Heat dissipation structure

Abstract

The utility model relates to a heat dissipation structure, which belongs to the technical field of heat dissipation, and comprises a box body, an accommodating space is arranged in the box body, a component to be cooled is arranged in the accommodating space, a heat dissipation assembly is arranged on one side or multiple sides of the box body, and the heat dissipation assembly comprises a heat dissipation fin group and an air flow speed increasing piece matched with the heat dissipation fin group for use. The heat dissipation fin group is connected with the to-be-cooled part through the first heat conduction assembly, in the using process, heat dissipated by the to-be-cooled part can be guided to the heat dissipation fin group through the first heat conduction assembly, and then the flow speed of air around the heat dissipation fin group is increased through the air flow speed increasing part; heat on the heat dissipation fin set is dissipated through air entrainment, so that the purpose of rapid heat dissipation is achieved, the temperature in the case is prevented from being too high, meanwhile, the requirement of a server for the use environment can be lowered, and the heat dissipation device can be applied to poor environmental conditions such as outdoor and vehicle-mounted environments.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, and more specifically to a heat dissipation structure. Background Art

[0002] As the digital transformation of society continues to deepen, computing power has become the core force to support and promote the development of the digital economy, and plays an important role in promoting scientific and technological progress and social governance. At the same time, artificial intelligence technology represented by large model training is also pushing AI to develop in a more general direction. Therefore, servers, as electronic devices that provide computing power, are also developing in the direction of high density and flexibility. As an important hub in the computer network structure, servers will generate heat during the process of running and processing data, especially when there is a large amount of data, the temperature will be very high, and timely heat dissipation is required.

[0003] Most of the existing servers are air-cooled structures, that is, non-sealed chassis, which have strict requirements on the use environment. When the server is placed outdoors or in a vehicle, dust easily accumulates inside the server, causing damage and failure. Utility Model Content

[0004] The technical problem to be solved by the utility model is that most of the existing servers are air-cooled structures, that is, non-sealed chassis, which have strict requirements on the use environment. When the server is placed outdoors or in a vehicle, dust is easily accumulated inside the server, causing damage and failure. In view of the above-mentioned defects of the prior art, a heat dissipation structure is provided.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A heat dissipation structure is constructed, including a box body, a containing space is provided in the box body, a component to be dissipated is provided in the containing space, a heat dissipation component is provided on one or more sides of the box body, the heat dissipation component includes a heat dissipation fin group and an air flow speed increasing member used in conjunction with the heat dissipation fin group, and the heat dissipation fin group is connected to the component to be dissipated through a first heat conduction component.

[0007] Optionally, the heat dissipation fin group includes a heat conducting plate and a plurality of fin members, and the first heat conducting component connects the component to be dissipated with the heat conducting plate.

[0008] Optionally, the air flow accelerating member includes an air inlet and a first air outlet, the air outlet is directly opposite to the fin member, and a side wall of the box body is provided with a second air outlet connected to the fin member.

[0009] Optionally, a mounting frame is provided in the accommodating space, the mounting frame is in contact with the heat conducting plate, the mounting frame includes a plurality of transverse heat dissipation plates arranged in sequence from top to bottom, a control circuit board is arranged on the transverse heat dissipation plates, a second heat conducting component is arranged between the transverse heat dissipation plates and the control circuit board, and the component to be dissipated is arranged on the control circuit board.

[0010] Optionally, the components to be cooled are a CPU component and a field effect transistor and a power inductor arranged beside the CPU component.

[0011] Optionally, the mounting frame includes a vertical heat dissipation plate, the vertical heat dissipation plate is distributed and connected to the horizontal heat dissipation plate and the heat conducting plate, and a second heat conducting component is arranged between the vertical heat dissipation plate and the heat conducting plate.

[0012] Optionally, the first heat-conducting component includes a heat-conducting sheet and a heat-conducting pipe, the heat-conducting sheet cover is arranged above the CPU component, the field effect transistor and the power inductor, and the gap between the heat-conducting sheet and the CPU component, the field effect transistor and the power inductor is filled by a second heat-conducting component.

