Silicon wafer curing film dissolving and soaking tank

Abstract

The utility model relates to the technical field of silicon wafers, and discloses a silicon wafer curing film dissolving and soaking tank which comprises a tank body, a containing tank is arranged in the tank body, a placing frame is arranged in the containing tank, a placing tank is arranged in the placing frame, communicating grooves are formed in the side walls of the placing tank, a fixing plate is arranged on the upper end face of the placing frame, and inserting holes are formed in the side walls of the fixing plate. A cover body is arranged on the upper end face of the groove body, a mounting cavity is formed in the cover body, a penetrating groove is formed in the lower end face of the mounting cavity, a mounting plate is arranged in the mounting cavity, inserting rods are arranged at the two ends of the mounting plate, and a moving assembly is arranged in the mounting cavity. By means of the structure, the silicon wafers are placed in the corresponding placing grooves, then the placing frame is placed in the containing groove, and the curing films on the silicon wafers are dissolved and removed, so that the situation that because the side walls of the adjacent silicon wafers in the placing grooves are attached, alkali wash water cannot make full contact with the side walls of the silicon wafers, and the service life of the silicon wafers is prolonged is avoided. Therefore, the removal effect of the cured film on the silicon wafer is influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slices, in particular to a silicon slice solidified film dissolving and soaking tank. Background Art

[0002] In the preparation process of integrated circuit chips, silicon wafers generally go through multiple process steps such as thin film deposition, etching and polishing. The implementation of these process steps will inevitably form a solidified film on the surface of the silicon wafer. Since the solidified film will affect the performance of the silicon wafer, it is necessary to remove the solidified film on the silicon wafer.

[0003] For example, a silicon processing alkaline washing liquid soaking device disclosed in the patent with publication number CN215613625U, although the silicon processing alkaline washing liquid soaking device is conducive to the complete soaking of the silicon wafers to be processed and improves the soaking effect through the alkaline washing tank, the soaking basket and the rotating lifting mechanism, the lifting mechanism and the screw rod can drive the soaking basket to move up and down, flexibly adjust the position, and the rotating motor can drive the soaking basket to rotate the angle, which can not only improve the soaking effect, but also facilitate material removal; however, when the silicon processing alkaline washing liquid soaking device is actually used, multiple silicon wafers are placed in the soaking basket, and then the soaking basket is moved down to place the silicon wafers in the alkaline washing tank for soaking and cleaning. During this process, the side walls of the silicon wafers in the soaking basket are easily attached to the side walls of the adjacent silicon wafers, resulting in the side walls of the two silicon wafers that are attached to each other cannot be better Contact with the alkaline washing liquid, thereby affecting the alkaline washing liquid to remove the solidified film on the silicon wafer, and the actual use effect is poor. Utility Model Content

[0004] The utility model aims to provide a silicon wafer solidified film dissolving immersion tank to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A silicon wafer solidified film dissolving and soaking tank comprises a tank body, a holding tank with an opening upward and used for placing alkaline washing solution is provided in the tank body, a slidable placement rack is provided in the holding tank, a plurality of placement tanks with an opening upward and used for placing silicon wafers are provided in the placement rack, a plurality of connecting slots connected to the holding tank are provided on the side walls of the placement tank, a relative fixing plate is provided on the upper end surface of the placement rack, a plug hole is provided on the side walls of the fixing plate, a cover body for closing the holding tank is provided on the upper end surface of the tank body, a mounting cavity is provided in the cover body, a through groove for inserting the corresponding fixing plate is provided on the lower end surface of the mounting cavity, a sliding mounting plate is provided in the mounting cavity, plug rods are provided at both ends of the mounting plate, and a moving component for inserting the plug rod on the mounting plate into the corresponding plug hole is also provided in the mounting cavity.

[0007] Preferably, a driving rod is provided on the side wall of the mounting plate facing the mounting cavity;

[0008] The moving component includes a rotating rod which is arranged in the installation cavity and can rotate. The rotating rod is provided with a rotating groove for one end of the driving rod to extend into. The rotating groove and the rotating rod are threadedly matched. The driving rod rotates to drive the rotating rod to slide in the installation cavity, and the insertion rod on the installation plate is inserted into the corresponding insertion hole. A driving member for driving the rotating rod to rotate is also provided in the installation cavity.

