Substrate structure and packaging structure
通过在基板结构中使用多个打线手指将芯片的焊盘连接到基板管脚,增加了键合线的水平长度,解决了现有技术中键合线过长导致的封装冲塌问题,确保 The chip thickness and performance stability is achieved.
Patent Information
- Application Number
- CN202323321163.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-06
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2033-12-06
AI Technical Summary
In the prior art, the bonding wire from the chip PAD to the substrate pins is too long, resulting in a high increase in the wire during chip packaging, which may cause the package to collapse or the chip thickness needs to be increased, affecting product performance.
A plurality of first wire-pushing fingers are connected to the substrate pins correspondingly, and the pad of the chip is connected to the first wire-pushing finger through a number of second wire-pushing fingers, and the pad and the second wire-pushing finger are connected to the third bonding wire. Finger connections, thereby increasing the horizontal length of the bonding line without changing the bus length and reducing the line height.
Through this structure, the wire height of the bonded wire is reduced, the risk of the package being collapsed is avoided, and the need to increase the chip thickness is avoided, ensuring the stability of product performance.
Smart Images
Figure CN222320263U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip packaging, and more specifically, to a substrate structure and a packaging structure. Background Art
[0002] In chip packaging, wires need to be bonded from the chip PAD (pad) to the pins of the substrate. The existing technology is to bond wires directly from the chip PAD to the bonding fingers on the substrate that are connected to the pins. The PAD and the bonding fingers are connected by bonding wires. When the bonding wire is too long, the wire height will increase. Too high a wire height will cause the chip to collapse during packaging, or the thickness of the chip needs to be increased. If the bonding wire is a sensitive wire, it will also affect the product performance. Utility Model Content
[0003] The technical problem to be solved by the utility model is that, in view of the above-mentioned defects of the prior art, a substrate structure and a packaging structure are proposed to solve the problem of increased height of the bonding wire from the chip PAD to the substrate pin.
[0004] The technical solution adopted by the utility model to solve its technical problem is: a substrate structure is proposed, including: a plurality of first bonding fingers, the first bonding fingers are connected to the pins in a one-to-one correspondence, and is characterized in that it also includes: a plurality of second bonding fingers, the second bonding fingers are used to connect the first bonding fingers and the pads of the chip.
[0005] In some embodiments, the second bonding finger and the first bonding finger are not on the same horizontal or vertical line.
[0006] In some embodiments, the pad is connected to the second bonding finger through a second bonding wire, and the second bonding finger is connected to the first bonding finger through a third bonding wire.
[0007] In some embodiments, the length of the second bonding wire plus the length of the third bonding wire is equal to the length of the first bonding wire.
[0008] In some embodiments, at least one second bonding finger is connected between the pad and the first bonding finger.
[0009] The implementation of the substrate structure of the utility model has the following beneficial effects: the horizontal length of the bonding wire between the PAD and the pin is increased through the second bonding finger, and the height of the bonding wire is reduced while the length of the bonding wire remains unchanged, thereby avoiding the risk of package collapse and increasing chip thickness. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:
[0011] Figure 1 It is a structural schematic diagram of the substrate structure of the utility model. DETAILED DESCRIPTION
[0012] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0013] like Figure 1 As shown, the substrate structure of the utility model includes: a first bonding finger 1, the first bonding finger 1 is connected to the pin of the substrate 4 in a one-to-one correspondence, and the first bonding finger 1 and the pin are fixedly connected through a metal layer. A chip is arranged on the substrate 4 structure, and the PAD 3 of the chip is connected to the first bonding finger 1 through a first bonding wire 5, and then an electrical connection with an external circuit is achieved through the pin.
[0014] In order to avoid the first bonding wire 5 directly connecting PAD3 and the first bonding finger 1 from being too long and to increase the wire height, the substrate 4 structure of the utility model also includes: a plurality of second bonding fingers 2, the second bonding finger 2 is an isolated island, and is not connected to any pin and the first bonding finger 1 in the metal layer. When the first bonding wire 5 is too long, PAD3 is connected to the second bonding finger 2 through the second bonding wire 6, and then the second bonding finger 2 and the first bonding finger 1 are connected through the third bonding wire 7, thereby realizing the connection between PAD3 and the pin. Among them, the length of the first bonding wire 5 is equal to the length of the second bonding wire 6 plus the length of the third bonding wire 7, that is, through the second bonding finger 2, the horizontal length of the bonding wire (the second bonding wire 6 and the third bonding wire 7) between PAD3 and the pin is increased, thereby reducing the wire height of the bonding wire (the first bonding wire 5), but the total bonding wire length remains unchanged, thereby avoiding the risk of the package being collapsed and avoiding increasing the chip thickness.
[0015] Furthermore, in order to increase the horizontal line length, the second bonding finger 2 cannot be located on the projection line of the first bonding finger 1 and PAD3, that is, the second bonding finger 2 is not on the same horizontal or vertical line as the first bonding finger 1. The projection line is the projection of the connection line between the first bonding finger 1 and PAD3 on the substrate 4, and the horizontal line and the vertical line are the frame lines of the substrate 4.
[0016] Furthermore, in some embodiments, more than one second finger is connected between the first bonding finger 1 and PAD3, and the second fingers are connected by a fourth bonding wire. The total length of the second bonding wire 6, the third bonding wire 7 and the fourth bonding wire is equal to the length of the first bonding wire 5, thereby further increasing the horizontal length of the bonding wire to ensure the purpose of reducing the wire height.
[0017] The utility model also provides a packaging structure, including the substrate structure described in the embodiment of the utility model.
[0018] The implementation of the substrate structure of the utility model has the following beneficial effects: through the second wire bonding finger 2, the horizontal length of the bonding wire between the PAD3 and the pin is increased, and the height of the bonding wire is reduced while the length of the bonding wire remains unchanged, thereby avoiding the risk of the package being collapsed and avoiding increasing the chip thickness.
[0019] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.
[0020] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot limit the protection scope of the utility model. All equivalent changes and modifications made to the scope of the claims of the utility model should fall within the scope of the claims of the utility model.
[0021] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.
Claims
1. A substrate structure, comprising: A plurality of first bonding fingers, wherein the first bonding fingers are connected to the pins in a one-to-one correspondence, and characterized in that the plurality of second bonding fingers are further included: a plurality of second bonding fingers, wherein the second bonding fingers are used to connect the first bonding fingers and the pads of the chip; the second bonding fingers and the first bonding fingers are not on the same horizontal or vertical line; the pads are connected to the second bonding fingers through second bonding wires, and the second bonding fingers are connected to the first bonding fingers through third bonding wires; the length of the second bonding wire plus the length of the third bonding wire is equal to the length of the first bonding wire; and at least one second bonding finger is connected between the pads and the first bonding fingers.
2. A packaging structure, characterized in that: Comprising the substrate structure according to claim 1.