Chassis patch SiC magnetic coding integrated circuit board

Abstract

The utility model discloses a chassis paster SiC magnetic coding integrated circuit board, which belongs to the technical field of controller circuit boards, and comprises a TOP surface, a ground layer and a BOTT0M surface which are connected in sequence, and further comprises a three-phase terminal, a paster IGBT, an isolation type grid driving chip, an MCU and a PWM control chip which are arranged on the TOP surface, and a magnetic encoder chip arranged on the BOTT0M surface, the patch IGBT is connected with the three-phase terminal and is used for controlling the output of the three-phase terminal; the input end of the PWM control chip is connected with the output end of the MCU, the output end of the PWM control chip is connected with the input end of the isolated gate driving chip, and the PWM control chip is used for generating a pulse modulation signal and sending the pulse modulation signal to the isolated gate driving chip; the output end of the isolated gate driving chip is connected with the patch IGBT and is used for controlling the patch IGBT to be switched on and off; the magnetic encoder chip is arranged at a position opposite to the axis of an external motor connected with the circuit board; according to the utility model, the accuracy and the real-time performance can be improved.

Description

Technical Field

[0001] The utility model relates to a chassis patch SiC magnetic encoding integrated circuit board, belonging to the technical field of controller circuit boards. Background Art

[0002] With the development of electric vehicles and autonomous driving technology, higher requirements are placed on the vehicle's power system. The existing car chassis circuit board has some challenges in driving efficiency, energy consumption and stability. Therefore, it is crucial to develop a new technology that can meet these requirements.

[0003] In traditional automotive main drive controllers, the separated encoder and controller require additional interfaces and wiring, which increases the complexity of the system. Delays and noise may be introduced during the transmission of signals from the encoder to the controller, which may affect the real-time performance and accuracy of the system. And with the development of miniaturization of electronic devices, the traditional magnetic encoder separated controller cannot meet the demand. Utility Model Content

[0004] The purpose of the utility model is to provide a chassis patch SiC magnetic encoding integrated circuit board to solve the problems of low accuracy and large space occupation in the prior art.

[0005] In order to achieve the above purpose, the utility model is implemented by adopting the following technical solutions:

[0006] The utility model provides a chassis patch SiC magnetic encoding integrated circuit board, including a TOP surface, a stratum and a BOTT0M surface connected in sequence, and also includes: a three-phase terminal, a patch IGBT, an isolated gate drive chip, an MCU and a PWM control chip arranged on the TOP surface, and a magnetic encoder chip arranged on the BOTT0M surface;

[0007] The three-phase terminal includes a U-phase terminal, a V-phase terminal and a W-phase terminal;

[0008] The SMD IGBT is provided with three groups, each group of SMD IGBT includes two SMD IGBTs, and the three groups of SMD IGBTs are respectively connected to the U-phase terminal, the V-phase terminal and the W-phase terminal, and are used to control whether the three-phase terminals are output;

[0009] The PWM control chip has an input end connected to the output end of the MCU, and an output end connected to the input end of the isolated gate drive chip, and is used to generate a pulse modulation signal and send it to the isolated gate drive chip;

[0010] The isolated gate drive chip has an output end connected to the SMD IGBT for controlling the switching of the SMD IGBT, and the output end and the SMD IGBT maintain a preset safety distance;

[0011] The magnetic encoder chip is arranged at the center of a preset circular area, and the center of the circular area is directly opposite to the axis of the external motor connected to the circuit board.

[0012] Furthermore, the ground layer includes a power ground and a signal ground, and the power ground and the signal ground are connected by single-point grounding.

[0013] Furthermore, the three-phase terminal is connected to one end of a lead in a controller where the circuit board is located, and the other end of the lead is connected to a motor in the controller.

[0014] Furthermore, each SMD IGBT maintains a distance of 4 mm to 5 mm from each other.

[0015] Furthermore, a TVS tube is connected to the isolated gate drive chip to protect the circuit in the circuit board.

[0016] Furthermore, it also includes a plurality of ceramic sheets, which are dispersedly arranged on the TOP surface and the BOTT0M surface for dissipating heat for the circuit board.

[0017] Furthermore, the three-phase terminals and the SMD IGBT are connected via copper cladding.

[0018] Furthermore, a honeycomb-shaped via array is provided on the solder pad of the SMD IGBT, and a ceramic sheet is provided between the SMD IGBT and the via array.

[0019] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0020] The utility model provides a chassis patch SiC magnetic encoding integrated circuit board, which designs a magnetic encoder chip, an MCU, and an isolated gate drive chip on the same circuit board, without the need for external connectors and wiring, thereby reducing the complexity of the system and reducing the production cost. Since the magnetic encoder chip is located on the circuit board in the controller, the distance is very close, the signal transmission path is short, the influence of delay and noise is reduced, and the real-time performance and accuracy of the system are improved;

[0021] The power ground and signal ground are connected by single-point grounding. Good grounding and shielding design helps to suppress electromagnetic interference and improve the stability and reliability of the system.

[0022] Ceramic sheets have high thermal conductivity and are placed on the front and back sides of the circuit board to effectively conduct away the heat generated by the SiC power device and ensure stable operation of the system.

