Wafer automatic oxygen control oven
By introducing the clamping mechanism of rack rod and clamping block in the wafer oven, and the adaptive design of the round frame and limit spring, the drying incomplete and efficiency caused by the closed state during the wafer drying process is solved. The problem of low results enables more efficient drying effect and adaptive fixation.
Patent Information
- Application Number
- CN202323566896.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2033-12-26
AI Technical Summary
During the drying process, the existing wafer ovens are in a closed state due to the fixed position of the wafer, resulting in incomplete drying or low drying efficiency.
An automatic wafer oxygen-controlled oven is designed. By setting a rack rod with the first clamping block and the second clamping block, the fastening spring and connecting rod mechanism are used to enable the wafer to rise simultaneously during the drying process. Avoid closed state and adapt to wafers of different thicknesses and diameters through round frames and limit springs to ensure full fit and stable clamping.
It effectively avoids the problems of incomplete drying or low efficiency, improves the quality and efficiency of wafer drying, and adapts to wafers of different sizes to prevent the occurrence of tilt.
Smart Images
Figure CN222335865U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of ovens, and more specifically to an automatic oxygen-controlled wafer oven. Background Art
[0002] Wafer drying ovens are mainly used for semiconductor wafer pre-baking after substrate cleaning before photolithography, glue coating and coating, soft baking after glue coating, and hard film baking after exposure and development. In order to make the air in the oven clean and reduce oxidation, nitrogen is often filled into the oven, thereby squeezing out the oxygen in the oven and filling the oven with nitrogen, thereby achieving the purpose of automatic oxygen control. However, the existing ovens need to fix the wafers when drying them. However, the position where the wafers are fixed is always in a closed state during drying, so that the position cannot be dried or is difficult to dry, which will lead to incomplete wafer drying or low drying efficiency.
[0003] China Utility Model Publication Specification CN115451665A discloses an intelligent temperature-controlled high-temperature dust-free and oxygen-free oven, including a box body and a drying plate. The number of the drying plates is four. The drying plates are installed in the box body from top to bottom in sequence. A rotating mechanism is installed inside the box body, and the rotating mechanism includes a flywheel and a support rod. The protrusions on the surface of the rotating block contact the bottom of the clamping claws, so that the two clamping claws are relatively tilted on the support rod at the same time to clamp the drying plate. However, this setting cannot effectively bake the wafer in a fixed position, resulting in incomplete drying of the wafer or low drying efficiency. Therefore, in view of this problem, how to design an automatic oxygen-controlled wafer oven has become a problem that we currently need to solve. Utility Model Content
[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the utility model provides an automatic oxygen-controlled oven for wafers. By arranging a rack rod and a first clamping block, the first fastening spring contracts and continuously generates thrust on the first clamping block to clamp the wafer. The continuous rise of the rack rod will drive the wafer to rise synchronously, so that the fixed position of the wafer is exposed to solve the problems raised in the above-mentioned background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer automatic oxygen control oven, comprising a box body, a motor fixedly installed inside the box body, a gear fixedly installed on the output end of the motor, a rack rod meshed with the outer side of the gear, the rack rod is slidably connected to the inside of the box body, a first limit plate fixedly installed on the outer side of the rack rod, a frame fixedly installed on the top of the rack rod, a first clamping block slidably connected to the inner wall of the frame, a first fastening spring is provided on one side of the first clamping block, the first fastening spring is fixedly installed on the inner wall of the frame, a first connecting rod is rotatably connected to one side of the first clamping block, the first connecting rod is slidably connected to the inside of the frame, and one end of the first connecting rod is hinged to the limit block.
[0006] In a preferred embodiment, a hollow frame is installed at the bottom of the frame, the limit block is slidably connected inside the hollow frame, and a second limit plate is fixedly installed on the outer side of the rack rod.
[0007] In a preferred embodiment, the outer side of the rack rod is slidably connected to a fixed plate, one side of the fixed plate is hinged to a second connecting rod, and the number of the second connecting rods is set to multiple, wherein every two second connecting rods are axially symmetrically arranged about the vertical center line of the fixed plate.
[0008] In a preferred embodiment, a sliding frame is hinged at one end of the second connecting rod, a bearing plate is fixedly mounted on the inner wall of the box body, and the sliding frame is slidably connected to the top of the bearing plate.
[0009] In a preferred embodiment, a circular frame is rotatably connected to the interior of the sliding frame, and a second clamping block is slidably connected to the interior of the sliding frame.
[0010] In a preferred embodiment, a second fastening spring is provided on one side of the second clamping block, and the second fastening spring is fixedly installed inside the sliding frame. A limit spring is provided on one side of the sliding frame, and the limit spring is fixedly installed on the top of the bearing plate.
[0011] In a preferred embodiment, one side of the box is connected to a nitrogen tank, and the side of the box away from the nitrogen tank is connected to a ventilation pipe.
