Power device

Abstract

The utility model discloses a power device comprising at least one device group, a pedestal and a heat radiator, the device group comprises at least one power device, the pedestal is used for fixing the device group and is suitable for heat exchange with the power device, the heat radiator is connected with the pedestal, and the heat radiator is connected with the pedestal. And the heat exchanger is suitable for exchanging heat with the base. According to the power equipment, the base is arranged, the device group is welded to the base, the base is further connected with the radiator, on one hand, the heat dissipation effect and heat dissipation efficiency of the device group can be improved, heat transfer resistance is effectively reduced, on the other hand, the power device does not need to be directly welded to the radiator, the welding flexibility is higher, and the cost is reduced. The welding difficulty is smaller, the requirement for welding equipment is smaller, the assembly cost of electric control equipment is lower, and the assembly efficiency is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of electric control, in particular to a power device. Background Art

[0002] In the related art, interface materials such as thermal conductive silicone grease are mainly used between power devices and heat sinks to fill the gap between the power devices and the heat sinks, and the connection is fastened by bolts.

[0003] Although the heat generation of power devices can be reduced, the disadvantages of interface material drying, migration and low thermal conductivity will limit the further increase of heat flux density. The poor heat dissipation effect and low heat dissipation efficiency will still affect the life of power devices and reduce the working reliability of power equipment.

[0004] Power device welding is a solution that can replace the filling interface material. It has the characteristics of high reliability and low heat transfer resistance. However, the welding between the power device and the heat sink is difficult and has high size requirements for the welding equipment. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a power device, which can reduce the difficulty of connecting the power device to the heat sink and reduce the size requirements of the welding equipment.

[0006] According to an embodiment of the present application, the power device includes: a device group, a base and a heat sink, the device group is at least one, and the device group includes at least one power device, the base is used to fix the device group and is suitable for heat exchange with the power device, and the heat sink is connected to the base and is suitable for heat exchange with the base.

[0007] According to the power device of the embodiment of the present application, a base is provided and the device group is welded to the base, and the base is further connected to the heat sink. On the one hand, the heat dissipation effect and heat dissipation efficiency of the device group can be improved, and the heat transfer thermal resistance can be effectively reduced. On the other hand, the power device does not need to be directly welded to the heat sink, the welding flexibility is higher, the welding difficulty is lower, the requirements for the welding equipment are smaller, the assembly cost of the electronic control equipment is lower, and the assembly efficiency is higher.

[0008] According to some embodiments of the present application, a plurality of the device groups are arranged at intervals along a first direction, and the device group includes a plurality of the power devices arranged in an array.

[0009] Furthermore, the base is constructed as an integrated plate and is divided into a plurality of assembly areas, and the assembly areas are arranged corresponding to the device groups.

[0010] Furthermore, the base includes a plurality of sub-boards, and at least one device group is disposed on each sub-board.

[0011] According to some embodiments of the present application, an enhanced heat exchange structure is provided on the area of ​​the base corresponding to the power device.

[0012] Furthermore, the enhanced heat exchange structure is constructed as a heat pipe or a heat spreader embedded in the base.

[0013] In some embodiments, at least a region of the bottom plate opposite to the power device is further provided with an additive layer, and the additive layer is made of the same material as or weldable to a welding surface of the power device.

[0014] Furthermore, a support body is provided on the surface of the additive layer facing the power device, and the support body is suitable for supporting the power device.

[0015] Furthermore, the height of the support body is smaller than the thickness of the solder between the additive layer and the power device.

[0016] According to some embodiments of the present application, the radiator includes a main body and a heat dissipation part, one side of the main body is suitable for being connected to the base, and the other side of the main body is connected to the heat dissipation part, and the heat dissipation part includes: one or a combination of heat dissipation fins and heat pipes.

[0017] Furthermore, a receiving groove is provided on one side of the main body defining the heat dissipation surface, and at least a portion of the base is located in the receiving groove.

