Chip bearing disc

Abstract

The utility model relates to the technical field of semiconductor chip bearing, in particular to a chip bearing disc. Through the meticulous design of the bearing unit and the cover body unit, the chip bearing disc realizes the omnibearing and sectional protection of the chip with the metal sheet extending from the middle part of the side surface of the body. According to the design, chip protection in a multi-layer stacking storage scene is fully considered. And when the two covered chip bearing plates are stacked, a third accommodating space for accommodating chip metal sheets is particularly reserved between the two covered chip bearing plates. According to the innovative design, direct contact between the metal sheet and the bearing disc is fundamentally avoided, the risk of chip damage possibly caused by interlayer extrusion is greatly reduced, and comprehensive consideration on protection of chips of special structures is embodied. Therefore, accurate adaptation of the bearing disc and the chip is ensured, the reliability of the loading process is improved, and potential safety hazards caused by mismatching of the bearing disc and the chip structure are remarkably reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip carrying technology, and in particular to a chip carrying tray. Background Art

[0002] The chip carrier structure is a plastic product that is mainly used in the chip loading, transportation and packaging test process. Its main purpose is to prevent the chip from being physically damaged during these steps, while improving the convenience of automated testing and installation.

[0003] For example, publication number CN213042892U discloses a chip tray structure, comprising a base, a plurality of fixed protrusions extending upward from one side of the base, and a plurality of surrounding walls extending downward from the other side of the base, wherein the fixed protrusions have a lower contact surface contacting a chip, and the surrounding walls surround at least a portion of the contour of the chip, wherein the fixed protrusions of one wafer tray structure are engaged with the surrounding walls of another wafer tray structure, and the other side of the base has a plurality of inclined upper contact surfaces adjacent to the surrounding walls. The contact position between the chip and the tray can be lowered, and the generation of static electricity when the tray is transported can be reduced.

[0004] Although the chip carrier structure has many practical functions, it has limitations in specific application scenarios: when a metal sheet extends from the middle of the side of the chip body, the carrier structure cannot be effectively compatible. When such a special chip uses the carrier, the metal sheet may be scratched or damaged due to contact, friction or uneven force with the carrier structure. Utility Model Content

[0005] The purpose of the present application is to provide a new chip carrier suitable for a chip having a metal sheet extending from the middle of the side of the body, which is specifically achieved through the following technical solutions:

[0006] A chip carrier tray comprises: a base, one side of which is provided with a carrier unit for carrying a chip with a metal foil extending from the middle part of the side surface of the body, and the other side of the base is provided with a cover unit corresponding to the carrier unit; the carrier unit comprises a first frame extending upward from one side of the base, and a first limiting retaining wall arranged at the outer edge of the first frame; the first frame and the first limiting retaining wall form a first accommodating space for accommodating a first part below the metal foil of the chip; the cover unit comprises a second frame extending downward from the other side of the base, and a second limiting retaining wall arranged at the outer edge of the second frame; the second frame and the second limiting retaining wall form a second accommodating space for accommodating a second part above the metal foil of the chip; when the chip is stored in two chip carrier trays that are covered, a third accommodating space for accommodating the metal foil of the chip is arranged between the two covered chip carrier trays.

[0007] Preferably, the first limiting retaining wall includes a first inclined surface extending outward from the end surface of the first frame body, and a second inclined surface connected to the first inclined surface and having an outward expansion angle greater than the outward expansion angle of the first inclined surface.

[0008] Preferably, the second limiting retaining wall includes a third inclined surface extending outward from the end surface of the second frame body, and a fourth inclined surface connected to the third inclined surface and having an outward expansion angle greater than the outward expansion angle of the third inclined surface.

[0009] Preferably, the first limiting retaining wall is provided with a first outer inclined surface on a side away from the first frame body and extending upward from one side of the base body.

[0010] Preferably, the second limiting retaining wall is provided with a second outer inclined surface on a side away from the second frame body and extending downward from one side of the base body.

[0011] Preferably, the chip carrier plate further comprises a through hole penetrating the carrier unit and the cover unit.

[0012] Preferably, the second limiting retaining wall and the first limiting retaining wall are distributed in a complementary structure.

[0013] Preferably, the first inclined surface is connected to the outer periphery of the first part of the chip.

[0014] Preferably, the third inclined surface is connected to the outer periphery of the second part of the chip.

[0015] Preferably, the first frame end surface is provided with a supporting surface for connecting with the edge of the lower surface of the first part of the chip; the second frame end surface is provided with a connecting surface for connecting with the edge of the upper surface of the second part of the chip.

