Adhesive bonding strength detection equipment

Abstract

The utility model discloses adhesive bonding strength detection equipment which comprises a base, a first mounting plate is fixedly mounted at one end of the base, a first hydraulic cylinder is fixedly mounted at the upper part of the first mounting plate, and a first tension sensor is fixedly connected to the telescopic end of the first hydraulic cylinder; one end of the first tension sensor is fixedly connected with a first test plate; a second mounting plate is fixedly mounted at the other end of the base, a second hydraulic cylinder is fixedly connected to one side of the second mounting plate, a second tension sensor is fixedly connected to the telescopic end of the second hydraulic cylinder, and a second test plate is fixedly connected to one end of the second tension sensor; a test board is fixedly mounted at the top of the base; a temperature control component is mounted on the test board; according to the adhesive strength detection device, the vertical and transverse adhesive strength of the adhesive can be detected, and the surface of the test board can be cooled through the temperature control component before the adhesive strength is detected, so that the curing speed of the adhesive is accelerated, and the detection efficiency of the adhesive is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of adhesive detection, in particular to an adhesive bonding strength detection device. Background Art

[0002] Adhesive is a substance with excellent bonding properties. It connects objects by bonding the surfaces through adhesion and cohesion. Curing temperature is one of the important parameters when curing adhesives. If the curing temperature is too high, it will easily cause the glue to flow out or make the glue layer brittle, resulting in a decrease in bonding strength. If the curing temperature is too low, the molecular chain of the matrix will have difficulty moving, which will make the cross-linking density of the glue layer too low and the curing reaction cannot be completed. Therefore, during the curing process, the curing temperature must be strictly controlled. Each adhesive has a specific curing temperature.

[0003] As in the prior art, a patent with application publication number CN213364446U discloses a sample preparation device for testing adhesive tensile strength, including a sample preparation table arranged above a foam block, and a supporting mechanism arranged below the sample preparation table for supporting the sample preparation table, a glue coating groove is provided on the sample preparation table, and the sample preparation table is in contact with the foam block.

[0004] The above patent can solve the corresponding technical problems and facilitate the control of the thickness of the adhesive when it is applied. However, the above patent still has disadvantages during use:

[0005] The above-mentioned adhesive tensile strength test sample maker can only perform vertical tensile strength test on the adhesive, and the test range is small. In addition, during the adhesive test, the adhesive solidifies naturally, and the curing time of the adhesive cannot be controlled, which reduces the efficiency of the adhesive bonding strength test. Utility Model Content

[0006] In view of the problems mentioned in the background technology, the purpose of the utility model is to provide an adhesive bonding strength testing device to solve the problems mentioned in the background technology.

[0007] The above technical objectives of the utility model are achieved through the following technical solutions:

[0008] An adhesive bonding strength testing device comprises: a base, a first mounting plate is fixedly mounted on one end of the base, a first hydraulic cylinder is fixedly mounted on the upper part of the first mounting plate, a first tension sensor is fixedly connected to the telescopic end of the first hydraulic cylinder, and a first test plate is fixedly connected to one end of the first tension sensor;

[0009] A second mounting plate is fixedly mounted on the other end of the base, a second hydraulic cylinder is fixedly connected to one side of the second mounting plate, a second tension sensor is fixedly connected to the telescopic end of the second hydraulic cylinder, and a second test plate is fixedly connected to one end of the second tension sensor;

[0010] A test bench is fixedly mounted on the top of the base, and a temperature control component for accelerating the curing of the adhesive is mounted on the test bench.