[0013] Optionally, a memory component is disposed on the control circuit board, the memory component is connected to a transverse heat sink disposed on the top of the memory component, and a second heat conduction component is disposed between the memory component and the transverse heat sink.

[0014] Optionally, a power module is included, the power module includes a power circuit board, the power circuit board is connected to the inner wall of the heat conducting plate, and a second heat conducting component is arranged between the power circuit board and the inner wall of the heat conducting plate.

[0015] Optionally, a solid state hard disk is disposed on the control circuit board, and a second heat conduction component is disposed between the solid state hard disk and the control circuit board.

[0016] The beneficial effects of the utility model are as follows: the utility model is provided with a relatively closed box, and a accommodating space is provided in the box, and components to be dissipated are provided in the accommodating space, and a heat dissipation component is provided on one side or multiple sides of the box, and the heat dissipation component includes a heat dissipation fin group and an air flow acceleration component used in conjunction with the heat dissipation fin group. The heat dissipation fin group and the components to be dissipated are connected through a first heat conduction component. When in use, the heat dissipated by the components to be dissipated can be guided to the heat dissipation fin group by the first heat conduction component, and then the flow rate of the air around the heat dissipation fin group is accelerated by the air flow acceleration component, and the heat on the heat dissipation fin group is dissipated through the air, so as to achieve the purpose of rapid heat dissipation, prevent the temperature in the chassis from being too high, and at the same time reduce the server's requirements for the use environment, and can be used in poor environmental conditions such as outdoors and in vehicles. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the utility model will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work:

[0018] Figure 1 It is an overall axonometric schematic diagram of the utility model.

[0019] Figure 2 It is an axonometric schematic diagram of the utility model as a whole from another angle.

[0020] Figure 3 It is an axonometric schematic diagram after the cover in the utility model is disassembled.

[0021] Figure 4 It is a schematic diagram of the internal structure of the utility model.

[0022] Figure 5 It is another schematic diagram of the internal structure of the utility model.

[0023] The accompanying drawings are marked as follows:

[0024] 100. box body; 101. second air outlet;

[0025] 200, accommodation space;

[0026] 300. Components to be cooled;

[0027] 401, heat dissipation fin group; 401.1, heat conduction plate; 401.2, fin member; 402, air flow speed increasing member; 402.1, air inlet; 402.2, first air outlet; 403.1, assembly slot; 403.2, cover; 403.3, grille;

[0028] 500, first heat conducting component; 501, heat conducting sheet; 502, heat conducting pipe;

[0029] 600, mounting frame; 601, horizontal heat sink; 602, vertical heat sink;

[0030] 700, control circuit board;

[0031] 800, a second heat conducting component;

[0032] 900, a power module; 901, a power circuit board. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0035] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0037] The utility model is implemented as follows Figure 1-Figure 5As shown in, it relates to a heat dissipation structure, including a box body 100, a accommodating space 200 is provided in the box body 100, a component to be dissipated 300 is provided in the accommodating space 200, a heat dissipation component is provided on one side or multiple sides of the box body 100, the heat dissipation component includes a heat dissipation fin group 401 and an air flow acceleration member 402 used in conjunction with the heat dissipation fin group 401, the heat dissipation fin group 401 and the component to be dissipated 300 are connected through a first heat conduction member 500, further, the utility model is provided with a relatively closed box body, and the first heat conduction member 500 can guide the heat dissipated by the component to be dissipated 300 to the heat dissipation fin group 401, and then the air flow acceleration member 402 accelerates the flow rate of the air around the heat dissipation fin group 401, and the heat on the heat dissipation fin group 401 is dissipated through the air, thereby preventing the temperature in the chassis from being too high and reducing the requirements of the server on the use environment, and can be used in poor environmental conditions such as outdoors and in-vehicle.

