Replating device

Abstract

The utility model discloses a plating repair device, which comprises a detection component arranged above a film and used for detecting quality information of a film plating layer, and the quality information comprises at least one of plating layer surface flatness and hole coordinates of the plating layer surface; the electro-deposition assembly is arranged on the side of the detection component, the electro-deposition assembly comprises a plating solution spray head, the plating solution spray head is located above the thin film, the position of the plating solution spray head is movably arranged, and the plating solution spray head is used for spraying a plating solution into the hole to form a plating layer; and the control module is connected with the detection part and the electro-deposition assembly, and the control module is used for obtaining the hole coordinates and controlling the plating solution spray head to move to the position above the hole according to the hole coordinates so as to spray the plating solution into the hole. The utility model solves the problem that the plating quality is reduced due to the defects of holes and the like easily appearing on the surface of the electroplated film in the prior art.

Description

Technical Field

[0001] The present application relates to the technical field of thin film electroplating, and in particular to a re-plating device. Background Art

[0002] Ion batteries are widely used in the field of new energy due to their many advantages such as high energy density, excellent power performance, and long cycle life. In the process of manufacturing ion batteries, the current collector is an important component, which is mainly welded on the pole ear to collect current for better output.

[0003] In the current collector production process, electroplating and other processes are mainly carried out on the copper foil to form a coating, which is then formed through a series of processing.

[0004] During the electroplating process of existing thin films, due to the instability of the coating process, there are parts on the film surface that are not plated with metal, or the coating is too thin, resulting in partial peeling of the coating. This causes defects such as holes to appear on the film surface after coating, affecting the coating quality and reducing the qualified rate of the current collector products. Utility Model Content

[0005] The main purpose of the present application is to provide a repair plating device to solve the problem in the prior art that defects such as holes are easily present on the surface of the electroplated film, thereby reducing the quality of the coating.

[0006] According to one aspect of the present application, a repair plating device is provided, comprising: a detection component, arranged above a thin film, for detecting quality information of a thin film coating, the quality information comprising at least one of the following: surface flatness of the coating, coordinates of holes on the coating surface; an electroplating component, arranged on the side of the detection component, the electroplating component comprising a plating liquid nozzle, the plating liquid nozzle being located above the thin film, the position of the plating liquid nozzle being movably arranged, the plating liquid nozzle being used to spray plating liquid into the holes to form a coating; a control module, connected to the detection component and the electroplating component respectively, the control module being used to obtain the coordinates of the holes, and controlling the plating liquid nozzle to move to above the holes according to the coordinates of the holes to spray the plating liquid into the holes.

[0007] Furthermore, the repair plating device also includes: a photosensitive screen, which is arranged on the side of the electroplating component, and the photosensitive screen is connected to the control module signal to obtain the coordinates of the hole; the electroplating component also includes: a reflective end face, which is located above the plating liquid nozzle and connected to the plating liquid nozzle, so that the reflective end face moves with the plating liquid nozzle; a laser emitter, which is arranged on the electroplating component and moves with the electroplating component, and the laser emitter is used to emit a light beam to the reflective end face, and the light beam is reflected from the reflective end face to the photosensitive screen, so that during the movement of the electroplating component, the coordinates of the reflected light spot are sensed by the photosensitive screen, and the control module compares the coordinates of the light spot with the hole coordinates to determine the position coordinates of the plating liquid nozzle according to the comparison result.

[0008] Furthermore, the electrodeposition assembly also includes: a first mounting plate extending in a vertical direction, and the laser emitter is arranged on the first mounting plate; a second mounting plate extending in a horizontal direction, the second mounting plate is connected to the first mounting plate, the reflective end surface is arranged on the second mounting plate, and at least a portion of the plating liquid nozzle is installed on a side of the second mounting plate away from the reflective end surface.

[0009] Furthermore, the repair plating device also includes: a moving component, which is movably arranged along a predetermined track, the first mounting plate is connected to the moving component, and the moving component moves through the first mounting plate and the second mounting plate, driving the laser emitter and the plating liquid nozzle to move.

[0010] Furthermore, the moving component includes: a first moving rail, extending along a first direction, a first slider is arranged on the first moving rail, and the first slider is movably arranged along the extension direction of the first moving rail; a second moving rail, extending along a second direction, the second moving rail is connected to the first slider, a second slider is arranged on the second moving rail, the second slider is movably arranged along the extension direction of the second moving rail, and a first mounting plate is connected to the second slider; wherein the first direction and the second direction are perpendicular to each other.