[0011] By adopting the above technical scheme: the first hydraulic cylinder is arranged vertically, and the adhesive is applied to the bottom of the first test plate and the first test plate is brought into contact with the top of the test bench. When the adhesive is fixed, the first test plate can be pulled up by the first hydraulic cylinder, and the data after the adhesive is broken is recorded by the first tension sensor to judge its strength, thereby testing the vertical bonding strength of the adhesive; the second hydraulic cylinder is arranged horizontally, and the adhesive is applied to one side of the second test plate and the second test plate is brought into contact with one side of the test bench. The second test plate can be pulled sideways by the second hydraulic cylinder, and the data after the adhesive is broken is recorded by the second tension sensor to judge its strength, thereby testing the horizontal bonding strength of the adhesive; before the adhesive strength test, the surface of the test bench can be cooled by the temperature control component to accelerate the curing speed of the adhesive and improve the detection efficiency of the adhesive.

[0012] Preferably, a temperature control chamber is provided inside the test bench;

[0013] The temperature control component includes a semiconductor refrigeration sheet, a controller and a temperature sensor. The semiconductor refrigeration sheet is installed on one side of the test bench, and the hot end of the semiconductor refrigeration sheet faces the inside of the temperature control cavity. The controller is fixedly installed on the bottom plate of the test bench, and the temperature sensor is fixedly installed on the inner wall of the temperature control cavity. The controller is electrically connected to the semiconductor refrigeration sheet and the temperature sensor respectively.

[0014] Wherein, the controller is provided with a temperature display and a temperature control switch;

[0015] The semiconductor refrigeration plate is rotatably installed on one side of the test bench through an adjusting component.

[0016] By adopting the above technical solution: heat is transported to the inside of the temperature control cavity through the semiconductor refrigeration sheet to achieve the effect of controlling the temperature of the test bench surface, the temperature inside the temperature control cavity is detected by the temperature sensor, and the temperature is controlled and adjusted according to the optimal fixation temperature of the detected adhesive, so that the adhesive is fixed at the optimal temperature, thereby accelerating the curing efficiency of the adhesive.

[0017] Preferably, the adjustment component comprises a mounting hole provided on one side of the test bench, axles are rotatably mounted on the bottom and the top of the mounting hole respectively, a mounting frame is fixedly mounted between the upper and lower axles, and the semiconductor cooling sheet is fixedly mounted inside the mounting frame;

[0018] A driving motor is also fixedly mounted on the bottom plate of the test bench, and the output shaft of the driving motor is fixedly connected to the bottom end of the shaft rod located below.

[0019] By adopting the above technical solution: the semiconductor refrigeration plate is driven by a driving motor to rotate 180 degrees, so that the cold end and the hot end of the semiconductor refrigeration plate can be switched at will, further facilitating the internal temperature adjustment of the temperature control chamber.

[0020] Preferably, bearings are fixedly mounted at the bottom and the top of the mounting hole respectively, and the shaft is fixedly mounted in the inner ring of the bearing.

[0021] By adopting the above technical solution, the rotation stability of the semiconductor refrigeration plate is further increased, which is helpful for the use of the device.

[0022] Preferably, a rubber pad is fixedly mounted at the contact portion between the mounting frame and the mounting hole.

[0023] By adopting the above technical solution, the gap between the mounting frame and the mounting hole can be sealed to prevent the temperature loss inside the temperature control cavity.

[0024] Preferably, the top of the test bench contacts the first test board, and one side of the test bench contacts the second test board.

[0025] By adopting the above technical solution: the first test plate can test the vertical bonding strength of the adhesive, and the second test plate can test the horizontal bonding strength of the adhesive.

[0026] Compared with the prior art, the beneficial effects of the utility model are:

[0027] By coating adhesive on the bottom of the first test plate and making the first test plate contact with the top of the test bench, when the adhesive is fixed, the first test plate can be pulled up by the first hydraulic cylinder, and the data after the adhesive is broken is recorded by the first tension sensor to judge its strength, so as to test the vertical bonding strength of the adhesive. The second hydraulic cylinder is arranged horizontally. By coating adhesive on one side of the second test plate and making the second test plate contact with one side of the test bench, the second test plate can be pulled sideways by the second hydraulic cylinder, and the data after the adhesive is broken is recorded by the second tension sensor to judge its strength, so as to test the horizontal bonding strength of the adhesive. Before the adhesive strength test, the surface of the test bench can be cooled by the temperature control component to accelerate the curing speed of the adhesive and improve the detection efficiency of the adhesive.