[0018] In some embodiments, the power device further includes: a shell, the device group and the base are arranged in the shell, the side of the shell facing away from the device group participates in defining an air duct, and the heat sink is arranged in the air duct; or a fan is also arranged on the side of the shell facing away from the device group, and the heat sink extends out of the shell and is opposite to the fan.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1-Figure 3 is a schematic diagram of the assembly process of the device group, the base and the heat exchanger according to an embodiment of the present application;

[0022] Figure 4is a cross-sectional schematic diagram of a device group, a base and a heat sink according to an embodiment of the present application;

[0023] Figure 5 is another cross-sectional schematic diagram of a device group, a base and a heat sink according to an embodiment of the present application;

[0024] Figure 6 is a schematic diagram of the coordination of a device group, a base and a heat sink according to an embodiment of the present application;

[0025] Figure 7 is another schematic diagram of the coordination of the device group, the base and the heat sink according to an embodiment of the present application;

[0026] Figure 8 is a schematic diagram of a base according to an embodiment of the present application;

[0027] Fig. 9 is a schematic diagram of another base according to an embodiment of the present application;

[0028] Fig.10 is a schematic diagram of the cooperation between a base provided with an additive layer and a power device according to an embodiment of the present application;

[0029] Fig.11 is a schematic diagram of a power device according to an embodiment of the present application from an angle;

[0030] Fig.12 It is a schematic diagram of a power device according to an embodiment of the present application from another angle.

[0031] Reference numerals:

[0032] A power device 100,

[0033] Device group 10, power device 11, substrate 12,

[0034] Base 20, sub-plate body 21, additive layer 22, support body 23,

[0035] Radiator 30, body 31, receiving groove 311, heat dissipation fins 32,

[0036] Heat pipe 40, heat sink 50, housing 60, fan 70,

[0037] Solder a, connecting material b. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as those commonly understood by technicians in the technical field of this application; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary and secondary relationship.

[0040] Reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "attached" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] The term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects before and after are in an "or" relationship.

[0043] In the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary descriptions and should not constitute any limitation to the present application.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] The term "plurality" used in the present application refers to two or more (including two).

[0046] Reference below Figure 1-Figure 12 A power device 100 according to an embodiment of the present invention is described, such as an inverter, a frequency converter, etc.

[0047] like Figure 1 , Figure 2 and Figure 3 As shown, the power device 100 according to the embodiment of the present application includes: a device group 10, a base 20 and a heat sink 30, there is at least one device group 10, and the device group 10 includes at least one power device 11, the base 20 is used to fix the device group 10, and is suitable for heat exchange with the power device 11, and the heat sink 30 is connected to the base 20, and is suitable for heat exchange with the base 20. Specifically, the power devices 11 can be classified according to their type, heat generation, function, etc., and power devices 11 of the same type and function can be concentrated as a device group 10; or based on the heat generation, multiple power devices 11 can be classified into multiple device groups 10 to make the comprehensive heat generation of the multiple device groups 10 consistent, or multiple power devices 11 with larger heat generation can be divided into one device group 10, and the heat exchange of the device group 10 can be enhanced, that is, multiple power devices 11 can form one or more device groups 10, each device group 10 has at least one power device 11, and then a base 20 is set, the device group 10 can be set on the base 20, and the base 20 is further welded to the heat sink 30.

[0048] Combination Figure 1 , Figure 2 and Figure 3 As shown, the assembly process of the device group 10, the base 20 and the heat sink 30 is that the power device 11 is fixed on the base 20 by soldering with solder a, and the base 20 is further connected to the heat sink 30 by connecting material b. The connection method between the base 20 and the heat sink 30 is not unique, and the connection method can be welding, thermal interface material, etc.

[0049] See also Figure 4 and Figure 5 As shown, the device group 10 can be defined as a power module. Each device group 10 can be formed into a power module with a substrate 12 having a substrate 12, or can be formed into a power module without a substrate 12 without a substrate 12. A plurality of power devices 11 can be fixed on the DBC substrate 12 by sintering. The DBC substrate 12 includes an intermediate layer and connecting layers on both sides thereof. The intermediate layer is a ceramic layer, and the connecting layer can be a copper metal layer. Figure 4 In the embodiment, the connection layer is connected to the substrate 12, and the substrate 12 is welded to the base 20. Figure 5 The middle connection layer is directly welded to the base 20 .

[0050] The power device 11 refers to a packaged chip structure. One power device 11 may contain one or more chips. The device group 10 is a general term for at least one packaged power device 11 located in a specific area.

