Pressure chip testing tool

Abstract

The utility model belongs to the field of pressure chip testing, and provides a pressure chip testing tool which comprises a testing substrate, a chip pasting substrate and a packaging shell. The test substrate is provided with a placement area, the placement area is provided with pins, the test substrate is provided with a first bonding pad group, and the first bonding pad group is electrically connected with the pins; the chip pasting substrate is located in the placing area, the chip pasting substrate is provided with insertion holes for the pins to be inserted, and the insertion holes are electrically connected with the pins; the side face, deviating from the test substrate, of the chip pasting substrate is provided with a pasting area which is used for pasting a pressure chip to be tested. The packaging shell is bonded with the side face, away from the test substrate, of the chip pasting substrate, and the packaging shell covers the pasting area. The packaging stress generated in the packaging process of the pressure chip testing tool is the same as that of a pressure sensor product, the testing result of the pressure chip is more accurate and reliable, the packaging shell of the pressure testing tool can be the same as that of the pressure sensor product, and the production cost can be reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of pressure chip testing, and more specifically, to a pressure chip testing tool. Background Art

[0002] Pressure sensors are indispensable in all fields of today's society. For example, invasive blood pressure sensors are widely used in surgical procedures because they can monitor the patient's blood pressure changes in real time.

[0003] With the continuous increase in the application scenarios of pressure sensors, the demand for pressure sensors is also increasing, and the performance requirements for pressure sensors are also getting higher and higher. The core technology of pressure sensors lies in the pressure chip. The quality of the pressure chip directly determines the performance of the pressure sensor. Therefore, in the production process of pressure sensors, it is particularly important to perform pressure testing on the pressure chip.

[0004] When the pressure chip of the invasive blood pressure sensor is pressure tested, it is necessary to use a pressure chip test tool to position the pressure chip. An existing pressure chip test tool adopts an epoxy resin encapsulation shell plastic encapsulation form, which requires the additional production of an injection mold with a cavity and a through hole, and then uses a plastic encapsulation device to complete the production of the encapsulation shell. This step leads to secondary design and high requirements for the injection mold, resulting in high production costs; another pressure chip test tool adopts a TO (Transistor Outline) metal shell packaging form, which requires the design of complex fasteners and sealing structures, resulting in high production costs. In addition, the packaging shells used in the above two test works are different from the packaging shells of the pressure sensor products, which results in the packaging stress generated during the test packaging process being different from that of the pressure sensor products, resulting in deviations between the results of the pressure test and the test results of the pressure sensor products, resulting in reduced accuracy and reliability. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a pressure chip test tool to solve the technical problems in the prior art of high production cost, poor testing accuracy and reliability of pressure chip test tools.

[0006] To achieve the above purpose, the technical solution adopted in this application is: to provide a pressure chip test tool, including:

[0007] A test substrate, wherein the test substrate has a placement area, the placement area is provided with pins, and the test substrate is provided with a first pad group, and the first pad group is electrically connected to the pins;

[0008] A chip pasting substrate, the chip pasting substrate is located in the placement area, the chip pasting substrate is provided with a socket for inserting the pin, the socket is electrically connected to the pin; the side of the chip pasting substrate away from the test substrate has a pasting area, the pasting area is used to stick the pressure chip to be tested; and

[0009] The packaging shell is bonded to the side of the chip pasting substrate away from the testing substrate, and the packaging shell covers the pasting area.

[0010] Optionally, the first pad group includes four first metal pads, the number of the pins on the placement area is four, and the four pins are electrically connected to the four first metal pads in a one-to-one correspondence.

[0011] Optionally, there are multiple placement areas, the number of the first pad groups and the number of the chip pasting substrates are equal to the number of the placement areas, multiple chip pasting substrates are respectively located on the multiple placement areas, and multiple first pad groups are respectively arranged in one-to-one correspondence with the multiple placement areas.

[0012] Optionally, a second pad group is further provided on the side of the chip pasting substrate facing away from the test substrate, the second pad group is electrically connected to the jack, and the second pad group is also used to be electrically connected to the pressure chip to be tested.

[0013] Optionally, the number of the second pad groups is two, each of the second pad groups includes four second metal pads, wherein the four second metal pads of one of the second pad groups are arranged at circumferential intervals along the pasting area, and the four second metal pads of another second pad group are arranged on the same side of the pasting area.

