Positioning etching device for heterogeneous integrated circuit processing

Abstract

The utility model relates to the technical field of circuit processing positioning etching, and discloses a positioning etching device for heterogeneous integrated circuit processing, which comprises a laser etching machine body, a motor I is fixedly connected to the left side of the outside of the laser etching machine body, and the output end of the motor I is fixedly connected with a screw rod I; one end of the first screw rod is rotationally connected to the interior of the laser etching machine body, the outer portion of the first screw rod is in threaded connection with a threaded block, the bottom of the threaded block is fixedly connected with an air cylinder, the output end of the air cylinder is fixedly connected with a fixing block, and the left side and the right side of the fixing block are both fixedly connected with connecting frames. And one side of the connecting frame is fixedly connected with a supporting frame. According to the utility model, the chip is stably clamped and fixed, the influence on the use of the chip due to offset during etching is avoided, the laser head can randomly move back and forth and left and right to engrave the chip, and the degree of freedom of engraving and the practicability of the device are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit processing positioning etching, in particular to a positioning etching device used for heterogeneous integrated circuit processing. Background Art

[0002] Positioning etching is a key step in semiconductor processing, which is used to accurately etch the chip surface during the integrated circuit manufacturing process to form the desired circuit pattern. Heterogeneous integrated circuits usually refer to the integration of different types of devices on the same chip, such as sensors, logic gates, memory cells, etc., which may be made of different materials and process steps. In such a case, the positioning etching device needs to be able to accurately control the etching position to ensure the accuracy and reliability of the integration of different devices.

[0003] After searching, the Chinese patent announcement number: CN218694971U discloses a precisely positioned etching mold assembly including a laser etching machine body, and a laser emitter is fixedly installed on the top of the laser etching machine body. Although this patented technology can quickly and accurately position the mold, making the positioning of the mold relatively simple and achieving the effect of improving processing efficiency, the problem of fixed position of the laser emitter leads to limited freedom of engraving and reduced practicality of the device. Therefore, those skilled in the art provide a positioning etching device for heterogeneous integrated circuit processing to solve the problems raised in the above background technology. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a positioning etching device for heterogeneous integrated circuit processing, aiming to improve the problem in the prior art that the freedom of engraving is limited and the practicality of the device is reduced.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a positioning etching device for heterogeneous integrated circuit processing, comprising a laser etching machine body, a motor 1 is fixedly connected to the outer left side of the laser etching machine body, a screw 1 is fixedly connected to the output end of the motor 1, one end of the screw 1 is rotatably connected to the inside of the laser etching machine body, the outer thread of the screw 1 is connected to a threaded block, the bottom of the threaded block is fixedly connected to a cylinder, the output end of the cylinder is fixedly connected to a fixed block, the left and right sides of the fixed block are fixedly connected to a connecting frame, one side of the connecting frame is fixedly connected to a support frame, the front side of the support frame is fixedly connected to a micro motor, and the output end of the micro motor is fixedly connected to a moving component.

[0006] As a further description of the above technical solution:

[0007] The moving assembly comprises a second screw rod, the second screw rod is fixedly connected to the output end of the micro motor, the external thread of the second screw rod is connected to a moving block, and the bottom of the moving block is fixedly connected to a laser head.

[0008] As a further description of the above technical solution:

[0009] A push rod is slidably connected to the inside of the laser etching machine body, and evenly distributed sockets are opened on the front side of the push rod. A clamp is fixedly connected to the corresponding end of the push rod. Bolts are threadedly connected to the front and back of the inner upper side of the clamp. A movable plate is provided at the bottom end of the bolt, and the bolt is rotatably connected to the inside of the movable plate.

[0010] As a further description of the above technical solution:

[0011] A support is fixedly connected to one side of the laser etching machine body, a rotating rod is rotatably connected inside the support, a gear is fixedly connected to the bottom end of the rotating rod, and a rack block is meshedly connected to one side of the gear.

[0012] As a further description of the above technical solution:

[0013] The rack plug-in block is slidably connected inside the plug-in hole.

[0014] As a further description of the above technical solution:

[0015] A telescopic rod is fixedly connected to the front and rear of one side of the clamp, a spring is arranged outside the telescopic rod, and the other end of the telescopic rod is fixed to one side of the interior of the laser etching machine body.

[0016] As a further description of the above technical solution:

[0017] The four corners of the bottom of the laser etching machine body are fixedly connected with supporting feet.

