (2), and the outflow channel (7) includes an outlet (22) disposed on the second cover (2). The inlet (21) and the outlet (22) are disposed on opposite sides of the second cover (2). The coolant flows into the heat dissipation component from the inlet (21) and flows in the cooling channel (8), and flows out of the heat dissipation component from the outlet (22).

11. The heat dissipation assembly according to claim 10, characterized in that, The inflow channel (6) further includes a first expansion hole (36) disposed on the plurality of heat sinks (3), and the outflow channel (7) further includes a second expansion hole (37) disposed on the plurality of heat sinks (3). The plurality of first expansion holes (36) and the inlet (21) are interconnected along the stacking direction, and the plurality of second expansion holes (37) and the outlet (22) are interconnected along the stacking direction. The cross-sectional area of ​​the first expansion hole (36) is larger than the cross-sectional area of ​​the inlet (21), and the cross-sectional area of ​​the second expansion hole (37) is larger than the cross-sectional area of ​​the outlet (22).

12. A semiconductor laser assembly, characterized in that, include: The heat dissipation assembly as described in any one of claims 1 to 11, wherein the first cover (1) of the heat dissipation assembly is provided with a circuit layer; Electronic components (200) are connected to the circuit layer of the first cover (1).

Images