Novel dual-purpose chuck for wafer

Abstract

The utility model relates to a wafer novel dual-purpose chuck, which is used for being installed in a vacuum chamber of welding equipment, and comprises a heating assembly, which comprises a heating disc, and the top surface of the heating disc is provided with a supporting assembly used for supporting a wafer; a heating wire is arranged on the bottom surface of the heating disc, the heating wire is coiled into a plurality of heating rings, and the plurality of heating rings are distributed at equal intervals along the radial direction of the heating disc; the cooling assembly comprises a cooling disc, the cooling disc is fixedly connected with the bottom face of the heating disc, a flow channel corresponding to the heating ring is formed in the cooling disc, and the flow channel is used for being filled with a cooling medium; and the temperature control assembly comprises a thermocouple, a detection head of the thermocouple is arranged on the heating disc and used for detecting the temperature of the heating disc, a detection piece is electrically connected with a controller, and the output end of the controller is electrically connected with the heating wire. According to the novel dual-purpose chuck for the wafer, the wafer can be heated more uniformly by the heating disc, a welding process and a cooling process are combined, and the welding quality and efficiency of the wafer are improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor welding equipment, and in particular to a novel dual-purpose chuck for wafers. Background Art

[0002] With the development of semiconductor technology, the manufacturing processes related to it have also developed rapidly. The vacuum reflow process has greatly improved the welding quality with its superior welding performance. Different from the traditional reflow process, the vacuum process is added to further reduce the void rate. It is more widely used in advanced semiconductors, new energy, consumer electronics, military and aerospace fields.

[0003] In the prior art, in the process of advanced semiconductor packaging, a reflow process is required to solder the pins of the formed chip. The traditional soldering method is to apply flux on the surface and then send it into the furnace for soldering. At present, it is gradually replaced by a formic acid reflow process with formic acid and nitrogen. This process is simple, low-cost, and does not require cleaning flux. In the packaging process, since the wafer is round, most of the existing packaging welding equipment cabins are rectangular. The rectangle can match the jig to optimize the arrangement of the maximum number of parts to be welded. There are very few equipment cabins for wafer packaging.

[0004] The patent with publication number CN212946142U provides a wafer welding platform, which adopts a heating method of a heating tube, and adopts multiple heating tubes to be inserted uniformly from the circumference to the center of the circle. This solution has several disadvantages. The volume of the heating tube itself is relatively large, so the overall thickness of the heating platform is virtually increased. The increase in thickness will lead to a decrease in the heat transfer rate during the heating process and an increase in manufacturing costs; the installation form of the heating tube will lead to an increasing temperature difference from the center of the circle to the circumference, which is easy to cause the risk of uneven heating and is difficult to achieve process indicators;

[0005] Therefore, it is necessary to provide a chuck for the existing reflow soldering equipment to provide a carrier for the soldering process in wafer packaging, that is, a soldering chuck, to enhance the uniformity of heating, reduce costs, and further improve the soldering quality, so as to realize the upgrading of product equipment and enhance the competitiveness and vitality of enterprises. Summary of the invention

[0006] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a novel dual-purpose chuck for wafers, the chuck being used to be installed in the vacuum chamber of the welding equipment, comprising:

[0007] A heating assembly, the heating assembly comprising a heating plate, the top surface of the heating plate being provided with a supporting assembly for supporting the wafer; a heating wire being provided on the bottom surface of the heating plate, the heating wire having a fixed section and a connecting section, the fixed section of the heating wire being wound on the heating plate into a plurality of heating coils, the plurality of heating coils being distributed at equal intervals along the radial direction of the heating plate;

[0008] A cooling assembly, the cooling assembly comprising a cooling plate, the cooling plate being fixedly connected to the bottom surface of the heating plate, the cooling plate being provided with a flow channel corresponding to the heating coil, the flow channel being used to be filled with a cooling medium;

[0009] The temperature control component includes a thermocouple, which is arranged on the heating plate and used to detect the temperature of the heating plate. The detection component is electrically connected to a controller, and the output end of the controller is electrically connected to the heating wire.

[0010] According to the technical solution provided in the embodiment of the present application, the support assembly includes at least three detection needles, and the at least three detection needles are distributed around the axis of the heating plate, and the axis of the detection needle is perpendicular to the top surface of the heating plate.

[0011] According to the technical solution provided in the embodiment of the present application, a mesh anti-sticking groove is provided on the top surface of the heating plate.