[0018] As a further description of the above technical solution:

[0019] One end of the second screw rod is rotatably connected to the inside of the support frame, and the moving block is slidably connected to the inside of the support frame.

[0020] The utility model has the following beneficial effects:

[0021] 1. In the utility model, by using the push rod, the clamp, the telescopic rod, the spring, the bolt, the moving plate, the rotating rod, the gear, the rack plug, the jack and other structures in coordination, the chip can be firmly clamped and fixed to avoid the chip being offset during etching and affecting its use.

[0022] 2. In the utility model, by using the coordination among motor 1, screw 1, threaded block, laser head, micro motor, screw 2, moving block and other structures, the laser head can be moved forward, backward, left and right at will to engrave the chip, thereby improving the freedom of engraving and the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A three-dimensional diagram of a positioning etching device for heterogeneous integrated circuit processing proposed by the utility model;

[0024] Figure 2 for Figure 1 A magnified image of point A;

[0025] Figure 3 This is a schematic diagram of the internal structure of the support frame of the positioning etching device for heterogeneous integrated circuit processing proposed by the utility model;

[0026] Figure 4 for Figure 1 Enlarged view of point B.

[0027] Legend:

[0028] 1. Support leg; 2. Laser etching machine body; 3. Motor 1; 4. Screw 1; 5. Cylinder; 6. Threaded block; 7. Clamp; 8. Telescopic rod; 9. Spring; 10. Bolt; 11. Moving plate; 12. Push rod; 13. Fixed block; 14. Connecting frame; 15. Support frame; 16. Micro motor; 17. Screw 2; 18. Moving block; 19. Support member; 20. Rotating rod; 21. Gear; 22. Rack plug-in block; 23. Socket; 24. Laser head. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Reference Figure 1-Figure 3The utility model provides an embodiment: a positioning etching device for heterogeneous integrated circuit processing, comprising a laser etching machine body 2, a motor 3 is fixedly connected to the left side of the outside of the laser etching machine body 2, a screw 4 is fixedly connected to the output end of the motor 3, one end of the screw 4 is rotatably connected to the inside of the laser etching machine body 2, a threaded block 6 is threadedly connected to the outside of the screw 4, a cylinder 5 is fixedly connected to the bottom of the threaded block 6, a fixed block 13 is fixedly connected to the output end of the cylinder 5, a connecting frame 14 is fixedly connected to the left and right sides of the fixed block 13, a support frame 15 is fixedly connected to one side of the connecting frame 14, a micro motor 16 is fixedly connected to the front side of the support frame 15, and a moving component is fixedly connected to the output end of the micro motor 16;

[0031] The moving component includes a screw rod 17, which is fixedly connected to the output end of the micro motor 16. The external thread of the screw rod 17 is connected to a moving block 18, and the bottom of the moving block 18 is fixedly connected to a laser head 24. One end of the screw rod 17 is rotatably connected to the inside of the support frame 15, and the moving block 18 is slidably connected to the inside of the support frame 15.

[0032] The motor 13 is started to drive the screw 14 to rotate and the threaded block 6 is moved, so that the laser head 24 moves left and right. The micro motor 16 is started to drive the screw 2 17 to rotate and the moving block 18 is moved, so that the laser head 24 moves forward and backward, so that the laser head 24 can be moved at will for engraving.

[0033] Reference Figure 1 and Figure 4 A push rod 12 is slidably connected to the inside of the laser etching machine body 2, and evenly distributed sockets 23 are opened on the front side of the push rod 12. A clamp 7 is fixedly connected to the corresponding end of the push rod 12. Bolts 10 are threadedly connected to the front and back of the upper side of the inside of the clamp 7. A movable plate 11 is provided at the bottom end of the bolt 10. The bolt 10 is rotatably connected to the inside of the movable plate 11. A support 19 is fixedly connected to one side of the laser etching machine body 2. A rotating rod 20 is rotatably connected to the inside of the support 19. A gear 21 is fixedly connected to the bottom end of the rotating rod 20. A rack block 22 is meshedly connected to one side of the gear 21, and the rack block 22 is slidably connected to the inside of the socket 23.

[0034] A telescopic rod 8 is fixedly connected to one side of the clamp 7 at the front and back, a spring 9 is arranged on the outside of the telescopic rod 8, and the other end of the telescopic rod 8 is fixed to one side of the inside of the laser etching machine body 2; the four corners of the bottom of the laser etching machine body 2 are fixedly connected with supporting feet 1.