[0009] Preferably, a gear is sleeved on the rotating rod;

[0010] The driving member includes a movable block arranged in the installation cavity, a rack meshing with the gear is provided on one side wall of the movable block, a threaded hole is provided on the other side wall of the movable block, and a rotatable threaded rod with one end extending into the installation cavity is provided on one side surface of the cover body, the extending end of the threaded rod is threadedly extended into the threaded hole, and the threaded rod rotates to drive the movable block to move in the installation cavity, and drives the rack to move to drive the gear to rotate, thereby realizing the rotation of the rotating rod.

[0011] Preferably, a limiting groove is provided on the upper end surface of the installation cavity along its length direction, and a limiting block is provided on the upper end surface of the moving block to be inserted into the limiting groove.

[0012] Preferably, an auxiliary plate for driving the threaded rod to rotate is provided on the protruding end of the threaded rod.

[0013] Preferably, positioning blocks are provided on the side walls opposite to the containing groove along the height direction thereof, and positioning grooves with downward openings and for corresponding positioning blocks to be inserted are provided on the side walls of the placement rack.

[0014] Preferably, handles for carrying the cover are provided on the side walls opposite to the cover.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The utility model, through the arrangement of the trough body, the containing trough, the placing rack and the placing trough, can place the silicon wafers to be cleaned in the corresponding placing trough, and then place the placing rack in the containing trough, so that the alkaline washing liquid in the containing trough can soak the silicon wafers in the placing trough, thereby dissolving and removing the cured film on the silicon wafers. Compared with the existing ones, this silicon wafer cured film dissolving placing trough can avoid the silicon wafers in the placing trough from being adhered to each other due to the side walls of adjacent silicon wafers, resulting in the alkaline washing liquid being unable to fully contact with the side walls of the silicon wafers, thereby improving the removal effect of the alkaline washing liquid in the immersion trough on the cured film on the silicon wafers.

[0017] 2. The utility model, through the arrangement of the driving rod, the rotating rod, the rotating groove and the driving member, makes it possible to drive the rotating rod to rotate through the driving member, thereby driving the driving rod to slide in the installation groove, that is, the installation plate drives the insertion rod to slide in the installation groove, and inserts one end of the insertion rod into the corresponding insertion hole to realize the connection of the placement rack on the cover body. The staff can take out the placement rack located in the alkaline cleaning solution by lifting the cover body, that is, take out the silicon wafer from the alkaline cleaning solution, thereby effectively reducing the contact between the staff and the alkaline cleaning solution when taking out the silicon wafer in the alkaline cleaning solution, and reducing the harm to the staff caused by chemicals in the alkaline cleaning solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The utility model is a schematic diagram of the overall structure of a silicon wafer solidified film dissolving immersion tank.

[0019] Figure 2 It is a structural schematic diagram of placing the placement rack in the utility model in the tank body.

[0020] Figure 3 It is a structural schematic diagram of the tank body in the utility model.

[0021] Figure 4 It is a structural schematic diagram of the placement rack in the utility model.

[0022] Figure 5 It is a structural schematic diagram of the mobile component in the utility model.

[0023] The meaning of the symbols in the figure is:

[0024] 100, tank body; 110, cover body; 111, handle;

[0025] 201, containing slot; 210, placing rack; 211, placing slot; 212, connecting slot; 220, fixing plate; 221, plug hole;

[0026] 300, positioning block;

[0027] 401, positioning groove;

[0028] 501, installation cavity; 502, through groove; 503, clamping groove; 510, installation plate; 511, insertion rod; 512, driving rod; 513, clamping plate; 520, rotating rod; 521, gear; 530, moving block; 531, rack; 532, threaded rod; 533, limit block; 540, auxiliary plate; 550, support plate. DETAILED DESCRIPTION

[0029] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments are only used to explain the utility model but not to limit it.

