Feeding and discharging device for silicon wafer scribing

Abstract

The utility model relates to the technical field of silicon wafer processing, in particular to a loading and unloading device for silicon wafer scribing, which comprises a loading assembly and an unloading assembly which carry silicon wafer scribing through a carrying mechanism, and the difference is that the carrying directions are different. The carrying mechanism comprises a mounting seat, a mounting plate and an adsorption part, the mounting seat is driven by driving force to perform reciprocating linear motion, the mounting plate takes the mounting seat as an assembly foundation, an adsorption port is formed in the bottom of the adsorption part, and the adsorption part is used for forming a negative pressure area at the adsorption port to adsorb the silicon wafer scribing to be carried. And the adsorption piece takes the mounting plate as an assembly basis. Compared with a traditional method, according to the technical scheme, the guide rail body and the sliding block are matched to drive the mounting base to move rapidly, meanwhile, the mounting plate and the adsorption part are arranged on the mounting base, the fixing mode between the adsorption part and the mounting plate is simple and convenient, and the position of the adsorption part can be set according to the scribing position of the silicon wafer to be carried.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a loading and unloading device for silicon wafer dicing. Background Art

[0002] Silicon wafer dicing is the process of dividing the entire wafer into single independent chips according to chip size. The production process involves the loading and unloading of silicon wafer dicing.

[0003] The patent document with patent announcement number: CN117612987A discloses a loading and unloading device and method for wafer processing, including a mounting seat, a rotating frame is provided below the mounting seat, a connecting plate is provided above the rotating frame, a rotating shaft is provided above the mounting seat, and a driving member for driving the rotating shaft to rotate is provided on the mounting seat, the rotating shaft and the connecting plate are connected by a friction transmission structure, the connecting plate and the rotating frame are connected by a stretching stopper, a pressing ring is provided above the rotating frame, the rotating shaft and the pressing ring are connected by a friction reciprocating motion component, the top of the rotating frame is fixedly connected to a limiting block, and the pressing ring is provided with two avoidance grooves that cooperate with the limiting block, and the bottom of the rotating frame is fixedly connected to a first wafer adsorption mechanism and a second wafer adsorption mechanism; unloading is carried out while loading, thereby reducing the wafer unloading cycle and increasing work efficiency.

[0004] The above scheme uses a wafer adsorption mechanism to limit and fix the wafer when transferring the wafer position, but it does not explain how the wafer adsorption mechanism adsorbs and fixes the wafer. In the silicon wafer dicing production process, since the wafer to be processed needs to be transferred to the processing platform, and then the wafer to be processed is laser cut on the processing platform, the finished wafer is transferred to the material box. This process involves the position transfer of the silicon wafer dicing. Efficiency and stability are crucial in this process. Because silicon wafer dicing is relatively fragile and easily damaged, it is necessary to avoid damage to the silicon wafer dicing itself while achieving fast movement of the silicon wafer dicing. Therefore, it is necessary to improve the current silicon wafer dicing loading and unloading device. Utility Model Content

[0005] In order to overcome the above-mentioned technical problems, the purpose of the utility model is to provide a loading and unloading device for silicon wafer dicing, which solves the problem that the current silicon wafer dicing does not move fast enough during the loading and unloading process and is easy to damage the dicing itself during the transfer process.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A loading and unloading device for silicon wafer slicing includes a loading assembly and a unloading assembly. Both the loading assembly and the unloading assembly transport the silicon wafer slicing through a transport mechanism. The transport mechanism includes a mounting seat, a mounting plate and a suction piece that perform reciprocating linear motion due to a driving force. The mounting plate is detachably connected to the top of the mounting seat. A suction port is formed at the bottom of the suction piece. The suction piece is used to form a negative pressure area at the suction port to adsorb the silicon wafer slicing to be transported, and the suction piece is plugged and fixed to the mounting plate in a vertical direction.

[0008] Furthermore, the transport mechanism includes a vertically arranged guide rail body, the guide rail body is slidably connected to a slide seat in a vertical direction, the slide seat is detachably connected to the mounting seat, and the slide seat drives the mounting seat, the mounting plate and the adsorption component to move synchronously during the sliding of the guide rail body.

