Integrated pyroelectric infrared sensor

Abstract

The utility model belongs to the technical field of infrared sensors, and particularly relates to an integrated pyroelectric infrared sensor which comprises a substrate, a photosensitive element and an infrared assembly. The infrared assembly comprises a tube cap, an infrared optical filter and an infrared sensitive element; the tube cap is installed on the substrate, an internal space is arranged between the substrate and the tube cap, and the infrared sensitive element is installed in the internal space; the tube cap is provided with a window, and the infrared optical filter is installed in the window in a sealed mode. The side wall of the pipe cap comprises at least one cambered surface section and at least one straight surface section; the cambered surface section is arranged opposite to a circular lens of the pyroelectric sensor; the photosensitive element is arranged on the substrate and is opposite to the straight surface section; the tube cap and the photosensitive element are both located in the orthographic projection of the circular lens on the substrate. According to the integrated pyroelectric sensor, only one through hole opposite to the circular lens needs to be formed in the outer shell, a through hole does not need to be additionally formed in the photosensitive element, the installation convenience and attractiveness of the integrated pyroelectric sensor are guaranteed, and the installation cost of the integrated pyroelectric sensor is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of infrared sensors, in particular to an integrated pyroelectric infrared sensor. Background Art

[0002] Pyroelectric infrared sensor is a sensor that detects infrared thermal radiation using materials with good pyroelectric properties as the core. It is mainly used to detect infrared rays from people, animals or other objects with thermal radiation to determine whether there are people or other animals in a certain space. It is widely used in inductive lighting, intrusion alarm, security, smart home and other fields.

[0003] In many application fields, such as various lighting fields, pyroelectric infrared sensors need to be used together with photosensitive sensors so that the circuit can identify day and night, thereby realizing no human body sensing function during the day and turning on the human body sensing function at night.

[0004] However, the existing pyroelectric infrared sensor does not have a light sensing function. When it is necessary to integrate a light sensing function, the application end needs to add an additional photosensitive sensor to the application circuit outside the pyroelectric infrared sensor, and then send the signal through the pin to the infrared sensor for processing, or to an external chip for processing. At the same time, in some applications, the circuit board where the photosensitive sensor (which recognizes the brightness of light) is installed is covered by an opaque shell, and the normal operation of the photosensitive sensor needs to be exposed to external light, so in these cases, it is necessary to open an additional small hole in the shell so that the light can shine on the internal photosensitive sensor. In the application of these occasions, not only is it necessary to open a first through hole in the shell for the infrared sensor to adapt, but it is also necessary to open a second through hole that is adapted to the photosensitive sensor, and the photosensitive sensor needs to be installed at a suitable height on the circuit board where the infrared sensor is located and adapted to the shell with two through holes, which greatly increases the complexity of the product structure and the manufacturing cost, and the photosensitive sensor is installed with a hole and exposed to the outside, which damages the external aesthetics of the product.

[0005] In addition, pyroelectric infrared sensors require a stable low-voltage DC power supply to work properly, and in many application areas, a low-voltage voltage regulator chip needs to be added to obtain a stable low-voltage DC power supply for the pyroelectric infrared sensor. In addition, pyroelectric infrared sensors only output signal voltage and their driving ability is very weak and generally do not directly carry loads. In most application areas, it is necessary to add output components to their output to enable them to directly drive loads or improve their driving ability. In applications that require these functions, existing pyroelectric infrared sensors have problems such as insufficient integration and large size. Utility Model Content

[0006] In order to overcome the technical problems that in the prior art, a photosensitive element is needed in the application end, but a through hole must be opened in the shell to adapt to the photosensitivity of the photosensitive element, and the prior art has insufficient integration and large volume, the utility model provides an integrated pyroelectric infrared sensor.

