Auxiliary heat dissipation structure of circuit board

Abstract

An auxiliary heat dissipation structure of a circuit board comprises two side bottom rods, an installation top frame, a heat dissipation device and a driving device, the two sides of the bottom of the installation top frame are clamped on the side bottom rods and can move along the side bottom rods, and the heat dissipation device and the driving device are both installed on the installation top frame. The driving device is connected to the heat dissipation device and pushes the heat dissipation device to move left and right in the extension direction of the mounting top frame; the heat dissipation device comprises a fan, an air inlet seat and a heat dissipation seat, an air inlet, an air blowing opening and an air outlet are formed in the air inlet seat, the air inlet is formed in the top end, the air blowing opening is formed in the bottom end, the air outlet is formed in the outer side or above one side, and the heat dissipation seat is arranged on the outer side of the air outlet. An air inlet cavity is formed in the air inlet seat, the air inlet cavity is gradually reduced from top to bottom, and the fan is arranged at the air inlet; and a plurality of hollowed-out cooling strip groups which are connected in sequence are arranged in the air inlet cavity. The device is high in practicability and has high popularization significance.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an auxiliary heat dissipation structure of a circuit board. Background Art

[0002] Circuit boards, also known as circuit boards, are mainly used to connect various electronic components in electronic devices and serve as structural supports. When electronic devices are working, electronic devices consume power to varying degrees, and the intensity of heat generation varies with the power consumption, resulting in local temperature rise, large-area temperature rise, short-term temperature rise, and long-term temperature rise on the circuit board. If the heat is not dissipated in time, some components on the circuit board will fail due to overheating. The heat dissipation method in the prior art is to optimize the structural layout of components and use a fan to blow air to the approximate area to dissipate heat, but there are problems such as poor heat dissipation effect and inability to accurately and efficiently dissipate heat in local high-temperature areas. Utility Model Content

[0003] Based on this, it is necessary to provide an auxiliary heat dissipation structure for a circuit board to address the deficiencies in the prior art.

[0004] The auxiliary heat dissipation structure of a circuit board comprises bottom bars on both sides, a mounting top frame, a heat dissipation device and a driving device, wherein the outer side surface of the side bottom bars is provided with convex strips, and the inner side surface is provided with slots; the bottom sides of the mounting top frame are engaged with the convex strips and can move along the convex strips, the heat dissipation device and the driving device are both installed on the mounting top frame, and the driving device is connected to the heat dissipation device and pushes it to move left and right along the extension direction of the mounting top frame; the heat dissipation device comprises a fan, an air inlet seat and a heat dissipation seat, and the air inlet seat is provided with an air inlet, an air blowing port and an air outlet, the air inlet is arranged at the top end, the air blowing port is arranged at the bottom end, the air outlet is arranged on the outside or above one side, and the heat dissipation seat is arranged outside the air outlet. An air inlet cavity is arranged in the air inlet seat, and the air inlet cavity is gradually reduced from top to bottom, and the fan is arranged at the air inlet; a plurality of orderly connected hollow cooling strip groups are arranged in the air inlet cavity, and a cooling grid is formed between the cooling strip groups; the cooling strip group is arranged in a shape of small on the top, large in the middle and small at the bottom, and four cooling strips extend from the vertex to the middle, and the four cooling strips converge from the middle to the bottom to form a bottom end point; the cooling strip groups are then arranged and connected in sequence up, down, left and right.

[0005] Furthermore, the mounting top frame is arranged in a frame shape, and two mounting shafts extending along the extending direction thereof are arranged inside the mounting top frame, and the heat dissipation device is installed on the two mounting shafts.

[0006] Furthermore, the driving device is installed on the outside of the mounting top frame, and a driving wheel is provided on the driving device. The two mounting shafts are provided with transmission gears on the same outside of the side plates, and the two transmission wheels are respectively arranged on the left and right sides of the driving wheel, and both are meshed with the driving wheel.

[0007] Furthermore, the installation shaft is provided with an external thread, the spiral directions of the external threads on the two installation shafts are opposite, the heat dissipation device is provided with a screw hole, and the installation shaft is screwed into the screw hole.

[0008] Furthermore, an extension portion is provided on the outer side of the bottom of the air inlet seat, and the air outlet is arranged on the top or side of the extension portion.

[0009] Furthermore, the cooling strip is hollow and contains cooling liquid.

[0010] Furthermore, a limiting wall is arranged at one end of the card slot, and the other end is a card entrance; two opposite side edges of the circuit board are inserted into the card slot from the card entrance.

[0011] Furthermore, a baffle portion is provided at one end of the convex strip, and the baffle portion extends to the upper and lower sides of the convex strip.

[0012] Furthermore, it also includes a positioning frame, the side bottom rod is installed below the inner side surface of the positioning frame; the mounting top frame is installed in the positioning frame above the side bottom rod.