[0009] Furthermore, the mounting seat is in an L-shaped structure consisting of a vertical portion and a horizontal portion, and the vertical portion and the horizontal portion are detachably connected.

[0010] Furthermore, the mounting plate is detachably connected to the horizontal portion, and the mounting plate is vertically arranged with respect to the horizontal portion.

[0011] Furthermore, at least one mounting plate is provided.

[0012] Furthermore, the horizontal portion is located in the middle of the mounting plate, at least two adsorption members are provided, and the positions of the two adsorption members on the mounting plate are symmetrically arranged with respect to the horizontal portion.

[0013] Furthermore, a notch is formed at a position where the mounting plate is connected to the horizontal portion, and a transverse dimension of the notch matches a width dimension of the horizontal portion.

[0014] Furthermore, a mounting hole is formed through the body of the mounting plate, and the adsorption component includes a hollow tube, which passes through the mounting hole, and the bottom of the hollow tube extends downward and forms an adsorption port which is adsorbed together with the surface of the silicon wafer being sliced, and the top of the hollow tube is connected to a vacuum pump.

[0015] Furthermore, the tube body of the hollow tube is threadedly connected with two nuts, and the two nuts are spaced apart from each other with respect to the mounting plate.

[0016] Furthermore, a corrugated rubber cover is provided at the bottom of the hollow tube, and a filter screen is provided inside the corrugated rubber cover.

[0017] Beneficial effects of the utility model:

[0018] Compared with the traditional method, the technical solution drives the mounting seat to move quickly through the cooperation of the guide rail body and the slider. At the same time, a mounting plate and an adsorption component are provided on the mounting seat. The fixing method between the adsorption component and the mounting plate is relatively simple, and the position of the adsorption component can be set according to the position of the silicon wafer slice to be transported. The adsorption component firmly adsorbs the silicon wafer slice through vacuum extraction, which can quickly install or remove the silicon wafer slice and is relatively stable during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings.

[0020] Figure 1 is a three-dimensional view of the utility model in use;

[0021] Figure 2 It is a three-dimensional view of the transport mechanism in the utility model;

[0022] Figure 3 It is a three-dimensional view of the mounting seat, the mounting plate and the adsorption member in the utility model;

[0023] Figure 4 It is a three-dimensional view of the mounting plate and the adsorption member in the utility model;

[0024] Figure 5 It is a stereoscopic view of the utility model in which a feeding component or a feeding component is assembled with a horizontal moving mechanism and a vertical moving mechanism.

[0025] In the figure: 1. silicon wafer dicing; 2. transport mechanism; 21. guide rail body; 22. slide seat; 23. mounting seat; 231. vertical portion; 232. horizontal portion; 24. mounting plate; 241. notch; 242. mounting hole; 25. adsorption part; 251. hollow tube; 252. nut; 253. corrugated rubber cover; 3. cross bar; 31. slide rail; 4. vertical bar; 41. slider. DETAILED DESCRIPTION

[0026] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] like Figure 1 , Figure 2As shown, a loading and unloading device for silicon wafer slicing includes a loading component and a unloading component, both of which transport silicon wafer slicing 1 through a transport mechanism 2, the difference being the direction of transport. The transport mechanism 2 includes a mounting seat 23 that performs reciprocating linear motion due to a driving force, a mounting plate 24, and an adsorption member 25, the mounting plate 24 uses the mounting seat 23 as an assembly base, a suction port is formed at the bottom of the adsorption member 25, the adsorption member 25 is used to form a negative pressure area at the suction port to adsorb the silicon wafer slicing 1 to be transported, and the adsorption member 25 uses the mounting plate 24 as an assembly base.

[0028] The technical solution is to provide a mounting plate 24 and an adsorbent 25 on a mounting seat 23, and the mounting seat 23, the mounting plate 24 and the adsorbent 25 can all move back and forth, so that the silicon wafer slice 1 can be transported according to the needs of loading or unloading. The fixing method between the adsorbent 25 and the mounting plate 24 is relatively simple, and the position of the adsorbent 25 can be set according to the position of the silicon wafer slice 1 to be transported. The adsorbent 25 firmly adsorbs the silicon wafer slice 1 by vacuuming, which can not only quickly install or disassemble the silicon wafer slice 1, but also is relatively stable during transportation.