[0051] Specifically, the power device can be an IGBT module after packaging, which has iGBT chips, freewheeling diodes (FWD), etc. packaged inside. The IGBT chip and the freewheeling diode are welded on a copper substrate, which is further fixed on the upper surface of the ceramic substrate of the power device 11. The lower surface of the ceramic substrate can also be provided with a connecting substrate, which is also constructed as a copper substrate. The connecting substrate on the lower surface of the power device 11 can be exposed to facilitate the transfer and fixation of the power device 11. In the embodiment of the present application, the transfer substrate can be used to connect to the base 20. The above copper substrate-ceramic substrate-copper substrate structure is a copper-clad ceramic substrate (DBC). In practical applications, the power device 11 can also be a surface-mount device encapsulated with other chips or other electronic components.

[0052] It should be pointed out that the interface materials such as thermal conductive silicone grease are mainly used between the power device 11 and the heat sink 30 to fill the gap between the power device 11 and the heat sink 30, and are fastened by bolts. Although the heat generation of the power device 11 can be reduced, the disadvantages of the interface material drying, migration and low thermal conductivity will limit the further improvement of the heat flux density, and the poor heat dissipation effect and low heat dissipation efficiency will still affect the life of the power device 11 and reduce the working reliability of the power device 100. The welding of the power device 11 is a solution that can replace the filling interface material, which has the characteristics of high reliability and low heat transfer resistance, but the welding between the power device 11 and the heat sink 30 is difficult and has high size requirements for the welding equipment.

[0053] That is to say, the power device 11 has a relatively small size, while the heat dissipation surface area of ​​the heat sink 30 is relatively large. When the two are welded, the size requirements of the welding equipment for the power device 11 are relatively high, the welding is more difficult, and the welding cost is relatively high.

[0054] Based on this, the present application divides the power device 11 into multiple device groups 10, each device group 10 is fixed on a base 20, or multiple device groups 10 are fixed on the same base 20, and the base 20 is fixed on the heat sink 30. First, the base 20 and the power device 11 are welded and fixed, and no interface material is required between the power device 11 and the base 20. The heat transfer resistance is smaller, the heat dissipation efficiency is higher, and the reliability is higher. Furthermore, there is no need to directly weld the power device 11 and the heat sink 30, and the size of the base 20 is generally much smaller than the size of the heat sink 30. Therefore, the size requirements for the welding equipment can be reduced, the connection difficulty is reduced, and the welding flexibility is higher.

[0055] It should be pointed out that the size of the base 20 is relatively smaller than that of the heat sink 30 , and the base 20 and the power device 11 can be directly welded and fixed by a sintering process, the welding difficulty is low, and no specific welding equipment is required.

[0056] At the same time, directly welding the power device 11 on the heat sink 30 has a lower welding error tolerance for the power device 11 (or a group of devices), that is, if 100 power devices 11 need to be welded on the heat sink 30, it is necessary to ensure that all 100 are correct at one time, which is difficult; using this solution, even if welding errors occur, they can be solved by replacing the sub-board body 21, which is shorter than removing the wrong power device 11 on the heat sink 30, and improves the production efficiency of the power device 100. At the same time, it is also easier to replace during maintenance.

[0057] According to the power device 100 of the embodiment of the present application, by providing a base 20 and welding the device group 10 to the base 20, the base 20 is further connected to the heat sink 30. On the one hand, the heat dissipation effect and heat dissipation efficiency of the device group 10 can be improved, and the heat transfer thermal resistance can be effectively reduced. On the other hand, the power device 11 does not need to be directly welded to the heat sink 30, the welding flexibility is higher, the welding difficulty is lower, the requirements for welding equipment are smaller, the assembly cost of the electronic control equipment is lower, and the assembly efficiency is higher.

[0058] like Figure 6 and Figure 7 As shown, according to some embodiments of the present application, a plurality of device groups 10 are arranged at intervals along a first direction, and the device group 10 includes a plurality of power devices 11 arranged in an array.

[0059] Exemplarily, when the device group 10 includes multiple power devices 11, the multiple power devices 11 can be arranged at intervals along the second direction to form a single column of power devices 11, and the multiple power devices can also be arranged in rows in the first direction and in columns in the second direction to form a plurality of power devices 11 arranged in an array, and the first direction and the second direction can be orthogonal (as shown in the accompanying drawings).

