Silicon wafer degumming and thick wafer removing device

Abstract

The utility model discloses a silicon wafer degumming and thick wafer removing device which comprises a machine frame, a crystal support placing frame is fixedly arranged in the machine frame, crystal support pressing structures are arranged at the two ends of the crystal support placing frame, the machine frame is provided with an electric drive linear moving platform, and a cutting knife rotating power device is arranged on the electric drive linear moving platform. And the cutter rotating power device is in driving connection with the thick-sheet cutter. According to the utility model, a crystal block is placed on the crystal support placing rack and is pressed and fixed by the crystal support pressing structure, the cutter rotating power device is started to drive the thick-sheet cutter to rotate to slice the crystal block, and the cutter moving power device drives the cutter rotating power device and the thick-sheet cutter to move to different positions, so that the crystal block is sliced, the automation degree is high, and the production efficiency is high. Manual operation is replaced, the thick sheet removing efficiency is higher, and safety is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slices and semiconductor processing equipment, in particular to a silicon slice degumming and thickening device. Background Art

[0002] The thick slice removal mechanism is used to remove the thick slices, fragments and broken pieces left after the silicon wafer is debonded. The mechanism is installed at the end of the debonding machine.

[0003] The existing technology is to manually remove the remaining thick slices, fragments, and broken pieces after the silicon wafers are not completely debonded, and remove them manually or by knocking with tools. This is inefficient and has high safety risks. At the same time, there is an external force impact on the handling actuator, and the removal effect of thick slices is poor, leaving slice residues.

[0004] Therefore, we propose a device for degumming and removing thick slices of silicon wafers. The device makes up for the non-automatic working condition of this process. After the silicon wafers are degummed, it can realize the functions of positioning, pressing, automatic cutting of thick slices, and automatic collection of thick slices for the crystal tray, which is far ahead of the existing manual technology. Utility Model Content

[0005] The utility model aims to provide a silicon wafer debonding and thickening device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical solution: a silicon wafer debonding and thickening device, comprising: a frame, a crystal support rack is fixedly arranged in the frame, and crystal support pressing structures are arranged at both ends of the crystal support rack;

[0007] The frame is provided with an electric-driven linear moving platform, on which a cutting blade rotating power device is provided, and the cutting blade rotating power device drives the thick-slice cutting blade.

[0008] Preferably, the electrically driven linear moving platform comprises a screw rod, a screw sleeve is threadedly connected to the screw rod, and the screw sleeve is rotatably connected to the moving platform via a bearing.

[0009] Preferably, a cutting blade rotating power device and a cutting blade moving power device are fixedly installed on the mobile platform.

[0010] Preferably, the cutting tool moving power device comprises a servo motor and a reducer, and the reducer drives the connecting screw sleeve.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The crystal block is placed on the crystal support rack and fixed by the crystal support clamping structure. The cutting knife rotating power device is started to drive the thick slice cutting knife to rotate and slice the crystal block. The cutting knife moving power device drives the cutting knife rotating power device and the thick slice cutting knife to move to different positions to slice the crystal block. It has a high degree of automation and replaces manual operation. It is more efficient and safer to remove thick slices. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the utility model;

[0014] Figure 2 It is a top view of the utility model;

[0015] Figure 3 It is a front view of the utility model.

[0016] In the figure: 1. frame; 2. screw rod; 3. cutting blade rotating power device; 4. screw sleeve; 5. crystal support placement rack; 6. thick slice cutting blade; 7. crystal support clamping structure; 8. cutting blade moving power device. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-3 The utility model provides a technical solution: a silicon wafer debonding and thickening device, comprising: a frame 1, a crystal support placement frame 5 is fixedly arranged in the frame 1, and crystal support pressing structures 7 are arranged at both ends of the crystal support placement frame 5;

[0019] The crystal tray placement frame 5 is used to place the crystal tray, and the crystal tray is fixed by the crystal tray pressing structure 7;

[0020] The frame 1 is fixedly provided with a screw rod 2 on both sides of the front and rear, the screw rod 2 is threadedly connected with a screw sleeve 4, the screw sleeve 4 is rotatably connected to the mobile platform through a bearing, and the cutting blade rotating power device 3 and the cutting blade moving power device 8 are fixedly installed on the mobile platform;

[0021] The cutting blade rotation power device 3 drives the connected thick slice cutting blade 6, so that the thick slice cutting blade 6 rotates to cut the crystal block to form slices of different thicknesses;

[0022] The cutting blade moving power device 8 comprises a servo motor and a reducer, the reducer drives the connection screw sleeve 4 to rotate the screw sleeve 4, and then moves on the screw rod 2 to realize the movement of the mobile platform, driving the cutting blade rotating power device 3 and the thick slice cutting blade 6 to move to different positions, and the thick slice cutting blade 6 slices the crystal block through the rotation driving force provided by the cutting blade rotating power device 3;

[0023] The wafer tray is placed on the upper surface of the wafer tray placement rack 5 by the robot, and the wafer tray is positioned around by the positioning structure arranged on the wafer tray placement rack 5. After placement, the wafer tray pressing structure 7 presses the wafer tray, and after pressing, the thick slice cutting knife 6 starts to work.

[0024] Working principle: Place the crystal block on the crystal support frame 5 and position it, and then press and fix it with the crystal support pressing structure 7;

[0025] The cutting blade rotation power device 3 is started to drive the thick slice cutting blade 6 to rotate and slice the crystal block;

[0026] The cutting knife moving power device 8 drives the cutting knife rotating power device 3 and the thick slice cutting knife 6 to move to different positions, so as to cut the thick slices with high automation and higher slicing accuracy.

[0027] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer debonding and thickening device, comprising: The frame (1) is characterized in that: a crystal tray placement frame (5) is fixedly arranged inside the frame (1), and crystal tray clamping structures (7) are arranged at both ends of the crystal tray placement frame (5); The frame (1) is provided with an electrically driven linear moving platform, on which a cutting blade rotating power device (3) is provided, and the cutting blade rotating power device (3) drives a thick slice cutting blade (6) to be connected.

2. The device for debonding and thickening silicon wafers according to claim 1, characterized in that: The electrically driven linear moving platform comprises a screw rod (2), the screw rod (2) is threadedly connected to a screw sleeve (4), and the screw sleeve (4) is rotatably connected to the moving platform via a bearing.

3. The silicon wafer debonding and thickening device according to claim 2, characterized in that: A cutting blade rotating power device (3) and a cutting blade moving power device (8) are fixedly installed on the mobile platform.

4. The device for debonding and thickening silicon wafers according to claim 3, characterized in that: The cutting blade moving power device (8) comprises a servo motor and a reducer, and the reducer drives the connecting screw sleeve (4).

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