Sucker rotating assembly and wafer pre-alignment control device

Abstract

The utility model relates to the technical field of semiconductor equipment, and provides a sucker rotating assembly and a wafer pre-alignment control device. The sucker rotating assembly comprises a sucker assembly and a driving part, and the sucker assembly is suitable for adsorbing a wafer; the driving part is fixedly connected with the sucker assembly and is suitable for driving the sucker assembly to rotate; the driving part comprises a frame body and a driving motor assembly, and the frame body is provided with a first through hole; the driving motor assembly is fixedly connected to the frame body and provided with an output shaft, and the output shaft penetrates through the first through hole to be in sealed connection with the suction cup assembly; a sealed space is formed between the outer side wall of the output shaft and the inner side wall of the first through hole, the output shaft is provided with an air outlet channel, and the frame body is provided with an air inlet channel; the air inlet channel, the sealed space, the air outlet channel and the sucker assembly are sequentially communicated. The output shaft is connected with the frame body in a sealed mode, in the rotating process of the output shaft, a sealing device does not need to be additionally arranged in a sleeved mode, the height of the suction cup rotating assembly in the axial direction of the output shaft is effectively reduced, and then miniaturization design is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a suction cup rotating component and a wafer pre-alignment control device. Background Art

[0002] In the prior art, wafer pre-alignment control devices are generally mechanically clamped or vacuum adsorption types. For vacuum adsorption type wafer pre-alignment control devices, a suction cup rotating assembly is usually provided to adsorb and drive the wafer to rotate. A sealing device needs to be mounted on the motor shaft connected to the suction cup to prevent vacuum gas from leaking during the rotation of the motor shaft. The sealing device is too large along the axial direction of the motor, and there is a difficulty in miniaturizing the suction cup rotating assembly, which in turn leads to the problem that the wafer pre-alignment control device is difficult to miniaturize and difficult to use under limited space. Utility Model Content

[0003] The utility model provides a suction cup rotating assembly, which is used to solve the defect that the suction cup rotating assembly in the prior art is too large and cannot be used in a situation where space is limited, and realizes a miniaturized design of the suction cup rotating assembly.

[0004] The utility model provides a suction cup rotating assembly, comprising:

[0005] A suction cup assembly, wherein the suction cup assembly is suitable for sucking the wafer;

[0006] A driving part, the driving part is fixedly connected to the suction cup assembly and is suitable for driving the suction cup assembly to rotate;

[0007] The driving part comprises a frame and a driving motor assembly, wherein the frame is provided with a first through hole; the driving motor assembly is fixedly connected to the frame, and the driving motor assembly is provided with an output shaft, and the output shaft passes through the first through hole and is sealed and connected to the suction cup assembly;

[0008] A sealed space is provided between the outer wall of the output shaft and the inner wall of the first through hole, the output shaft is provided with an air outlet channel, and the frame is provided with an air inlet channel; the air inlet channel, the sealed space, the air outlet channel and the suction cup assembly are connected in sequence.

[0009] According to an embodiment provided by the utility model, a first seal and a second seal are sequentially provided between the output shaft and the frame along the axial direction of the output shaft from the frame toward the suction cup assembly, and the output shaft, the frame, the first seal and the second seal surround and form the sealed space.

[0010] According to an embodiment provided by the utility model, the output shaft is provided with a first annular groove, a second annular groove and a third annular groove in sequence along its axial direction pointing from the frame body to the suction cup assembly, a first seal is provided in the first annular groove, a second seal is provided in the second annular groove, and the third annular groove is arranged corresponding to the suction cup assembly and is provided with a third seal.

[0011] According to an embodiment provided by the utility model, the drive motor assembly includes:

[0012] A driving motor having a driving shaft;

[0013] A flange, the flange comprising a connecting portion and the output shaft, the output shaft being vertically disposed on a first side of the connecting portion;

[0014] A reducer, wherein the input end of the reducer is connected to the driving shaft of the driving motor, the output end of the reducer is connected to the second side of the connecting portion, and the first side is arranged opposite to the second side.