[0060] The power device 100 may include multiple device groups 10, and the multiple device groups 10 are all cooled by a heat sink 30. The heat sink 30 may have multiple heat dissipation surfaces, and one or more device groups 10 may be arranged on each heat dissipation surface. In an embodiment in which multiple device groups 10 are arranged on a heat dissipation surface, the multiple device groups 10 are arranged at intervals along a first direction on the heat dissipation surface, and the multiple power devices 11 in each device group 10 are arranged at intervals in a second direction.

[0061] Therefore, on the one hand, more power devices 11 can be cooled by a heat sink 30, which can reduce the layout cost and make the interior of the power device 100 more compact. On the other hand, the device groups 10 are arranged at intervals, and multiple power devices 11 in the same device group 10 are arranged at intervals. During the heat dissipation and cooling process, the thermal interference between adjacent power devices 11 is smaller, the heat dissipation effect is better, and the heat dissipation efficiency is higher.

[0062] It can be understood that multiple power devices 11 of the same or similar specifications can be arranged on the same sub-board body 21, such as power devices 11 with similar high temperature resistance, similar size, and the same welding requirements, which can improve the working stability and reliability of the power device 100. Of course, power devices 11 of different specifications can also be arranged on the same sub-board body 21, which can achieve a compact setting to save space.

[0063] In some embodiments, the base 20 is constructed as an integral plate and is divided into a plurality of assembly areas, and the assembly areas are arranged corresponding to the device groups 10 .

[0064] That is to say, the base 20 can be constructed as a large plate structure, and multiple assembly areas can be maliciously formed thereon. For example, if there are three device groups 10, three assembly areas, two assembly areas (a large assembly area and a small assembly area), and one assembly area (a separate assembly area with a larger area) can be correspondingly formed on the base 20.

[0065] Of course, the structure of the base 20 in the embodiment of the present application is not limited thereto. In other embodiments, such as Figure 6 and Figure 7 As shown, the base 20 may include a plurality of sub-boards 21 , each of which is provided with a device group 10 , and the device group 10 includes a row of power devices 11 arranged in an array along the second direction.

[0066] Specifically, the base 20 includes a plurality of sub-boards 21, which are spaced apart in a first direction, and the structures of the plurality of sub-boards 21, such as one or more of length, width, thickness and material selection, may be the same or different, and may be appropriately selected according to the welding temperature requirements, the function, type, heat generation, etc. of the device group 10 thereon.

[0067] For example, multiple sub-boards 21 are provided, and if different welding temperature requirements are required, power devices 11 with the same or similar welding temperature requirements are divided into a device group 10 and provided on the same sub-board 21 .

[0068] Thus, the size design of the base 20 can be made more diversified and flexibly adapted to different power conversion requirements. The space on the heat sink 30 can also be fully utilized and the space occupied by the power device 100 can be effectively reduced, making the arrangement of multiple power devices 11 more compact.

[0069] See also Figure 8 and Fig. 9 As shown, according to some embodiments of the present application, an enhanced heat exchange structure is provided on the area of ​​the base 20 corresponding to the power device 11 .

[0070] Exemplarily, the base 20 may form one side of the assembly area, and the enhanced heat exchange structure may extend out of the assembly area.

[0071] Specifically, in an embodiment where the base 20 is an integrated plate, an enhanced heat exchange structure can be set on the assembly area corresponding to the device group 10 with a larger heat generation among the multiple assembly areas, or an enhanced heat exchange structure can be set on multiple assembly areas; in an embodiment where the base 20 includes multiple sub-board bodies 21, an enhanced heat exchange structure can be set on the sub-board body 21 corresponding to the device group 10 with a larger heat generation, or an enhanced heat exchange structure can be set on all the sub-board bodies 21.

[0072] Therefore, the heat exchange capacity of the base 20 or the base 20 can be improved by enhancing the heat exchange structure to achieve enhanced heat exchange of one, multiple or all of the multiple device groups 10, so that the operating temperature of the power device 100 is lower, the operating stability is higher, and the safety of use is higher.