[0007] On one hand, the utility model provides an integrated pyroelectric infrared sensor, including a substrate, a photosensitive element and an infrared component;

[0008] The infrared component includes a tube cap, an infrared filter and an infrared sensitive element; the tube cap is mounted on the substrate, and an internal space is provided between the substrate and the tube cap, and the infrared sensitive element is mounted in the internal space;

[0009] The tube cap is provided with a window communicating with the internal space, and the infrared filter is sealed and installed in the window;

[0010] The side wall of the tube cap includes at least one arc surface segment and at least one straight surface segment; the arc surface segment is arranged opposite to the circular lens of the pyroelectric sensor; the photosensitive element is mounted on the substrate and arranged opposite to the straight surface segment;

[0011] The tube cap and the photosensitive element are both located in a circular ring, and the circular ring is the orthographic projection of the circular lens on the substrate.

[0012] Optionally, the integrated pyroelectric infrared sensor further includes a circular lens coaxially arranged with the arc surface segment.

[0013] Optionally, the circular lens is a Fresnel lens.

[0014] Optionally, the side wall of the tube cap is provided with two arc surface segments and two straight surface segments connecting the arc surface segments; the two straight surface segments are respectively a first straight surface segment and a second straight surface segment, and the photosensitive element is arranged opposite to the first straight surface segment.

[0015] The integrated pyroelectric infrared sensor further includes a first element; the first element is mounted on the substrate, electrically connected to the substrate, and arranged opposite to the second straight-surface segment;

[0016] The tube cap, the photosensitive element and the first element are all located in the circular ring.

[0017] Optionally, the two straight surface segments are symmetrically arranged, and the two arc surface segments are symmetrically arranged.

[0018] Optionally, on the orthographic projection of the tube cap on the substrate, the arc angle of at least one of the arc surface segments is greater than or equal to π / 3.

[0019] Optionally, the infrared component further includes an infrared sensitive element support, and the infrared sensitive element is mounted on the substrate through the infrared sensitive element support.

[0020] Optionally, a first groove is provided on the upper surface of the substrate, and the infrared sensitive element covers the first groove.

[0021] Optionally, the infrared component further comprises a signal processing component mounted on the upper surface or the lower surface of the substrate, and the infrared sensitive element and / or the photosensitive element are electrically connected to the signal processing component.

[0022] Optionally, the infrared component also includes signal processing components and a small substrate mounted on the substrate; the infrared sensitive element is mounted on the small substrate and electrically connected to the small substrate; the signal processing components are mounted and electrically connected to the substrate or the small substrate.

[0023] Optionally, the signal processing component is mounted on the lower surface of the small substrate; a first groove is provided on the upper surface of the substrate, and one end of the signal processing component away from the small substrate extends into the first groove.

[0024] Optionally, a second groove is provided on the lower surface of the small substrate, and the signal processing component is mounted on the upper surface of the substrate and embedded in the second groove.

[0025] Optionally, the infrared component further comprises an infrared substrate support, and the infrared substrate support is mounted on the upper surface and / or the lower surface of the small substrate.

[0026] Optionally, a third groove is provided on the upper surface of the small substrate, the small substrate is mounted on the upper surface of the substrate, and the infrared sensitive element is mounted on the upper surface of the small substrate and covers the third groove.

[0027] Optionally, the integrated pyroelectric infrared sensor further includes a voltage stabilizing chip, and the voltage stabilizing chip is mounted on the substrate.

[0028] Optionally, the integrated pyroelectric infrared sensor further includes an output component, and the output component is mounted on the substrate.

[0029] Optionally, the integrated pyroelectric infrared sensor further comprises a connecting component mounted on the substrate, the photosensitive element and the infrared sensitive element are both electrically connected to the substrate, and the substrate is electrically connected to an external electrical device via the connecting component.