[0014] Optionally, a test point is provided on a side of the chip pasting substrate facing away from the test substrate, and the test point is electrically connected to the second pad group.

[0015] Optionally, the packaging shell is a plastic shell.

[0016] Optionally, the placement area is provided with a first opening, and the pasting area is provided with a second opening, and the second opening is correspondingly connected to the first opening.

[0017] Optionally, the packaging shell is provided with a cavity and an air inlet, the cavity is used to accommodate the pressure chip to be tested, the air inlet is communicated with the cavity, and the air inlet is used to be connected to an external pressure gas source.

[0018] The pressure chip testing tool provided by the present application has at least the following beneficial effects:

[0019] 1. After the pressure chip to be tested is bonded to the pasting area, the packaging shell is bonded to the side of the chip pasting substrate away from the test substrate, and the packaging shell covers the pasting area, that is, the packaging shell covers the pressure chip to be tested to protect the pressure chip to be tested.

[0020] 2. By bonding the packaging shell to the side of the chip pasting substrate facing away from the test substrate, the packaging method is the same as that of the pressure sensor product, and the packaging shell of the pressure testing tool can be the same as the packaging shell of the pressure sensor product, so that the packaging stress generated by the packaging process is the same as that of the pressure sensor product, effectively reducing the deviation between the pressure chip test results and the performance of the pressure sensor product, so that the test results of the pressure chip using the pressure testing tool of this application are more accurate and reliable.

[0021] 3. The packaging shell of the pressure testing tool can be the same as the packaging shell of the pressure sensor product, so that the packaging shell common to the pressure testing tool and the pressure sensor product can be obtained through only one design and processing, and there is no need to use different processes and materials to make a packaging shell dedicated to the pressure testing tool. In this way, the secondary design and processing costs are avoided. The packaging shell and the chip pasting substrate are fixed by bonding, which is simple to operate and does not require the use of plastic sealing equipment. At the same time, the packaging shell can be fixed to the chip pasting substrate using adhesive, and the structure is simple, and there is no need to design complex fasteners and sealing structures, which is conducive to reducing production costs.

[0022] 4. When assembling the chip pasting substrate and the test substrate, the chip pasting substrate is positioned in the placement area by inserting the pins on the test substrate into the sockets of the chip pasting substrate. After the test is completed, the test substrate is separated from the chip pasting substrate by disengaging the pins from the sockets. In this way, the test substrate can be recycled, so that when testing the next pressure chip, only the chip pasting substrate and the packaging shell need to be replaced, which is conducive to cost saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 A schematic diagram of a top view of the test substrate provided in an embodiment of the present application;

[0025] Figure 2 A schematic diagram of the top view of the chip pasting substrate provided in an embodiment of the present application;

[0026] Figure 3 A schematic diagram of the main structure of the pressure chip testing tool provided in an embodiment of the present application;

[0027] Figures 4 to 6 A diagram of the assembly process of the pressure chip testing tooling provided in an embodiment of the present application.

[0028] Description of main reference numerals:

[0029] 10. Test substrate; 11. Placement area; 12. First pad group; 121. First metal pad; 13. Pin; 14. First port; 20. Chip pasting substrate; 21. Socket; 22. Pasting area; 23. Second pad group; 231. Second metal pad; 24. Second port; 25. Test point; 30. Pressure chip to be tested; 31. Back cavity structure; 40. Package shell; 41. Cavity; 42. Air inlet. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0032] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] Please also read Figures 1 to 6Now, the pressure chip test tool provided in the embodiment of the present application is described. The pressure chip test tool can be used to locate the pressure chip of the pressure sensor. In the embodiment of the present application, the pressure chip of the invasive blood pressure sensor is taken as an example.

[0035] See also Figures 1 to 3 The pressure chip test tool comprises: a test substrate 10, a chip pasting substrate 20 and a package shell 40. The test substrate 10 has a placement area 11, the placement area 11 is provided with a pin 13, the test substrate 10 is provided with a first pad group 12, and the first pad group 12 is electrically connected to the pin 13; the chip pasting substrate 20 is located in the placement area 11, and the chip pasting substrate 20 is provided with a plug hole 21 for the pin 13 to be inserted, and the plug hole 21 is electrically connected to the pin 13; the side of the chip pasting substrate 20 away from the test substrate 10 has a pasting area 22, and the pasting area 22 is used to adhere to the pressure chip 30 to be tested; the package shell 40 is bonded to the side of the chip pasting substrate 20 away from the test substrate 10, and the package shell 40 covers the pasting area 22.

