Semiconductor packaging unit with high reliability

Abstract

The utility model relates to the technical field of semiconductor packaging units, and discloses a high-reliability semiconductor packaging unit which comprises a packaging shell, the front and rear sides of the left and right ends of the packaging shell are fixedly connected with mounting racks, the opposite ends of the mounting racks are provided with mounting holes, and the top end of the packaging shell is connected with a packaging cover through an assembling assembly. A semiconductor element is mounted at the top end of the packaging shell, connecting pipes are fixedly connected to the left and right parts of the front and rear sides of the top end of the packaging shell, adjusting blocks are rotationally connected to the bottom ends of the inner walls of the connecting pipes through tension springs, adapter rings are rotationally connected to the bottom ends of the adjusting blocks, and a heat dissipation block is fixedly connected to the bottom end of the packaging cover. According to the utility model, the packaging shell and the packaging cover can be conveniently assembled with each other, so that the structure can reduce the assembly time on a production line and accelerate the process from production to the market, and meanwhile, when the structure needs to be maintained or upgraded, parts can be conveniently and quickly replaced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging units, in particular to a semiconductor packaging unit with high reliability. Background Art

[0002] The semiconductor packaging unit is a key component that is used to protect semiconductor chips from physical and environmental damage while also providing the necessary electrical connections and thermal management. This process is called semiconductor packaging and is a vital part of the semiconductor manufacturing process. The design and material selection of the packaging directly affect the performance, reliability and life of the final product.

[0003] After searching, a semiconductor packaging unit with high reliability, with announcement number CN214043634U, includes a heat dissipation device, a packaging component and a control device, a cavity is arranged inside the packaging component, welding sheets are installed at the left and right ends of the cavity, the heat dissipation device is located at the top of the cavity, the heat dissipation device includes a heat-conducting copper tube, a heat-conducting ring and a heat-absorbing copper sheet, the heat-absorbing copper sheet is located at the top of the cavity, the heat-conducting rings are evenly distributed at the bottom of the heat-absorbing copper sheet, the heat-conducting copper tube is installed at the bottom of the heat-conducting ring, the heat-absorbing copper sheet and the heat-conducting copper tube are slidably connected to the two ends of the cavity, a heating device is installed at the bottom of the cavity, a substrate is installed at the top of the heating device, a semiconductor chip is installed at the top of the substrate, a control device is installed at the right side of the heating device at the bottom of the cavity, a temperature sensor is arranged at the left side of the substrate in the cavity, the control device is electrically connected to the heating device and the temperature sensor, and the device can quickly and effectively dissipate the heat generated by the operation of the semiconductor packaging unit.

[0004] Based on the above patent, through the cooperation of heat-conducting copper tubes, heat-absorbing copper sheets, heat-conducting rings and heat-dissipating fins, the heat generated by the operation of the semiconductor packaging unit can be quickly and effectively dissipated, so that the semiconductor packaging unit can work at room temperature, and the temperature will not be too high to cause damage to the components, effectively preventing the semiconductor packaging unit from leaking electricity during operation. Through the heating device, the device can be effectively warmed up under low temperature conditions, preventing the device from being damaged due to excessive temperature. However, when the semiconductor packaging unit is assembled in this patent, the connection between the packages is usually made by welding, so that the components are assembled, resulting in the need to spend time and labor during the assembly process of the device, affecting the assembly efficiency of the semiconductor packaging unit. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor packaging unit with high reliability, which facilitates the mutual assembly between the packaging shell and the packaging cover, so that the structure can reduce the assembly time on the production line.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A semiconductor packaging unit with high reliability comprises a packaging shell, wherein both left and right ends and both front and back sides of the packaging shell are fixedly connected with mounting frames, and both ends of the mounting frames opposite to each other are provided with mounting holes, and the top of the packaging shell is connected with a packaging cover through an assembly component, and a semiconductor element is installed on the top of the packaging shell, and both the front and back sides and both left and right parts of the top of the packaging shell are fixedly connected with connecting tubes, and the bottom ends of the inner walls of the connecting tubes are rotatably connected with adjusting blocks through tension springs, and the bottom ends of the adjusting blocks are rotatably connected with an adapter ring, and the bottom end of the packaging cover is fixedly connected with a heat dissipation block, and both the left and right sides of the top of the packaging shell are provided with docking grooves.

[0008] Furthermore, the assembly component includes a fixing tube fixedly connected on all four sides of the bottom end of the packaging cover, a fixing ring fixedly connected to the inner wall of the fixing tube, a slide tube fixedly connected to the inner wall of the corresponding fixing tube at the bottom end of the inner wall of the docking groove, an adjusting rod slidably connected to the bottom ends of the front and rear ends of the inner wall of the docking groove through a return spring, a fixing rod fixedly connected to the front and rear sides of the top end of the slide tube, and an external clamping claw installed on the outer wall of the fixing rod.