[0030] In the utility model, the side wall of the tube cap includes at least one arc surface segment and at least one straight surface segment, and the photosensitive element is mounted on the substrate and arranged opposite to the straight surface segment; the orthographic projection of the circular lens on the substrate is a circular ring, and the tube cap and the photosensitive element are both located in the circular ring, so that a part of the space of the straight surface segment of the tube cap is reserved for accommodating the photosensitive element, which reduces the volume of the integrated pyroelectric sensor, improves the compactness of the integrated pyroelectric sensor, and is conducive to the miniaturization design of the integrated pyroelectric sensor. In addition, the photosensitive element and the infrared component share a circular lens (that is, the photosensitive element and the tube cap are both located in the orthographic projection of the circular lens on the substrate), so that only one through hole for mounting the circular lens or arranged opposite to the circular lens is required on the external shell, and there is no need to set another through hole for the photosensitive element, which simplifies the structural complexity of the existing design caused by the need to additionally install a photosensitive element in the terminal product, reduces the product manufacturing cost, and ensures the aesthetics of the product exterior and the convenience of installation of the integrated pyroelectric sensor. In addition, the infrared sensitive element and the photosensitive element share the same substrate, which reduces the manufacturing cost of the terminal product. The reserved space of the straight surface section of the tube cap is also used to accommodate the first element, further improving the integration of the integrated pyroelectric infrared sensor and reducing its volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the explosion structure of an integrated pyroelectric infrared sensor provided in one embodiment of the utility model;

[0032] Figure 2 It is a top view of the integrated pyroelectric infrared sensor provided by the first embodiment of the utility model;

[0033] Figure 3 It is a structural schematic diagram of a pipe cap provided in the first embodiment of the utility model;

[0034] Figure 4 It is a schematic structural diagram of an integrated pyroelectric infrared sensor provided in the second embodiment of the utility model;

[0035] Figure 5 is a top view of an integrated pyroelectric infrared sensor provided in the second embodiment of the utility model;

[0036] Figure 6 It is a structural schematic diagram of a pipe cap provided in a second embodiment of the utility model;

[0037] Figure 7 It is a schematic structural diagram of an integrated pyroelectric infrared sensor provided in the third embodiment of the present utility model;

[0038] Figure 8It is a schematic structural diagram of an integrated pyroelectric infrared sensor provided in the fourth embodiment of the utility model;

[0039] Fig. 9 It is a structural schematic diagram of an integrated pyroelectric infrared sensor provided in the fifth embodiment of the utility model;

[0040] Fig.10 It is a structural schematic diagram of an integrated pyroelectric infrared sensor provided in the fifth embodiment of the utility model;

[0041] Fig.11 It is a schematic diagram of the explosion structure of the integrated pyroelectric infrared sensor provided in the fifth embodiment of the utility model;

[0042] Fig.12 It is a schematic diagram of the explosion structure of the integrated pyroelectric infrared sensor provided in the sixth embodiment of the utility model;

[0043] Fig.13 It is a schematic diagram of the explosion structure of the integrated pyroelectric infrared sensor provided in the seventh embodiment of the utility model.

[0044] Among them, 1. substrate; 11. first groove; 2. photosensitive element; 3. infrared component; 31. tube cap; 311. window; 312. arc surface segment; 313. straight surface segment; 3131. first straight surface segment; 3132. second straight surface segment; 32. infrared filter; 33. infrared sensitive element; 35. ring; 36. infrared sensitive element support; 4. first element; 5. connecting component; 6. signal processing component; 7. small substrate; 71. second groove; 72. third groove; 8. infrared substrate support; 91. voltage regulator chip; 92. output component. DETAILED DESCRIPTION

[0045] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0046] In the description of the present invention, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] like Figures 1 to 3 As shown, an embodiment of the utility model provides an integrated pyroelectric infrared sensor, including a substrate 1, a photosensitive element 2 and an infrared component 3;