[0011] Further, the first movable track includes a first lead screw, the first slider is sleeved on the first lead screw and is threadedly connected to the first lead screw, and the movable component also includes: a first drive motor, which is drivingly connected to the first lead screw, and the first drive motor drives the first lead screw to rotate; and / or, the second movable track includes a second lead screw, the second slider is sleeved on the second lead screw and is threadedly connected to the second lead screw, and the movable component also includes: a second drive motor, which is drivingly connected to the second lead screw, and the second drive motor drives the second lead screw to rotate.

[0012] Furthermore, the electrodeposition assembly also includes: a power supply, the negative terminal of the power supply is in contact with the surface of the film, and the positive terminal of the power supply extends into the plating solution of the plating solution nozzle, so that the plating solution in the holes forms a coating on the surface of the film under the action of electrolysis.

[0013] Furthermore, the negative electrode connector is provided with a fitting end surface that fits with the surface of the film, and the fitting end surface is an arc-shaped surface.

[0014] Furthermore, the electrodeposition assembly also includes: a liquid storage tank for storing plating liquid; a plating liquid nozzle, a plating liquid nozzle is arranged at the end of the plating liquid nozzle and is connected to the plating liquid nozzle, and an end of the plating liquid nozzle away from the plating liquid nozzle is connected to the liquid storage tank; wherein at least a portion of the positive electrode connector is arranged in the plating liquid nozzle.

[0015] Furthermore, the detection component is a three-dimensional laser scanner.

[0016] Compared with the prior art, the technical solution of this application has at least the following technical effects:

[0017] The repair plating device provided by the utility model includes a detection component, an electroplating component and a control module. The detection component is arranged above the film. During the transmission of the film, the detection component is used to detect the quality of the coating on the surface of the film. The quality information includes at least one of the following: the flatness of the coating surface, the coordinates of the holes on the coating surface. If the coating surface is damaged or defective, holes will be formed on the coating surface. At this time, the detection component generates the hole coordinates after detecting the defects on the coating surface, and transmits the hole coordinates to the control module. After receiving the hole coordinates, the control module controls the plating liquid nozzle to move to the top of the hole and sprays the plating liquid into the hole to form a coating in the hole, fill the hole, realize repair plating, reduce film surface defects, and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 It is a structural schematic diagram of an embodiment of a plating repair device disclosed in this application;

[0020] Figure 2 It is a structural schematic diagram of a moving component in the plating repair device disclosed in this application;

[0021] Figure 3 It is a schematic structural diagram of the electrodeposition component in the plating repair device disclosed in this application;

[0022] Figure 4 It is a schematic structural diagram of the negative electrode connector in the plating repair device disclosed in this application.

[0023] The above drawings include the following reference numerals:

[0024] 100, film; 1, detection component; 2, electrodeposition component; 20, plating solution nozzle; 3, photosensitive screen; 40, reflective end face; 41, laser emitter; 21, first mounting plate; 22, second mounting plate; 5, moving component; 50, first moving track; 501, first slider; 51, second moving track; 510, second slider; 52, first drive motor; 53, second drive motor; 23, power supply; 230, negative electrode connector; 231, positive electrode connector; 2301, fitting end face; 24, liquid storage tank; 25, plating solution nozzle; 26, power component; 27, delivery pipe. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0027] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0028] As mentioned in the background technology, in the process of producing the current collector, the copper foil film needs to be electroplated. In the prior art, when the film is electroplated, the plating layer may be incomplete or peeled off, holes may appear on the plating layer, etc., which leads to unqualified production quality of the current collector and reduces the qualified rate of the current collector product. Therefore, in view of the above technical problems, the utility model provides a plating device, including a detection component 1, an electrodeposition component 2 and a control module. The detection component 1 is arranged above the film 100. During the transmission of the film 100, the quality information of the coating on the film is detected by the detection component 1. The quality information includes at least the following: the flatness of the coating surface, the coordinates of the holes on the coating surface, so that the detection component 1 is used to detect whether the coating is complete. When it is detected that the coating surface is damaged or peeled off and a hole is formed, the detection component 1 automatically generates coordinate information for the position of the hole and transmits the coordinate information to the control module. After receiving the coordinate information, the control module controls the electrodeposition component 2 to move to the top of the hole according to the coordinate information of the hole, and then uses the plating liquid nozzle 20 to spray the plating liquid into the hole to form a coating in the hole. In this way, the damaged position on the coating surface is repaired, the film surface defects are reduced, and the product quality is improved.