[0016] Compared with the prior art, this application has the following beneficial effects:

[0017] Through the careful design of the bearing unit and the cover unit, the chip bearing plate of the present application realizes all-round and segmented protection for the chip with the metal sheet extending from the middle part of the side of the body. The first frame extending upward from the bearing unit and the first limiting retaining wall on the outer edge jointly construct a first accommodation space, which is specifically used to carry the main part (first part) below the metal sheet of the chip; while the second frame extending downward from the cover unit and the second limiting retaining wall on the outer edge form a second accommodation space, which accurately matches and supports the main part (second part) above the metal sheet of the chip. This segmented structure ensures that both the main body of the chip and the metal sheet can be fully supported and limited during transportation, storage or processing, effectively preventing potential damage such as shaking and collision caused by external disturbances.

[0018] More importantly, this design also fully considers chip protection in multi-layer stacking storage scenarios. When the two covered chip carriers are stacked, a third storage space is specially reserved for accommodating the chip metal sheet. This innovative design fundamentally avoids direct contact between the metal sheet and the carrier, greatly reduces the risk of chip damage caused by interlayer compression, and reflects the comprehensive consideration of chip protection with special structures. In this way, it not only ensures the precise adaptation of the carrier and the chip, improves the reliability of the loading process, but also significantly reduces the potential safety hazards caused by the mismatch between the carrier and the chip structure.

[0019] In summary, the chip carrier of the present application successfully achieves all-round protection for the metal foil chip extending from the middle part of the side of the main body by virtue of its segmented protection structure, precise space allocation and careful consideration of stacking storage scenarios, ensuring the safety and integrity of the chip under various operating conditions, while improving the compatibility and work efficiency of the overall loading system. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to clearly illustrate the embodiments, the following is a brief introduction to the accompanying drawings:

[0021] Figure 1 A top view of a chip carrier according to an embodiment of the present application;

[0022] Figure 2 A bottom view of the chip carrier of the embodiment of the present application;

[0023] Figure 3 , 4 It is a schematic diagram of the structure of the chip carrier at different angles;

[0024] Figure 5 is a top view of the chip;

[0025] Figure 6 , 7 The side views of the chip at different angles;

[0026] Figure 8 , 9 The assembled cross-sectional views of the laminated chip carrier of the embodiment of the present application at different angles;

[0027] Figure numerals: 100, base, 210, first frame, 220, first limiting retaining wall, 221, first inclined plane, 222, second inclined plane, 223, first outer inclined plane, 310, second frame, 320, second limiting retaining wall, 321, third inclined plane, 322, fourth inclined plane, 323, second outer inclined plane, 400, through hole. DETAILED DESCRIPTION

[0028] The utility model is further described below in conjunction with the drawings and specific embodiments of the specification. A person of ordinary skill in the art will be able to implement the utility model based on these descriptions. In addition, the embodiments of the utility model involved in the following description are usually only embodiments of a part of the utility model, rather than all of the embodiments. Therefore, based on the embodiments in the utility model, all other embodiments obtained by a person of ordinary skill in the art without making creative work should fall within the scope of protection of the utility model. Example

[0029] See also Figures 1 to 9 , a chip carrier disclosed in this embodiment includes:

[0030] A substrate 100, wherein one side of the substrate 100 is provided with a carrying unit for carrying a chip, and the other side of the substrate is provided with a cover unit corresponding to the carrying unit; the carrying unit includes a first frame 210 extending upward from one side of the substrate, and a first limiting retaining wall 220 arranged at the outer edge of the first frame 210; the first frame 210 and the first limiting retaining wall 220 form a first accommodating space for accommodating a first part below the metal foil of the chip; the cover unit includes a second frame 310 extending downward from the other side of the substrate, and a second limiting retaining wall 320 arranged at the outer edge of the second frame 310; the second frame 310 and the second limiting retaining wall 320 form a second accommodating space for accommodating a second part above the metal foil of the chip; when the chip is stored in two chip carrier trays that are covered, a third accommodating space for accommodating the metal foil of the chip is arranged between the two chip carrier trays that are covered. This segmented structure ensures that both the chip body and the metal sheet can be fully supported and limited during transportation, storage or processing, so that the bearing unit, cover unit and chip together form a stable bearing structure, effectively preventing potential damage such as shaking and collision caused by external disturbances.

[0031] The first limiting retaining wall 220 includes a first inclined surface 221 extending outward from the end surface of the first frame body 210, and a second inclined surface 222 connected to the first inclined surface 221 and having an outward expansion angle greater than the outward expansion angle of the first inclined surface 221.

[0032] This design not only significantly improves the demoulding performance of the carrier plate in the process, but also improves production efficiency in many aspects, reduces the defective rate, and demonstrates excellent process adaptability and economic practicality.

[0033] The second limiting retaining wall 320 includes a third inclined surface 321 extending outward from the end surface of the second frame 310, and a fourth inclined surface 322 connected to the third inclined surface 321 and having an outward expansion angle greater than the outward expansion angle of the third inclined surface 321. This embodiment facilitates the guidance and positioning of the chip when the carrier plate is flipped through this design. Specifically, when the carrier plate is flipped, the chip may have a certain sliding tendency under the action of gravity. The continuous inclined surface design of the third inclined surface 321 and the fourth inclined surface 322 provides a preset motion trajectory for the chip, guiding it to slide along the inclined surface to a predetermined position. This guiding effect helps the chip maintain a stable motion direction during the flipping process, avoiding inaccurate positioning or impact damage caused by accidental offset.