[0049] The infrared component 3 includes a tube cap 31, an infrared filter 32 and an infrared sensitive element 33; the tube cap 31 is installed on the substrate 1, and an internal space (not shown in the figure) is provided between the substrate 1 and the tube cap 31, and the infrared sensitive element 33 is installed in the internal space; further preferably, the infrared component 3 also includes a signal processing component 6, and the signal processing component 6 is provided on the upper surface of the substrate 1, or the lower surface of the substrate 1; it can be understood that the signal processing component 6 includes a JFET and an intelligent signal processing chip, an amplifier, an MCU and other integrated circuits; it should be noted that the substrate 1 can be a circuit board, and when the substrate 1 is a circuit board, the infrared sensitive element 33 and the photosensitive element 2 are both electrically connected to the substrate 1. The cap 31 is provided with a window 311 communicating with the internal space, and the infrared filter 32 is sealed and installed in the window 311; it can be understood that the infrared filter 32 is an infrared-transmitting filter, and the substrate of the infrared filter 32 can be silicon, germanium, gallium arsenide or other infrared glass; and the shape of the infrared filter 32 can be circular, rectangular or other polygonal; the infrared filter 32 can have optical properties of focusing. The substrate 1 is an epoxy resin PCB circuit board or a ceramic substrate.

[0050] The side wall of the tube cap 31 includes at least one arc surface segment 312 and at least one straight surface segment 313; the arc surface segment 312 is arranged opposite to the circular lens of the pyroelectric sensor (not shown in the figure); the photosensitive element 2 is mounted on the substrate 1 and is arranged opposite to the straight surface segment 313 (that is, the photosensitive element 2 is arranged close to the straight surface segment 313); it can be understood that the number of the arc surface segments 312 and the straight surface segments 313 can be set according to actual needs, and the arc surface segment 312 and the straight surface segment 313 are both part of the side surface of the tube cap 31 body, and the straight surface segment 313 is equivalent to a straight surface cut out on the cylindrical tube cap 31.

[0051] The tube cap 31 and the photosensitive element 2 are both located in a circular ring 35, and the circular ring 35 is the positive projection of the circular lens on the substrate 1. It can be understood that the circular lens can be installed on the external housing or on the top of the tube cap 31; the circular lens is arranged above the tube cap 31, and external light can be captured by the photosensitive element 2 and the infrared sensitive element 33 through the circular lens.

[0052] In the utility model, the side wall of the tube cap 31 includes at least one arc surface segment 312 and at least one straight surface segment 313, and the photosensitive element 2 is mounted on the substrate 1 and arranged opposite to the straight surface segment 313; the orthographic projection of the circular lens on the substrate 1 is a circular ring 35, and the tube cap 31 and the photosensitive element 2 are both located in the circular ring 35, so that a part of the space of the straight surface segment 313 of the tube cap 31 is reserved for accommodating the photosensitive element 2, which reduces the volume of the integrated pyroelectric sensor, improves the compactness of the integrated pyroelectric sensor, and is conducive to the miniaturized design of the integrated pyroelectric sensor. In addition, the photosensitive element 2 and the infrared component 3 share a circular lens (that is, the photosensitive element 2 and the tube cap 31 are both located within the orthographic projection of the circular lens on the substrate 1), so that only one through hole for mounting the circular lens or arranged opposite to the circular lens needs to be provided on the external housing, and no additional through hole is required for the photosensitive element 2, thereby ensuring the installation convenience and aesthetics of the integrated pyroelectric sensor and reducing the structural complexity and installation cost. In addition, the infrared sensitive element 33 and the photosensitive element 2 share a substrate 1, reducing the manufacturing cost of the integrated pyroelectric infrared sensor.

[0053] In one embodiment, the integrated pyroelectric infrared sensor further comprises a circular lens coaxially arranged with the arc surface segment 312. Preferably, the circular lens is a Fresnel lens. It can be understood that the circular lens can be arranged and installed on the external housing, or can be installed on the top of the tube cap 31; the circular lens is arranged above the tube cap 31, and external light can be captured by the photosensitive element 2 and the infrared sensitive element 33 through the circular lens; and the circular lens is a conventional lens component in the prior art, and there is no need to set up a light-transmitting mirror for the integrated pyroelectric sensor.