[0015] According to an embodiment provided by the utility model, the frame includes:

[0016] A sealing end cover, wherein the sealing end cover is provided with the first through hole and the air inlet passage, and the sealing end cover comprises a first shaft section and a second shaft section, wherein the diameter of the first shaft section is smaller than that of the second shaft section;

[0017] The base is provided with a connecting hole, suitable for being matched and connected with the first shaft section.

[0018] According to an embodiment provided by the utility model, the suction cup assembly includes:

[0019] The adsorption tray comprises a soft adsorption portion and a hard adsorption portion, wherein the soft adsorption portion is arranged around the outer circumference of the hard adsorption portion.

[0020] According to an embodiment provided by the utility model, the hard adsorption portion is provided with at least two protrusions, and the at least two protrusions are symmetrically arranged around the rotation axis of the suction cup assembly.

[0021] According to an embodiment provided by the utility model, the distances between adjacent protrusions are the same, which is suitable for evenly dividing the space between the hard adsorption part and the wafer.

[0022] The utility model also provides a wafer pre-alignment control device, comprising:

[0023] The suction cup rotating assembly as described above;

[0024] A centering component, which is disposed on one side of the wafer and is suitable for calculating the center offset distance of the wafer;

[0025] A moving component, adapted to drive the wafer to move;

[0026] A control circuit board is used to control the moving component according to the center offset distance.

[0027] According to an embodiment provided by the utility model, it also includes:

[0028] A bottom plate, wherein the control circuit board is provided at the center of the bottom plate;

[0029] A side plate, the side plate is perpendicular to the bottom plate and is arranged around the control circuit board, the centering assembly is installed on the side of the side plate facing the center of the bottom plate, and the moving assembly is installed on the side of the bottom plate away from the wafer;

[0030] The moving component is a robot, which is suitable for adjusting the position of the wafer according to the center offset distance.

[0031] The suction cup rotating assembly provided by the utility model seals and connects the output shaft with the frame body. During the rotation of the output shaft, there is no need to set up an additional sealing device, thereby effectively reducing the height of the suction cup rotating assembly along the axial direction of the output shaft, thereby realizing a miniaturized design. Taking the suction cup rotating assembly of the present application applied to a wafer pre-alignment control device as an example, the height of the wafer pre-alignment control device along the output shaft direction is effectively reduced, thereby achieving the effect of adapting to a narrower working space. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 This is one of the structural schematic diagrams of the suction cup rotating assembly provided by the utility model;

[0034] Figure 2 This is the second structural schematic diagram of the suction cup rotating assembly provided by the utility model;

[0035] Figure 3 It is a structural schematic diagram of a driving motor assembly of a suction cup rotating assembly provided by the utility model;

[0036] Figure 4 It is a structural schematic diagram of a suction cup assembly of a suction cup rotating assembly provided by the utility model;

[0037] Figure 5This is one of the structural schematic diagrams of the wafer pre-alignment control device provided by the utility model;

[0038] Figure 6 This is the second structural schematic diagram of the wafer pre-alignment control device provided by the utility model.

[0039] Reference numerals:

[0040] 100, suction cup rotating assembly; 110, suction cup assembly; 111, suction cup; 112, soft suction part; 113, hard suction part; 114, protrusion; 120, driving part; 121, frame; 1211, first through hole; 1212, air inlet channel; 1213, sealing end cover; 1214, first shaft section; 1215, second shaft section; 1216, connecting hole; 1217, base; 122, driving motor assembly; 1221, output shaft; 1220, air outlet channel; 1224, first ring groove; 1225, second ring groove; 1226, third ring groove; 1227, driving motor; 1228, flange; 1229, connecting part; 1230, reducer; 123, sealing space; 124, first sealing member; 125, second sealing member; 126, third sealing member;