[0029] See also Figures 1 to 4 As shown, the utility model provides a plating repair device, including: a detection component 1, which is arranged above the film 100 and is used to detect quality information of the film coating, and the quality information includes at least one of the following: the flatness of the coating surface and the coordinates of the holes on the coating surface; an electrodeposition component 2, which is arranged on the side of the detection component 1, and the electrodeposition component 2 includes a plating liquid nozzle 20, which is located above the film 100, and the position of the plating liquid nozzle 20 is movably set, and the plating liquid nozzle 20 is used to spray the plating liquid into the hole to form a coating; a control module, which is connected to the detection component 1 and the electrodeposition component 2 respectively, and the control module is used to obtain the hole coordinates, and control the plating liquid nozzle 20 to move to the top of the hole according to the hole coordinates to spray the plating liquid into the hole.

[0030] According to the repair plating device provided by the utility model, it includes a detection component 1, an electroplating component 2 and a control module. The detection component 1 is arranged above the film 100. During the transmission of the film 100, the detection component 1 is used to detect the quality of the coating on the surface of the film 100. The quality information includes at least one of the following: the flatness of the coating surface, the coordinates of the holes on the coating surface. If the coating surface is damaged or defective, holes will be formed on the coating surface. At this time, the detection component 1 generates the hole coordinates after detecting the defects on the coating surface, and transmits the hole coordinates to the control module. After receiving the hole coordinates, the control module controls the plating liquid nozzle 20 to move to the top of the hole, sprays the plating liquid into the hole, so as to form a coating in the hole, fill the hole, realize repair plating, reduce film surface defects, and improve product quality.

[0031] Specifically, the plating repair device also includes: a photosensitive screen 3, which is arranged on the side of the electroplating component 2, and the photosensitive screen 3 is connected to the control module signal to obtain the coordinates of the hole; the electroplating component also includes: a reflective end surface 40, which is located above the plating liquid nozzle 20 and connected to the plating liquid nozzle 20, so that the reflective end surface 40 moves with the plating liquid nozzle 20; a laser emitter 41, which is arranged on the electroplating component 2 and moves with the electroplating component 2, and the laser emitter 41 is used to emit a light beam to the reflective end surface 40, and the light beam is reflected from the reflective end surface 40 to the photosensitive screen 3, so that during the movement of the electroplating component 2, the coordinates of the reflected light spot are sensed by the photosensitive screen 3, and the control module compares the coordinates of the light spot with the hole coordinates to determine the position coordinates of the plating liquid nozzle 20 according to the comparison result. Among them, the angle of the laser emitted by the laser emitter 41 is fixed. As the electrodeposition component 2 moves, the angle of the laser reflected by the laser emitter 41 changes, that is, the position of the light spot falling on the photosensitive screen 3 changes with the movement of the electrodeposition component 2. Since the reflective end surface 40 is located above the plating liquid nozzle 20, the position of the plating liquid nozzle 20 is fed back by the light spot reflected by the laser on the photosensitive screen 3. When the light spot on the photosensitive screen 3 moves to a position that coincides with the hole coordinates, the electrodeposition component 2 stops moving. At this time, the plating liquid nozzle 20 is located above the hole to be plated, and the plating liquid is sprayed into the hole to form a plating layer in the hole to fill the hole.

[0032] In a specific implementation, the electrodeposition assembly 2 further includes: a first mounting plate 21 extending in a vertical direction, on which a laser emitter 41 is disposed; a second mounting plate 22 extending in a horizontal direction, the second mounting plate 22 being connected to the first mounting plate 21, a reflective end surface 40 being disposed on the second mounting plate 22, and at least a portion of the plating liquid nozzle 20 being mounted on a side of the second mounting plate 22 away from the reflective end surface 40. The laser emitter 41 is fixed by the first mounting plate 21, the second mounting plate 22 is connected to the first mounting plate 21, and the reflective end surface 40 is disposed on the second mounting plate 22, so that the laser emitter 41 and the reflective end surface 40 move synchronously, so as to ensure that the light spot on the photosensitive screen 3 can accurately feedback the position of the plating liquid nozzle 20.