[0038] Furthermore, the heat dissipation fin group 401 includes a heat conducting plate 401.1 and a plurality of fin members 401.2, the first heat conducting component 500 connects the heat dissipation component 300 to the heat conducting plate 401.1, the air flow acceleration member 402 includes an air inlet 402.1 and a first air outlet 402.2, the air outlet is directly opposite to the fin member 401.2, and a side wall of the box body 100 is provided with a second air outlet 101 connected to the fin member 401.2. In this embodiment, the air flow acceleration member 402 is a vortex fan, the heat conducting plate 401.1 is recessed with an assembly groove 403.1, the air flow acceleration member 402 and the fin member 401.2 are arranged in parallel in the assembly groove 403.1, and a cover 403.1 is detachably installed at the notch of the assembly groove 403.1. 3.2, the cover 403.2 is provided with a grille 403.3 for air intake from the air inlet 402.1. When in use, the air flow acceleration member 402 is started, and air enters the air flow acceleration member 402 from the air inlet 402.1 and is then blown out from the first air outlet 402.2 at an accelerated speed. At this time, the accelerated air will pass through the fin member 401.2 and bring the heat emitted by the fin member 401.2 to the second air outlet 101 for blowing out, so as to achieve the purpose of cooling. Optionally, the air flow acceleration member 402 is provided with two turbo fans with a diameter of 90 mm and a maximum air volume of 31.3. The fan supports PWM speed adjustment and can adjust the fan speed in real time according to the CPU temperature to ensure heat dissipation while reducing the speed when the CPU load is small to reduce fan noise.

[0039] See also Figure 3-Figure 5In this embodiment, a mounting frame 600 is arranged in the accommodating space 200, and the mounting frame 600 is in contact with the heat conducting plate 401.1. The mounting frame 600 includes a plurality of transverse heat dissipation plates 601 arranged in sequence from top to bottom, and a control circuit board 700 is arranged on the transverse heat dissipation plate 601. A second heat conducting component 800 is arranged between the transverse heat dissipation plate 601 and the control circuit board 700. The component to be dissipated 300 is arranged on the control circuit board 700. Optionally, the transverse heat dissipation plate 601 is a 2 mm thick heat dissipation aluminum plate, and the second heat conducting component 800 is a thermal paste and / or a thermal pad.

[0040] In this embodiment, the heat dissipation component 300 is a CPU component and a field effect transistor and a power inductor arranged beside the CPU component. During operation, the CPU component, the field effect transistor and the power inductor generate a large amount of heat.

[0041] In this embodiment, the mounting frame 600 includes a vertical heat dissipation plate 602, which is distributed and connected to the horizontal heat dissipation plate 601 and the heat conducting plate 401.1. A second heat conducting component 800 is arranged between the vertical heat dissipation plate 602 and the heat conducting plate 401.1. The vertical heat dissipation plate 602 and the heat conducting plate 401.1 are both aluminum plates.

[0042] In this embodiment, the first heat-conducting component 500 includes a heat-conducting sheet 501 and a heat-conducting pipe 502. The heat-conducting sheet 501 is covered on top of the CPU component, the field effect transistor and the power inductor. The gap between the heat-conducting sheet 501 and the CPU component, the field effect transistor and the power inductor is filled by the second heat-conducting component 800. Optionally, the heat-conducting sheet 501 and the heat-conducting pipe 502 are made of materials with high thermal conductivity efficiency. In this embodiment, the heat-conducting sheet 501 and the heat-conducting pipe 502 are made of copper.

[0043] See also Figure 3-Figure 5 In this embodiment, a memory component (not shown in the figure) is arranged on the control circuit board 700, and the memory component is connected to a horizontal heat sink 601 arranged on the top thereof, and a second heat-conducting component 800 is arranged between the memory component and the horizontal heat sink 601. Further, the memory component is installed on the control circuit board 700, and the heat of the memory component can be exported through the horizontal heat sink 601 by connecting the memory component to the horizontal heat sink 601 arranged on the top thereof, and the second heat-conducting component 800 is arranged between the memory component and the horizontal heat sink 601 to increase the heat export efficiency. A solid state hard disk (not shown in the figure) is arranged on the control circuit board 700, and a second heat-conducting component 800 is arranged between the solid state hard disk and the control circuit board 700.

