Heat pipe stacking conduction heat dissipation module
By adopting a heat pipe stacked conductive structure and D-shaped heat pipe design in the heat dissipation module, the problems of messy structure and large space occupation in the prior art are solved, and a compact layout and efficient heat dissipation performance are achieved.
Patent Information
- Application Number
- CN202421231547.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-05-31
AI Technical Summary
The heat dissipation modules in the existing consumer electronics market have a single layer arrangement, resulting in a messy structural layout and occupying a lot of space, making it difficult to meet the needs of miniaturized heat dissipation module structure, affecting the heat dissipation performance.
The heat pipe stacking conduction and heat dissipation module is adopted, and the stacked upper and lower heat conduction pipes are arranged between the first fin group, the second fin group and the third fin group, and the close stacking of the heat conduction pipes is achieved by using the placement frame and the placement groove. Combining D-shaped structure and thermal paste to improve heat conduction efficiency.
It achieves a compact structure and reasonable layout, improves space utilization and heat dissipation efficiency, meets the needs of miniaturized heat dissipation module structure, and significantly improves heat dissipation performance.
Smart Images
Figure CN222337590U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, and in particular to a heat pipe stacking conduction heat dissipation module. Background Art
[0002] With the development and maturity of the electronic technology industry, more and more users have an increasing demand for high-power computers. Coupled with the continuous expansion of software and hardware and the increasing space occupied, while pursuing high-power computers, according to the law of conservation of energy in physics, this will cause electronic components to release more heat. However, the heat pipes of the heat dissipation modules on the current consumer electronics market are arranged in a single layer. In order to discharge the heat released by the electronic components in a timely manner, more heat pipes are needed, which will lead to a messy structural layout of the heat dissipation module, which requires more space and is difficult to meet the needs of miniaturization of the heat dissipation module structure, affecting the heat dissipation performance. Utility Model Content
[0003] The purpose of the utility model is to provide a heat pipe stacking conduction heat dissipation module in view of the deficiencies in the prior art, which has a compact structure, a reasonable layout, high space utilization, meets the demand for miniaturization of the heat dissipation module structure, and improves the heat dissipation efficiency and heat dissipation performance.
[0004] To achieve the above-mentioned purpose, the utility model provides a heat pipe stacking conduction heat dissipation module, comprising a first fin group, a second fin group arranged opposite to the first fin group, a third fin group arranged between the first fin group and the second fin group, and a heat conductive pipe group arranged between the first fin group, the second fin group and the third fin group, the heat conductive pipe group comprising an upper heat conductive pipe and a lower heat conductive pipe stacked with the upper heat conductive pipe, the third fin group is provided with a placement frame, the placement frame is provided with a placement groove, the upper heat conductive pipe stops and contacts the lower heat conductive pipe, so that the outer wall of the lower heat conductive pipe contacts and is attached to the inner wall of the placement groove.
[0005] Preferably, the upper heat-conducting pipe includes a first contact plane and a first curved surface arranged on the first contact plane, the first contact plane and the first curved surface are arranged to form a D-shaped structure, the first curved surface is provided with thermal conductive paste, and the lower heat-conducting pipe includes a second contact plane and a second curved surface arranged on the second contact plane, the second contact plane and the second curved surface are arranged to form a D-shaped structure, and the outer wall of the first contact plane is arranged in close contact with the outer wall of the second contact plane.
[0006] Preferably, a plurality of the upper-layer heat-conducting tubes are arranged in parallel, and two adjacent upper-layer heat-conducting tubes are arranged in close proximity, and a plurality of the lower-layer heat-conducting tubes are arranged in parallel, and two adjacent lower-layer heat-conducting tubes are arranged in close proximity.
[0007] Preferably, the placement frame is provided with a mounting hole, the mounting hole is provided with a mounting stud, and the third fin group is provided with a connecting hole, so that the mounting stud passes through the mounting hole and is connected to the connecting hole.
[0008] Preferably, in the rack, the first fin group, the second fin group and the third fin group are arranged at intervals along the length direction of the rack, and both ends of the rack are provided with assembly holes.
[0009] The utility model has the following beneficial effects: compact structure and reasonable layout, high space utilization, meeting the demand for miniaturization of the heat dissipation module structure, and improving heat dissipation efficiency and heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is a structural schematic diagram of the utility model.
[0011] Figure 2 It is a schematic diagram of the exploded structure of the utility model.
