Novel liquid cooling radiator water cooling head
Through the combination of stamping technology and diffusion welding, the complex production process of water-cooling heads and solder residues are solved, and the rapid and cost-effective production of water-cooling heads is achieved, improving the heat dissipation effect and adaptability.
Patent Information
- Application Number
- CN202421122482.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-05-22
AI Technical Summary
The existing water-cooling head production process is complex, the cost is high, the size is inconsistent, and the residual solder or rubber debris may cause the coolant to be blocked, affecting the heat dissipation effect.
Use stamping technology to produce the lower cover, copper sheet runner and upper cover, and weld them into a whole through diffusion welding technology to ensure the consistency of the parts and thermal conductivity while avoiding solder residue. Use the S-type copper sheet runner to increase coolant Contact area.
It realizes rapid and cost-effective water cooling head production, ensures the fluidity and heat dissipation effect of the coolant, improves the heat dissipation performance and the adaptability of the device, and reduces the risk of aging leakage.
Smart Images

Figure CN222338281U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of water cooling heads, in particular to a novel water cooling head for a liquid cooling radiator. Background Art
[0002] The water-cooling head in a liquid-cooled radiator refers to a component used to connect the liquid cooling system pipeline and the radiator. It is responsible for transferring heat from the radiator to the flowing cooling liquid and promoting effective heat dissipation. Existing water-cooling heads are produced by machining methods such as skiving or CNC machining. The production process is complex, the cost is high, the processing time is long, the processing size is inconsistent, and it is not conducive to large-scale production. Water-cooling heads are basically assembled by brazing and sealing rings. Solder residue or rubber debris will chemically react with the liquid medium and easily block the flow channel, so there is a need for improvement. Utility Model Content
[0003] The utility model aims at the deficiencies of the prior art and provides the following technical solutions:
[0004] A novel liquid-cooled radiator water-cooling head comprises a lower cover, the upper surface of which is fixedly connected to a copper sheet flow channel, the upper surface of which is fixedly connected to an upper cover, the upper surface of which is fixedly connected to a liquid inlet pipe, and the upper surface of which is fixedly connected to a liquid outlet pipe.
[0005] As an improvement of the above technical solution, there are multiple copper sheet flow channels, which are evenly arranged and stacked.
[0006] As an improvement of the above technical solution, the inner cavity of the copper sheet flow channel is S-shaped.
[0007] Beneficial effects of the utility model:
[0008] 1. The lower cover, copper sheet runner and upper cover are produced by stamping technology. Stamping can quickly produce parts, and the efficiency is dozens of times that of the previous process. It can also ensure the dimensional consistency of the parts. The parts are directly produced by stamping or aluminum extrusion, and then the lower cover, copper sheet runner and upper cover are welded as a whole by diffusion welding technology. Diffusion welding technology can effectively ensure the thermal conductivity of the water cooling head. There is no flux in welding, and there will be no solder residue due to other welding methods, which will cause the residual solder to react chemically with the liquid medium. The residual solder is prevented from clogging the flow channel of the inner cavity of the copper sheet runner, thereby ensuring that the coolant can flow quickly, and then the coolant can quickly take away the heat, so that the heat dissipation effect of the water cooling head is better. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 This is the structural diagram of the utility model;
[0010] Figure 2 For this utility model Figure 1 A front view of
[0011] Figure 3 For this utility model Figure 1 A cross-sectional view of
[0012] Figure 4 For the utility model 1 Figure 1 Bottom view of .
[0013] Figure numerals: 1, lower cover; 2, copper sheet flow channel; 3, upper cover; 4, liquid inlet pipe; 5, liquid outlet pipe. DETAILED DESCRIPTION
[0014] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.