[0033] In the present invention, the plating repair device further includes: a moving assembly 5, which is movably arranged along a predetermined track, the first mounting plate 21 is connected to the moving assembly 5, and the moving assembly 5 moves through the first mounting plate 21 and the second mounting plate 22, driving the laser emitter 41 and the plating liquid nozzle 20 to move. In this way, the first mounting plate 21 and the second mounting plate 22 are driven to move synchronously by the moving assembly 5, so as to ensure that the point on the reflective end surface 40 irradiated by the laser emitter 41 is kept synchronous with the plating liquid nozzle 20.

[0034] Furthermore, the moving assembly 5 includes: a first moving rail 50 extending in a first direction, a first slider 501 being arranged on the first moving rail 50, and the first slider 501 being movably arranged along the extending direction of the first moving rail 50; a second moving rail 51 extending in a second direction, the second moving rail 51 being connected to the first slider 501, a second slider 510 being arranged on the second moving rail 51, and the second slider 510 being movably arranged along the extending direction of the second moving rail 51, and a first mounting plate 21 being connected to the second slider 510; wherein the first direction and the second direction are perpendicular to each other. In this way, the first moving rail 50 and the second moving rail 51 provide the first mounting plate 21 with moving space in two directions, and at the same time, the first mounting plate 21 is used to drive the second mounting plate 22 to move synchronously.

[0035] Specifically, the first moving track 50 includes a first lead screw, a first slider 501 is sleeved on the first lead screw and is threadedly connected to the first lead screw, and the moving assembly 5 also includes: a first drive motor 52, which is connected to the first lead screw, and the first drive motor 52 drives the first lead screw to rotate; and / or, the second moving track 51 includes a second lead screw, a second slider 510 is sleeved on the second lead screw and is threadedly connected to the second lead screw, and the moving assembly 5 also includes: a second drive motor 53, which is connected to the second lead screw, and the second drive motor 53 drives the second lead screw to rotate. The structure set in this way is simple and easy to implement, the control module is connected to the first drive motor 52 and the second drive motor 53 respectively, the first drive motor 52 drives the first lead screw to rotate, so that the first slider 501 moves along the length direction of the first lead screw, and the first slider 501 drives the second lead screw to move, wherein the end of the second lead screw is threadedly connected to the first slider 501, and the second lead screw is driven to rotate by the second drive motor 53, at this time, the second slider 510 moves along the length direction of the second lead screw, thereby driving the first mounting plate 21 to move.

[0036] In the specific implementation process, the electrodeposition assembly 2 also includes: a power supply 23, the negative electrode connector 230 of the power supply 23 is attached to the surface of the film 100, and the positive electrode connector 231 of the power supply 23 extends into the plating solution of the plating solution nozzle 20, so that the plating solution in the hole forms a plating layer on the surface of the film under the action of electrolysis. In this way, the negative electrode connector 230, the positive electrode connector 231 and the film 100 form a current loop. At the moment when the plating solution is sprayed into the hole, the copper ions in the plating solution are reduced to copper in the hole under the action of electrolysis, and filled in the hole, so that the plating layer is complete. Preferably, the plating solution is a copper sulfate solution.

[0037] The negative electrode connector 230 is provided with a fitting end face 2301 that fits with the surface of the film 100, and the fitting end face 2301 is an arc-shaped surface. In the actual production process, since the film 100 and the electrodeposition assembly move relative to each other, in order to avoid secondary damage to the coating during the contact between the negative electrode connector 230 and the surface of the film 100, the fitting end face 2301 is designed as an arc-shaped surface to reduce the friction between the coating and the negative electrode connector 230. Preferably, the negative electrode connector 230 includes a roller, and the fitting end face 2301 is the circumferential surface of the roller, and the roller is rotatably arranged around its own axis.

[0038] Furthermore, the electrodeposition assembly 2 further includes: a liquid storage tank 24 for storing plating liquid; a plating liquid nozzle 25, the plating liquid nozzle head 20 is disposed at the end of the plating liquid nozzle 25 and communicated with the plating liquid nozzle 25, and one end of the plating liquid nozzle 25 away from the plating liquid nozzle head 20 is communicated with the liquid storage tank 24; wherein, at least part of the positive electrode connector 231 is disposed in the plating liquid nozzle 25. Specifically, the liquid storage tank 24 and the plating liquid nozzle 25 are communicated through a delivery pipe 27, and a power component 26 is disposed on the delivery pipe 27, and the power component 26 is a pump body or an atomizer, which delivers the plating liquid in the liquid storage tank 24 to the plating liquid nozzle 25.

