Adsorption type conductive clamp and electroplating device

Abstract

The utility model relates to an adsorption type conductive clamp and an electroplating device, the adsorption type conductive clamp comprises a first conductive clamp and a second conductive clamp which are used for clamping a thin film, and the second conductive clamp is arranged on the first conductive clamp in a sliding mode through a sliding rail assembly. The first conductive clamp is provided with an adjusting assembly used for driving the second conductive clamp to move up and down, one end of the first conductive clamp is connected with a vacuum generation device, and the side, close to the bottom of the first conductive clamp, of the first conductive clamp is provided with an adsorption air hole used for adsorbing a film; the electroplating device comprises an electroplating bath and an adsorption type conductive clamp; the coating machine comprises an adsorption type conductive clamp or an electroplating device. According to the adsorption type conductive clamp and the electroplating device, negative pressure can be formed through the vacuum generating device, a thin film is adsorbed through the adsorption air holes, the thin film makes full contact with the conductive contact face, the conductive effect is improved, and the problem that coating is not uniform is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive film production, in particular to an adsorption-type conductive clip and an electroplating device. Background Art

[0002] Conductive film is a polymer material with metal plated on the surface. It is widely used in lithium-ion batteries and is mainly used as a battery current collector in lithium-ion batteries. The coating machine electroplates the conductive base film. When using the coating machine for coating, a conductive clamp can be used to clamp the conductive base film and move it so that the conductive base film is immersed in the plating solution for electroplating. Among them, the conductive clamp is connected to the negative pole of the power supply so that the current can flow through the conductive clamp to the conductive base film, so that the conductive base film forms a plating cathode, thereby realizing the electroplating of the conductive base film. The existing first clamping arm and the second clamping arm are used to fix the conductive base film, and then transport it on the conveyor belt. Usually, multiple clamps need to be installed at equal distances on the conveyor belt. When fixing the conductive base film, the user needs to control the clamping by electric or manual means. In such a clamping method, the clamping is not stable enough and loosens during the film movement, resulting in unstable local current, thereby making the coating uneven. Therefore, it is necessary to provide an adsorption-type conductive clamp and an electroplating device to solve the above problems. Utility Model Content

[0003] In order to overcome the deficiencies of the prior art, the utility model provides an adsorption-type conductive clamp to solve the problem that the clamping is not stable enough and the film becomes loose during film feeding, resulting in unstable local current and thus uneven coating.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] An adsorption-type conductive clamp comprises a first conductive clamp and a second conductive clamp for clamping a film, wherein the second conductive clamp is slidably arranged on the first conductive clamp via a slide rail assembly, the first conductive clamp is provided with an adjustment assembly for driving the second conductive clamp to move up and down on the slide rail assembly, one end of the first conductive clamp is connected to a vacuum generating device, and the first conductive clamp and / or the second conductive clamp are provided with adsorption pores for adsorbing the film.

[0006] In the above structure, the slide rail assembly includes a slide rail and a slider, the slider is slidably arranged on the slide rail, the slide rail is fixedly mounted on the first conductive clip, and the second conductive clip is fixedly connected to the slider.

[0007] In the above structure, the adjustment assembly includes an adjustment member and an adjustment rod, one end of the adjustment rod passes through the second conductive clip and is locked by a locking member, and the other end of the adjustment rod passes through the first conductive clip and is connected to the adjustment member.

[0008] In the above structure, an air pipe interface is provided on the first conductive clip and / or the second conductive clip, the air pipe interface is connected to the adsorption air hole, the air pipe interface is connected to an air pipe joint, and the air pipe joint is connected to the vacuum generating device through a vacuum air pipe.

[0009] In the above structure, the first conductive clip and the second conductive clip are both provided with conductive contact surfaces, and the two conductive contact surfaces are arranged opposite to each other.

[0010] In the above structure, the bottoms of the first conductive clip and the second conductive clip are both provided with insulating rubber coating, and the conductive contact surface is arranged on the insulating rubber coating.