[0041] 200, centering assembly; 300, control circuit board; 400, bottom plate; 500, side plate; 610, amplifier; 620, vacuum filter; 630, vacuum pressure gauge; 640, external air inlet;

[0042] 900. Wafer. DETAILED DESCRIPTION

[0043] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0044] In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0045] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0046] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0047] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model embodiment. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0048] Combination Figures 1 to 4As shown, the suction cup rotation assembly of the utility model includes: a suction cup assembly 110 and a driving part 120, the suction cup assembly 110 is suitable for sucking the wafer 900; the driving part 120 is fixedly connected to the suction cup assembly 110, and is suitable for driving the suction cup assembly 110 to rotate; the driving part 120 includes a frame 121 and a driving motor assembly 122, and the frame 121 is provided with a first through hole 1211; the driving motor assembly 122 is fixedly connected to the frame 121, and the driving motor assembly 122 is provided with an output shaft 1221, and the output shaft 1221 passes through the first through hole 1211 and is sealed and connected with the suction cup assembly 110; a sealed space 123 is provided between the outer wall of the output shaft 1221 and the inner wall of the first through hole 1211, the output shaft 1221 is provided with an air outlet channel 1220, and the frame 121 is provided with an air inlet channel 1212; the air inlet channel 1212, the sealed space 123, the air outlet channel 1220 and the suction cup assembly 110 are connected in sequence.

[0049] According to the suction cup rotating assembly of the utility model, the vacuum gas flows from the air inlet channel 1212 through the sealed space 123 and the air outlet channel 1220 in sequence and then enters the suction cup assembly 110. When the suction cup assembly 110 is adsorbed on the wafer 900, the pressure difference between the vacuum gas and the external gas causes the wafer 900 to be pressed and fixed on the suction cup assembly 110, and rotates driven by the output shaft 1221 of the driving unit 120.

[0050] According to the suction cup rotating assembly of the utility model, by sealingly connecting the output shaft 1221 with the frame 121, there is no need to additionally set a sealing device on the output shaft 1221 during the rotation of the output shaft 1221, thereby effectively reducing the height of the suction cup rotating assembly 100 along the axial direction of the output shaft 1221, thereby realizing a miniaturized design. Taking the suction cup rotating assembly 100 of the present application applied to a wafer pre-alignment control device as an example, the height of the wafer 900 wafer pre-alignment control device along the output shaft 1221 direction is effectively reduced, thereby achieving the effect of adapting to a narrower working space.

[0051] According to an embodiment provided by the utility model, combined with Figure 1 and Figure 2 As shown, a first seal 124 and a second seal 125 are sequentially arranged between the output shaft 1221 and the frame 121 along the axial direction of the output shaft 1221 from the frame 121 toward the suction cup assembly 110 . The output shaft 1221 , the frame 121 , the first seal 124 and the second seal 125 form a sealed space 123 .

[0052] In this embodiment, the output shaft 1221 is clearance-matched with the frame body 121, and the first seal 124 and the second seal 125 are sequentially arranged in the first through hole 1211 to limit the axial direction of the output shaft 1221, thereby effectively ensuring the coaxiality of the output shaft 1221 and the first through hole 1211, and avoiding the output shaft 1221 from rubbing against the inner wall of the first through hole 1211 of the frame body 121 during rotation.

[0053] In one embodiment, in combination Figure 3 As shown, the output shaft 1221 is provided with a first annular groove 1224, a second annular groove 1225 and a third annular groove 1226 in sequence along its axial direction from the frame 121 to the suction cup assembly 110. The first annular groove 1224 is provided with a first seal 124, the second annular groove 1225 is provided with a second seal 125, and the third annular groove 1226 is provided corresponding to the suction cup assembly 110 and is provided with a third seal 126.