[0044] In this embodiment, a power module 900 is included, and the power module 900 includes a power circuit board 901, and the power circuit board 901 is connected to the inner wall of the heat conducting plate 401.1. A second heat conducting component 800 is arranged between the power circuit board 901 and the inner wall of the heat conducting plate 401.1 so that the power module 900 can quickly conduct the heat it dissipates directly through the heat conducting plate 401.1.

[0045] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

Claims

1. A heat dissipation structure, characterized in that: The invention comprises a box (100), wherein a housing space (200) is provided in the box (100), wherein a component to be dissipated (300) is provided in the housing space (200), and a heat dissipation component is provided on one or more sides of the box (100), wherein the heat dissipation component comprises a heat dissipation fin group (401) and an air flow speed increasing member (402) used in conjunction with the heat dissipation fin group (401), and the heat dissipation fin group (401) and the component to be dissipated (300) are connected via a first heat conduction component (500).

2. A heat dissipation structure according to claim 1, characterized in that: The heat dissipation fin group (401) comprises a heat conduction plate (401.1) and a plurality of fin members (401.2), and the first heat conduction component (500) connects the component to be dissipated (300) with the heat conduction plate (401.1).

3. A heat dissipation structure according to claim 2, characterized in that: The air flow accelerating member (402) comprises an air inlet (402.1) and a first air outlet (402.2), the air outlet is directly opposite to the fin member (401.2), and a side wall of the box body (100) is provided with a second air outlet (101) connected to the fin member (401.2).

4. A heat dissipation structure according to claim 2, characterized in that: A mounting frame (600) is arranged in the accommodating space (200), the mounting frame (600) is in contact with the heat conducting plate (401.1), the mounting frame (600) comprises a plurality of transverse heat dissipation plates (601) arranged in sequence from top to bottom, a control circuit board (700) is arranged on the transverse heat dissipation plate (601), a second heat conducting component (800) is arranged between the transverse heat dissipation plate (601) and the control circuit board (700), and the component to be dissipated (300) is arranged on the control circuit board (700).

5. The heat dissipation structure according to claim 1, characterized in that: The components (300) to be cooled are a CPU component and a field effect transistor and a power inductor arranged beside the CPU component.

6. A heat dissipation structure according to claim 4, characterized in that: The mounting frame (600) comprises a vertical heat dissipation plate (602), wherein the vertical heat dissipation plate (602) is distributed and connected to the horizontal heat dissipation plate (601) and the heat conducting plate (401.1), and a second heat conducting component (800) is arranged between the vertical heat dissipation plate (602) and the heat conducting plate (401.1).

7. The heat dissipation structure according to claim 5, characterized in that: The first heat-conducting component (500) comprises a heat-conducting sheet (501) and a heat-conducting pipe (502); the heat-conducting sheet (501) is arranged to cover the CPU component, the field effect transistor and the power inductor; and the gap between the heat-conducting sheet (501) and the CPU component, the field effect transistor and the power inductor is filled by the second heat-conducting component (800).

8. The heat dissipation structure according to claim 6, characterized in that: A memory component is arranged on the control circuit board (700), the memory component is connected to a transverse heat sink (601) arranged on the top of the memory component, and a second heat conduction component (800) is arranged between the memory component and the transverse heat sink (601).

9. A heat dissipation structure according to claim 4, characterized in that: The invention comprises a power module (900), wherein the power module (900) comprises a power circuit board (901), wherein the power circuit board (901) is connected to the inner side wall of the heat conducting plate (401.1), and a second heat conducting component (800) is arranged between the power circuit board (901) and the inner side wall of the heat conducting plate (401.1).

10. The heat dissipation structure according to claim 6, characterized in that: A solid state hard disk is arranged on the control circuit board (700), and a second heat conduction component (800) is arranged between the solid state hard disk and the control circuit board (700).

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