[0034] The first limiting retaining wall 220 is provided with a first outer inclined surface 223 extending upward from the base 100 on the side away from the first frame 210. The second limiting retaining wall 320 is provided with a second outer inclined surface 323 extending downward from the base 100 on the side away from the second frame 310. To prevent vacuum adsorption when the carrier tray is stacked, so that the chip is adsorbed and then falls and causes damage. The chip carrier tray also includes a through hole 400 that penetrates the carrier unit and the cover unit.

[0035] In principle, as long as the second limiting retaining wall 320 can limit and fix the side surface of the second part above the metal sheet of the chip, and the first limiting retaining wall 220 can limit and fix the side surface of the first part below the metal sheet of the chip, and form a third accommodating space, it can realize the support of the new type of chip with a metal sheet extending from the middle of the side of the body of this embodiment. However, in order to reduce the weight of the chip carrier plate itself and reduce its pressure on the chip, this embodiment reduces the material of the second limiting retaining wall 320 and the first limiting retaining wall 220, and the second limiting retaining wall 320 and the first limiting retaining wall 220 are distributed in a complementary structure; the complementary structure distribution can provide sufficient support and guarantee for the first and second parts of the chip.

[0036] When in use, when the first part of the chip is placed in the first accommodating space, the first inclined surface 221 is connected to the outer periphery of the first part of the chip; the supporting surface of the first frame 210 is connected to the edge of the lower surface of the first part of the chip; then, another carrier plate is stacked on the original carrier plate, and at this time, the third inclined surface 321 of the other carrier plate is connected to the outer periphery of the second part of the chip; the connecting surface of the second frame 310 is connected to the edge of the upper surface of the second part of the chip.

Claims

1. A chip carrier, characterized in that: include: A base body (100), wherein one side of the base body (100) is provided with a carrying unit for carrying a chip having a metal sheet extending from the middle of a side surface of the body, and the other side of the base body is provided with a cover unit corresponding to the carrying unit; The bearing unit comprises a first frame (210) extending upward from one side of the base, and a first limiting retaining wall (220) arranged at the outer edge of the first frame (210); the first frame (210) and the first limiting retaining wall (220) form a first accommodating space for accommodating a first portion below the chip metal sheet; The cover unit comprises a second frame (310) extending downward from the other side of the base, and a second limiting retaining wall (320) arranged at the outer edge of the second frame (310); the second frame (310) and the second limiting retaining wall (320) form a second accommodating space for accommodating a second portion above the chip metal sheet; When the chip is stored in the two covered chip carriers, a third accommodating space for accommodating the chip metal sheet is arranged between the two covered chip carriers.

2. A chip carrier according to claim 1, characterized in that: The first position-limiting retaining wall (220) comprises a first inclined surface (221) extending outwardly from the end surface of the first frame body (210), and a second inclined surface (222) connected to the first inclined surface (221) and having an outward expansion angle greater than that of the first inclined surface (221).

3. A chip carrier according to claim 1 or 2, characterized in that: The second position-limiting retaining wall (320) comprises a third inclined surface (321) extending outwardly from the end surface of the second frame body (310), and a fourth inclined surface (322) connected to the third inclined surface (321) and having an outward expansion angle greater than the outward expansion angle of the third inclined surface (321).

4. The chip carrier according to claim 1, characterized in that: A first outer inclined surface (223) extending upwards from one side of the base body (100) is provided on the side of the first limiting retaining wall (220) away from the first frame body (210).

5. A chip carrier according to claim 1 or 4, characterized in that: The second position-limiting retaining wall (320) is provided with a second outer inclined surface (323) on the side away from the second frame body (310) and extending downward from one side of the base body (100).

6. The chip carrier according to claim 1, characterized in that: The chip carrier plate further comprises a through hole (400) penetrating the carrier unit and the cover unit.

7. The chip carrier according to claim 1, characterized in that: The second limiting retaining wall (320) and the first limiting retaining wall (220) are distributed in a complementary structure.

8. The chip carrier according to claim 2, characterized in that: The first inclined surface (221) is connected to the outer periphery of the first part of the chip.

9. The chip carrier according to claim 3, characterized in that: The third inclined surface (321) is connected to the outer periphery of the second part of the chip.

10. The chip carrier according to claim 1, characterized in that: The end surface of the first frame body (210) is provided with a supporting surface for connecting with the edge of the lower surface of the first part of the chip; the end surface of the second frame body (310) is provided with a connecting surface for connecting with the edge of the upper surface of the second part of the chip.

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