[0011] In the above structure, there is more than one adsorption pore.

[0012] In the above structure, there are a plurality of adsorption pores, which are distributed in an array.

[0013] The utility model also provides:

[0014] An electroplating device comprises an electroplating tank, in which the adsorption-type conductive clip is installed.

[0015] In the above structure, the connecting member is a screw, and the first conductive clip is fixed in the electroplating tank by two screws arranged up and down.

[0016] In the above structure, two first conductive clips are arranged on the electroplating tank, and the two first conductive clips are symmetrically arranged on the electroplating tank.

[0017] The beneficial effects of the utility model are as follows: providing an adsorption-type conductive clamp and an electroplating device, which can adjust the clamping distance between the first conductive clamp and the second conductive clamp by setting an adjustment component, and connecting the first conductive clamp to a vacuum generating device to form a negative pressure, and utilizing adsorption pores to adsorb the film, thereby reducing the film detachment phenomenon, allowing the film to fully contact the conductive contact surface, improving the conductive effect, and solving the problem of unstable clamping, loosening during film movement, resulting in unstable local current, and thus uneven coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is a front view of the structure of the utility model;

[0021] Figure 3 It is a structural schematic diagram of a part of the structure of the utility model;

[0022] Figure 4 It is a structural schematic diagram of the application state of the utility model.

[0023] Wherein: A-film, 1-first conductive clip, 2-second conductive clip, 3-slide rail, 4-slider, 5-adjusting piece, 6-adjusting rod, 7-locking piece, 8-insulating rubber bag, 9-electroplating tank, 10-connecting piece, 11-air pipe joint, 12-vacuum air pipe, 13-adsorption air hole. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the concept, specific structure and technical effects of the utility model in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the utility model. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the utility model can be combined interchangeably without conflicting with each other.

[0025] The utility model provides an adsorption type conductive clip, such as Figure 1-4 As shown, it includes a first conductive clip 1 and a second conductive clip 2 for clamping a film A. The second conductive clip 2 is slidably arranged on the first conductive clip 1 through a slide rail assembly. The slide rail assembly includes a slide rail 3 and a slider 4. The slider 4 is slidably arranged on the slide rail 3. Two sliders 4 are slidably arranged on the slide rail 3. The slide rail 3 is fixedly mounted on the first conductive clip 1. The second conductive clip 2 is fixedly connected to the slider 4. The first conductive clip 1 is provided with an adjustment assembly for driving the second conductive clip 2 to move up and down on the slide rail assembly. The adjustment assembly includes an adjustment member 5 and an adjustment rod 6. One end of the adjustment rod 6 passes through the second conductive clip 2 and is locked by a locking member 7. The locking member 7 is a nut. The other end of the adjustment rod 6 passes through the first conductive clip 1 and is connected to the adjustment member 5. The adjustment member 5 is a spiral adjuster. By rotating the spiral adjuster, the clamping distance between the first conductive clip 1 and the second conductive clip 2 is adjusted to clamp the film A.

[0026] In the above structure, the first conductive clip 1 and the second conductive clip 2 are both provided with conductive contact surfaces, and the two conductive contact surfaces are arranged opposite to each other. The bottoms of the first conductive clip 1 and the second conductive clip 2 are both provided with insulating rubber coating 8, and the insulating rubber coating prevents the bottoms of the first conductive clip 1 and the second conductive clip 2 from being copper-plated, and the conductive contact surfaces are arranged on the insulating rubber coating.

