Modularized stacking structure applied to small signal measurement and circuit module thereof

Abstract

The utility model discloses a modularized stacking structure applied to small signal measurement and a circuit module thereof, comprising a measurement module circuit board, the measurement module circuit board is provided with a small signal measurement component, and the measurement module circuit board is provided with a first fastener; a measurement module stacked circuit board, the measurement module stacked circuit board is provided with a second fastener, and the first fastener is matched with the second fastener; signal transmission is carried out between the measurement module circuit board and the measurement module stacked circuit board through the stacking connector, so that the purpose of improving the internal space utilization rate of the small signal measurement electronic equipment and further improving the miniaturization of the small signal measurement electronic equipment is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of small signal measurement electronic equipment, in particular to a modular stacking structure and a circuit module thereof applied to small signal measurement. Background Art

[0002] As small signal measurement electronic devices become smaller and more compact, the functional requirements for measurement equipment are becoming increasingly complex and the control logic requirements are becoming increasingly intelligent. In order to meet the corresponding functional performance requirements within the limited internal space of the device, small signal measurement electronic devices need to achieve higher integration and smaller size.

[0003] The main paths to miniaturization and compactness of small signal measurement electronics are:

[0004] Path 1: Use more integrated electronic components to achieve richer functions;

[0005] Path 2: Use multi-layer circuit boards to meet higher signal interconnection requirements;

[0006] Path 3: Use the module stacking method to realize the construction of the internal circuit board of the electronic device.

[0007] Path 1 is the main way to achieve miniaturization and compactness of electronic devices. The use of smaller and lighter packages and micro components, such as QFN, QFP, BGA, etc., can further reduce the size of the device. However, due to the constraints of physical limitations, heat dissipation, cost and complexity of analog chip integration, Path 1 has limited effect on the miniaturization of small signal measurement electronic devices.

[0008] The above-mentioned path 2 requires electronic equipment circuit board layout engineers to design multi-layer circuit board signal interconnection within the layout size per unit area, so as to achieve the purpose of compressing the size of the equipment circuit board and completing high-performance integrated circuit signal interconnection.

[0009] The above-mentioned path 3 is that the multi-layer circuit board can only provide more signal interconnection layers, but the electronic components can only be installed on the surface of the circuit board.

[0010] Therefore, based on Path 3, this technology proposes a modular stacking design to further improve the internal space utilization of small-signal measurement electronic equipment, so as to further improve the miniaturization of small-signal measurement electronic equipment. Utility Model Content

[0011] In view of the above problems, the utility model provides a modular stacking structure and a circuit module thereof for small signal measurement, so as to improve the internal space utilization of small signal measurement electronic equipment and further improve the miniaturization of small signal measurement electronic equipment.

[0012] The technical solution of the utility model is: a modular stacking structure applied to small signal measurement, comprising:

[0013] A measurement module circuit board, wherein the measurement module circuit board is provided with small signal measurement components, and a first fastener is provided on the measurement module circuit board;

[0014] The measurement module is stacked on a circuit board, the measurement module is stacked on the circuit board and a second fastener is provided, and the first fastener is adapted to the second fastener;

[0015] A stacking connector is used for signal transmission between the measurement module circuit board and the measurement module stacked circuit board.

[0016] Among them, the first fastener and the second fastener realize the reinforcement function of the modular stacking structure.

[0017] Furthermore, the stacking connector includes a connector plug and a connector socket, and the connector plug and the connector socket are respectively arranged on the measurement module circuit board and the measurement module stacked circuit board.

[0018] Furthermore, the first fastener is a bolt, and the second fastener is a screw hole seat; the bolt is matched with the screw hole seat, and a sleeve is sleeved on the bolt, and the height of the sleeve is matched with the combined height of the stacking connector. In the modular stacking structure, the stacking combination height of the connector plug and the connector socket is determined by the stacking connector, and the height is selected as needed to ensure design flexibility.

[0019] Furthermore, the stacking connector is set as a board-to-board connector, a pin-and-female header connector or a board-to-wire connector, and the signal transmission function is realized through the design of the stacking connector; on the other hand, the board-to-board connector, the pin-and-female header connector or the board-to-wire connector is designed to adapt to the transmission requirements of different signals.