[0030] The following is combined with Figure 1-Figure 5 This embodiment is described in further detail.

[0031] like Figure 1 As shown, a silicon wafer solidified film dissolving and soaking tank in this embodiment includes a tank body 100, a holding tank 201 with an opening facing upward and used for placing alkaline washing solution is provided in the tank body 100, a slidable placement rack 210 is provided in the holding tank 201, a plurality of placement slots 211 for placing silicon wafers are provided in the placement rack 210, a plurality of connecting slots 212 with an opening facing upward and connected to the holding tank 201 are provided on the side walls of the placement slots 211, a relative fixing plate 220 is provided on the upper end surface of the placement rack 210, and the fixing plate 220 is provided with a fixing plate 220. There are sockets 221 on the side walls, and a cover body 110 for closing the containing groove 201 is provided on the upper end surface of the groove body 100. An installation cavity 501 is provided in the cover body 110, and a through groove 502 for inserting the corresponding fixed plate 220 is provided on the lower end surface of the installation cavity 501. A sliding installation plate 510 is provided in the installation cavity 501, and insertion rods 511 are provided at both ends of the installation plate 510. There is also a moving component in the installation cavity 501 for inserting the insertion rod 511 on the installation plate 510 into the corresponding socket 221.

[0032] In this embodiment, the alkaline cleaning solution is poured into the holding tank 201, and then the silicon wafers to be attached with the cured film on the surface are sequentially placed into the corresponding placement tank 211, so that the adjacent silicon wafers in the placement rack 210 are separated from each other. At this time, when the placement rack 210 is placed in the holding tank 201, the alkaline cleaning solution in the holding tank 201 flows into the placement tank 211 through the connecting tank 212, and soaks the silicon wafers in the placement tank 211, so that the cured film on the silicon wafer is dissolved and removed. Compared with the existing ones, this silicon wafer cured film dissolving soaking tank can avoid the silicon wafer in the placement tank 211 from being stuck to each other due to the side walls of adjacent silicon wafers, which makes the alkaline cleaning solution unable to fully contact the side walls of the silicon wafer, thereby improving the removal effect of the alkaline cleaning solution in the soaking tank on the cured film on the silicon wafer;

[0033] The upper end surface of the tank body 100 is overlapped with a cover body 110 for closing the containing tank 201. The cover body 110 closes the containing tank 201, thereby preventing dust outside the tank body 100 from entering the containing tank 201 and contaminating the alkaline cleaning solution, thereby affecting the alkaline cleaning solution's effect of removing the solidified film on the silicon wafer.

[0034] The fixing plate 220 is fixedly mounted on the placement rack 210, and the insertion rod 511 is fixedly mounted on the mounting plate 510. When the alkaline cleaning solution has finished dissolving and removing the cured film of the silicon wafer, the mounting plate 510 in the mounting cavity 501 is driven to move by the moving component, and the insertion rod 511 on the mounting plate 510 is inserted into the corresponding insertion hole 221, so that the placement rack 210 is connected to the cover body 110. The staff can take out the placement rack 210 in the alkaline cleaning solution by picking up the cover body 110, that is, the silicon wafer is taken out of the alkaline cleaning solution, thereby effectively reducing the contact between the staff and the alkaline cleaning solution when the staff takes out the silicon wafer in the alkaline cleaning solution, and reducing the harm caused to the staff by the chemicals in the alkaline cleaning solution;

[0035] When the placement rack 210 is taken out from the holding tank 201, the alkaline washing liquid in the placement tank 211 will flow into the holding tank 201 from the connecting tank 212, so as to avoid the alkaline washing liquid being taken out from the holding tank 201 when the placement rack 210 is taken out, thereby causing waste of the de-alkaline washing liquid;

[0036] Among them, positioning blocks 300 are fixedly installed on the opposite side walls of the containing groove 201 along the height direction thereof, and positioning grooves 401 with downward openings and corresponding positioning blocks 300 are provided on the side walls of the placing rack 210, so that the placing rack 210 slides along the positioning blocks 300 through the positioning grooves 401, so that when the placing rack 210 is located in the containing groove 201, the positioning blocks 300 limit the placing rack 210 in the containing groove 201, thereby preventing the placing rack 210 from moving in the containing groove 201 when the cover body 110 closes the containing groove 201, resulting in the fixing plate 220 on the placing rack 210 being unable to extend into the installation cavity 501 through the through groove 502, affecting the connection between the placing rack 210 and the cover body 110;