[0028] Heat is transported to the interior of the temperature control chamber through the semiconductor refrigeration sheet to achieve the effect of controlling the temperature of the test bench surface. The temperature inside the temperature control chamber is detected by the temperature sensor, and the temperature is adjusted according to the optimal fixation temperature of the detected adhesive, so that the adhesive is fixed at the optimal temperature, which accelerates the curing efficiency of the adhesive.

[0029] The semiconductor refrigeration plate is driven by a driving motor to rotate 180 degrees, so that the cold end and the hot end of the semiconductor refrigeration plate can be switched at will, further facilitating the internal temperature adjustment of the temperature control chamber;

[0030] The bearing further increases the rotation stability of the semiconductor cooling plate, which is helpful for the use of the device;

[0031] The gap between the mounting frame and the mounting hole can be sealed by the rubber pad to prevent the temperature inside the temperature control chamber from being lost. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a front view of the utility model;

[0033] Figure 2 It is a schematic diagram of the rotation of the semiconductor refrigeration sheet of the utility model;

[0034] Figure 3 This is a schematic diagram of the front section structure of the test bench of the utility model;

[0035] Figure 4 It is a schematic diagram of the side section structure of the test bench of the utility model.

[0036] Figure numerals: 100, base; 200, first mounting plate; 300, first hydraulic cylinder; 301, first tension sensor; 302, first test plate; 400, second mounting plate; 500, second hydraulic cylinder; 501, second tension sensor; 502, second test plate; 600, test bench; 601, mounting hole; 602, bearing; 700, mounting frame; 701, rubber pad; 800, semiconductor cooling plate; 900, drive motor; 901, shaft; 1000, controller; 1001, temperature sensor. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] Embodiment 1

[0039] Please refer to Figure 1-Figure 3 , an adhesive bonding strength testing device, comprising: a base 100, a first mounting plate 200 is fixedly mounted on one end of the base 100, a first hydraulic cylinder 300 is fixedly mounted on the upper part of the first mounting plate 200, a first tension sensor 301 is fixedly connected to the telescopic end of the first hydraulic cylinder 300, and a first test plate 302 is fixedly connected to one end of the first tension sensor 301;

[0040] A second mounting plate 400 is fixedly mounted on the other end of the base 100, a second hydraulic cylinder 500 is fixedly connected to one side of the second mounting plate 400, a second tension sensor 501 is fixedly connected to the telescopic end of the second hydraulic cylinder 500, and a second test plate 502 is fixedly connected to one end of the second tension sensor 501;

[0041] A test bench 600 is fixedly mounted on the top of the base 100 , and a temperature control component for accelerating the curing of the adhesive is mounted on the test bench 600 .

[0042] Embodiment 2

[0043] Improvements are made based on the first embodiment:

[0044] In order to achieve the effect of controlling the temperature of the surface of the test bench 600, the temperature can be controlled and adjusted according to the optimal fixation temperature of the detected adhesive, so that the adhesive is fixed at the optimal temperature, which accelerates the curing efficiency of the adhesive. A temperature control cavity is provided inside the test bench 600; the temperature control component includes a semiconductor cooling sheet 800, a controller 1000 and a temperature sensor 1001, the semiconductor cooling sheet 800 is installed on one side of the test bench 600, the hot end of the semiconductor cooling sheet 800 faces the inside of the temperature control cavity, the controller 1000 is fixedly installed on the bottom plate of the test bench 600, and the temperature sensor 1001 is fixedly installed on the inner wall of the temperature control cavity, and the controller 1000 is electrically connected to the semiconductor cooling sheet 800 and the temperature sensor 1001 respectively; wherein, a temperature display and a temperature control switch are provided on the controller 1000; the semiconductor cooling sheet 800 is rotatably installed on one side of the test bench 600 through an adjustment component, and the temperature display is used to display the temperature inside the temperature control cavity in real time;