[0054] In one embodiment, if Figures 4 to 6 As shown, the side wall of the tube cap 31 is provided with two arc surface segments 312 and two straight surface segments 313 connecting the arc surface segments 312; the two straight surface segments 313 are respectively a first straight surface segment 3131 and a second straight surface segment 3132, and the photosensitive element 2 is arranged opposite to the first straight surface segment 3131;

[0055] The integrated pyroelectric infrared sensor further includes a first element 4; the first element 4 is mounted on the substrate 1, electrically connected to the substrate 1, and arranged opposite to the second straight surface segment 3132; preferably, the two straight surface segments 313 are symmetrically arranged, and the two arc surface segments 312 are symmetrically arranged. It can be understood that the two straight surface segments 313 can be arranged on the front and rear sides of the tube cap 31, and the two arc surface segments 312 can be arranged on the left and right sides of the tube cap 31.

[0056] The tube cap 31, the photosensitive element 2 and the first element 4 are all located in the circular ring 35. It can be understood that the photosensitive element 2 is arranged close to the first straight surface section 3131, and the first element 4 is arranged close to the second straight surface section 3132; and the first element 4 includes but is not limited to components such as voltage stabilizing chips, resistors, and capacitors. In this embodiment, the first straight surface section 3131 of the tube cap 31 reserves a first space for accommodating the photosensitive element 2, and the second straight surface section 3132 of the tube cap 31 reserves a second space for accommodating the first element 4, and the tube cap 31, the photosensitive element 2 and the first element 4 are all located in the circular ring 35, thereby further improving the integration of the integrated pyroelectric sensor and reducing its volume.

[0057] In one embodiment, the arc angle of at least one of the arc surface segments 312 is greater than or equal to π / 3 (that is, the center angle of at least one of the arc surface segments 312 is greater than or equal to 60 degrees). In this embodiment, at least one of the arc surface segments 312 has a center angle greater than or equal to 60 degrees, so as to avoid the center angles of all the arc surface segments 312 being relatively small, so that all the arc surface segments 312 are difficult to play the role of positioning the circular lens.

[0058] In one embodiment, if Figure 1 As shown, the infrared component 3 further includes an infrared sensitive element support 36, and the infrared sensitive element 33 is mounted on the substrate 1 through the infrared sensitive element support 36. It can be understood that the infrared sensitive element support 36 is formed by directly coating solder paste on the pad on the substrate 1 and then melting the tin in a reflow furnace to solidify; specifically, a large amount of solder paste is first coated on the pad of the substrate 1, and then the substrate 1 coated with solder paste is melted and cooled in a reflow furnace, and the solder paste will form the infrared sensitive element support 36 on the substrate 1. In this embodiment, the infrared sensitive element 33 is mounted on the substrate 1 through the infrared sensitive element support 36, so that the infrared sensitive element 33 can be mounted on the substrate 1 without customizing or using a standard infrared sensitive element support 36, which reduces the manufacturing cost of the integrated pyroelectric infrared sensor and simplifies its manufacturing process.

[0059] In one embodiment, if Figure 7 As shown, the upper surface of the substrate 1 is provided with a first groove 11, and the infrared sensitive element 33 covers the first groove 11. Preferably, the sensing area of ​​the infrared sensitive element 33 is located directly above the first groove 11; since the substrate 1 will introduce the external heat of the sensor to the surface of the substrate 1 when the circuit is working, if the two are in direct contact, the substrate 1 will transfer its heat to the infrared sensitive element 33, resulting in unstable operation of the infrared sensitive element 33; and the design of the first groove 11 avoids direct contact between the infrared sensitive element 33 (sensing area) and the substrate 1, so that the substrate 1 is not easy to transfer its heat to the infrared sensitive element 33, ensuring the thermal stability between the infrared sensitive element 33 and the substrate 1.