[0020] The utility model also provides a circuit module for small signal measurement, the circuit module comprising:

[0021] A module housing, wherein the module housing is provided with a modular stacking structure for small signal measurement as provided above;

[0022] A heat dissipation cover plate matched with the module housing, wherein the heat dissipation cover plate is located above the modular stacking structure.

[0023] The beneficial effects of the utility model are:

[0024] 1. The modular stacking structure and circuit module thereof for small signal measurement provided by the utility model can improve the internal space utilization rate of small signal measurement electronic equipment; at the same time, it can further increase the number of electronic components installed per unit volume, thereby reducing the overall volume occupied by the circuit.

[0025] 2. The modular stacking structure and circuit module thereof for small signal measurement provided by the utility model increase the number of PCB boards while increasing the total signal wiring layer and the total component layout layer, thereby reducing the number of board layer components of a single PCB board, further reducing the manufacturing cost and process requirements of a single PCB board.

[0026] 4. The modular stacking structure and circuit module for small signal measurement provided by the utility model adopt modular design for reuse and rapid development. The measurement module circuit board designed by the stacking design has a solidified technical status after qualified debugging. When developing products with similar functional requirements, only a new measurement module circuit board needs to be developed, thus shortening the overall design and debugging workload of the project.

[0027] 5. The modular stacking structure and circuit module for small signal measurement provided by the utility model can reduce the number of cables inside the small signal measurement equipment, improve signal connection reliability, and reduce production process requirements. At the same time, stacking connectors are used for communication connection without wiring, thereby improving equipment reliability and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a top view of a measurement module circuit board in a modular stacking structure for small signal measurement described in Example 1 of the utility model;

[0029] Figure 2 It is a bottom view of a measurement module circuit board in a modular stacking structure for small signal measurement described in Embodiment 1 of the present utility model;

[0030] Figure 3 It is a partially enlarged schematic diagram of a circuit board stacked with a measurement module in a modular stacking structure for small signal measurement described in Embodiment 1 of the present utility model;

[0031] Figure 4 It is a schematic diagram of the overall structure of a circuit module used for small signal measurement described in Embodiment 2 of the present utility model;

[0032] Figure 5 It is a schematic diagram of the internal structure of a circuit module used for small signal measurement described in Embodiment 2 of the present utility model;

[0033] Figure 6 for Figure 4 A partial enlarged schematic diagram of the left part.

[0034] Description of reference numerals:

[0035] 1- measurement module circuit board; 2- small signal measurement components; 3- first fastener; 4- second fastener; 5- measurement module stacked circuit board; 6- connector plug; 7- connector socket; 8- sleeve; 9- module housing; 10- heat dissipation cover. DETAILED DESCRIPTION

[0036] The embodiments of the present utility model will be further described below in conjunction with the accompanying drawings.

[0037] Embodiment 1:

[0038] like Figure 1-Figure 3 As shown, in this embodiment, a modular stacking structure for small signal measurement is specifically provided, including: a measurement module circuit board, a measurement module stacked circuit board and a stacking connector. The measurement module circuit board is provided with small signal measurement components, a small signal measurement circuit, and a connector plug, and a first fastener is provided on the measurement module circuit board, and the measurement module circuit board is fixedly installed by the first fastener. Among them, the connector plug establishes a communication connection with the small signal measurement components through the small signal measurement circuit, and the measurement module circuit board, the small signal measurement components, the small signal measurement circuit, the connector plug and the first fastener together constitute a modular small signal measurement module. Among them, the small signal measurement circuit is an existing mature circuit, which is mainly used to transmit signals.