[0073] Exemplarily, the enhanced heat exchange structure is configured as a heat pipe 40 or a heat spreader 50 embedded in the base 20 .

[0074] See also Fig.10 As shown, in some embodiments, at least the region of the bottom plate opposite to the power device 11 is further provided with an additive layer 22 , and the additive layer 22 is made of the same material as or can be welded to the welding surface of the power device 11 .

[0075] Specifically, the welding surface of the power device 11 is defined by the surface of the substrate 12 on one side facing the base 20. When the substrate 12 and the base 20 cannot be directly welded due to material reasons, additive processing can be performed on the base 20, that is, an additive layer 22 is set. The additive layer 22 can be made of copper, nickel or other materials. The additive layer 22 can completely cover the surface of the base 20 facing the power device 11. The additive layer 22 can also be specifically set and only corresponds to the area of ​​the power device 11.

[0076] In this way, by providing the additive layer 22 , and the additive layer 22 is provided on the base 20 and used for welding with the power device 11 , the technical problem that the power device 11 and the base 20 cannot be welded can be solved, and the adaptability of the base 20 can be improved.

[0077] like Fig.10 As shown, further, a support body 23 is provided on the surface of the additive layer 22 facing the power device 11 , and the support body 23 is suitable for supporting the power device 11 .

[0078] Specifically, the support body 23 is integrally formed with the additive layer 22, or is detachably disposed on the additive layer 22. There may be multiple support bodies 23, and they are located on the corner areas of the additive layer 23. When welding the power device 11 and the additive layer 22, the support body 23 can support the power device 11 to prevent the power device 11 from tilting.

[0079] In other words, when the power device 11 is tilted, the power device 11 will touch the support body 23, and the support body 23 can limit the power device 11 to correct the tilt angle of the power device 11 and improve the welding accuracy and reliability between the power device 11 and the additive layer 22.

[0080] Furthermore, the height of the support body 23 is less than the thickness of the solder a between the additive layer 22 and the power device 11 , and the top surfaces of the plurality of support bodies 23 have the same height.

[0081] In this way, the power device 11 can be prevented from tilting when welding is not required, the assembly accuracy can be improved, the connection stability and reliability can be improved, and the technical problem of being unable to weld can be effectively solved.

[0082] like Figure 1 and Figure 2 , Figure 3 As shown, according to some embodiments of the present application, the radiator 30 includes a main body 31 and a heat dissipation part, one side of the main body 31 is suitable for being connected to the base 20, and the other side of the main body 31 is connected to the heat dissipation part, and the heat dissipation part includes heat dissipation fins 32, heat pipes, or a combination thereof.

[0083] Specifically, in some embodiments, one side of the main body 31 is formed as a heat dissipation surface, which is connected to the base 20. A heat dissipation portion is provided on at least the other side surface of the main body 31, and the heat dissipation portion is formed as heat dissipation fins 32 to increase the heat dissipation area of ​​the radiator 30, thereby improving the heat dissipation effect and heat dissipation efficiency of the radiator 30. In other embodiments, a heat dissipation portion is embedded in the main body 31, and the heat dissipation portion is formed as a heat pipe, and the heat pipe can contact the base 20 to achieve contact heat exchange. Preferably, one or more heat dissipation portions can be compositely designed on the main body 31 to improve the heat dissipation effect and heat dissipation efficiency.

[0084] like Figure 7 As shown, further, a receiving groove 311 is provided on one side of the heat dissipation surface defined by the body 31 , and at least a portion of the base 20 is located in the receiving groove 311 .

[0085] Therefore, by opening a receiving groove 311 on the heat dissipation surface and disposing at least a portion of the base 20 in the receiving groove 311, at least a portion of the base 20 in the height direction can be disposed in the receiving groove 311. For example, if the height of the base 20 is 10 mm, the depth of the receiving groove 11 can be 5 mm, 10 mm, etc., so that part or all of the base 20 is disposed in the receiving groove 11. This can not only make the contact between the base 20 and the radiator 30 more sufficient and the heat exchange effect better, but also facilitate the installation of the base 20, and the base 20 can be fastened and limited to improve stability and reliability.