[0060] In one embodiment, if Figure 7 As shown, the signal processing component 6 is mounted on the upper surface or the lower surface of the substrate 1, and the infrared sensitive element 33 and / or the photosensitive element 2 are electrically connected to the signal processing component 6. It can be understood that the signal processing component 6 can be electrically connected only to the infrared sensitive element 33 or the photosensitive element 2, or can be electrically connected to both the infrared sensitive element 33 and the photosensitive element 2. In this embodiment, the design of the signal processing component 6 further improves the integration of the integrated pyroelectric infrared sensor.

[0061] In one embodiment, if Fig.13As shown, the infrared component 3 further includes a signal processing component 6 and a small substrate 7 mounted on the substrate 1; the infrared sensitive element 33 is mounted on the small substrate 7 and electrically connected to the small substrate 7; the signal processing component 6 is mounted on the upper surface of the substrate 1 and electrically connected to the substrate 1. It can be understood that the small substrate 7 is mounted on the upper surface of the substrate 1 and is located in the internal space, and the infrared sensitive element 33 is mounted on the upper surface of the small substrate 7, so that the small substrate 7 can raise the height of the infrared sensitive element 33 in the internal space, so that the infrared sensitive element 33 can better match the focal length of the circular lens. The signal processing component 11 can be mounted on the upper surface or lower surface of the small substrate 7, or on the upper surface or lower surface of the substrate 1, so that the small substrate 7 can also play a role in supporting the signal processing component 6.

[0062] In one embodiment, if Fig.12 As shown, the signal processing component 6 is mounted on the lower surface of the small substrate 7; the upper surface of the substrate 1 is provided with a first groove 11, and one end of the signal processing component 6 away from the small substrate 7 extends into the first groove 11. It can be understood that the upper end of the signal processing component 6 is fixed on the small substrate 7 and electrically connected to the small substrate 7, and the lower end of the signal processing component 6 extends into the first groove 11, thereby reducing the height of the substrate 1, the signal processing component 6 and the small substrate 7 in the vertical direction, further improving the compactness of the integrated pyroelectric infrared sensor.

[0063] In one embodiment, if Fig. 9 As shown, the lower surface of the small substrate 7 is provided with a second groove 71, and the signal processing component 6 is mounted on the substrate 1 and embedded in the second groove 71. It can be understood that when the second groove 71 is provided on the lower surface of the small substrate 7, the lower end of the signal processing component 6 is fixed on the substrate and electrically connected to the substrate, and the upper end is embedded in the second groove 71 at the bottom of the small substrate 7; in this embodiment, the design of the second groove 71 further reduces the height of the substrate 1, the signal processing component 6 and the small substrate 7 in the vertical direction, thereby improving the compactness of the integrated pyroelectric infrared sensor.

[0064] In one embodiment, if Fig.11As shown, the infrared component 3 further includes an infrared substrate support 8, which is mounted on the upper surface and / or lower surface of the small substrate 7; the small substrate 7 is mounted on the substrate 1 through the infrared substrate support 8. It can be understood that the infrared substrate support 8 can raise the height of the infrared sensitive element in the internal space through the small substrate 7. When the infrared substrate support 8 is mounted on the lower surface of the small substrate 7, the small substrate 7 is mounted on the substrate 1 through the infrared substrate support 8, and the infrared sensitive element 33 is mounted on the upper surface of the infrared substrate support 8. At this time, the infrared substrate support 8 arranged between the substrate 1 and the small substrate 7 can play a role in avoiding the signal processing component 6. When the infrared substrate support 8 is mounted on the upper surface of the small substrate 7, the infrared sensitive element 33 is mounted on the infrared substrate support 8, so that the infrared substrate support 8 makes the infrared sensitive element 33 not be installed close to the small substrate 7, which can further ensure the thermal stability of the infrared sensitive element 33. The infrared substrate support 8 installed on the upper surface and / or lower surface of the small substrate 7 also further raises the height of the infrared sensitive element 33 in the internal space, so that the infrared sensitive element 33 can better match the focal length of the circular lens. When the infrared substrate support 8 is provided on both the upper surface of the small substrate 7 and the lower surface of the small substrate 7, the small substrate 7 is installed on the substrate 1 through the infrared substrate support 8 at the bottom, and the infrared sensitive element 33 is installed on the small substrate 7 through the infrared substrate support 8 at the top.