[0012] According to the technical solution provided in the embodiment of the present application, a limiting groove matching the heating ring is provided on the bottom surface of the heating plate for positioning the heating wire. The bottom surface of the heating plate is also fixedly connected to a fixing strip for preventing the heating wire from escaping from the limiting groove.

[0013] According to the technical solution provided in the embodiment of the present application, the cooling plate includes a base plate and a cover plate welded to each other, the flow channel is opened on the top surface of the base plate, and the cover plate covers the flow channel.

[0014] According to the technical solution provided in the embodiment of the present application, the input end of the flow channel is connected to a water inlet pipe, and the output end of the flow channel is connected to a water outlet pipe, which is used to circulate cooling water into the flow channel.

[0015] According to the technical solution provided in the embodiment of the present application, a connecting component is fixedly connected to the bottom surface of the cooling plate, the connecting component movably passes through the bottom wall of the vacuum chamber, and is fixedly connected to a driving component, and the driving component is used to drive the connecting component to move along the axis of the vacuum chamber.

[0016] According to the technical solution provided in the embodiment of the present application, the connecting assembly includes a connecting tube, the connecting section of the heating wire and the thermocouple pass through the cooling plate and extend into the connecting tube, the connecting tube is used to accommodate the heating wire, the water inlet pipe, the water outlet pipe and the thermocouple, a plurality of strip holes are opened on the outer wall of the connecting tube, and the plurality of strip holes are distributed around the axis of the connecting tube, one end of the connecting tube is fixedly connected to the bottom surface of the cooling plate, and the other end is fixedly connected to the driving end of the driving assembly through a flange, and a bellows is covered on the outer wall of the connecting tube.

[0017] According to the technical solution provided in the embodiment of the present application, an insulating cable is wrapped on the connecting section of the heating wire located outside the vacuum chamber.

[0018] According to the technical solution provided in the embodiment of the present application, a plurality of first through holes are provided on the flange, which are respectively used to allow the connecting section of the heating wire, the thermocouple, the water inlet pipe and the water outlet pipe to pass through.

[0019] The beneficial effects are:

[0020] When welding the pins of the wafer, the wafer is placed on the support assembly, and the controller controls the heating wire to heat up so that the heating plate is heated to a preset temperature to weld the pins of the wafer; after welding is completed, a cooling medium is filled into the flow channel to cool down.

[0021] The temperature of the heating plate is detected by the thermocouple, and the detected temperature information is transmitted to the controller, and the controller compares the real-time temperature information with the preset heating temperature. When the heating plate reaches the preset temperature, the controller controls the heating wire to stop heating up, so that the heating plate is stabilized at the preset temperature; the cooling component can timely cool the wafer after welding, so as to avoid oxidation of the wafer after being moved out of the vacuum chamber due to insufficient cooling; the heating wire is coiled into a plurality of heating coils, and the plurality of heating coils are evenly distributed along the radial direction of the heating plate, so that the heating plate heats the wafer more evenly, and the welding process and the cooling process are combined to improve the welding quality and efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0023] Figure 1 It is a schematic diagram of the exploded structure of a new dual-purpose chuck for wafers;

[0024] Figure 2 It is an internal cross-sectional view of the welding equipment;

[0025] Figure 3 A top view of a new dual-purpose chuck for wafers;

[0026] Figure 4 for Figure 1 A bottom view of the middle heating plate;

[0027] Figure 5 for Figure 3 Middle AA section view;

[0028] In the figure:

[0029] 1. Heating assembly; 11. Heating plate; 111. Second through hole; 12. Heating wire; 121. Insulated cable; 122. Heating wire gland; 13. Anti-sticking groove; 14. Limiting groove; 15. Fixing strip; 2. Cooling assembly; 21. Bottom plate; 22. Cover plate; 23. Flow channel; 24. Water inlet pipe; 25. Water outlet pipe; 3. Welding equipment; 31. Vacuum chamber; 32. Control room; 4. Connecting assembly; 41. Connecting tube; 411. Strip hole; 42. Flange; 5. Thermocouple; 51. Thermocouple gland; 6. Detection needle; 71. First water pipe joint; 72. Second water pipe joint. DETAILED DESCRIPTION

[0030] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0031] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] Please refer to Figure 1~Figure 5 A novel dual-purpose chuck for wafers, the chuck is used to be installed in the vacuum chamber 31 of the welding equipment 3, comprising:

[0033] A heating assembly 1, the heating assembly 1 comprising a heating plate 11, the top surface of the heating plate 11 being provided with a supporting assembly for supporting a wafer; a heating wire 12 being provided on the bottom surface of the heating plate 11, the heating wire 12 having a fixed section and a connecting section, the fixed section of the heating wire 12 being wound on the heating plate 11 into a plurality of heating coils, the plurality of heating coils being distributed at equal intervals along the radial direction of the heating plate 11;

[0034] A cooling assembly 2, wherein the cooling assembly 2 comprises a cooling plate, wherein the cooling plate is fixedly connected to the bottom surface of the heating plate 11, wherein a flow channel 23 corresponding to the heating coil is provided in the cooling plate, and wherein the flow channel 23 is used to be filled with a cooling medium;

[0035] The temperature control component includes a thermocouple 5 , a detection head of the thermocouple 5 is arranged on the heating disk 11 for detecting the temperature of the heating disk 11 , the thermocouple is electrically connected to a controller, and an output end of the controller is electrically connected to the heating wire 12 .

[0036] Specifically, the heating plate 11 is circular.

[0037] Specifically, the cooling plate and the heating plate 11 are fixedly connected by bolts.

[0038] Specifically, the cooling medium is cold water.

[0039] Specifically, the thermocouple 5 is a three-head platinum resistor, and the three detection heads of the three-head platinum resistor are evenly distributed on the bottom surface of the heating plate 11.

[0040] Specifically, the fixed section of the heating wire 12 is coiled into a plurality of heating coils, and the plurality of heating coils are evenly spaced radially along the heating disk 11. During the heating process, the heat of each heating coil is transferred to its periphery, and the distance between adjacent heating coils is consistent, thereby improving the temperature uniformity of the heating disk 11.

[0041] Furthermore, the denser the distribution of the heating coils is, the higher the temperature uniformity is and the better the heating effect is.

[0042] Specifically, a circular hole for the connecting section of the heating wire 12 to pass through is opened at the center of the cooling plate.

[0043] Specifically, the controller controls the heating wire 12 to heat up so that the heating plate 11 is heated to a preset temperature to weld the pins of the wafer. After welding is completed, the controller controls the heating wire 12 to stop heating, and then fills the cooling medium into the flow channel 23. The cooling component 2 can timely cool down the welded wafer to avoid oxidation of the wafer after being moved out of the vacuum chamber 31 without being fully cooled.

[0044] In a preferred embodiment, the support assembly includes at least three detection needles 6 , and the at least three detection needles 6 are distributed around the axis of the heating plate 11 , and the axis of the detection needles 6 is perpendicular to the top surface of the heating plate 11 .

[0045] Specifically, a second through hole 111 corresponding to the detection needle 6 is formed on the top surface of the heating plate 11 , and the detection needle 6 is inserted into the second through hole 111 .

[0046] Specifically, the detection needle 6 is electrically connected to the controller, and is used to transmit the detected wafer temperature information to the controller.

[0047] In a preferred embodiment, a mesh anti-sticking groove 13 is provided on the top surface of the heating plate 11 .

[0048] Specifically, the anti-sticking groove 13 is in a spider web shape to prevent the wafer from sticking to the surface of the heating plate 11 during the heating process.

[0049] In a preferred embodiment, a limiting groove 14 matching the heating ring is formed on the bottom surface of the heating disk 11 for positioning the fixed section of the heating wire 12. The bottom surface of the heating disk 11 is also fixedly connected with a fixing bar 15 for preventing the fixed section of the heating wire 12 from escaping from the limiting groove 14.

[0050] Specifically, an expansion margin is left in the limiting groove 14 to prepare for releasing space for deformation of the heating wire 12 .

[0051] Specifically, the starting point of the fixed section of the heating wire 12 is fixed at the center of the heating plate 11 , and then the heating wire 12 is inserted into the limiting groove 14 .

[0052] In a preferred embodiment, the cooling plate includes a bottom plate 21 and a cover plate 22 welded to each other, the flow channel 23 is opened on the top surface of the bottom plate 21 , and the cover plate 22 covers the flow channel 23 .

[0053] Specifically, the cover plate 22 serves to seal the flow channel 23 .

[0054] In a preferred embodiment, the input end of the flow channel 23 is connected to a water inlet pipe 24 , and the output end of the flow channel 23 is connected to a water outlet pipe 25 for circulating cooling water into the flow channel 23 .