[0029] like Figure 2 , Figure 3 As shown, the transport mechanism 2 includes a vertically arranged guide rail body 21, the guide rail body 21 is slidably connected to a slide seat 22 in a vertical direction, the slide seat 22 is detachably connected to a mounting seat 23, and the slide seat 22 drives the mounting seat 23, the mounting plate 24 and the adsorbent 25 to move synchronously during the sliding process on the guide rail body 21;

[0030] In this solution, the driving method of the sliding connection between the guide rail body 21 and the slide 22 can be achieved through various technical means, and can use electromagnetic drive or a servo motor and a precision screw to drive. The movement of the slide 22 drives the mounting seat 23, the mounting plate 24 and the adsorption member 25 to move synchronously, thereby realizing the loading or unloading of the silicon wafer dicing 1.

[0031] As a further refinement of the above technical solution, Figure 3 As shown, the mounting seat 23 is an L-shaped structure consisting of a vertical portion 231 and a horizontal portion 232 , and the vertical portion 231 and the horizontal portion 232 are detachably connected by screws.

[0032] As an example, the mounting plate 24 and the horizontal portion 232 are detachably connected via screws, the mounting plate 24 is located above the horizontal portion 232 , and the mounting plate 24 is vertically arranged with respect to the horizontal portion 232 .

[0033] As a further refinement of the above technical solution, Figure 3 , Figure 4As shown, the mounting plate 24 is provided with at least one horizontal portion 232 located in the middle of the mounting plate 24, and at least two adsorption members 25 are provided. The positions of the two adsorption members 25 on the mounting plate 24 are symmetrically arranged with respect to the horizontal portion 232. It needs to be ensured that the distance between the two adsorption members 25 is smaller than the diameter size of the silicon wafer dicing 1.

[0034] As an example, a notch 241 is formed at the position where the mounting plate 24 is connected to the horizontal portion 232, and the lateral dimension of the notch 241 matches the width dimension of the horizontal portion 232. When the mounting plate 24 and the horizontal portion 232 are assembled together, the thickness of the two when stacked together is smaller, which can save space when transporting the silicon wafer dicing 1.

[0035] As a further refinement of the above technical solution, Figure 4 As shown, the body of the mounting plate 24 is penetrated with a plurality of mounting holes 242, the mounting holes 242 are bar-shaped through holes, the adsorbent 25 comprises a hollow tube 251, the hollow tube 251 penetrates the mounting holes 242, the bottom of the hollow tube 251 extends downward and forms an adsorption port adsorbed together with the surface of the silicon wafer dicing 1, and the top of the hollow tube 251 is connected to a vacuum extractor;

[0036] According to the size of the silicon wafer slice 1, the hollow tube 251 can be pre-installed in the mounting hole 242, and then the mounting plate 24 and the hollow tube 251 are moved to the top of the silicon wafer slice 1 through the slide 22. As the hollow tube 251 gradually moves downward, the suction port at the bottom of the hollow tube 251 contacts the silicon wafer slice 1, and then the vacuum pump is started to extract the air in the hollow tube 251, thereby forming a negative pressure area at the suction port, so that the silicon wafer slice 1 can be stably and reliably adsorbed on the bottom of the hollow tube 251 under the action of the negative pressure effect. At this time, the silicon wafer slice 1 can be transported by controlling the slide 22.

[0037] As a further refinement of the above technical solution, the tube body of the hollow tube 251 is threadedly connected with two nuts 252, and the two nuts 252 are separated and arranged with respect to the mounting plate 24. When installing the hollow tube 251, the nuts 252 can be screwed to make them abut against the top and bottom surfaces of the mounting plate 24, thereby achieving the effect of fixing the hollow tube 251.

[0038] As a further refinement of the above technical solution, a corrugated rubber cover 253 is provided at the bottom of the hollow tube 251, and a filter is provided inside the corrugated rubber cover 253. The filter can protect the vacuum extractor from the influence of external environment such as dust, dirt, sand, wood chips or metal chips, moisture, water mist, etc.; the corrugated rubber cover 253 can achieve better mechanical sealing through its elastic material properties, thereby effectively preventing these unwanted substances from entering the interior of the hollow tube 251.