[0035] The clamp 7 is moved by pushing the push rod 12, and the telescopic rod 8 and the spring 9 are pulled at the same time. The movable plate 11 is driven downward by rotating the bolt 10 to clamp and fix the chip. The rotating rod 20 is rotated to drive the gear 21 to rotate, and at the same time the rack block 22 is driven to move and insert into the socket 23 to fix the position of the push rod 12. The device is fixedly supported by the support leg 1.

[0036] Working principle: When the device is needed, push the push rod 12 to drive the clamp 7 to move, pull the telescopic rod 8 and the spring 9 at the same time, and turn the bolt 10 to drive the moving plate 11 to move down to clamp and fix the chip. Turn the rotating rod 20 to drive the gear 21 to rotate, so that it drives the rack plug 22 to move, insert it into the inside of the socket 23, and fix the position of the push rod 12, so as to achieve a stable clamping and fixation of the chip to avoid offset during etching to affect the use of the chip. Start the motor 13 to drive the screw 14 to rotate, so that the threaded block 6 moves and drives the laser head 24 to move left and right, and start the micro motor 16 to rotate the screw 2 17 and drive the moving block 18 to move, so that the laser head 24 moves forward and backward, so that the laser head 24 can move forward and backward and left and right at will to engrave the chip, which improves the freedom of engraving and the practicality of the device.

[0037] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A positioning etching device for heterogeneous integrated circuit processing, comprising a laser etching machine body (2), characterized in that: The left side of the outside of the laser etching machine body (2) is fixedly connected to a motor 1 (3), the output end of the motor 1 (3) is fixedly connected to a screw 1 (4), one end of the screw 1 (4) is rotatably connected to the inside of the laser etching machine body (2), the external thread of the screw 1 (4) is connected to a threaded block (6), the bottom of the threaded block (6) is fixedly connected to a cylinder (5), the output end of the cylinder (5) is fixedly connected to a fixed block (13), the left and right sides of the fixed block (13) are fixedly connected to a connecting frame (14), one side of the connecting frame (14) is fixedly connected to a support frame (15), the front side of the support frame (15) is fixedly connected to a micro motor (16), and the output end of the micro motor (16) is fixedly connected to a moving component.

2. The positioning etching device for heterogeneous integrated circuit processing according to claim 1, characterized in that: The moving assembly comprises a second screw rod (17), the second screw rod (17) is fixedly connected to the output end of the micro motor (16), the external thread of the second screw rod (17) is connected to a moving block (18), and the bottom of the moving block (18) is fixedly connected to a laser head (24).

3. The positioning etching device for heterogeneous integrated circuit processing according to claim 1, characterized in that: The laser etching machine body (2) is slidably connected to a push rod (12) inside, and the front side of the push rod (12) is provided with evenly distributed sockets (23). The corresponding end of the push rod (12) is fixedly connected to a clamp (7), and the front and rear sides of the inner upper side of the clamp (7) are threadedly connected with bolts (10), and the bottom end of the bolt (10) is provided with a movable plate (11), and the bolt (10) is rotatably connected to the inside of the movable plate (11).

4. The positioning etching device for heterogeneous integrated circuit processing according to claim 1, characterized in that: A support member (19) is fixedly connected to one side of the laser etching machine body (2); a rotating rod (20) is rotatably connected inside the support member (19); a gear (21) is fixedly connected to the bottom end of the rotating rod (20); and a rack plug (22) is meshedly connected to one side of the gear (21).

5. The positioning etching device for heterogeneous integrated circuit processing according to claim 4, characterized in that: The rack insert block (22) is slidably connected inside the insert hole (23).

6. The positioning etching device for heterogeneous integrated circuit processing according to claim 3, characterized in that: A telescopic rod (8) is fixedly connected to one side of the clamp (7) at the front and rear, a spring (9) is arranged outside the telescopic rod (8), and the other end of the telescopic rod (8) is fixed to one side inside the laser etching machine body (2).

7. The positioning etching device for heterogeneous integrated circuit processing according to claim 1, characterized in that: The four corners of the bottom of the laser etching machine body (2) are all fixedly connected with supporting feet (1).

8. The positioning etching device for heterogeneous integrated circuit processing according to claim 2, characterized in that: One end of the second screw rod (17) is rotatably connected to the inside of the support frame (15), and the moving block (18) is slidably connected to the inside of the support frame (15).

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