[0045] In order to make the cold end and the hot end of the semiconductor cooling sheet 800 switchable and further facilitate the internal temperature adjustment of the temperature control chamber, the adjustment component includes a mounting hole 601 opened on one side of the test bench 600, and the bottom and the top of the mounting hole 601 are respectively rotatably mounted with shafts 901, and a mounting frame 700 is fixedly mounted between the upper and lower shafts 901, and the semiconductor cooling sheet 800 is fixedly mounted inside the mounting frame 700;

[0046] In order to further increase the rotation stability of the semiconductor cooling sheet 800 and facilitate the use of the device, the bottom and top of the mounting hole 601 are respectively fixedly mounted with bearings 602, and the shaft 901 is fixedly mounted in the inner ring of the bearing 602;

[0047] In order to seal the gap between the mounting frame 700 and the mounting hole 601 and prevent the temperature inside the temperature control chamber from being lost, a rubber pad 701 is fixedly installed at the contact portion between the mounting frame 700 and the mounting hole 601;

[0048] In order to test the vertical and horizontal bonding strength of the adhesive, the top of the test bench 600 contacts the first test board 302 , and one side of the test bench 600 contacts the second test board 502 .

[0049] It is worth noting that the temperature sensor 1001 can be a pt100 temperature sensor, and the controller 1000 is a PLC controller, and its model is 6ES72350KD220XA8.

[0050] Structural principle: When in use, to test the vertical tensile strength of the adhesive, the adhesive is coated on the bottom of the first test plate 302, and the first test plate 302 is brought into contact with the top of the test bench 600. When the adhesive is fixed, the first test plate 302 can be pulled up by the first hydraulic cylinder 300, and the strength of the adhesive can be determined by recording the data after the adhesive is disconnected by the first tension sensor 301, thereby testing the vertical bonding strength of the adhesive;

[0051] When testing the transverse tensile strength of the adhesive, the adhesive is applied on one side of the second test plate 502 and the second test plate 502 is brought into contact with one side of the test bench 600. The second test plate 502 can be pulled laterally by the second hydraulic cylinder 500, and the strength of the adhesive can be determined by recording the data after the adhesive is broken by the second tension sensor 501, thereby testing the transverse bonding strength of the adhesive.

[0052] When the temperature of the surface of the test bench 600 is controlled, heat is transported to the inside of the temperature control cavity through the hot end of the semiconductor refrigeration sheet 800, so as to achieve the effect of controlling the temperature of the surface of the test bench 600. The temperature inside the temperature control cavity is detected by the temperature sensor 1001, and the temperature is controlled and adjusted according to the optimal fixation temperature of the detected adhesive, so that the adhesive is fixed at the optimal temperature, thereby accelerating the curing efficiency of the adhesive.

[0053] In summary, this application:

[0054] By coating adhesive on the bottom of the first test plate 302 and making the first test plate 302 contact with the top of the test bench 600, when the adhesive is fixed, the first test plate 302 can be pulled up by the first hydraulic cylinder 300, and the strength of the adhesive can be determined by recording the data after the adhesive is disconnected by the first tension sensor 301, so as to test the vertical bonding strength of the adhesive. The second hydraulic cylinder 500 is arranged horizontally. By coating adhesive on one side of the second test plate 502 and making the second test plate 502 contact with one side of the test bench 600, the second test plate 502 can be pulled sideways by the second hydraulic cylinder 500, and the strength of the adhesive can be determined by recording the data after the adhesive is disconnected by the second tension sensor 501, so as to test the horizontal bonding strength of the adhesive. Before the adhesive strength test, the surface of the test bench 600 can be cooled by the temperature control component to accelerate the curing speed of the adhesive and improve the detection efficiency of the adhesive.