[0054] The setting of the annular groove (referring to any one of the first annular groove 1224, the second annular groove 1225, and the third annular groove 1226) can pre-install the seal (referring to any one of the first seal 124, the second seal 125, and the third seal 126) on the output shaft 1221. After the output shaft 1221 is inserted into the first through hole 1211 and reaches the installation position, a sealed connection with the inner wall of the first through hole 1211 is achieved, thereby effectively reducing the difficulty of manufacturing and installation.

[0055] Of course, the annular groove may not be set on the output shaft 1221. For example, an annular groove may be opened on the inner wall of the first through hole 1211 alone, and the seal needs to be pre-installed in the annular groove of the first through hole 1211 during installation; annular grooves may also be opened on the outer wall of the output shaft 1221 and the inner wall of the first through hole 1211 at the same time, and the annular grooves between the two are spliced ​​to form an annular groove, which not only allows the seal to be pre-installed on the output shaft 1221, but also improves the fixing effect of the seal and the inner wall of the first through hole 1211.

[0056] According to an embodiment provided by the utility model, combined with Figure 3As shown, the drive motor assembly 122 includes a drive motor 1227, a flange 1228, and a speed reducer 1230. The drive motor 1227 is provided with a drive shaft; the flange 1228 includes a connecting portion 1229 and an output shaft 1221, and the output shaft 1221 is vertically disposed on the first side of the connecting portion 1229; the input end of the speed reducer 1230 is connected to the drive shaft of the drive motor 1227, and the output end of the speed reducer 1230 is connected to the second side of the connecting portion 1229, and the first side and the second side are oppositely arranged. The connection between the flange 1228 and the speed reducer 1230 can replace the flange 1228 with different diameter output shafts 1221 for different diameters of the first through holes 1211, effectively reducing the overall manufacturing cost of the chuck rotating assembly 100; and the speed reducer 1230 ensures that the high-speed input of the drive motor 1227 is converted into the lower speed required by the chuck assembly 110, so as to match the rotation speed required for wafer 900 measurement, and the speed reducer 1230 can be paired with a high-precision encoder to achieve the effect of precise control of the rotation position and rotation process of the chuck assembly 110.

[0057] According to an embodiment provided by the present invention, in combination with Figure 1 and Figure 2 As shown, the frame 121 includes a sealing end cover 1213 and a base 1217. The sealing end cover 1213 is provided with a first through hole 1211 and an air inlet passage 1212. The sealing end cover 1213 includes a first shaft section 1214 and a second shaft section 1215, and the diameter of the first shaft section 1214 is smaller than that of the second shaft section 1215; the base 1217 is provided with a connection hole 1216 and is adapted to be connected in cooperation with the first shaft section 1214.

[0058] When the user installs the sealing end cover 1213 to the base 1217, the first shaft section 1214 can be inserted into the connection hole 1216 to achieve the pre-fixation of the sealing end cover 1213 and the base 1217, without always taking the sealing end cover 1213 and the base 1217 during the installation process, reducing the installation difficulty for the user.

[0059] In this embodiment, the base 1217 is in a "J" shape, and the drive motor 1227 is always exposed to the air, effectively improving the heat dissipation effect of the drive motor 1227; in other embodiments, the shape of the base 1217 can also be adjusted according to the actual environment. For example, in a humid environment, the base 1217 and the sealing end cover 1213 can form an integral body with a closed cavity, and the drive motor 1227 is disposed in the closed cavity, always isolated from the humid environment, effectively extending the service life of the motor.

[0060] According to an embodiment of the present invention, the chuck assembly 110 includes a suction chuck 111. The suction chuck 111 includes a soft suction portion 112 and a hard suction portion 113, and the soft suction portion 112 is disposed around the outer periphery of the hard suction portion 113.