[0036] The pin 13 is arranged at the edge of the placement area 11, and the pin 13 is electrically connected to the first pad group 12 through a wire. When the chip pasting substrate 20 is located in the placement area 11 of the test substrate 10, the pin 13 is inserted into the socket 21 to position the chip pasting substrate 20 in the placement area 11 of the test substrate 10, and when the pin 13 is inserted into the socket 21, the pin 13 contacts the inner wall of the socket 21, so that the pin 13 is electrically connected to the socket 21, and then the chip pasting substrate 20 is electrically connected to the first pad group 12. The first pad group 12 is arranged corresponding to the placement area 11, and the first pad group 12 is used for external power supply and measurement equipment, and is used to realize voltage input and signal output. When the pressure chip 30 to be tested is fixed in the pasting area 22, the pressure chip 30 to be tested is electrically connected to the chip pasting substrate 20. It can be understood that the pressure chip 30 to be tested is externally connected to the power supply and measurement equipment through the chip pasting substrate 20, the pin 13 and the first pad group 12.

[0037] Compared with the prior art, the pressure chip test tool provided in this application has the following beneficial effects:

[0038] 1. After the pressure chip 30 to be tested is bonded to the pasting area 22, the packaging shell 40 is bonded to the side of the chip pasting substrate 20 facing away from the test substrate 10, and the packaging shell 40 covers the pasting area 22, that is, the packaging shell 40 covers the pressure chip 30 to be tested, so as to protect the pressure chip 30 to be tested.

[0039] 2. By bonding the packaging shell 40 to the side of the chip pasting substrate 20 facing away from the test substrate 10, the packaging method is the same as that of the pressure sensor product, and the packaging shell 40 of the pressure testing tool can be the same as the packaging shell 40 of the pressure sensor product. It can be understood that the pressure chip testing tool of the present application adopts the same packaging shell 40 and packaging method as the pressure sensor product, and the pressure chip 30 to be tested is also bonded to the pasting area 22 of the chip pasting substrate 20, which is the same as the pressure chip of the pressure sensor product, so that the packaging stress generated by the packaging process is the same as that of the pressure sensor product, effectively reducing the deviation between the pressure chip test results and the performance of the pressure sensor product, so that the test results of the pressure chip using the pressure testing tool of the present application are more accurate and reliable.

[0040] 3. The packaging shell 40 of the pressure testing tool can be the same as the packaging shell 40 of the pressure sensor product, so that the packaging shell 40 that is common to the pressure testing tool and the pressure sensor product can be obtained through only one design and processing, and there is no need to use different processes and materials to make the packaging shell 40 dedicated to the pressure testing tool. In this way, the secondary design and processing costs are avoided, and the packaging shell 40 and the chip pasting substrate 20 are fixed by bonding, which is simple to operate and does not require the use of plastic packaging equipment. At the same time, the packaging shell 40 can be fixed to the chip pasting substrate 20 using adhesive, and the structure is simple, and there is no need to design complex fasteners and sealing structures, which is beneficial to reduce production costs.

[0041] 4. When bonding the packaging shell 40 and the chip pasting substrate 20, it can be done manually or by using a dispensing machine. The operation is flexible and simple, and is suitable for small-scale trial production, production and performance testing of pressure sensors in the research and development stage.

[0042] 5. When assembling the chip pasting substrate 20 and the test substrate 10, the pins 13 on the test substrate 10 are inserted into the sockets 21 of the chip pasting substrate 20 to position the chip pasting substrate 20 in the placement area 11. After the test is completed, the test substrate 10 is separated from the chip pasting substrate 20 by disengaging the pins 13 from the sockets 21. In this way, the test substrate 10 can be recycled, so that when testing the next pressure chip, only the chip pasting substrate 20 and the packaging shell 40 need to be replaced, which is conducive to cost saving.