[0039] In the present application, the detection component 1 is a three-dimensional laser scanner. The three-dimensional laser scanner adopts the principle of laser ranging. By recording the three-dimensional coordinates, reflectivity, texture and other information of a large number of dense points on the surface of the measured object, it can quickly reconstruct the three-dimensional model of the measured target and various drawing data such as lines, surfaces, and bodies. Therefore, by scanning the coating with a three-dimensional laser scanner, the flatness information of the coating surface can be obtained. If the coating surface is damaged and an uneven structure is formed on the coating surface, that is, there are holes or grooves on the coating surface, the three-dimensional laser scanner will generate the position coordinates of the holes or grooves according to the ranging principle, and transmit the coordinate information to the control module.

[0040] In actual application, the distance between the three-dimensional laser scanner and the plating liquid nozzle 20 is fixed. When the three-dimensional laser scanner scans the damage on the surface of the coating, it generates coordinate information at the same time, and then uploads the coordinate information to the control module and the photosensitive screen 3. The area displayed on the photosensitive screen 3 is the area scanned by the three-dimensional laser scanner. Then, the film is controlled to move to the bottom of the electrodeposition component 2 and the film is stopped to ensure that the area scanned by the three-dimensional laser scanner is below the electrodeposition component 2. The first drive motor 52 and the second drive motor 53 are controlled to operate and drive The laser emitter 41 moves, and the position of the light spot reflected on the photosensitive screen 3 changes accordingly. The hole position information on the photosensitive screen 3 corresponds to the position information of the scanned area. The photosensitive screen 3 adopts interactive photon touch technology. The photosensitive screen 3 can sense the position of the light spot. When the light spot position on the photosensitive screen 3 moves to the hole coordinate, the photosensitive screen 3 sends a signal to the control module to control the first drive motor 52 and the second drive motor 53 to stop running. Then the plating liquid nozzle 20 sprays the plating liquid, and under the action of electrolysis, a coating is formed in the hole to make the coating on the surface of the film complete.

[0041] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0042] According to the positioning and re-plating device provided by the utility model, it includes a detection component 1, an electroplating component 2 and a control module. The detection component 1 is arranged above the film 100. During the transmission of the film 100, the detection component 1 is used to detect the quality of the coating on the surface of the film 100. The quality information includes at least one of the following: the flatness of the coating surface, the coordinates of the holes on the coating surface, wherein when the coating surface is flat, it indicates that the coating quality is good and no re-plating is required. When the coating surface is detected to be uneven or damaged to produce holes, the surface of the coating is damaged and re-plating is required. At this time, the detection component 1 generates the coordinate information of the holes on the coating surface and transmits the coordinate information to the control module. The control module transmits the coordinate information to the sensor. Inside the light screen 3, the film 100 is controlled to stop transmitting after moving a predetermined distance. At this time, the damaged area of ​​the coating is located below the electrodeposition component 2. The laser emitter 41 is used to emit a laser beam to the reflective end surface 40. The laser beam is reflected on the photosensitive screen 3. As the first drive motor 52 and the second drive motor 53 drive the laser emitter 41 to move, the laser light spot moves on the photosensitive screen 3. When the light spot moves to the hole coordinates displayed on the photosensitive screen 3, the photosensitive screen 3 sends a signal to the control module to control the first drive motor 52 and the second drive motor 53 to stop running, and then the plating liquid nozzle 20 is controlled to spray the plating liquid to fill the holes on the surface of the coating to ensure the integrity of the coating on the surface of the film, reduce film surface defects, and improve product quality.

[0043] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0044] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0045] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A repair plating device, characterized in that: include: A detection component (1) is arranged above the film (100) and is used to detect quality information of the film coating, wherein the quality information includes at least one of the following: surface flatness of the coating, and coordinates of holes on the coating surface; An electrodeposition assembly (2) is arranged on the side of the detection component (1), the electrodeposition assembly (2) comprises a plating liquid nozzle (20), the plating liquid nozzle (20) is located above the film (100), the position of the plating liquid nozzle (20) is movably arranged, and the plating liquid nozzle (20) is used to spray the plating liquid into the hole to form a plating layer; A control module is connected to the detection component (1) and the electrodeposition component (2) respectively, and is used to obtain the coordinates of the hole and control the plating liquid nozzle (20) to move to the top of the hole according to the hole coordinates so as to spray the plating liquid into the hole.