[0009] Furthermore, the top ends of the tension springs are fixedly connected to the bottom ends of the adjustment blocks, and the bottom ends of the tension springs are fixedly connected to the bottom ends of the inner walls of the connecting tubes.

[0010] Furthermore, the outer walls of the adapter ring are slidably connected to the inner walls of the connecting pipe.

[0011] Furthermore, the top end of the return spring is fixedly connected to the top end of the inner wall of the adjusting rod, and the bottom end of the return spring is fixedly connected to the front and rear sides of the bottom end of the inner wall of the docking groove.

[0012] Furthermore, the outer wall of the adjusting rod is slidably connected to the inner wall of the slide groove tube.

[0013] Furthermore, the outer claw is rotatably connected to the front and rear sides of the top end of the adjusting rod respectively at one relative end.

[0014] Furthermore, the opposite ends of the outer claws can be detachably connected to the top of the fixing ring.

[0015] The utility model has the following beneficial effects:

[0016] In the utility model, by using the combination of the docking groove, the fixing tube, the slide tube, the fixing rod, the return spring, the outer claw, the adjusting rod and the fixing ring, the packaging shell and the packaging cover can be easily assembled with each other, so that the structure can reduce the assembly time on the production line and accelerate the process from production to market. At the same time, when the structure needs to be repaired or upgraded, it is also convenient to quickly replace parts to ensure that the structure is put into use again as soon as possible, reducing production costs and making the maintenance and upgrade process simpler. Through this flexibility, manufacturers can quickly adjust and expand product lines to adapt to market changes, making the installation process more reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional diagram of a semiconductor packaging unit with high reliability proposed by the utility model;

[0018] Figure 2 A half-section diagram of a packaging cover of a semiconductor packaging unit with high reliability proposed by the utility model;

[0019] Figure 3 A half-section diagram of a connection tube of a semiconductor packaging unit with high reliability proposed by the utility model;

[0020] Figure 4 This is a half-section view of a fixing tube of a semiconductor packaging unit with high reliability proposed by the utility model.

[0021] Legend:

[0022] 1. Packaging shell; 2. Mounting frame; 3. Packaging cover; 4. Semiconductor element; 5. Connecting tube; 6. Tension spring; 7. Adjustment block; 8. Adapter ring; 9. Heat sink; 10. Mounting hole; 11. Docking groove; 12. Fixing tube; 13. Slide tube; 14. Fixing rod; 15. Reset spring; 16. External claw; 17. Adjustment rod; 18. Fixing ring. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Reference Figure 1-4, the utility model provides an embodiment: a semiconductor packaging unit with high reliability, including a packaging shell 1, the left and right ends of the packaging shell 1 are fixedly connected with mounting frames 2 on both sides, the mounting frames 2 are provided with mounting holes 10 on the opposite ends, the top of the packaging shell 1 is connected with a packaging cover 3 through an assembly component, a semiconductor element 4 is installed on the top of the packaging shell 1, the front and back sides of the top of the packaging shell 1 are fixedly connected with connecting tubes 5, the bottom end of the inner wall of the connecting tube 5 is rotatably connected with adjusting blocks 7 through tension springs 6, the bottom end of the adjusting block 7 is rotatably connected with an adapter ring 8, the bottom end of the packaging cover 3 is fixedly connected with a heat sink 9, the left and right sides of the top of the packaging shell 1 are provided with docking grooves 11, the top of the tension spring 6 is fixedly connected to the bottom end of the adjusting block 7, the bottom end of the tension spring 6 is fixedly connected to the bottom end of the inner wall of the connecting tube 5, and the outer wall of the adapter ring 8 is slidably connected to the inner wall of the connecting tube 5. When the semiconductor element 4 is placed on the packaging shell 1, the adjusting block 7 is rotated and the tension spring 6 is allowed to make the adapter ring 8 through elastic force to make the adjusting block 7 stuck at the semiconductor element 4, so as to fix the semiconductor element 4.

[0025] Specifically, the four sides of the bottom end of the packaging cover 3 are fixedly connected with a fixing tube 12, the inner wall of the fixing tube 12 is fixedly connected with a fixing ring 18, the bottom end of the inner wall of the docking groove 11 is fixedly connected with a slide tube 13 corresponding to the inner wall of the fixing tube 12, the bottom ends of the front and rear ends of the inner wall of the docking groove 11 are slidably connected with an adjusting rod 17 through a return spring 15, the front and rear sides of the top of the slide tube 13 are fixedly connected with a fixing rod 14, the outer wall of the fixing rod 14 is installed with an external claw 16, the top of the return spring 15 is fixedly connected to the top of the inner wall of the adjusting rod 17, the bottom end of the return spring 15 is respectively fixedly connected to the front and rear sides of the bottom end of the inner wall of the docking groove 11, the outer wall of the adjusting rod 17 is slidably connected to the inner wall of the slide tube 13, the opposite end of the external claw 16 is rotatably connected to the front and rear sides of the top of the adjusting rod 17, and the opposite end of the external claw 16 can be detachably connected to the top of the fixing ring 18. In the docking groove 11, the fixed tube 12 is docked at the slide groove tube 13, and the adjusting rod 17 allows the outer claws 16 to open along both sides of the fixed rod 14 under the elastic force of the reset spring 15, so that the fixing rod 14 is clamped at the fixing ring 18, so that the packaging shell 1 and the packaging cover 3 can be installed, making the packaging shell 1 and the packaging cover 3 more reliable during the installation process, and facilitating the mutual assembly between the packaging shell 1 and the packaging cover 3, so that the structure can reduce the assembly time on the production line and accelerate the process from production to market. At the same time, when the structure needs to be repaired or upgraded, it is also convenient to quickly replace parts to ensure that the structure is put back into use as soon as possible, reducing production costs, and making the maintenance and upgrade process easier. Through this flexibility, manufacturers can quickly adjust and expand product lines to adapt to market changes, making the installation process more reliable.