[0043] 6. When the pressure chip 30 to be tested is bonded to the bonding area 22 of the chip bonding substrate 20, the pressure chip 30 to be tested is electrically connected to the chip bonding substrate 20. When the chip bonding substrate 20 bonded with the pressure chip 30 to be tested and the packaging shell 40 is positioned in the placement area 11 of the test substrate 10, the pin 13 is electrically connected to the jack 21 to realize the electrical connection between the pressure chip 30 to be tested and the first pad group 12. Therefore, when the first pad group 12 is connected to an external power supply and a measuring device, voltage input and signal output can be realized for the pressure to be tested.

[0044] In one embodiment of the present application, see Figure 1 The first pad group 12 includes four first metal pads 121 , the number of the pins 13 on the placement area 11 is four, and the four pins 13 are electrically connected to the four first metal pads 121 in a one-to-one correspondence.

[0045] Optionally, four pins 13 are arranged at intervals on the same side of the placement area 11, and the four pins 13 are electrically connected to the four first metal pads 121 of the first pad group 12 through wires. When in use, two of the first metal pads 121 are used for external power supply, and the other two first metal pads 121 are used for external measurement equipment.

[0046] In one embodiment of the present application, there are multiple placement areas 11, the number of first pad groups 12 and the number of chip pasting substrates 20 are equal to the number of placement areas 11, multiple chip pasting substrates 20 are respectively located on the multiple placement areas 11, and the multiple first pad groups 12 are respectively arranged in a one-to-one correspondence with the multiple placement areas 11.

[0047] Among them, the test substrate 10 is a rectangular structure, and multiple placement areas 11 are arranged along the length direction of the test substrate 10. Each placement area 11 is provided with a pin 13, and the pin 13 is electrically connected to the first pad group 12 set in the corresponding placement area 11. Therefore, during testing, multiple chip pasting substrates 20 with multiple pressure chips 30 to be tested can be respectively fixed on multiple placement areas 11, so that multiple pressure chips 30 to be tested can be tested in parallel, which is beneficial to improving test efficiency.

[0048] Optionally, the number of the placement areas 11 is three, and the three placement areas 11 are arranged at intervals along the length direction of the test substrate 10. The number of the first pad groups 12 is also three, and the three first pad groups 12 are arranged in one-to-one correspondence with the three placement areas 11, so that three chip pasting substrates 20 with pressure chips 30 to be tested can be placed at one time, and three pressure chips 30 to be tested can be tested at the same time. Of course, the number of the placement areas 11 can also be other numbers, such as two, four or five, etc., which can be set according to actual conditions.

[0049] In one embodiment of the present application, see Figure 2 A second pad group 23 is also provided on the side of the chip pasting substrate 20 facing away from the test substrate 10. The second pad group 23 is electrically connected to the jack 21. The second pad group 23 is also used to be electrically connected to the pressure chip 30 to be tested.

[0050] Specifically, the second pad group 23 is arranged near the pasting area 22, and the second pad group 23 is electrically connected to the side wall of the insertion hole 21 through a wire, so that when the pin 13 is inserted into the insertion hole 21, the chip pasting substrate 20 is electrically connected to the test substrate 10. The second pad group 23 is also electrically connected to the pressure chip 30 to be tested through wire bonding, so that the pressure chip 30 to be tested is electrically connected to the chip pasting substrate 20, and then the pressure chip 30 to be tested is electrically connected to the first pad group 12.

[0051] Optionally, the number of second pad groups 23 is two, each second pad group 23 includes four second metal pads 231, wherein the four second metal pads 231 of one second pad group 23 are arranged at circumferential intervals along the pasting area 22, and the four second metal pads 231 of another second pad group 23 are arranged on the same side of the pasting area 22.

[0052] The two second pad groups 23 are electrically connected to each other. Specifically, the four second metal pads 231 of one second pad group 23 are electrically connected to the four second metal pads 231 of the other second pad group 23 through wires.

[0053] By providing two second pad groups 23 with different arrangements, two pressure chips with different designs can be compatible, which is beneficial to improving the application scope of the pressure chip testing tooling.

[0054] In one embodiment of the present application, a test point 25 is provided on the side of the chip pasting substrate 20 facing away from the test substrate 10 , and the test point 25 is electrically connected to the second pad group 23 .

[0055] The test point 25 is set corresponding to the pasting area 22. Optionally, the chip pasting substrate 20 is a rectangular structure, and the test point 25 is located at one end of the pasting area 22 away from the plug hole 21. The number of the test points 25 is set according to the number of the second metal pads 231 of the second pad group 23. For example, when the number of the second metal pads 231 of the second pad group 23 is four, the number of the test points 25 is also four, and the four test points 25 are respectively electrically connected to the four second metal pads 231 of the second pad group 23 through wires.