[0037] Among them, handles 111 for carrying the cover body 110 are fixed on the opposite side walls of the cover body 110. When the placement rack 210 is connected to the cover body 110, the staff can better drive the cover body 110 to move through the handles 111 on both sides of the cover body 110, release the cover body 110 from closing the containing tank 201, that is, the silicon wafers in the placement rack 210 are taken out from the alkaline washing solution, which is convenient for the staff to actually use;

[0038] In actual use, a constant temperature water tank (which is an existing structure) is installed next to the tank body 100, and an output pipe and an input pipe connected to the holding tank 201 are installed on the constant temperature water tank. The alkaline washing liquid in the holding tank 201 enters the constant temperature water tank through the input pipe for temperature adjustment, so that the alkaline washing liquid in the constant temperature water tank can be at different temperatures, and then the alkaline washing liquid of different temperatures in the constant temperature water tank enters the holding tank 201 through the output pipe, thereby realizing the alkaline washing liquid of different temperatures in the holding tank 201 to remove the cured film on the silicon wafer. Test.

[0039] like Figure 1-5 As shown, in this embodiment, a driving rod 512 is provided on the side wall of the mounting plate 510 facing the mounting cavity 501;

[0040] The moving component includes a rotating rod 520 which is arranged in the installation cavity 501 and can rotate. A rotating groove is provided in the rotating rod 520 for one end of the driving rod 512 to extend into. The rotating groove and the rotating rod 520 are threadedly matched. The driving rod 512 rotates to drive the rotating rod 520 to slide in the installation cavity 501, and the insertion rod 511 on the installation plate 510 is inserted into the corresponding socket 221. A driving member for driving the rotating rod 520 to rotate is also provided in the installation cavity 501.

[0041] In this embodiment, the drive rod 512, the rotating rod 520, the rotating groove and the driving member are arranged so that the drive rod 512 is fixedly installed on the mounting plate 510, so that the drive rod 512 is limited. When the driving member drives the rotating rod 520 to rotate, the rotating groove rotates on one end of the drive rod 512, thereby driving the drive rod 512 to slide in the mounting cavity 501, that is, the mounting plate 510 drives the insertion rod 511 to slide in the mounting cavity 501, and inserts one end of the insertion rod 511 into the corresponding insertion hole 221, thereby realizing the connection of the placement rack 210 on the cover body 110;

[0042] When the placement rack 210 is taken out of the alkaline washing solution through the cover 110, if the silicon wafers in the placement rack 210 need to be taken out, the driving member needs to drive the rotating rod 520 to rotate in the opposite direction again, and drive the driving rod 512 to move, so that the insertion rod 511 on the mounting plate 510 slides out of the corresponding insertion hole 221, thereby releasing the connection between the placement rack 210 and the cover 110, and then the staff can take out the silicon wafers after the curing film in the placement groove 211 is removed;

[0043] A support plate 550 is fixedly mounted on the bottom wall of the installation cavity 501, one end of the rotating rod 520 is mounted on the support plate 550 through a bearing seat, and a concave hole for inserting the other end of the rotating rod 520 is opened on the side wall of the installation cavity 501, thereby realizing the rotating installation of the rotating rod 520 in the installation cavity 501;

[0044] When it is actually used, the opposite side walls of the mounting cavity 501 are provided with card grooves 503 along their width direction, and the opposite side walls of the mounting plate 510 are fixedly installed with card plates 513 that are movable and inserted into the corresponding card grooves 503. By inserting one end of the card plate 513 into the card groove 503, the sliding of the corresponding mounting plate 510 is limited, so that the mounting plate 510 can only slide stably along the card groove 503, that is, the insertion rod 511 can be better inserted into the corresponding insertion hole 221, and at the same time, the driving rod 512 is also better limited, thereby preventing the mounting plate 510 from driving the driving rod 512 to shake in the mounting cavity 501, causing the threaded fit between the driving rod 512 and the rotating groove to be affected.