[0039] In order to modularly install the small signal measurement module and realize its function, a measurement module stacked circuit board is also designed. The measurement module stacked circuit board is provided with an analog quantity processing circuit. The analog quantity processing circuit is an existing mature circuit and the analog quantity processing circuit is communicatively connected with the connector socket. A second fastener is provided on the measurement module stacked circuit board, and the first fastener is adapted to the second fastener. The installation of the small signal measurement module can be realized by assembling the first fastener and the second fastener. Among them, the first fastener and the second fastener realize the reinforcement function of the modular stacking structure. Specifically:

[0040] The first fastener is set as a bolt and a fastening hole corresponding to the bolt is provided on the measurement module circuit board, and the second fastener is set as a screw hole seat, and the screw hole seat corresponds to the fastening hole. The bolt is adapted to the screw hole seat, and a sleeve is sleeved on the bolt, and the bolt is screwed into the inside of the screw hole seat. While being reinforced by the bolt, it should also be ensured that the height of the sleeve is adapted to the combined height of the stacking connector. In the modular stacking structure, the stacking combination height of the connector plug and the connector socket is determined by the properties of the stacking connector itself. The combined height is selected according to the requirements of the modular design to ensure design flexibility, and when the combined height is determined, the height of the sleeve is determined according to the height, thereby meeting the installation and fastening requirements of the measurement module circuit board on the stacked circuit board of the measurement module.

[0041] In order to realize the function of the small signal measurement module, the stacking connector is used to transmit signals between the measurement module circuit board and the measurement module stacked circuit board. The stacking connector includes a connector plug and a connector socket, and the connector plug and the connector socket are respectively arranged on the measurement module circuit board and the measurement module stacked circuit board. In practical applications, the stacking connector can be set as a board-to-board connector, a pin-and-female connector, or a board-to-wire connector. The signal transmission function is realized through the design of the stacking connector; on the other hand, the board-to-board connector, the pin-and-female connector, or the board-to-wire connector are designed to meet the transmission requirements of different signals.

[0042] The modular stacking structure applied to small signal measurement in this embodiment can flexibly set the signal definition in actual application. In the signal definition of the stacking connector, the signal positive electrode is wrapped by the signal negative electrode, thereby achieving the effect of electrical shielding against electromagnetic radiation interference. As a result, the stacked circuit boards and the stacked circuits and stacked connectors can form an electrical shielding effect, so that they have the low noise requirements for small signal measurement transmission.

[0043] Example 2

[0044] like Figure 4-Figure 6 As shown, this embodiment also provides a circuit module for small signal measurement, which applies the modular stacking structure provided in Example 1. The circuit module includes: a module shell and a heat dissipation cover plate detachably assembled on the module shell, and the module shell is provided with a modular stacking structure for small signal measurement as provided in the above-mentioned Example 1, and the heat dissipation cover plate is located above the modular stacking structure, which can ensure that the small signal measurement components on the modular stacking structure can dissipate heat normally during operation.

[0045] The above-mentioned embodiments only express the specific implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.

Claims

1. A modular stacking structure for small signal measurement, characterized in that: include: A measurement module circuit board, wherein the measurement module circuit board is provided with small signal measurement components, and a first fastener is provided on the measurement module circuit board; The measurement module is stacked on a circuit board, the measurement module is stacked on the circuit board and a second fastener is provided, and the first fastener is adapted to the second fastener; A stacking connector is used for signal transmission between the measurement module circuit board and the measurement module stacked circuit board.

2. The modular stacking structure for small signal measurement according to claim 1, characterized in that: The stacking connector includes a connector plug and a connector socket, and the connector plug and the connector socket are respectively arranged on a measurement module circuit board and a measurement module stacked circuit board.

3. The modular stacking structure for small signal measurement according to claim 1, characterized in that: The first fastener is a bolt, and the second fastener is a screw hole seat; the bolt is matched with the screw hole seat, and a sleeve is sleeved on the bolt, and the height of the sleeve is matched with the combined height of the stacking connector.

4. The modular stacking structure for small signal measurement according to claim 1, characterized in that: The stacking connector is configured as a board-to-board connector, a pin-and-female connector, or a board-to-wire connector.

5. A circuit module for small signal measurement, characterized in that: The circuit module includes: A module housing, wherein the module housing is provided with a modular stacking structure for small signal measurement as described in any one of claims 1 to 4; A heat dissipation cover plate matched with the module housing, wherein the heat dissipation cover plate is located above the modular stacking structure.

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