[0013] Furthermore, guide grooves are provided on two opposite inner side surfaces of the position adjustment frame, and both ends of the mounting top frame are accommodated in the guide grooves.

[0014] In summary, the utility model can greatly improve the cooling effect by setting a targeted cooling device to cool down the electronic components. By setting a cooling strip, not only can the fan's fluidity be ensured, but the wind can also be cooled, so that the wind blowing to the electronic components is cooling wind, and the cooling effect is good. The hot air can be discharged from the air outlet to the heat sink in time for heat dissipation, which has little impact on other components. The utility model is highly practical and has a strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of an auxiliary heat dissipation structure of a circuit board of the utility model;

[0016] Figure 2 for Figure 1 A schematic diagram of the structure of the heat dissipation structure from another perspective;

[0017] Figure 3 It is an exploded schematic diagram of the heat dissipation device in the figure;

[0018] Figure 4 for Figure 3 Structural diagram of the middle air inlet seat;

[0019] Figure 5 It is a schematic cross-sectional structure diagram of another embodiment of an auxiliary heat dissipation structure of a circuit board of the utility model;

[0020] Figure 6 for Figure 5 Schematic diagram of the structure of the heat dissipation device. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] like Figures 1 to 6 As shown, the utility model provides an auxiliary heat dissipation structure 100 for a circuit board, which is used to assist in heat dissipation of a circuit board 200 to improve heat dissipation efficiency. The auxiliary heat dissipation structure 100 for a circuit board comprises two side bottom bars 10, a mounting top frame 20, a heat dissipation device 30 and a driving device 40. The inner side surfaces of the two side bottom bars 10 are respectively clamped on two opposite side surfaces of the circuit board 200, and the two ends of the mounting top frame 20 are movably mounted on the outer side surfaces of the two side bottom bars 10. The heat dissipation device 30 and the driving device 40 are both mounted on the mounting top frame 20, and the driving device 40 is connected to the heat dissipation device 30.

[0023] A convex strip 11 is provided on the outer side surface of the side bottom rod 10, and a slot 12 is provided on the inner side surface of the side bottom rod 10. A limiting wall 121 is provided at one end of the slot 12, and the other end is a slot entrance. The two opposite side edges of the circuit board 200 are inserted into the slot 12 from the slot entrance, and the limiting wall 121 limits the circuit board 200. A baffle portion 111 is provided at one end of the convex strip 11, and the baffle portion 111 extends to the upper and lower sides of the convex strip 11. A side plate 21 is provided on each side of the bottom surface of the mounting top frame 20, and a mounting slot 211 is provided on the inner surface of the side plate 21. The convex strip 11 is clamped in the mounting slot 211, and the baffle portion 111 limits the side plate 21.

[0024] The mounting top frame 20 is arranged in a frame shape, and two mounting shafts 22 extending along the extending direction thereof are arranged inside the mounting top frame 20, and the heat sink 30 is arranged on the two mounting shafts 22. The driving device 40 is arranged on the outer side of the mounting top frame 20, and a driving wheel 41 is arranged on the driving device 40. The two mounting shafts 22 are provided with transmission gears 221 on the same outer side of the side plate 21, and the two transmission wheels 221 are respectively arranged on the left and right sides of the driving wheel 41, and both are meshed with the driving wheel 41. The driving device 40 drives the driving wheel 41 to drive the two transmission wheels 221 to rotate, and the transmission wheel 211 drives the two mounting shafts 22 to rotate. The mounting shaft 22 is provided with an external thread, and the external threads on the two mounting shafts 22 have opposite spiral directions, so that the heat sink 30 will move to the left or right. The heat sink 30 is provided with a mounting hole, and the mounting hole is provided with an internal thread, and the internal threads of the two mounting holes are opposite in direction and consistent with the threads of the corresponding mounting shafts 22.

[0025] The heat dissipation device 30 includes a fan 31, an air inlet seat 32 and a heat dissipation seat 33. The air inlet seat 32 is provided with an air inlet 321, an air outlet 322 and an air outlet 323. The air inlet 321 is provided at the top, the air outlet 322 is provided at the bottom, the air outlet 323 is provided at the outside or above one side, and the heat dissipation seat 33 is provided above one side of the air outlet 323. Specifically, an air inlet cavity is provided in the air inlet seat 32, and the air inlet cavity is gradually reduced from top to bottom. The fan 31 is provided at the air inlet 321. A plurality of orderly connected hollow cooling strip groups 33 are provided in the air inlet cavity, and a cooling grid is formed between the cooling strip groups 33. The cooling strip group 33 is provided in a shape of small at the top, large in the middle and small at the bottom, and four cooling strips 331 extend from its apex to the middle, and the four cooling strips 331 converge from the middle to the bottom to form a bottom end point; the cooling strip groups 33 are then arranged and connected in sequence up, down, left and right. In this embodiment, the cooling strip 331 is hollow and contains cooling liquid.