[0086] See also Fig.11 and Fig.12 As shown, in some embodiments, the power device 100 further includes: a housing 60, the device group 10 and the base 20 are arranged in the housing 60, the side of the housing 60 facing away from the device group 10 participates in defining the air duct, and the heat sink 30 is arranged in the air duct; or a fan 70 is also arranged on the side of the housing 60 facing away from the device group 10, and the heat sink 30 extends out of the housing 60 and is opposite to the fan 70.

[0087] That is to say, the power device 100 can be cooled and dissipated with the help of external airflow, such as: the outer shell 60 helps to define an air duct, and the heat dissipation part of the radiator 30 is located in the air duct. When the external airflow flows through the air duct, the heat dissipation of the radiator 30 can be achieved, so as to achieve the heat dissipation of the power device 11; the power device 100 can also achieve forced air cooling and heat dissipation with the help of the fan 70 arranged on the outer shell 60, so as to improve the cooling effect and cooling efficiency.

[0088] In a preferred embodiment, the fan 70 can be provided by itself, and the housing 60 also helps to define an air duct for air cooling.

[0089] Exemplarily, the power device 100 can be a power device 100 of an air conditioner, and the power device 100 is arranged in an outdoor unit of the air conditioner. An air inlet is opened on the shell of the outdoor unit, and the air duct defined by the outer shell 60 of the power device 100 is connected to the air inlet. When the wind wheel of the outdoor unit rotates, a negative pressure is formed inside the outdoor unit, and the external air flow flows through the air inlet through the air duct, and is dissipated through the fan 70 arranged on the outer shell 60 to achieve double air cooling and improve the heat dissipation effect of the power device 11.

[0090] Other structures and operations of the power device 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0092] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A power device, characterized in that: include: A device group (10), the device group (10) being at least one, and the device group (10) comprising at least one power device (11); A base (20), the base (20) being used to fix the device group (10) and being suitable for exchanging heat with the power device (11); A radiator (30), the radiator (30) is connected to the base (20) and is suitable for exchanging heat with the base (20).

2. The power device according to claim 1, characterized in that A plurality of the device groups (10) are arranged at intervals along a first direction, and the device group (10) includes a plurality of the power devices (11) arranged in an array.

3. The power device according to claim 2, characterized in that The base (20) is constructed as an integrated plate and is divided into a plurality of assembly areas, wherein the assembly areas are arranged corresponding to the device groups (10).

4. The power device according to claim 2, characterized in that The base (20) comprises a plurality of sub-board bodies (21), and each sub-board body (21) is provided with at least one of the device groups (10).

5. The power device according to claim 1, characterized in that An enhanced heat exchange structure is provided on the base (20) in an area corresponding to the power device (11).

6. The power device according to claim 5, characterized in that The enhanced heat exchange structure is constructed as a heat pipe (40) or a heat spreader (50) embedded in the base (20).

7. The power device according to claim 1, characterized in that At least a region of the base (20) opposite to the power device (11) is further provided with an additive layer (22); the additive layer (22) is made of the same material as or can be welded to a welding surface of the power device (11).

8. The power device according to claim 7, characterized in that A support body (23) is provided on the surface of the additive layer (22) facing the power device (11), and the support body (23) is suitable for supporting the power device (11).

9. The power device according to claim 8, characterized in that The height of the support body (23) is smaller than the thickness of the solder (a) between the additive layer (22) and the power device (11).

10. The power device according to claim 1, characterized in that The heat sink (30) comprises a main body (31) and a heat dissipation portion, one side of the main body (31) is suitable for being connected to the base (20), and the other side of the main body (31) is connected to the heat dissipation portion, and the heat dissipation portion comprises: heat dissipation fins (32), heat pipes, or a combination thereof.

11. The power device according to claim 10, characterized in that The body (31) defines a heat dissipation surface on one side of which a receiving groove (311) is provided, and at least a portion of the base (20) is located in the receiving groove (311).

12. The power device according to claim 1, characterized in that The power device further comprises: a housing (60), the device group (10) and the base (20) being arranged in the housing (60), a side of the housing (60) facing away from the device group (10) participating in defining an air duct, and the heat sink (30) being arranged in the air duct; or a fan (70) is further arranged on a side of the housing (60) facing away from the device group (10), and the heat sink (30) protrudes out of the housing (60) and is opposite to the fan (70).

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