[0056] The test point 25 is used for external test equipment, such as a digital multimeter. Specifically, when the pressure chip 30 to be tested is bonded to the pasting area 22, and the pressure chip 30 to be tested is electrically connected to the chip pasting substrate 20 through the second pad group 23, the test equipment can be used to perform quality inspection before the packaging shell 40 is packaged. For example, a digital multimeter is used to electrically connect the test point 25 to perform a preliminary test on the electrical connection line between the pressure chip 30 to be tested and the chip pasting substrate 20 to test whether the circuit between the second pad group 23 and the chip pasting substrate 20 is a passage.

[0057] In one embodiment of the present application, see Figures 1 to 3 The placement area 11 is provided with a first opening 14 , and the pasting area 22 is provided with a second opening 24 , and the second opening 24 is correspondingly connected to the first opening 14 .

[0058] Optionally, the first through opening 14 penetrates the side of the test substrate 10 facing the chip pasting substrate 20 and the side of the test substrate 10 facing away from the chip pasting substrate 20. The second through opening 24 is provided at the center of the pasting area 22, and the second through opening 24 penetrates the side of the chip pasting substrate 20 facing the test substrate 10 and the side of the chip pasting substrate 20 facing away from the test substrate 10.

[0059] See also Figure 3 When the pressure chip 30 to be tested is bonded to the pasting area 22, one side of the pressure chip 30 to be tested covers the second opening 24, and the center of the pressure chip 30 to be tested is arranged corresponding to the second opening 24. Specifically, the pressure chip 30 to be tested has a back cavity structure 31, the edge of the pressure chip 30 to be tested is bonded to the edge of the pasting area 22, and the back cavity structure 31 is connected to the second opening 24. When the chip pasting substrate 20 with the pressure chip 30 to be tested is fixed to the placement area 11, the second opening 24 is correspondingly connected to the first opening 14, so that one side of the pressure to be tested is connected to the external atmospheric pressure through the second opening 24 and the first opening 14.

[0060] Optionally, the packaging shell 40 is a plastic shell. Specifically, the packaging shell 40 is made of plastic material, and the material cost is low.

[0061] In one embodiment of the present application, see Figure 3 Furthermore, the packaging shell 40 is provided with a cavity 41 and an air inlet 42 . The cavity 41 is used to accommodate the pressure chip 30 to be tested. The air inlet 42 is communicated with the cavity 41 , and the air inlet 42 is used to connect to an external pressure gas source.

[0062] When the edges of the packaging shell 40 are bonded to the chip pasting substrate 20, the cavity 41 covers the pasting area 22, so that the pressure chip 30 to be tested is located in the cavity 41, and the air inlet 42 is connected to an external pressure gas source through an air duct. The pressure gas source can be a pressure controller, which is used to input gas with a calibrated pressure into the cavity 41 and apply it to the pressure chip 30 to be tested.

[0063] The specific assembly process of the pressure chip test tooling is as follows:

[0064] S10; The pressure chip 30 to be tested is fixed on the chip pasting substrate 20 by an adhesive, such as Figure 4 .

[0065] Optionally, a placement machine can be used for automatic placement, and the specific steps are as follows:

[0066] S11. Set the placement parameters on the placement machine.

[0067] S12 , the adhesive dipping head of the chip mounter takes adhesive and evenly applies it to the edge of the pasting area 22 of the chip pasting substrate 20 .

[0068] S13 , the chip mounter aligns the pressure chip 30 to be tested with the pasting area 22 , and then places the pressure chip 30 to be tested in the pasting area 22 .

[0069] S14 , curing the adhesive so that the pressure chip 30 to be tested is adhered to the pasting area 22 .

[0070] It should be noted that the corresponding curing method is selected according to the material of the adhesive, wherein the adhesive may be silicone, vulcanized adhesive, thermally conductive adhesive or a crystal bonding adhesive made of other materials.

[0071] S20 , electrically connecting the pressure chip 30 to be tested to the chip pasting substrate 20 .