[0023] The three-phase terminals and the SMD IGBT are connected by copper cladding to ensure the safety of the large current output by the three-phase terminals;

[0024] The use of a honeycomb via array can make the vias more densely arranged than a conventional via array, thereby enhancing the heat dissipation effect of the SMD IGBT. In addition, the ceramic sheet transfers the heat to the ceramic sheet through the vias. Since the ceramic sheet has a higher thermal conductivity, a better heat dissipation effect is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the circuit layout of a chassis patch SiC magnetic encoding integrated circuit board provided by the utility model;

[0026] Figure 2 This is a schematic diagram of the layout of electronic components on the TOP surface of a chassis patch SiC magnetic encoding integrated circuit board provided by the utility model;

[0027] Figure 3 This is a schematic diagram of the layout of electronic components on the BOTTOM surface of a chassis patch SiC magnetic encoding integrated circuit board provided by the utility model;

[0028] Figure 4 This is a schematic diagram of the wiring of electronic components on the TOP surface of a chassis patch SiC magnetic encoding integrated circuit board provided by the utility model;

[0029] Figure 5 This is a schematic diagram of wiring of electronic components on the BOTTOM surface of a chassis patch SiC magnetic encoding integrated circuit board provided by the utility model;

[0030] Figure 6 It is a schematic diagram of stratum segmentation of a chassis patch SiC magnetic encoding integrated circuit board provided by the utility model. DETAILED DESCRIPTION

[0031] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are not intended to limit the protection scope of the present invention.

[0032] In the description of the utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the utility model; in addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated; thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features; in the description of the utility model, unless otherwise specified, "multiple" means two or more.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two components; for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

[0034] like Figure 1 As shown, the utility model provides a chassis patch SiC magnetic encoding integrated circuit board, including a TOP surface, a stratum and a BOTT0M surface connected in sequence, and also includes: a three-phase terminal arranged on the TOP surface, a patch IGBT (Insulate-Gate Bipolar Transistor), an isolated gate drive chip, an MCU (Microcontroller Unit) and a PWM (Pulse Width Modulation) control chip, and a magnetic encoder chip arranged on the BOTT0M surface.

[0035] like Figure 2 As shown, U, V and W are the U-phase terminal, V-phase terminal and W-phase terminal of the controller, which correspond to the yellow, green and red three-phase electricity on the three-phase power supply, respectively. They are high voltage. The three-phase terminals will be connected to the external leads, which are connected to the controller to control the operation of the motor.

[0036] like Figure 4As shown, Q11, Q21, Q31, Q41, Q51 and Q61 are SMD IGBTs; Q11 and Q21 are connected to the U-phase terminal as a group, Q11 is the upper bridge of the drive circuit, Q21 is the lower bridge of the drive circuit, the upper bridge Q11 is turned on, Q21 is turned off, the U-phase is output, and the other three phases refer to the U-phase; Q31 and Q41 are connected to the V-phase terminal as a group; Q51 and Q61 are connected to the W-phase terminal as a group. Since the position of the three-phase terminal is fixed, according to the position of the three-phase terminal, the SMD IGBT is placed in the following manner: Q11, Q21, Q31, Q41, Q51 and Q61 maintain a certain creepage distance (4.5mm in this embodiment) according to the design requirements.

[0037] U20 is the MCU, which is the core of the entire control system. It is responsible for receiving input signals, processing these signals and generating corresponding output signals to control the operation of the system, connecting all other components, and outputting low-voltage control signals to the PWM control chip through its output terminals.

[0038] U30 is a PWM control chip. After receiving the low-voltage control signal from the MCU, it generates a pulse width modulation signal and transmits it to each isolated gate drive chip through its output end.

[0039] U11, U21, U31, U41, U51 and U61 are isolated gate drive chips. U11 is connected to Q11, U21 is connected to Q21, U31 is connected to Q31, U41 is connected to Q41, U51 is connected to Q51, and U61 is connected to Q61. Each isolated gate drive chip transmits a high-voltage signal to the corresponding SMD IGBT through its output terminal, and controls the opening and closing of the SMD IGBT, thereby controlling whether the three-phase terminals are output.

[0040] like Figure 3 As shown, U40 is a magnetic encoder chip, which needs to be placed in the center of the circular area shown. The center of the circular area is opposite to the axis of the external motor. Placing the magnetic encoder chip in the center of the circular area can more accurately measure the position and speed of the motor rotor.

[0041] like Figure 3 As shown, using ceramic sheets as thermal conductors can help SiC devices dissipate heat effectively, thereby reducing junction temperature and improving device reliability. Figure 3 P11, P21, P31, P41, P51 and P61 are ceramic sheets, which are placed on the front and back sides of the circuit board. Since ceramics have high thermal conductivity, they can effectively conduct away the heat generated by SiC power devices by placing them on the front and back sides of the circuit board to ensure stable operation of the system.

[0042] like Figure 4As shown in the figure, after the SMD IGBT drive circuit and PWM control chip are placed, the network is connected according to the circuit requirements. Since the three-phase U, V, and W output currents of the controller are large, copper cladding is used to connect to the SMD IGBT. The remaining traces are selected according to the current size and the appropriate line width is selected to connect to the network in sequence.