[0045] like Figure 1-5 As shown, in this embodiment, a gear 521 is sleeved on the rotating rod 520;

[0046] The driving member includes a movable moving block 530 which is arranged in the installation cavity 501, a rack 531 meshing with the gear 521 is provided on one side wall of the moving block 530, a threaded hole is provided on the other side wall of the moving block 530, and a rotatable threaded rod 532 with one end extending into the installation cavity 501 is provided on one side surface of the cover body 110, the extending end of the threaded rod 532 is threadedly extended into the threaded hole, and the threaded rod 532 rotates to drive the moving block 530 to move in the installation cavity 501, and drives the rack 531 to move and drive the gear 521 to rotate, thereby realizing the rotation of the rotating rod 520.

[0047] In this embodiment, by setting the gear 521, the moving block 530, the rack 531, the threaded hole and the threaded rod 532, the rack 531 is fixedly installed on the rotating rod 520, and the rack 531 is fixedly installed on the moving block 530. When the threaded rod 532 rotates in the threaded hole, the moving block 530 drives the rack 531 to move in the installation cavity 501, and the movement of the rack 531 drives the meshing gear 521 to rotate, thereby realizing the rotation of the rotating rod 520.

[0048] By driving the threaded rod 532 to rotate forward and reversely, the rack 531 on the moving block 530 can be driven to move back and forth in the installation cavity 501, thereby driving the rotating rod 520 to rotate forward and reversely, and driving the driving rod 512 to move back and forth in the installation cavity 501, so that the insertion rod 511 on the installation plate 510 is inserted into or slid out of the insertion hole 221, and the placement rack 210 can be connected or disconnected from the cover body 110 by rotating the threaded rod 532;

[0049] A limiting groove is provided on the upper end surface of the installation cavity 501 along its length direction, and a limiting block 533 is fixedly installed on the upper end surface of the moving block 530 and is inserted into the limiting groove. By inserting one end of the limiting block 533 into the limiting groove, the moving block 530 can only move stably along the limiting groove, that is, the movement of the rack 531 is more stable, thereby better driving the gear 521 to rotate;

[0050] During actual use, one end of the threaded rod 532 is extended out of the cover body 110, and is rotatably installed on the cover body 110 through a bearing. An auxiliary plate 540 for driving the threaded rod 532 to rotate is fixedly installed on the extended end of the threaded rod 532. The threaded rod 532 and the cover body 110 are connected through a bearing seat, so that the rotation effect of the threaded rod 532 is better, thereby better driving the moving block 530 to move. The staff can better drive the threaded rod 532 to rotate through the auxiliary plate 540, which is more convenient to use.

[0051] Working principle: First, pour the alkaline cleaning liquid into the holding tank 201, and then place the silicon wafer that needs to remove the cured film in the corresponding placement tank 211, and then slide the positioning groove 401 on the placement rack 210 along the positioning block 300, and place the placement rack 210 into the holding tank 201, so that the alkaline cleaning liquid can remove the cured film on the silicon wafer. When the cured film of the silicon wafer is removed, the holding tank 201 is closed by the cover body 110. At this time, the fixed plate 220 on the placement rack 210 extends into the installation cavity 501 through the connecting groove 212. When the removal of the cured film on the silicon wafer is completed, the threaded rod 532 is driven to rotate by the auxiliary plate 540, so that the moving block 530 drives the rack 531 to move. Move, thereby realizing that the gear 521 rotates and drives the rotating rod 520 to rotate, that is, the rotating rod 520 drives the driving rod 512 to move, and then drives the mounting plate 510 to move, and inserts the insertion rod 511 on the mounting plate 510 into the corresponding insertion hole 221. Then, the staff can remove the cover body 110 from the slot body 100 through the handles 111 on both sides of the cover body 110, release the closure of the containing slot 201, thereby driving the placement rack 210 to be taken out from the containing slot 201, and then drive the threaded rod 532 to rotate through the auxiliary plate 540, and slide the insertion rod 511 on the mounting plate 510 out of the corresponding insertion hole 221, so that the silicon wafer after the cured film in the placement slot 211 is removed can be taken out.