[0065] In one embodiment, if Figure 8 As shown, the upper surface of the small substrate 7 is provided with a third groove 72, the small substrate 7 is mounted on the upper surface of the substrate 1, and the infrared sensitive element 33 is mounted on the upper surface of the small substrate 7 and covers the third groove 72. It can be understood that the sensing area of ​​the infrared sensitive element 33 is located directly above the third groove 72. The design of the third groove 72 avoids direct contact between the sensing area of ​​the infrared sensitive element 33 and the small substrate 7, thereby ensuring the thermal stability of the infrared sensitive element 33.

[0066] In one embodiment, if Fig.10 As shown, the integrated pyroelectric infrared sensor further includes a voltage stabilizing chip 91, which is mounted on the substrate 1. It can be understood that the voltage stabilizing chip 91 can stabilize the power supply voltage of the sensor, and integrating the voltage stabilizing chip 91 on the substrate further improves the integration of the integrated pyroelectric infrared sensor.

[0067] In one embodiment, if Fig.10As shown, the integrated pyroelectric infrared sensor further includes an output component 92, and the output component 92 is mounted on the substrate 1. It can be understood that the output component 92 at least includes: any one or more of a triode, a field effect transistor, a thyristor, and a relay; the output component 92 can enable the sensor to directly drive a larger load instead of only providing a control signal; in this embodiment, the output component 92 is integrated on the substrate, which further improves the integration of the integrated pyroelectric infrared sensor.

[0068] It should be noted that other components can be installed on the substrate and / or the small substrate 7, and the other components include at least: any one or more of a microcontroller, an analog or digital processing chip, a diode, a triode, a passive device, a switch, and a potentiometer; the passive device includes at least: any one or more of a resistor, a capacitor, and an inductor. The output component 92 can enable the sensor to directly drive a larger load instead of only providing a control signal; microcontrollers, analog or digital processing chips, and other chips can be used for more powerful functions and performance control to make the product more functional. The diode has a unidirectional conductive property and can be used as an anti-reverse connection of the input power supply. The triode can be used for control or amplification. Passive devices such as resistors and capacitors can be used as voltage dividers, current limiting filters, and are generally used as auxiliary circuits of the main chip. The switch can be used as a function control device for function switching, and the potentiometer can be used as a performance parameter adjustment component, such as adjusting the sensing distance and delay time.

[0069] In one embodiment, if Figure 1 As shown, the integrated pyroelectric infrared sensor also includes a connecting component 5 installed on the substrate 1, the photosensitive element 2 and the infrared sensitive element 33 are both electrically connected to the substrate 1, and the substrate 1 is electrically connected to an external electrical device through the connecting component 5. It can be understood that the connecting component 5 includes but is not limited to a connector, a connector, a BGA ball or other spherical and non-spherical supporting welding components, a pad or a half-hole pad, etc.; preferably, the connecting component 5 is arranged at the bottom of the substrate 1. In this embodiment, the design of the connecting component 5 improves the convenience of connecting and installing the integrated pyroelectric sensor with external electrical devices.

[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated pyroelectric infrared sensor, characterized in that: It includes a substrate, a photosensitive element and an infrared component; The infrared component includes a tube cap, an infrared filter and an infrared sensitive element; the tube cap is mounted on the substrate, and an internal space is provided between the substrate and the tube cap, and the infrared sensitive element is mounted in the internal space; The tube cap is provided with a window communicating with the internal space, and the infrared filter is sealed and installed in the window; The side wall of the tube cap includes at least one arc segment and at least one straight segment; the arc segment is arranged opposite to the circular lens of the pyroelectric sensor; the photosensitive element is mounted on the substrate and arranged opposite to the straight segment; The tube cap and the photosensitive element are both located in a circular ring, and the circular ring is the orthographic projection of the circular lens on the substrate.