[0061] During the process of the adsorption plate 111 adsorbing the wafer 900, the soft adsorption part 112 first contacts the wafer 900 compared with the hard adsorption part 113, and the soft adsorption part 112 itself is deformed during the adsorption process to adapt to the irregular shape of the surface of the wafer 900 (such as the warping of the wafer 900 itself formed during manufacturing), thereby ensuring the complete adsorption of the wafer 900 and preventing the adsorption plate 111 and the wafer 900 from detaching from the adsorption plate 111 during rotation due to the inadequate adsorption.

[0062] In this embodiment, the soft adsorption portion 112 may be made of silica gel, which has good deformation ability and will not contaminate the wafer surface.

[0063] According to an embodiment of the present invention, the hard adsorption portion 113 is provided with at least two protrusions 114 , and the at least two protrusions 114 are symmetrically arranged around the rotation axis of the suction cup assembly 110 .

[0064] In this embodiment, when the adsorption plate 111 adsorbs the wafer 900, the pressure of the vacuum gas in the adsorption space between the adsorption plate 111 and the wafer 900 is lower than the external pressure, and the wafer 900 gradually approaches the adsorption plate 111. Due to the supporting effect of the soft adsorption portion 112, the closer the wafer 900 is to the middle position of the adsorption plate 111 (that is, the farther away from the support of the soft adsorption portion 112), the greater the deformation. By providing the protrusion 114, it is ensured that the position on the wafer 900 away from the support of the soft adsorption portion 112 is effectively supported, thereby preventing the wafer 900 from being deformed too much when being adsorbed. Moreover, the volume of the protrusion 114 is smaller than the volume occupied by the entire adsorption space, and does not affect the flow of vacuum gas, thereby ensuring the adsorption effect of the suction cup assembly 110.

[0065] In this embodiment, at least two protrusions 114 are symmetrically arranged to ensure uniform support for the entire wafer 900, thereby preventing local deformation exceeding the rated deformation amount due to excessive support force or lack of support at local locations on the surface of the wafer 900 (usually the rated deformation amount of the wafer 900 is set to be less than 30 microns in this field).

[0066] In this embodiment, twenty-one protrusions 114 are provided on the hard adsorption portion 113, the overall flatness of all the protrusions 114 is 10 microns, and the surface area of ​​a single protrusion 114 in contact with the wafer 900 is 0.8x0.4 square millimeters; in other embodiments, based on wafers 900 of different sizes, the number of protrusions 114, the contact area between a single protrusion 114 and the wafer 900, the overall flatness of the protrusion 114, etc. can be adaptively adjusted.

[0067] In this embodiment, the hard adsorption part 113 can be made of industrial plastics such as PEEK (polyetheretherketone) or PPS (polyphenylene sulfide), which has good hardness and is not easy to deform, and has no other impurity elements that affect the adsorbed surface of the wafer (900).

[0068] According to one embodiment of the utility model, combined Figure 4 As shown, the distances between adjacent protrusions 114 are the same, which is suitable for evenly dividing the space between the hard adsorption portion 113 and the wafer 900 .

[0069] In this embodiment, the distance is the same, that is, the area formed by any three adjacent protrusions 114 is the same, and the adsorption space is evenly divided, so as to ensure the uniform flow of the vacuum gas in the adsorption space, which is beneficial to prevent the local pressure unevenness caused by the local flow rate of the vacuum gas in the adsorption space being too fast or too slow, and the local deformation of the wafer 900 exceeding the rated deformation.

[0070] Of course, considering that the area of ​​the hard adsorption part 113 (such as a circle) may not be completely covered by the triangular divided area, the area difference between adjacent divided areas can be adaptively adjusted to gradually expand or reduce the divided area. For example, since the middle position is the inlet of the vacuum gas, the gas flow rate is fast and the pressure difference is large, and the deformation of the wafer 900 is large. Therefore, the divided area close to the middle position is the smallest to improve the support effect per unit area. The area of ​​the divided area in the process of extending from the middle position to the soft adsorption part 112 gradually increases to meet the overall support effect of the wafer 900.