[0026] Working principle: when the semiconductor element 4 is placed on the packaging shell 1, the adjusting block 7 is rotated and the tension spring 6 allows the adapter ring 8 to clamp the adjusting block 7 on the semiconductor element 4 through elastic force to fix the semiconductor element 4. When the packaging cover 3 is docked in the docking groove 11, the fixing tube 12 is docked at the slide groove tube 13, and the adjusting rod 17 is under the elastic force of the reset spring 15. The adjusting rod 17 allows the outer claws 16 to open along both sides of the fixing rod 14, so that the fixing rod 14 is clamped at the fixing ring 18, so that the packaging shell 1 and the packaging cover 3 can be installed, making the packaging shell 1 and the packaging cover 3 more reliable during the installation process, facilitating the mutual assembly between the packaging shell 1 and the packaging cover 3, so that the structure can reduce the assembly time on the production line and accelerate the process from production to market. At the same time, when the structure needs to be repaired or upgraded, it is also convenient to quickly replace parts to ensure that the structure is put into use again as soon as possible, reducing production costs, and making the maintenance and upgrade process easier. Through this flexibility, manufacturers can quickly adjust and expand product lines to adapt to market changes, making the installation process more reliable.

[0027] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor packaging unit with high reliability, comprising a packaging shell (1), characterized in that: The left and right ends and the front and rear sides of the packaging shell (1) are fixedly connected with mounting frames (2), and the opposite ends of the mounting frames (2) are provided with mounting holes (10). The top of the packaging shell (1) is connected with a packaging cover (3) through an assembly component, and a semiconductor element (4) is installed on the top of the packaging shell (1). The front and rear sides and the left and right parts of the top of the packaging shell (1) are fixedly connected with connecting tubes (5), and the bottom end of the inner wall of the connecting tube (5) is rotatably connected with an adjustment block (7) through a tension spring (6), and the bottom end of the adjustment block (7) is rotatably connected with an adapter ring (8), and the bottom end of the packaging cover (3) is fixedly connected with a heat sink (9), and the left and right sides of the top of the packaging shell (1) are provided with docking grooves (11).

2. A semiconductor packaging unit with high reliability according to claim 1, characterized in that: The assembly component comprises a fixed tube (12) fixedly connected to four sides of the bottom end of the packaging cover (3); the inner wall of the fixed tube (12) is fixedly connected to a fixed ring (18); the bottom end of the inner wall of the docking groove (11) is fixedly connected to the inner wall of the fixed tube (12); the bottom ends of the front and rear ends of the inner wall of the docking groove (11) are slidably connected to an adjustment rod (17) via a return spring (15); the front and rear sides of the top of the slide tube (13) are fixedly connected to a fixed rod (14); and the outer wall of the fixed rod (14) is installed with an external claw (16).

3. A semiconductor packaging unit with high reliability according to claim 1, characterized in that: The top end of the tension spring (6) is fixedly connected to the bottom end of the adjustment block (7), and the bottom end of the tension spring (6) is fixedly connected to the bottom end of the inner wall of the connecting pipe (5).

4. The semiconductor packaging unit with high reliability according to claim 1, characterized in that: The outer wall of the adapter ring (8) is slidably connected to the inner wall of the connecting pipe (5).

5. The semiconductor packaging unit with high reliability according to claim 2, characterized in that: The top end of the return spring (15) is fixedly connected to the top end of the inner wall of the adjustment rod (17), and the bottom end of the return spring (15) is fixedly connected to the front and rear sides of the bottom end of the inner wall of the docking groove (11).

6. The semiconductor packaging unit with high reliability according to claim 2, characterized in that: The outer wall of the adjusting rod (17) is slidably connected to the inner wall of the slide groove tube (13).

7. A semiconductor packaging unit with high reliability according to claim 2, characterized in that: The outer claw (16) is rotatably connected to the front and rear sides of the top of the adjusting rod (17) at one opposite end.

8. The semiconductor packaging unit with high reliability according to claim 2, characterized in that: The opposite end of the outer claw (16) can be detachably connected to the top of the fixing ring (18).

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