[0072] Specifically, wire bonding is used to electrically connect the pressure chip 30 to be tested to the chip-attached substrate 20. Alternatively, a wire bonding machine can be used to bond metal wires to electrically connect the pressure chip 30 to be tested to the second pad group 23, thereby electrically connecting the pressure chip 30 to be tested to the chip-attached substrate 20.

[0073] S30 , electrically connecting the test equipment to the test point 25 to perform a preliminary test on the electrical connection line between the pressure chip 30 to be tested and the chip pasting substrate 20 .

[0074] It should be noted that, in other embodiments, step S30 may be omitted, and step S40 may be performed directly after step S20 is completed.

[0075] S40, bonding the package housing 40 to the chip attaching substrate 20 by means of an adhesive, such as Figure 5 .

[0076] Optionally, a dispensing machine can be used for automatic dispensing. The specific steps are as follows:

[0077] S41, setting dispensing parameters on the dispensing machine;

[0078] S42 , the adhesive dispenser applies adhesive to a preset position of the chip pasting substrate 20 .

[0079] S43 , placing the packaging shell 40 on the chip pasting substrate 20 , and the packaging shell 40 covers the pressure chip 30 to be tested.

[0080] S44 , curing the adhesive so that the package casing 40 is bonded to the chip attaching substrate 20 .

[0081] It should be noted that the corresponding curing method is selected according to the material of the adhesive, wherein the adhesive may be UV-curable adhesive (UV for short), epoxy adhesive, silicone adhesive or other adhesive materials.

[0082] S50, placing the chip bonding substrate on the placement area 11 of the test substrate 10, and inserting the pins 13 into the sockets 21, as shown in FIG. Figure 6 .

[0083] S60, connecting one end of the air guide tube to the air inlet 42, and the other end to the pressure air source, and connecting the first pad group 12 to an external power source and a measuring device.

[0084] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A pressure chip testing tool, characterized in that: include: A test substrate, wherein the test substrate has a placement area, the placement area is provided with pins, and the test substrate is provided with a first pad group, and the first pad group is electrically connected to the pins; A chip pasting substrate, the chip pasting substrate is located in the placement area, the chip pasting substrate is provided with a socket for inserting the pin, the socket is electrically connected to the pin; the side of the chip pasting substrate away from the test substrate has a pasting area, the pasting area is used to stick the pressure chip to be tested; and The packaging shell is bonded to the side of the chip pasting substrate away from the testing substrate, and the packaging shell covers the pasting area.

2. The pressure chip testing tool as claimed in claim 1, characterized in that: The first pad group includes four first metal pads, the number of the pins on the placement area is four, and the four pins are electrically connected to the four first metal pads in a one-to-one correspondence.

3. The pressure chip testing tool as claimed in claim 1, characterized in that: The number of the placement areas is multiple, the number of the first pad groups and the number of the chip pasting substrates are equal to the number of the placement areas, the multiple chip pasting substrates are respectively located on the multiple placement areas, and the multiple first pad groups are respectively arranged in one-to-one correspondence with the multiple placement areas.

4. The pressure chip testing tool as claimed in claim 1, characterized in that: A second pad group is also provided on the side of the chip pasting substrate away from the test substrate. The second pad group is electrically connected to the jack and is also used to be electrically connected to the pressure chip to be tested.

5. The pressure chip testing tool as claimed in claim 4, characterized in that: There are two second pad groups, each of which includes four second metal pads. The four second metal pads of one second pad group are arranged at intervals along the circumference of the pasting area, and the four second metal pads of another second pad group are arranged on the same side of the pasting area.

6. The pressure chip testing tool as claimed in claim 4, characterized in that: A test point is provided on the side of the chip pasting substrate facing away from the test substrate, and the test point is electrically connected to the second pad group.

7. The pressure chip testing tool as described in any one of claims 1 to 6, characterized in that: The packaging shell is a plastic shell.

8. The pressure chip testing tool as described in any one of claims 1 to 6, characterized in that: The placement area is provided with a first opening, and the pasting area is provided with a second opening, and the second opening is correspondingly communicated with the first opening.

9. The pressure chip testing tool as described in any one of claims 1 to 6, characterized in that: The packaging shell is provided with a cavity and an air inlet, wherein the cavity is used to accommodate the pressure chip to be tested, and the air inlet is communicated with the cavity, and the air inlet is used to connect to an external pressure gas source.

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