[0055] Specifically, the cooling water enters the flow channel 23 along the water inlet pipe 24 , cools down the heating plate 11 while flowing along the tortuous flow channel 23 , and then flows out along the water outlet pipe 25 .

[0056] In a preferred embodiment, a connecting component 4 is fixedly connected to the bottom surface of the cooling plate, the connecting component 4 movably passes through the bottom wall of the vacuum chamber 31, and is fixedly connected to a driving component, and the driving component is used to drive the connecting component 4 to move along the axis of the vacuum chamber 31.

[0057] Specifically, the driving assembly is disposed in a control room 32 of the welding device 3 .

[0058] In a preferred embodiment, the connecting assembly 4 includes a connecting tube 41, the connecting section of the heating wire 12 and the thermocouple 5 pass through the cooling plate and extend into the connecting tube 41, the connecting tube 41 is used to accommodate the connecting section of the heating wire 12, the water inlet pipe 24, the water outlet pipe 25 and the thermocouple 5, a plurality of strip holes 411 are opened on the outer wall of the connecting tube 41, and the plurality of strip holes 411 are distributed around the axis of the connecting tube 41, one end of the connecting tube 41 is fixedly connected to the bottom surface of the cooling plate, and the other end is fixedly connected to the driving end of the driving assembly through a flange 42, and a bellows 43 is covered on the outer wall of the connecting tube 41.

[0059] Specifically, a third through hole is formed on the flange 42 , and the third through hole is connected to a vacuum pumping device.

[0060] Specifically, when the vacuum chamber 31 needs to be evacuated, the driving assembly drives the chuck to move upward along the axis of the vacuum chamber 31 so that the vacuum chamber 31 is connected to the connecting tube 41 through the strip hole 411. After the vacuuming is completed, the driving assembly drives the chuck to move downward along the axis of the vacuum chamber 31 so that all the strip holes 411 are in the control chamber 32, blocking the connection between the vacuum chamber 31 and the connecting tube 41.

[0061] Specifically, one end of the bellows 43 is fixedly connected to the top wall of the control chamber 32 , and the other end is fixedly connected to the flange 42 .

[0062] In a preferred embodiment, an insulating cable 121 is wrapped around the connecting section of the heating wire 12 outside the vacuum chamber 31 .

[0063] Specifically, the insulating cable 121 is used to protect the heating wire 12 , and the insulating cable 121 is located outside the vacuum chamber 31 , which can reduce the pollution of the vacuum chamber 31 caused by volatiles generated by the insulating cable 121 when heated.

[0064] In a preferred embodiment, the flange 42 is provided with a plurality of first through holes for respectively passing the connecting section of the heating wire 12 , the thermocouple 5 , the water inlet pipe 24 and the water outlet pipe 25 .

[0065] Specifically, after the free end of the heating wire 12 passes through the first through hole, it is fixedly sealed at the bottom of the flange 42 through the heating wire pressure cover 122 , and after the free end of the thermocouple 5 passes through the first through hole, it is fixedly sealed at the bottom of the flange 42 through the thermocouple pressure cover 51 .

[0066] Specifically, after the free end of the water inlet pipe 24 passes through the flange 42, it is connected to the first water pipe joint 71, and the first water pipe joint 71 is connected to the output end of the circulating water supply equipment through the water pipe. After the free end of the water outlet pipe 25 passes through the flange 42, it is connected to the second water pipe joint 72, and the second water pipe joint 72 is connected to the input end of the circulating water supply equipment through the water pipe.

[0067] Workflow:

[0068] When welding the pins of the wafer, the wafer is placed on the support assembly, the driving assembly drives the chuck to move upward along the axis of the vacuum chamber 31, and the vacuum pumping device vacuumizes the vacuum chamber 31. After the vacuum pumping is completed, the driving assembly drives the chuck to move downward along the axis of the vacuum chamber 31, so that the strip holes 411 are all in the control chamber 32, blocking the connection between the vacuum chamber 31 and the connecting tube 41; the controller controls the heating wire 12 to heat up the heating disk 11 to a preset temperature to weld the pins of the wafer; after the welding is completed, the circulating water supply device allows the cooling water to enter the flow channel 23 along the water inlet pipe 24, and when flowing along the tortuous flow channel 23, the heating disk 11 is cooled down, and then flows back to the circulating water supply device along the water outlet pipe 25. The new dual-purpose chuck for the wafer makes the heating disk 11 heat the wafer more evenly, and combines the welding process with the cooling process, thereby improving the welding quality and efficiency of the wafer.