[0071] The utility model also provides a wafer pre-alignment control device, including: a suction cup rotation component 100, a centering component 200, a moving component, and a control circuit board 300 as in the above-mentioned embodiment; the centering component 200 is arranged on one side of the wafer 900, suitable for calculating the center offset distance of the wafer 900; the moving component is suitable for driving the wafer 900 to move; the control circuit board 300 is used to control the moving component according to the center offset distance.

[0072] In a specific implementation process, the control circuit board 300 controls the moving component to make the wafer pre-alignment control device return to the mechanical origin as a whole, and then the control circuit board 300 receives the position signal of the wafer 900 size and the notch (used to indicate the direction or orientation of the wafer 900) sent by the host computer, and places the wafer 900 with the notch on the suction cup rotation component 100. The suction cup rotation component 100 adsorbs and fixes the wafer 900 and rotates it, and at the same time feeds back the position signal to the control circuit board 300. The centering component 200 detects the edge of the wafer 900 and feeds back the data signal to the control circuit board 300. After the rotation is completed, the control circuit board 300 calculates the center position and notch position of the wafer 900 based on the collected signals, thereby detecting the center offset distance of the wafer 900, and the control circuit board 300 controls the movement of the moving component according to the center offset distance.

[0073] In this embodiment, the center-seeking component 200 includes a pair of laser beam sensors, which are respectively arranged on both sides of the wafer 900. When the notch of the wafer 900 rotates into the range of the laser beam sensor, the light beam emitted by the sensor will be covered by the edge of the wafer 900, and the center offset distance of the wafer 900 is determined by the edge algorithm.

[0074] In this embodiment, the wafer pre-alignment control device also includes: an amplifier 610, responsible for adjusting the threshold of the centering component 200; a vacuum filter 620, responsible for filtering gas impurities to protect the vacuum solenoid valve, a vacuum pressure gauge 630, suitable for displaying the current vacuum gas pressure value; an external air inlet 640, suitable for connecting to the factory vacuum to increase the vacuum gas.

[0075] In one embodiment, in combination Figure 5 and Figure 6 As shown, the wafer pre-alignment control device includes a base plate 400 and a side plate 500. A control circuit board 300 is provided at the center of the base plate 400; the side plate 500 is perpendicular to the base plate 400 and is arranged around the control circuit board 300. A centering assembly 200 is installed on the side of the side plate 500 facing the center of the base plate 400, and a moving assembly is installed on the side of the base plate 400 away from the wafer 900.

[0076] The area required for the bottom plate 400 is thereby reduced, and the space required for the bottom plate 400 in the horizontal direction is converted into the space required in the height direction, thereby realizing the narrow island design of the wafer pre-alignment control device, and effectively adapting to the narrow working environment. Of course, in this embodiment, multiple side plates 500 may be provided, and different components, such as an amplifier 610, a vacuum filter 620, an external air inlet 640, etc., may be installed on the side plates 500.

[0077] It should be noted that “the control circuit board 300 is arranged at the center of the base plate 400” means that the control circuit board 300 is close to the center of the base plate 400 rather than being absolutely at the center of the base plate 400. The actual position can be adaptively adjusted according to the relationship and volume between components.

[0078] According to an embodiment provided by the present invention, the moving component is a robot, which is suitable for adjusting the position of the wafer 900 according to the center offset distance.

[0079] In this embodiment, a robot is arranged under the base plate 400, and compared with the traditional use of an X, Y moving device (for adjusting the position of the wafer 900 in the horizontal direction) for correction, less space is occupied in the X, Y directions (i.e., the horizontal directions), and the robot can also realize adjustment in the Z direction (vertical direction), which not only realizes the position adjustment function of the wafer 900 but also effectively reduces the space occupied by the wafer pre-alignment control device, and effectively adapts to the narrow working environment.