[0012] Figure 3 It is a schematic diagram of the structure between the third fin group and the heat pipe group of the utility model.
[0013] Reference numerals include:
[0014] 1——First fin group 2——Second fin group
[0015] 3——third fin group 31——placing frame 32——placing slot
[0016] 33 - Mounting hole 34 - Mounting stud 35 - Connection hole
[0017] 4——heat pipe group 41——upper heat pipe 411——first contact plane
[0018] 412——First curved surface
[0019] 42——lower layer heat conducting pipe 421——second contact plane 422——second arc surface
[0020] 5. Thermal paste
[0021] 6——Frame 61——Assembly hole. DETAILED DESCRIPTION
[0022] The utility model is described in detail below with reference to the accompanying drawings.
[0023] like Figures 1 to 3As shown, a heat pipe stacking conduction heat dissipation module of the utility model includes a first fin group 1, a second fin group 2 arranged opposite to the first fin group 1, a third fin group 3 arranged between the first fin group 1 and the second fin group 2, and a heat conduction pipe group 4 arranged between the first fin group 1, the second fin group 2, and the third fin group 3. The heat conduction pipe group 4 includes an upper heat conduction pipe 41 and a lower heat conduction pipe 42 stacked with the upper heat conduction pipe 41. The third fin group 3 is provided with a placement frame 31. The placement frame 31 is provided with a placement groove 32. The upper heat conduction pipe 41 blocks and resists the lower heat conduction pipe 42, so that the outer wall of the lower heat conduction pipe 42 resists and sticks to the inner wall of the placement groove 32.
[0024] The first fin group 1 and the second fin group 2 are arranged opposite to each other, and the third fin group 3 is located between the first fin group 1 and the second fin group 2, wherein the outer wall of the upper heat-conducting tube 41 is closely attached to the inner wall of the placement frame 31, and the outer wall of the lower heat-conducting tube 42 is closely attached to the inner wall of the placement groove 32, so that the upper heat-conducting tube 41 and the lower heat-conducting tube 42 are neatly arranged in the placement frame 31 in an up-and-down manner, with a compact structure and ingenious design. Since both the upper heat-conducting tube 41 and the lower heat-conducting tube 42 are superconducting heat carriers, the upper heat-conducting tube 41 can transfer heat The heat is quickly transferred to the lower heat pipe 42, and then the heat is quickly transferred to the third fin group 3 for discharge through the lower heat pipe 42. At the same time, since the upper heat pipe 41 and the lower heat pipe 42 are arranged between the first fin group 1, the second fin group 2, and the third fin group 3, the heat is transferred to the first fin group 1 and the second fin group 2 for discharge through the upper heat pipe 41 and the lower heat pipe 42. With the help of the first fin group 1, the second fin group 2, and the third fin group 3, the heat is quickly and comprehensively discharged from multiple directions, accelerating the heat dissipation and achieving high heat dissipation efficiency. The utility model has a compact structure and a reasonable layout, with high space utilization, meets the needs of miniaturization of the heat dissipation module structure, and improves heat dissipation efficiency and heat dissipation performance.
[0025] The upper heat-conducting pipe 41 of the present embodiment includes a first contact plane 411 and a first curved surface 412 arranged on the first contact plane 411, the first contact plane 411 and the first curved surface 412 are arranged to form a D-shaped structure, the first curved surface 412 is provided with a thermal conductive paste 5, the lower heat-conducting pipe 42 includes a second contact plane 421 and a second curved surface 422 arranged on the second contact plane 421, the second contact plane 421 and the second curved surface 422 are arranged to form a D-shaped structure, and the outer wall of the first contact plane 411 is arranged in close contact with the outer wall of the second contact plane 421. Specifically, the first contact plane 411 and the first curved surface 412 are arranged to form an upper heat-conducting pipe 41 of a D-shaped structure, and the second contact plane 421 and the second curved surface 422 are arranged to form a lower heat-conducting pipe 42 of a D-shaped structure, and the outer wall of the first contact plane 411 and the outer wall of the second contact plane 421 are arranged to be fitted up and down, and the fitting contact area is large, so that the second curved surface 422 is pressed against and fitted in the placement groove 32, thereby better fixing the position of the lower heat-conducting pipe 42 in the placement groove 32, and also making the first curved surface 412 exposed outside the placement frame 31 and fitted with the thermal paste 5, the upper heat-conducting pipe 41 quickly conducts and discharges the heat through the first curved surface 412 with the help of the thermal paste 5, and the heat dissipation speed is fast, the upper heat-conducting pipe 41 and the lower heat-conducting pipe 42 are accommodated in the placement frame 31, and the accessories are welded into a heat dissipation module through solder paste welding, and then flattened to form a D-shaped structure through a post-process, and a plane in contact with the chip is formed.