[0027] One end of the first conductive clip 1 is connected to a vacuum generating device, and an air pipe interface is provided on the first conductive clip 1 and / or the second conductive clip 2, and the air pipe interface is connected to the adsorption air hole 13. In this embodiment, the air pipe interface is arranged on the side of the first conductive clip 1 away from the second conductive clip 2, and the air pipe interface is connected to an air pipe joint 11, and the air pipe joint 11 is connected to the vacuum generating device through a vacuum air pipe 12, and the vacuum air pipe 12 is arranged between the first conductive clip 1 and the electroplating tank 9. The first conductive clip 1 and / or the second conductive clip 2 are provided with an adsorption air hole 13 for adsorbing a film. Specifically, the first conductive clip 1 is provided with an adsorption air hole 13 for adsorbing a film A on one side close to the bottom of the second conductive clip 2, and the adsorption air hole 13 is arranged on the conductive contact surface of the first conductive clip 1, and a negative pressure is formed by the vacuum generating device, and the film A is adsorbed by the adsorption air hole 13. After being adsorbed by the adsorption air hole 13, the film A can fit and slide with the adsorption air hole 13, so that the film A is fully in contact with the conductive contact surface, thereby improving the conductive effect.

[0028] In the above structure, there are more than one adsorption pore 13 .

[0029] In the above structure, there are a plurality of adsorption pores 13, which are distributed in an array, and the array distribution includes a rectangular array or a ring array.

[0030] Based on the above-mentioned adsorption-type conductive clip, the utility model also provides:

[0031] A plating device includes a plating tank 9, in which the above-mentioned adsorption-type conductive clip is arranged. Specifically, a first conductive clip 1 is installed in the plating tank 9 through a connecting piece 10, and the connecting piece 10 is a screw. The first conductive clip 1 is fixed in the plating tank 9 by two screws arranged up and down. Two first conductive clips 1 are arranged on the plating tank 9, and the two first conductive clips 1 are symmetrically arranged on the plating tank 9.

[0032] The above is a specific description of the preferred implementation of the utility model, but the invention of the utility model is not limited to the described embodiments. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the utility model. These equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. An adsorption-type conductive clip, characterized in that: It includes a first conductive clip and a second conductive clip for clamping a film, the second conductive clip is slidably arranged on the first conductive clip through a slide rail assembly, the first conductive clip is provided with an adjustment assembly for driving the second conductive clip to move up and down on the slide rail assembly, one end of the first conductive clip is connected to a vacuum generating device, and the first conductive clip and / or the second conductive clip are provided with adsorption pores for adsorbing the film.

2. The adsorption-type conductive clip according to claim 1, characterized in that: The slide rail assembly comprises a slide rail and a slider, the slider is slidably arranged on the slide rail, the slide rail is fixedly mounted on the first conductive clip, and the second conductive clip is fixedly connected to the slider.

3. The adsorption-type conductive clip according to claim 1, characterized in that: The adjusting assembly comprises an adjusting member and an adjusting rod, one end of the adjusting rod passes through the second conductive clip and is locked by a locking member, and the other end of the adjusting rod passes through the first conductive clip and is connected to the adjusting member.

4. An adsorption-type conductive clip according to any one of claims 1 to 3, characterized in that: The first conductive clip and / or the second conductive clip is provided with an air pipe interface, the air pipe interface is communicated with the adsorption air hole, the air pipe interface is connected with an air pipe joint, and the air pipe joint is connected with the vacuum generating device through a vacuum air pipe.

5. An adsorption-type conductive clip according to any one of claims 1 to 3, characterized in that: The first conductive clip and the second conductive clip are both provided with conductive contact surfaces, and the two conductive contact surfaces are arranged opposite to each other.

6. The adsorption-type conductive clip according to claim 5, characterized in that: The bottoms of the first conductive clip and the second conductive clip are both provided with insulating rubber coating, and the conductive contact surface is arranged on the insulating rubber coating.

7. An adsorption-type conductive clip according to any one of claims 1 to 3 or 6, characterized in that: The number of the adsorption pores is more than one.

8. The adsorption-type conductive clip according to claim 7, characterized in that: There are a plurality of adsorption pores, which are distributed in an array.

9. An electroplating device, characterized in that: It comprises an electroplating tank, in which the adsorption-type conductive clip according to any one of claims 1 to 8 is installed.

10. An electroplating device according to claim 9, characterized in that: Two first conductive clips are arranged on the electroplating tank, and the two first conductive clips are symmetrically arranged on the electroplating tank.

Images