[0080] The above horizontal and vertical directions are based on the case where the surface of wafer 900 is horizontal. When wafer 900 on the wafer pre-alignment control device is tilted, the orientation is adjusted accordingly to ensure that the center position of wafer 900 is adjusted on the plane where the surface of wafer 900 is located and in the direction perpendicular to the surface of wafer 900.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A suction cup rotating assembly, characterized in that: include: A suction cup assembly, wherein the suction cup assembly is suitable for sucking the wafer; A driving part, the driving part is fixedly connected to the suction cup assembly and is suitable for driving the suction cup assembly to rotate; The driving part comprises a frame and a driving motor assembly, wherein the frame is provided with a first through hole; the driving motor assembly is fixedly connected to the frame, and the driving motor assembly is provided with an output shaft, and the output shaft passes through the first through hole and is sealed and connected to the suction cup assembly; A sealed space is provided between the outer wall of the output shaft and the inner wall of the first through hole, the output shaft is provided with an air outlet channel, and the frame is provided with an air inlet channel; the air inlet channel, the sealed space, the air outlet channel and the suction cup assembly are connected in sequence.

2. The suction cup rotating assembly according to claim 1, characterized in that: A first seal and a second seal are sequentially arranged between the output shaft and the frame along the axial direction of the output shaft from the frame to the suction cup assembly. The output shaft, the frame, the first seal and the second seal surround and form the sealed space.

3. The suction cup rotating assembly according to claim 2, characterized in that: The output shaft is provided with a first annular groove, a second annular groove and a third annular groove in sequence along its axial direction from the frame body to the suction cup assembly, a first seal is provided in the first annular groove, a second seal is provided in the second annular groove, and the third annular groove is provided corresponding to the suction cup assembly and is provided with a third seal.

4. The suction cup rotating assembly according to claim 1, characterized in that: The drive motor assembly comprises: A driving motor having a driving shaft; A flange, the flange comprising a connecting portion and the output shaft, the output shaft being vertically disposed on a first side of the connecting portion; A reducer, wherein the input end of the reducer is connected to the driving shaft of the driving motor, the output end of the reducer is connected to the second side of the connecting portion, and the first side is arranged opposite to the second side.

5. The suction cup rotating assembly according to any one of claims 1 to 4, characterized in that: The frame comprises: A sealing end cover, wherein the sealing end cover is provided with the first through hole and the air inlet passage, and the sealing end cover comprises a first shaft section and a second shaft section, wherein the diameter of the first shaft section is smaller than that of the second shaft section; The base is provided with a connecting hole, suitable for being matched and connected with the first shaft section.

6. The suction cup rotating assembly according to any one of claims 1 to 4, characterized in that: The suction cup assembly comprises: The adsorption tray comprises a soft adsorption portion and a hard adsorption portion, wherein the soft adsorption portion is arranged around the outer circumference of the hard adsorption portion.

7. The suction cup rotating assembly according to claim 6, characterized in that: The hard adsorption portion is provided with at least two protrusions, and the at least two protrusions are symmetrically arranged around the rotation axis of the suction cup assembly.

8. The suction cup rotating assembly according to claim 7, characterized in that: The distances between adjacent protrusions are the same, which is suitable for evenly dividing the space between the hard adsorption part and the wafer.

9. A wafer pre-alignment control device, characterized in that: include: The suction cup rotation assembly according to any one of claims 1 to 8; A centering component, which is disposed on one side of the wafer and is suitable for calculating the center offset distance of the wafer; A moving component, adapted to drive the wafer to move; A control circuit board is used to control the moving component according to the center offset distance.

10. The wafer pre-alignment control device according to claim 9, characterized in that: Also includes: A bottom plate, wherein the control circuit board is provided at the center of the bottom plate; A side plate, the side plate is perpendicular to the bottom plate and is arranged around the control circuit board, the centering assembly is installed on the side of the side plate facing the center of the bottom plate, and the moving assembly is installed on the side of the bottom plate away from the wafer; The moving component is a robot, which is suitable for adjusting the position of the wafer according to the center offset distance.

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