[0039] like Figure 5 As shown, a schematic diagram of the loading and unloading assembly or the unloading assembly in use is shown, which includes a cross bar 3 and a vertical bar 4, with two vertical bars 4 in total. The cross bar 3 is located between the two vertical bars 4, and a slide rail 31 is provided on the surface of the cross bar 3. The guide rail body 21 is slidably connected to the slide rail 31, and the vertical bar 4 is slidably connected to a slider 41, and the two sliders 41 are respectively connected to the two ends of the cross bar 3; through the cooperation of the cross bar 3 and the vertical bar 4, a larger range of lateral and longitudinal movement of the conveying mechanism 2 can be achieved, thereby realizing loading and unloading work over a larger distance.

[0040] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0041] The above contents are merely examples and explanations of the present utility model. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of the present utility model.

Claims

1. A loading and unloading device for silicon wafer dicing, comprising a loading assembly and a unloading assembly, wherein both the loading assembly and the unloading assembly transport the silicon wafer dicing (1) through a transport mechanism (2), characterized in that: The transport mechanism (2) comprises a mounting seat (23) that performs reciprocating linear motion due to a driving force, a mounting plate (24) and an adsorbent (25), wherein the mounting plate (24) is detachably connected to the top of the mounting seat (23), a bottom of the adsorbent (25) is formed with an adsorption port, the adsorbent (25) is used to form a negative pressure area at the adsorption port to adsorb the silicon wafer dicing (1) to be transported, and the adsorbent (25) is plugged and fixed to the mounting plate (24) in a vertical direction.

2. A loading and unloading device for silicon wafer dicing according to claim 1, characterized in that: The transport mechanism (2) comprises a vertically arranged guide rail body (21), the guide rail body (21) being slidably connected to a slide seat (22) in a vertical direction, the slide seat (22) being detachably connected to the mounting seat (23), and the slide seat (22) driving the mounting seat (23), the mounting plate (24) and the adsorption member (25) to move synchronously during the sliding process of the guide rail body (21).

3. A loading and unloading device for silicon wafer dicing according to claim 1 or 2, characterized in that: The mounting seat (23) is in an L-shaped structure consisting of a vertical portion (231) and a horizontal portion (232), and the vertical portion (231) and the horizontal portion (232) are detachably connected.

4. A loading and unloading device for silicon wafer dicing according to claim 3, characterized in that: The mounting plate (24) is detachably connected to the horizontal portion (232), and the mounting plate (24) is vertically arranged with respect to the horizontal portion (232).

5. A loading and unloading device for silicon wafer dicing according to claim 4, characterized in that: At least one mounting plate (24) is provided.

6. The loading and unloading device for silicon wafer dicing according to claim 4, characterized in that: The horizontal portion (232) is located in the middle of the mounting plate (24), and at least two adsorption members (25) are provided, and the positions of the two adsorption members (25) on the mounting plate (24) are symmetrically arranged with respect to the horizontal portion (232).

7. A loading and unloading device for silicon wafer dicing according to claim 6, characterized in that: A notch (241) is formed at the position where the mounting plate (24) is connected to the horizontal portion (232), and the transverse dimension of the notch (241) matches the width dimension of the horizontal portion (232).

8. The loading and unloading device for silicon wafer dicing according to claim 6, characterized in that: The mounting plate (24) is provided with a mounting hole (242) through the plate body, and the adsorbent (25) comprises a hollow tube (251), the hollow tube (251) passes through the mounting hole (242), the bottom of the hollow tube (251) extends downward and forms an adsorption port adsorbed together with the surface of the silicon wafer dicing (1), and the top of the hollow tube (251) is connected to a vacuum extractor.

9. The loading and unloading device for silicon wafer dicing according to claim 8, characterized in that: The body of the hollow tube (251) is threadedly connected to two nuts (252), and the two nuts (252) are spaced apart from each other with respect to the mounting plate (24).

10. The loading and unloading device for silicon wafer dicing according to claim 8, characterized in that: The bottom of the hollow tube (251) is sleeved with a corrugated rubber cover (253), and a filter screen is arranged inside the corrugated rubber cover (253).

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