[0052] In short, the above is only a preferred embodiment of the present utility model, and all equivalent changes and modifications made according to the scope of the patent application of the present utility model should fall within the scope of the present utility model patent.

Claims

1. A silicon wafer cured film dissolving immersion tank, characterized in that: The invention comprises a tank body (100), wherein a holding tank (201) with an opening upward and used for placing alkaline washing liquid is provided in the tank body (100), a slidable placing rack (210) is provided in the holding tank (201), a plurality of placing tanks (211) with an opening upward and used for placing silicon wafers are provided in the placing rack (210), a plurality of connecting slots (212) connected to the holding tank (201) are provided on the side walls of the placing tank (211), a relative fixing plate (220) is provided on the upper end surface of the placing rack (210), a plug hole (221) is provided on the side walls of the fixing plate (220), and the tank body (201) is provided with a plurality of connecting slots (212) connected to the holding tank (201). A cover body (110) for closing the containing groove (201) is provided on the upper end surface of the body (100), a mounting cavity (501) is provided inside the cover body (110), a through groove (502) for inserting a corresponding fixing plate (220) is provided on the lower end surface of the mounting cavity (501), a sliding mounting plate (510) is provided inside the mounting cavity (501), insertion rods (511) are provided at both ends of the mounting plate (510), and a moving component for inserting the insertion rod (511) on the mounting plate (510) into the corresponding insertion hole (221) is also provided inside the mounting cavity (501).

2. The silicon wafer cured film dissolving immersion tank according to claim 1, characterized in that: A driving rod (512) is provided on the side wall of the mounting plate (510) facing the mounting cavity (501); The moving assembly comprises a rotating rod (520) which is arranged in the installation cavity (501) and can rotate. A rotating groove is provided in the rotating rod (520) for one end of the driving rod (512) to extend into. The rotating groove and the rotating rod (520) are threadedly matched. The driving rod (512) rotates to drive the rotating rod (520) to slide in the installation cavity (501), and the insertion rod (511) on the installation plate (510) is inserted into the corresponding insertion hole (221). A driving member for driving the rotating rod (520) to rotate is also provided in the installation cavity (501).

3. The silicon wafer cured film dissolving immersion tank according to claim 2, characterized in that: A gear (521) is sleeved on the rotating rod (520); The driving member comprises a movable moving block (530) which is arranged in the installation cavity (501), a rack (531) meshing with the gear (521) is provided on one side wall of the moving block (530), a threaded hole is provided on the other side wall of the moving block (530), a threaded rod (532) which is rotatable and has one end extending into the installation cavity (501) is provided on one side surface of the cover body (110), the extending end of the threaded rod (532) is threadedly extended into the threaded hole, the threaded rod (532) rotates to drive the moving block (530) to move in the installation cavity (501), and drives the rack (531) to move and drive the gear (521) to rotate, thereby realizing the rotation of the rotating rod (520).

4. The silicon wafer cured film dissolving immersion tank according to claim 3, characterized in that: A limiting groove is provided on the upper end surface of the installation cavity (501) along its length direction, and a limiting block (533) is provided on the upper end surface of the moving block (530) to be inserted into the limiting groove.

5. The silicon wafer cured film dissolving immersion tank according to claim 3, characterized in that: An auxiliary plate (540) for driving the threaded rod (532) to rotate is provided on the protruding end of the threaded rod (532).

6. The silicon wafer cured film dissolving immersion tank according to claim 1, characterized in that: Positioning blocks (300) are provided on the side walls opposite to the containing groove (201) along the height direction thereof, and positioning grooves (401) with downward openings and corresponding positioning blocks (300) are provided on the side walls of the placement rack (210).

7. The silicon wafer cured film dissolving immersion tank according to claim 5, characterized in that: Handles (111) for carrying the cover body (110) are provided on the side walls opposite to the cover body (110).

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