[0015] See also Figure 1-4The utility model provides a technical solution: a new type of liquid cooling radiator water cooling head, including a lower cover 1, the upper surface of the lower cover 1 is fixedly connected with a copper sheet flow channel 2, the inner cavity of the copper sheet flow channel 2 is S-shaped, which increases the contact area between the inner cavity of the copper sheet flow channel 2 and the coolant, so that the heat of the copper sheet flow channel 2 can quickly enter the coolant, thereby making the cooling effect of the copper sheet flow channel 2 better, there are multiple copper sheet flow channels 2, and they are evenly arranged and stacked, so that the heat of the copper sheet flow channel 2 can enter the coolant more quickly , thereby making the cooling effect better, and the stacking height of the copper sheet flow channel 2 can be adjusted according to the power consumption of the chip, so that the adaptability of the device is more extensive, the upper surface of the copper sheet flow channel 2 is fixedly connected with an upper cover 3, the upper surface of the upper cover 3 is fixedly connected with a liquid inlet pipe 4, and the upper surface of the upper cover 3 is fixedly connected with a liquid outlet pipe 5. The coolant enters the copper sheet flow channel 2 through the liquid inlet pipe 4 and the upper cover 3, and then enters the S-shaped channel inside the copper sheet flow channel 2 to absorb the heat of the copper sheet flow channel 2, thereby cooling the copper sheet flow channel 2. 2 for heat dissipation, the lower cover 1, the copper sheet flow channel 2 and the upper cover 3 are produced by stamping technology. The stamping process can quickly produce parts, and the efficiency is dozens of times that of the previous process. It can also ensure the size consistency of the parts. The parts are directly produced by stamping or aluminum extrusion, and then the lower cover 1, the copper sheet flow channel 2 and the upper cover 3 are welded as a whole by diffusion welding technology. The diffusion welding technology can effectively ensure the thermal conductivity of the water cooling head. There is no flux in the welding, and there will be no solder residue due to other welding methods, so that the residual solder and the liquid medium have a risk of chemical reaction, which prevents the residual solder from clogging the flow channel of the inner cavity of the copper sheet flow channel 2, thereby ensuring that the coolant can flow quickly, and then the coolant can quickly take away the heat, so that the heat dissipation effect of the water cooling head is better. The reliability of the diffusion welding technology is greatly improved than the existing sealing ring tight fitting method on the market. There is no risk of aging leakage for a long time. On the other hand, there is no flux, and there will be no chemical reaction with the liquid medium due to solder residue in other welding methods, which is easy to block the copper sheet flow channel 2.
[0016] Specifically, there are multiple copper sheet flow channels 2, and they are evenly arranged and stacked, so that the heat of the copper sheet flow channels 2 can enter the coolant more quickly, thereby achieving a better cooling effect. The stacking height of the copper sheet flow channels 2 can also be adjusted according to the power consumption of the chip, making the device more adaptable.
[0017] Specifically, the inner cavity of the copper sheet flow channel 2 is S-shaped, which increases the contact area between the inner cavity of the copper sheet flow channel 2 and the coolant, so that the heat of the copper sheet flow channel 2 can quickly enter the coolant, thereby improving the cooling effect of the copper sheet flow channel 2.
[0018] Working principle: The coolant enters the copper sheet flow channel 2 through the liquid inlet pipe 4 and the upper cover 3, and then enters the S-shaped channel inside the copper sheet flow channel 2, absorbs the heat of the copper sheet flow channel 2, and then dissipates the heat of the copper sheet flow channel 2, and then the water cooling head dissipates the heat to the chip. The copper sheet flow channel 2 is stamped to ensure that the copper sheet flow channel 2 has the same size, is suitable for mass production, is easy to process, and reduces costs. On the other hand, it can also be delivered quickly to ensure that the overall product cost is more competitive in the market.
[0019] The above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it.
Claims
1. A novel liquid cooling radiator water cooling head, comprising a lower cover (1), characterized in that: The upper surface of the lower cover (1) is fixedly connected to a copper sheet flow channel (2), the upper surface of the copper sheet flow channel (2) is fixedly connected to an upper cover (3), the upper surface of the upper cover (3) is fixedly connected to a liquid inlet pipe (4), and the upper surface of the upper cover (3) is fixedly connected to a liquid outlet pipe (5).
2. The novel liquid cooling radiator water cooling head according to claim 1 is characterized in that: The copper sheet flow channels (2) are multiple and are evenly arranged and stacked.
3. The novel liquid cooling radiator water cooling head according to claim 1 is characterized in that: The inner cavity of the copper sheet flow channel (2) is S-shaped.