2. The integrated pyroelectric infrared sensor according to claim 1, characterized in that: The integrated pyroelectric infrared sensor also includes a circular lens coaxially arranged with the arc surface segment.

3. The integrated pyroelectric infrared sensor according to claim 1, characterized in that: The side wall of the tube cap is provided with two arc surface segments and two straight surface segments connecting the arc surface segments; the two straight surface segments are respectively a first straight surface segment and a second straight surface segment, and the photosensitive element is arranged opposite to the first straight surface segment. The integrated pyroelectric infrared sensor further includes a first element; the first element is mounted on the substrate, electrically connected to the substrate, and arranged opposite to the second straight-surface segment; The tube cap, the photosensitive element and the first element are all located in the circular ring.

4. The integrated pyroelectric infrared sensor according to claim 3, characterized in that: The two straight surface segments are symmetrically arranged, and the two arc surface segments are symmetrically arranged.

5. The integrated pyroelectric infrared sensor according to claim 1, characterized in that: On the orthographic projection of the tube cap on the substrate, the arc angle of at least one arc surface segment is greater than or equal to π / 3.

6. The integrated pyroelectric infrared sensor according to claim 1, characterized in that: The infrared component further comprises an infrared sensitive element supporting member, and the infrared sensitive element is mounted on the substrate through the infrared sensitive element supporting member.

7. The integrated pyroelectric infrared sensor according to claim 1, characterized in that: A first groove is provided on the upper surface of the substrate, and the infrared sensitive element covers the first groove.

8. The integrated pyroelectric infrared sensor according to claim 1, characterized in that: The infrared component further comprises a signal processing component mounted on the upper surface or the lower surface of the substrate, and the infrared sensitive element and / or the photosensitive element are electrically connected to the signal processing component.

9. The integrated pyroelectric infrared sensor according to claim 1, characterized in that: The infrared component also includes a signal processing component and a small substrate mounted on the substrate; the infrared sensitive element is mounted on the small substrate and electrically connected to the small substrate; the signal processing component is mounted and electrically connected to the substrate or the small substrate.

10. The integrated pyroelectric infrared sensor according to claim 9, characterized in that: The signal processing component is mounted on the lower surface of the small substrate; a first groove is provided on the upper surface of the substrate, and one end of the signal processing component away from the small substrate extends into the first groove.

11. The integrated pyroelectric infrared sensor according to claim 9, characterized in that: A second groove is provided on the lower surface of the small substrate, and the signal processing component is mounted on the upper surface of the substrate and embedded in the second groove.

12. The integrated pyroelectric infrared sensor according to claim 9, characterized in that: The infrared component further comprises an infrared substrate support member, and the infrared substrate support member is mounted on the upper surface and / or the lower surface of the small substrate.

13. The integrated pyroelectric infrared sensor according to claim 9, characterized in that: The upper surface of the small substrate is provided with a third groove, the small substrate is mounted on the upper surface of the substrate, and the infrared sensitive element is mounted on the upper surface of the small substrate and covers the third groove.

14. The integrated pyroelectric infrared sensor according to any one of claims 1 to 13, characterized in that: The integrated pyroelectric infrared sensor further comprises a voltage stabilizing chip, and the voltage stabilizing chip is mounted on the substrate.

15. The integrated pyroelectric infrared sensor according to any one of claims 1 to 13, characterized in that: The integrated pyroelectric infrared sensor further includes an output component, and the output component is mounted on the substrate.

16. The integrated pyroelectric infrared sensor according to any one of claims 1 to 13, characterized in that: The integrated pyroelectric infrared sensor also includes a connecting component mounted on the substrate, the photosensitive element and the infrared sensitive element are both electrically connected to the substrate, and the integrated pyroelectric infrared sensor is mounted and electrically connected to an external electrical device via the connecting component.

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