[0055] Heat is transported to the interior of the temperature control chamber by the semiconductor cooling sheet 800 to achieve the effect of controlling the temperature of the surface of the test bench 600. The temperature inside the temperature control chamber is detected by the temperature sensor 1001, and the temperature is controlled and adjusted according to the detected optimal fixation temperature of the adhesive, so that the adhesive is fixed at the optimal temperature, thereby accelerating the curing efficiency of the adhesive.

[0056] The semiconductor cooling plate 800 is driven by the driving motor 900 to rotate 180 degrees, so that the cold end and the hot end of the semiconductor cooling plate 800 can be switched at will, further facilitating the internal temperature adjustment of the temperature control chamber;

[0057] The bearing 602 further increases the rotation stability of the semiconductor cooling sheet 800, which is helpful for the use of the device;

[0058] The gap between the mounting frame 700 and the mounting hole 601 can be sealed by the rubber pad 701 to prevent the temperature inside the temperature control chamber from being lost.

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An adhesive bonding strength testing device, characterized in that ,include: A base (100), wherein a first mounting plate (200) is fixedly mounted on one end of the base (100), a first hydraulic cylinder (300) is fixedly mounted on the upper portion of the first mounting plate (200), a first tension sensor (301) is fixedly connected to the telescopic end of the first hydraulic cylinder (300), and a first test plate (302) is fixedly connected to one end of the first tension sensor (301); A second mounting plate (400) is fixedly mounted on the other end of the base (100); a second hydraulic cylinder (500) is fixedly connected to one side of the second mounting plate (400); a second tension sensor (501) is fixedly connected to the telescopic end of the second hydraulic cylinder (500); and a second test plate (502) is fixedly connected to one end of the second tension sensor (501); A test bench (600) is fixedly mounted on the top of the base (100), and a temperature control component for accelerating the curing of the adhesive is mounted on the test bench (600).

2. The adhesive bonding strength testing device according to claim 1, characterized in that: The test bench (600) is provided with a temperature control chamber inside; The temperature control component comprises a semiconductor cooling sheet (800), a controller (1000) and a temperature sensor (1001); the semiconductor cooling sheet (800) is mounted on one side of the test bench (600); the hot end of the semiconductor cooling sheet (800) faces the interior of the temperature control cavity; the controller (1000) is fixedly mounted on the bottom plate of the test bench (600); the temperature sensor (1001) is fixedly mounted on the inner wall of the temperature control cavity; and the controller (1000) is electrically connected to the semiconductor cooling sheet (800) and the temperature sensor (1001) respectively; Wherein, the controller (1000) is provided with a temperature display and a temperature control switch; The semiconductor cooling plate (800) is rotatably mounted on one side of the test bench (600) via an adjusting component.

3. The adhesive bonding strength testing device according to claim 2, characterized in that: The adjusting component comprises a mounting hole (601) provided on one side of the test bench (600); shafts (901) are rotatably mounted at the bottom and top of the mounting hole (601); a mounting frame (700) is fixedly mounted between the upper and lower shafts (901); and the semiconductor cooling sheet (800) is fixedly mounted inside the mounting frame (700); A driving motor (900) is also fixedly mounted on the bottom plate of the test bench (600), and an output shaft of the driving motor (900) is fixedly connected to the bottom end of the shaft (901) located below.

4. The adhesive bonding strength testing device according to claim 3, characterized in that: Bearings (602) are fixedly mounted at the bottom and top of the mounting hole (601), respectively, and the shaft (901) is fixedly mounted in the inner ring of the bearing (602).

5. The adhesive bonding strength testing device according to claim 3, characterized in that: A rubber pad (701) is fixedly mounted at the contact portion between the mounting frame (700) and the mounting hole (601).

6. The adhesive bonding strength testing device according to claim 1, characterized in that: The top of the test bench (600) contacts the first test board (302), and one side of the test bench (600) contacts the second test board (502).

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