[0012] Technical effects and advantages of the utility model:
[0013] 1. The utility model provides a rack rod and a first clamping block. The first fastening spring contracts and continuously generates thrust on the first clamping block to clamp the wafer. The continuous rise of the rack rod drives the wafer to rise synchronously, so that the fixed position of the wafer is exposed and dried by the box, thereby avoiding the problem of incomplete drying or low drying efficiency caused by the fixed position of the wafer being in a closed state;
[0014] 2. The utility model sets a circular sticking frame and a second clamping block. The second fastening spring contracts and continuously applies thrust to the second clamping block to limit the wafer. The circular sticking frame rotates accordingly according to the size of the wafer, so as to fully fit with the outer side of the wafer, thereby adapting to wafers of different thicknesses and avoiding the phenomenon of wafer tilting due to different thicknesses when the wafer is fixed. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a partial structural sectional view of the utility model.
[0016] Figure 2 For this utility model Figure 1 A-section structure enlarged view.
[0017] Figure 3 For this utility model Figure 1 Enlarged view of the structure of part B.
[0018] The accompanying drawings are marked as follows: 1. box body; 2. motor; 3. gear; 4. rack rod; 5. first limit plate; 6. frame; 7. first clamping block; 8. first fastening spring; 9. first connecting rod; 10. limit block; 11. hollow frame; 12. second limit plate; 13. second connecting rod; 14. sliding frame; 15. bearing plate; 16. round frame; 17. second clamping block; 18. second fastening spring; 19. limit spring; 20. nitrogen tank; 21. ventilation pipe; 22. fixing plate. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] Refer to the instruction manual Figure 1-3 ,like Figure 1 As shown, an automatic wafer oxygen control oven according to an embodiment of the utility model comprises a box body 1, a motor 2 is fixedly installed inside the box body 1, the model of the motor 2 is Y801-4, a gear 3 is fixedly installed at the output end of the motor 2, a rack rod 4 is meshed on the outer side of the gear 3, and each component is driven by the setting of the rack rod 4, and the rack rod 4 is slidably connected to the inside of the box body 1, as shown in FIG. Figure 2As shown, a first limit plate 5 is fixedly installed on the outer side of the rack rod 4, and through the setting of the first limit plate 5, the second limit plate 12 is limited by cooperation with each other, and a frame 6 is fixedly installed on the top of the rack rod 4, and a first clamping block 7 is slidably connected to the inner wall of the frame 6. A first fastening spring 8 is provided on one side of the first clamping block 7, and the first fastening spring 8 is fixedly installed on the inner wall of the frame 6. A first connecting rod 9 is rotatably connected to one side of the first clamping block 7. Through the setting of the first connecting rod 9, the limit block 10 is transmitted so that the limit block 10 can move accordingly when the first clamping block 7 slides. The first connecting rod 9 is slidably connected to the inside of the frame 6, and one end of the first connecting rod 9 is hinged to the limit block 10. Through the setting of the limit block 10, the wafer is limited, and a hollow frame 11 is installed at the bottom of the frame 6. The limit block 10 is slidably connected to the inside of the hollow frame 11, and a second limit plate 12 is fixedly installed on the outer side of the rack rod 4.
[0021] It should be noted that, after the box body 1 starts working and dries the clamped wafer for a period of time, the gear 3 is rotated by starting the motor 2, and the rack rod 4 is raised by meshing with the rack rod 4. When the first clamping block 7 contacts the bottom of the clamped wafer, the continuous movement of the rack rod 4 causes the inclined surface of the first clamping block 7 to continuously contact the bottom of the wafer, so that the wafer enters the middle of the multiple first clamping blocks 7 along the inclined surface of the first clamping block 7. At this time, the first fastening spring 8 contracts and continuously generates thrust on the first clamping block 7 to clamp the wafer. When the first clamping block 7 slides into the frame 6, it will drive the first connecting rod 9 to slide synchronously. When the first connecting rod 9 moves, it will pull the limit block 10 to rise, and when the first clamping block 7 slides to the maximum distance, the limit block 10 rises to the highest point, thereby passing through the limit block 10 The inclined surface supports the outer side of the wafer, thereby preventing the box 1 from shaking, which causes the first clamping block 7 to clamp the wafer unstably and cause the wafer to roll to one side. At the same time, the first limit plate 5 contacts the fixed plate 22, and the first limit plate 5 drives the fixed plate 22 to rise synchronously under the continuous rise of the rack rod 4. When the fixed plate 22 rises, the sliding frame 14 will slide to one side through the second connecting rod 13, so that the sliding frame 14 loses the limit on the wafer. At this time, the continuous rise of the rack rod 4 will drive the wafer to rise synchronously, and turn off the motor 2 after rising to a certain height. At this time, the wafer is exposed at the position limited by the sliding frame 14, so as to be dried by the box 1, so as to avoid the problem of incomplete drying or low drying efficiency caused by the closed position of the wafer, thereby improving the quality and efficiency of wafer drying.