[0026] In this embodiment, a plurality of upper heat-conducting tubes 41 are arranged in parallel, and two adjacent upper heat-conducting tubes 41 are arranged in close contact with each other. A plurality of lower heat-conducting tubes 42 are arranged in parallel, and two adjacent lower heat-conducting tubes 42 are arranged in close contact with each other. Specifically, as a preferred embodiment, four upper heat-conducting tubes 41 are arranged, and the four upper heat-conducting tubes 41 are closely contacted with each other. Three lower heat-conducting tubes 42 are arranged, and the three lower heat-conducting tubes 42 are closely contacted with each other. The structure arrangement is compact, occupies a small space, and can conduct and discharge more heat.
[0027] The placement frame 31 of this embodiment is provided with a mounting hole 33, and the mounting hole 33 is provided with a mounting stud 34, and the third fin group 3 is provided with a connecting hole 35, so that the mounting stud 34 passes through the mounting hole 33 and is connected to the connecting hole 35. Specifically, as a preference, four mounting holes 33 are provided, and the four mounting holes 33 are respectively located at the four corners of the placement frame 31, four mounting studs 34 are provided, and the four mounting studs 34 are respectively connected to the four mounting holes 33, and four connecting holes 35 are provided, and the four connecting holes 35 are respectively located at the four corners of the third fin group 3, and the mounting studs 34 pass through the mounting holes 33 and are connected to the connecting holes 35, so that the placement frame 31 is stably installed on the third fin group 3, and the connection is stable and firm.
[0028] The present embodiment further includes a frame 6, wherein the first fin group 1, the second fin group 2, and the third fin group 3 are arranged at intervals along the length direction of the frame 6, and both ends of the frame 6 are provided with assembly holes 61. Specifically, the first fin group 1, the second fin group 2, and the third fin group 3 are arranged at intervals along the length direction of the frame 6, and external screws are passed through the assembly holes 61, so that the frame 6 is installed and fixed in an appropriate working position, and the installation is simple and convenient.
[0029] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.
Claims
1. A heat pipe stacking conduction heat dissipation module, characterized in that: The heat conducting tube comprises a first fin group, a second fin group arranged opposite to the first fin group, a third fin group arranged between the first fin group and the second fin group, and a heat conducting tube group arranged between the first fin group, the second fin group and the third fin group. The heat conducting tube group comprises an upper heat conducting tube and a lower heat conducting tube stacked with the upper heat conducting tube. The third fin group is provided with a placement frame, and the placement frame is provided with a placement groove. The upper heat conducting tube blocks and contacts the lower heat conducting tube, so that the outer wall of the lower heat conducting tube contacts and is attached to the inner wall of the placement groove.
2. The heat pipe stacking conduction heat dissipation module according to claim 1, characterized in that: The upper heat-conducting pipe includes a first contact plane and a first curved surface arranged on the first contact plane, the first contact plane and the first curved surface are arranged to form a D-shaped structure, the first curved surface is provided with thermal conductive paste, the lower heat-conducting pipe includes a second contact plane and a second curved surface arranged on the second contact plane, the second contact plane and the second curved surface are arranged to form a D-shaped structure, and the outer wall of the first contact plane is arranged in contact with the outer wall of the second contact plane.
3. The heat pipe stacking conduction heat dissipation module according to claim 2, characterized in that: A plurality of upper-layer heat-conducting pipes are arranged in parallel, and two adjacent upper-layer heat-conducting pipes are arranged in close contact with each other. A plurality of lower-layer heat-conducting pipes are arranged in parallel, and two adjacent lower-layer heat-conducting pipes are arranged in close contact with each other.
4. The heat pipe stacking conduction heat dissipation module according to claim 1, characterized in that: The placement frame is provided with a mounting hole, the mounting hole is provided with a mounting stud, and the third fin group is provided with a connecting hole so that the mounting stud passes through the mounting hole and is connected to the connecting hole.
5. The heat pipe stacking conduction heat dissipation module according to claim 1, characterized in that: It also includes a frame, wherein the first fin group, the second fin group and the third fin group are arranged at intervals along the length direction of the frame, and both ends of the frame are provided with assembly holes.