2. The repair plating device according to claim 1, characterized in that: The repair plating device further comprises: a photosensitive screen (3) arranged on the side of the electrodeposition component (2), the photosensitive screen (3) being connected to the control module by signal to obtain the coordinates of the hole; the electrodeposition component further comprises: A reflective end surface (40) is located above the plating liquid nozzle (20) and is connected to the plating liquid nozzle (20), so that the reflective end surface (40) moves with the plating liquid nozzle (20); A laser emitter (41) is arranged on the electrodeposition assembly (2) and moves with the electrodeposition assembly (2). The laser emitter (41) is used to emit a light beam to the reflective end surface (40). The light beam is reflected from the reflective end surface (40) to the photosensitive screen (3). During the movement of the electrodeposition assembly (2), the coordinates of the reflected light spot are sensed by the photosensitive screen (3). The control module compares the coordinates of the light spot with the coordinates of the hole to determine the position coordinates of the plating liquid nozzle (20) according to the comparison result.

3. The repair plating device according to claim 2, characterized in that: The electrodeposition assembly (2) further comprises: A first mounting plate (21) extending in a vertical direction, wherein the laser emitter (41) is arranged on the first mounting plate (21); The second mounting plate (22) extends in a horizontal direction. The second mounting plate (22) is connected to the first mounting plate (21). The reflective end surface (40) is arranged on the second mounting plate (22). At least a part of the plating liquid nozzle (20) is installed on a side of the second mounting plate (22) away from the reflective end surface (40).

4. The repair plating device according to claim 3, characterized in that: The plating repair device also includes: The movable component (5) is movably arranged along a predetermined track, the first mounting plate (21) is connected to the movable component (5), and the movable component (5) moves through the first mounting plate (21) and the second mounting plate (22), thereby driving the laser emitter (41) and the plating liquid nozzle (20) to move.

5. The repair plating device according to claim 4, characterized in that: The moving component (5) comprises: A first movable track (50) extending in a first direction, a first slider (501) being arranged on the first movable track (50), and the first slider (501) being movably arranged along the extending direction of the first movable track (50); A second movable track (51) extending along a second direction, the second movable track (51) being connected to the first slider (501), a second slider (510) being arranged on the second movable track (51), the second slider (510) being movably arranged along an extending direction of the second movable track (51), and the first mounting plate (21) being connected to the second slider (510); The first direction and the second direction are perpendicular to each other.

6. The repair plating device according to claim 5, characterized in that: The first movable track (50) comprises a first lead screw, the first slider (501) is sleeved on the first lead screw and is threadedly connected to the first lead screw, and the movable assembly (5) further comprises: a first drive motor (52) drivingly connected to the first lead screw, and the first drive motor (52) drives the first lead screw to rotate; and / or, The second movable track (51) includes a second lead screw, the second slider (510) is sleeved on the second lead screw and is threadedly connected to the second lead screw, and the movable assembly (5) further includes: a second drive motor (53) which is drive-connected to the second lead screw and drives the second lead screw to rotate through the second drive motor (53).

7. The repair plating device according to claim 1, characterized in that: The electrodeposition assembly (2) further comprises: A power source (23), wherein the negative electrode connector (230) of the power source (23) is in contact with the surface of the film (100), and the positive electrode connector (231) of the power source (23) extends into the plating solution of the plating solution nozzle (20), so that the plating solution in the hole forms a plating layer on the surface of the film under the action of electrolysis.

8. The repair plating device according to claim 7, characterized in that: The negative electrode connector (230) is provided with a fitting end surface (2301) fitted with the surface of the film (100), and the fitting end surface (2301) is an arc-shaped surface.

9. The repair plating device according to claim 7, characterized in that: The electrodeposition assembly (2) further comprises: A liquid storage tank (24) for storing plating solution; a plating liquid spray pipe (25), wherein the plating liquid spray head (20) is arranged at the end of the plating liquid spray pipe (25) and is in communication with the plating liquid spray pipe (25), and an end of the plating liquid spray pipe (25) away from the plating liquid spray head (20) is in communication with the liquid storage tank (24); Wherein, at least a portion of the positive electrode connector (231) is disposed within the plating solution nozzle (25).

10. The repair plating device according to claim 1, characterized in that: The detection component (1) is a three-dimensional laser scanner.

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