[0022] Further, such as Figure 3 As shown, the outer side of the rack rod 4 is slidably connected to a fixed plate 22, and a second connecting rod 13 is hinged on one side of the fixed plate 22. The number of the second connecting rods 13 is set to be multiple, wherein every two second connecting rods 13 are axially symmetrically arranged about the vertical center line of the fixed plate 22, as shown in FIG. Figure 3 As shown, one end of the second connecting rod 13 is hinged with a sliding frame 14, and a carrying plate 15 is fixedly installed on the inner wall of the box body 1. The sliding frame 14 is slidably connected to the top of the carrying plate 15. The inside of the sliding frame 14 is rotatably connected with a round frame 16. Through the setting of the round frame 16, it is fitted with the outer side of the wafer to ensure that the wafer is completely fixed. The inside of the sliding frame 14 is slidably connected with a second clamping block 17, and a second fastening spring 18 is provided on one side of the second clamping block 17. The second fastening spring 18 is fixedly installed in the inside of the sliding frame 14. A limit spring 19 is provided on one side of the sliding frame 14, and the limit spring 19 is fixedly installed on the top of the carrying plate 15. Figure 1 As shown, one side of the box body 1 is connected to a nitrogen tank 20 , and the side of the box body 1 away from the nitrogen tank 20 is connected to a ventilation pipe 21 .
[0023] It should be noted that, when fixing the wafer, the wafer is placed vertically in the middle of the multiple sliding frames 14, and the wafer is pressed downward to make it contact with the rounded corners of the multiple second clamping blocks 17. As the wafer continues to descend, the wafer follows the rounded corners of the second clamping blocks 17 and enters between the multiple wafers, so that the second clamping blocks 17 slide into the interior of the sliding frame 14. At the same time, the second fastening spring 18 contracts and continuously applies thrust to the second clamping blocks 17 to limit the wafer. When the wafer enters the bottom of the sliding frame 14, it will contact the round frame 16. At this time, the round frame 16 will rotate accordingly according to the size of the wafer, so as to fully fit with the outside of the wafer. At this time, the wafer is continuously pressed to make the sliding frame 14 slide to one side. At the same time, the limit spring 19 contracts and continuously applies thrust to the slide frame 14, thereby limiting and fixing the wafer, so that the second clamping block 17 is adjusted accordingly according to the thickness of the wafer to adapt to wafers of different thicknesses and avoid the wafer tilting due to different thicknesses when the wafer is fixed. At the same time, when fixing the wafer, the slide frame 14 will slide accordingly according to wafers of different diameters, so that wafers of different diameters can be fixed accordingly. After the wafer is fixed, the door of the box 1 is closed and the ventilation pipe 21 is opened at the same time so that the nitrogen entering the box 1 from the nitrogen tank 20 can drive out the air in the box 1, and the driven air flows out from the ventilation pipe 21, thereby automatically controlling the oxygen of the box 1.
[0024] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;
[0025] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;
[0026] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.
Claims
1. A wafer automatic oxygen control oven, comprising a box (1), characterized in that: A motor (2) is fixedly installed inside the box body (1), a gear (3) is fixedly installed at the output end of the motor (2), a rack rod (4) is meshed on the outer side of the gear (3), the rack rod (4) is slidably connected to the inside of the box body (1), a first limit plate (5) is fixedly installed on the outer side of the rack rod (4), a frame (6) is fixedly installed on the top of the rack rod (4), a first clamping block (7) is slidably connected to the inner wall of the frame (6), a first fastening spring (8) is provided on one side of the first clamping block (7), the first fastening spring (8) is fixedly installed on the inner wall of the frame (6), a first connecting rod (9) is rotatably connected to one side of the first clamping block (7), the first connecting rod (9) is slidably connected to the inside of the frame (6), and one end of the first connecting rod (9) is hinged to the limit block (10).
2. The wafer automatic oxygen control oven according to claim 1, characterized in that: A hollow frame (11) is installed at the bottom of the frame (6), the limit block (10) is slidably connected inside the hollow frame (11), and a second limit plate (12) is fixedly installed on the outer side of the rack rod (4).
3. The wafer automatic oxygen control oven according to claim 2, characterized in that: The outer side of the rack rod (4) is slidably connected to a fixed plate (22), one side of the fixed plate (22) is hinged to a second connecting rod (13), the number of the second connecting rods (13) is set to be multiple, wherein every two of the second connecting rods (13) are axially symmetrically arranged about the vertical center line of the fixed plate (22).
4. The wafer automatic oxygen control oven according to claim 3, characterized in that: One end of the second connecting rod (13) is hinged with a sliding frame (14), the inner wall of the box body (1) is fixedly mounted with a bearing plate (15), and the sliding frame (14) is slidably connected to the top of the bearing plate (15).
5. The wafer automatic oxygen control oven according to claim 4, characterized in that: The interior of the sliding frame (14) is rotatably connected to a circular frame (16), and the interior of the sliding frame (14) is slidably connected to a second clamping block (17).
6. The wafer automatic oxygen control oven according to claim 5, characterized in that: A second fastening spring (18) is provided on one side of the second clamping block (17), and the second fastening spring (18) is fixedly mounted inside the sliding frame (14). A limiting spring (19) is provided on one side of the sliding frame (14), and the limiting spring (19) is fixedly mounted on the top of the bearing plate (15).
7. The wafer automatic oxygen control oven according to claim 6, characterized in that: One side of the box body (1) is connected to a nitrogen tank (20), and the side of the box body (1) away from the nitrogen tank (20) is connected to a ventilation pipe (21).