[0043] like Figure 4 As shown, IGBT generates a lot of heat due to its high power density. In the utility model, a honeycomb via array is added to the pad of the SMD IGBT. The honeycomb via array can be more densely arranged than the conventional via array, thereby enhancing the heat dissipation effect of the SMD IGBT. In the utility model, a ceramic sheet is welded on the back of the SMD IGBT, and the heat is transferred to the ceramic sheet through the vias. Since the ceramic sheet has a high thermal conductivity, the heat dissipation effect is achieved.

[0044] like Figure 5 As shown in the figure, after the magnetic encoder chip is placed, the output signal of the magnetic encoder chip is connected to the MCU for processing. In the MCU, these signals from the magnetic encoder chip will be decoded and used to calculate the position and speed information of the motor. This information will then be used to execute various control algorithms to achieve precise control of the motor.

[0045] like Figure 6 As shown, the ground layer needs to be divided into power ground and signal ground. The power ground and signal ground need to be connected through single-point grounding to reduce mutual interference between ground loops. The power drive circuit has a strong current and a high voltage, so the interference on the power ground line is large. Therefore, the power ground must be set and wired separately from other weak current grounds to ensure stable and reliable operation of the entire system.

[0046] Compared with the existing technology, this utility model patent has the following advantages:

[0047] 1. Compactness: SMD packaging makes SiC devices smaller in size, suitable for high-density integration applications. Mounting the magnetic encoder directly on the circuit board can reduce the volume of the entire system and make the design more compact.

[0048] 2. Reduced costs: Designs that are directly integrated onto circuit boards typically reduce material and assembly costs because no additional connectors, cables, and packaging materials are required.

[0049] 3. Simplified wiring: Direct installation on the circuit board can simplify wiring and reduce the complexity and cost of wire harness management.

[0050] 4. Optimize signal quality: Direct connection can reduce noise interference and signal attenuation during signal transmission, especially for high-frequency signals.

[0051] 5. Easy to test and debug: The integrated design makes the interaction between the magnetic encoder and the controller easier to test and debug, because measurement and analysis equipment can be easily connected on the same board.

[0052] 6. Fast response: Due to the reduced distance and time delay of signal transmission, magnetic encoders mounted directly on the circuit board can provide faster response speed, which is important for applications requiring high-precision positioning and control.

[0053] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A chassis patch SiC magnetic encoding integrated circuit board, characterized in that: It includes a TOP surface, a ground layer and a BOTT0M surface connected in sequence, and also includes: a three-phase terminal, a surface-mounted IGBT, an isolated gate drive chip, an MCU and a PWM control chip arranged on the TOP surface, and a magnetic encoder chip arranged on the BOTT0M surface; The three-phase terminal includes a U-phase terminal, a V-phase terminal and a W-phase terminal; The SMD IGBT is provided with three groups, each group of SMD IGBT includes two SMD IGBTs, and the three groups of SMD IGBTs are respectively connected to the U-phase terminal, the V-phase terminal and the W-phase terminal, and are used to control whether the three-phase terminals are output; The PWM control chip has an input end connected to the output end of the MCU, and an output end connected to the input end of the isolated gate drive chip, and is used to generate a pulse modulation signal and send it to the isolated gate drive chip; The isolated gate drive chip has an output end connected to the SMD IGBT for controlling the switching of the SMD IGBT, and the output end and the SMD IGBT maintain a preset safety distance; The magnetic encoder chip is arranged at the center of a preset circular area, and the center of the circular area is directly opposite to the axis of the external motor connected to the circuit board.

2. The chassis patch SiC magnetic encoding integrated circuit board according to claim 1, characterized in that: The ground layer includes a power ground and a signal ground, and the power ground and the signal ground are connected via a single-point grounding method.

3. The chassis patch SiC magnetic encoding integrated circuit board according to claim 1, characterized in that: The three-phase terminal is connected to one end of a lead in a controller where the circuit board is located, and the other end of the lead is connected to a motor in the controller.

4. The chassis patch SiC magnetic encoding integrated circuit board according to claim 1, characterized in that: Each SMD IGBT maintains a distance of 4mm to 5mm from each other.

5. The chassis patch SiC magnetic encoding integrated circuit board according to claim 1, characterized in that: The isolated gate drive chip is connected to a TVS tube for protecting the circuit in the circuit board.

6. The chassis patch SiC magnetic encoding integrated circuit board according to claim 1, characterized in that: It also includes a plurality of ceramic sheets, which are dispersedly arranged on the TOP surface and the BOTT0M surface for dissipating heat for the circuit board.

7. The chassis patch SiC magnetic encoding integrated circuit board according to claim 1, characterized in that: The three-phase terminals and the chip IGBT are connected via copper cladding.

8. The chassis patch SiC magnetic encoding integrated circuit board according to claim 1, characterized in that: A honeycomb-shaped via array is arranged on the pad of the SMD IGBT, and a ceramic sheet is arranged between the SMD IGBT and the via array.

Images