[0069] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with (but not limited to) technical features with similar functions disclosed in the present application.

Claims

1. A novel dual-purpose wafer chuck, the chuck being used for installation in a vacuum chamber (31) of a welding device (3), characterized in that: include: A heating component (1), the heating component (1) comprising a heating plate (11), the top surface of the heating plate (11) being provided with a support component for supporting a wafer; the bottom surface of the heating plate (11) being provided with a heating wire (12), the heating wire (12) having a fixed section and a connecting section, the fixed section of the heating wire (12) being wound on the heating plate (11) into a plurality of heating coils, the plurality of heating coils being distributed at equal intervals along the radial direction of the heating plate (11); A cooling assembly (2), the cooling assembly (2) comprising a cooling plate, the cooling plate being fixedly connected to the bottom surface of the heating plate (11), the cooling plate being provided with a flow channel (23) corresponding to the heating coil, the flow channel (23) being used to be filled with a cooling medium; A temperature control component, the temperature control component comprising a thermocouple (5), the detection head of the thermocouple (5) being arranged on the heating disk (11) and being used to detect the temperature of the heating disk (11), the thermocouple (5) being electrically connected to a controller, and the output end of the controller being electrically connected to the heating wire (12).

2. A novel dual-purpose wafer chuck according to claim 1, characterized in that: The support assembly comprises at least three detection needles (6), wherein the at least three detection needles (6) are distributed around the axis of the heating plate (11), and the axis of the detection needles (6) is perpendicular to the top surface of the heating plate (11).

3. A novel dual-purpose wafer chuck according to claim 1, characterized in that: The top surface of the heating plate (11) is provided with a mesh anti-sticking groove (13).

4. A novel dual-purpose wafer chuck according to claim 3, characterized in that: The bottom surface of the heating plate (11) is provided with a limiting groove (14) matching the heating ring and used for positioning the heating wire (12); the bottom surface of the heating plate (11) is also fixedly connected with a fixing strip (15) for preventing the heating wire (12) from escaping from the limiting groove (14).

5. The novel dual-purpose wafer chuck according to claim 1, characterized in that: The cooling plate comprises a base plate (21) and a cover plate (22) which are welded to each other, the flow channel (23) is opened on the top surface of the base plate (21), and the cover plate (22) covers the flow channel (23).

6. A novel dual-purpose wafer chuck according to claim 5, characterized in that: The input end of the flow channel (23) is connected to a water inlet pipe (24), and the output end of the flow channel (23) is connected to a water outlet pipe (25) for circulating cooling water into the flow channel (23).

7. A novel dual-purpose wafer chuck according to claim 6, characterized in that: A connecting component (4) is fixedly connected to the bottom surface of the cooling plate. The connecting component (4) movably penetrates the bottom wall of the vacuum chamber (31) and is fixedly connected to a driving component. The driving component is used to drive the connecting component (4) to move along the axis of the vacuum chamber (31).

8. The novel dual-purpose wafer chuck according to claim 7, characterized in that: The connecting assembly (4) comprises a connecting tube (41), the connecting section of the heating wire (12) and the thermocouple penetrate the cooling disk and extend into the connecting tube (41), the connecting tube (41) is used to accommodate the connecting section of the heating wire (12), the water inlet pipe (24), the water outlet pipe (25) and the thermocouple (5), the outer wall of the connecting tube (41) is provided with a plurality of strip holes (411), the plurality of strip holes (411) are distributed around the axis of the connecting tube (41), one end of the connecting tube (41) is fixedly connected to the bottom surface of the cooling disk, and the other end is fixedly connected to the driving end of the driving assembly via a flange (42), and a bellows (43) is provided on the outer wall of the connecting tube (41).

9. The novel dual-purpose wafer chuck according to claim 1, characterized in that: An insulating cable (121) is wrapped around the connecting section of the heating wire (12) located outside the vacuum chamber (31).

10. The novel dual-purpose wafer chuck according to claim 8, characterized in that: The flange (42) is provided with a plurality of first through holes for respectively allowing the connecting section of the heating wire (12), the thermocouple (5), the water inlet pipe (24) and the water outlet pipe (25) to pass through.

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