[0026] An extension portion 324 is provided on the outer side of the bottom of the air inlet seat 32, and the air outlet 323 is arranged on the top or side of the extension portion 324. The heat sink 33 is made of a metal material with good heat dissipation, and includes a bottom plate 331 and a plurality of heat dissipation fins 332 arranged on the bottom plate 331. The bottom plate 331 is provided with through holes 333, and the through holes 333 are arranged corresponding to the air outlet 323. Furthermore, except for the two outermost heat dissipation fins 332, the other heat dissipation fins 332 in the middle are divided into a plurality of fin segments to facilitate the uniform dissipation and transfer of heat. In this embodiment, the heat dissipation fins 332 are gradually narrowed from bottom to top, and the gaps between the heat dissipation fins 332 gradually widen to facilitate heat dissipation.

[0027] like Figures 4 to 5As shown, it is the second embodiment of the utility model. The structure of this embodiment is basically the same as that of the first embodiment, except that, in this embodiment, it also includes a position adjustment frame 50, and the side bottom rod 10 is installed below the inner side surface of the position adjustment frame 50. Guide grooves 51 are provided on the two opposite inner sides of the position adjustment frame 50, and both ends of the mounting top frame 20a are accommodated in the guide grooves 51 and are located above the side bottom rod 10. A lifting drive 51 is provided on the top of the position adjustment frame 50, and a gas rod extends from the bottom end of the lifting drive 51, and the gas rod is connected to the top surface of the mounting top frame 20a; the lifting drive 51 drives the mounting top frame 20a to move up and down along the guide groove 51 through the gas rod.

[0028] The air outlet 322 is provided with a receiving cavity 325 for receiving electronic components. When the heat sink 30 is moved to the position of the electronic component with high heat dissipation, the lifting drive 51 drives the mounting top frame 20a and the heat sink 30 to move downward to receive the electronic component in the receiving cavity 325, so as to gather heat and discharge the heat from the air outlet 323a, thereby further improving the heat dissipation efficiency and preventing the heat from being dissipated to other positions.

[0029] In summary, the utility model can greatly improve the cooling effect by setting a targeted cooling device to cool down the electronic components. By setting a cooling strip, not only can the fan's fluidity be ensured, but the wind can also be cooled, so that the wind blowing to the electronic components is cooling wind, and the cooling effect is good. The hot air can be discharged from the air outlet to the heat sink in time for heat dissipation, which has little impact on other components. The utility model is highly practical and has a strong promotion significance.

[0030] The above-mentioned embodiments only express two implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An auxiliary heat dissipation structure of a circuit board, characterized in that: The heat dissipation device comprises bottom bars on both sides, a mounting top frame, a heat dissipation device and a driving device, wherein the outer side surface of the side bottom bars is provided with convex strips, and the inner side surface is provided with a card slot; the bottom sides of the mounting top frame are engaged with the convex strips and can move along the convex strips, the heat dissipation device and the driving device are both installed on the mounting top frame, and the driving device is connected to the heat dissipation device and pushes it to move left and right along the extension direction of the mounting top frame; the heat dissipation device comprises a fan, an air inlet seat and a heat dissipation seat, the air inlet seat is provided with an air inlet, an air outlet and an air outlet, and the air inlet is arranged at the top The air outlet is arranged at the bottom, the air outlet is arranged on the outside or on one side, and the heat dissipation seat is arranged on the outside of the air outlet; an air inlet cavity is arranged in the air inlet seat, and the air inlet cavity is gradually reduced from top to bottom, and the fan is arranged at the air inlet; a plurality of orderly connected hollow cooling strip groups are arranged in the air inlet cavity, and a cooling grid is formed between the cooling strip groups; the cooling strip group is arranged in a shape of small on the top, large in the middle and small on the bottom, and four cooling strips are extended from its vertex to the middle, and the four cooling strips converge from the middle to the bottom to form a bottom end point; the cooling strip groups are then arranged and connected in sequence up, down, left and right.

2. The auxiliary heat dissipation structure of a circuit board as claimed in claim 1, characterized in that: The mounting top frame is arranged in a frame shape, and two mounting shafts extending along the extending direction thereof are arranged inside the mounting top frame, and the heat dissipation device is arranged on the two mounting shafts; and a side plate is arranged on each side of the bottom surface of the mounting top frame.

3. The auxiliary heat dissipation structure of a circuit board as claimed in claim 2, characterized in that: The driving device is installed on the outside of the mounting top frame, and a driving wheel is arranged on the driving device. The two mounting shafts are provided with transmission gears on the same outside of the side plates. The two transmission wheels are respectively arranged on the left and right sides of the driving wheel, and both are meshed with the driving wheel.

4. The auxiliary heat dissipation structure of a circuit board as claimed in claim 2, characterized in that: The installation shaft is provided with an external thread, and the spiral directions of the external threads on the two installation shafts are opposite. The heat dissipation device is provided with a screw hole, and the installation shaft is screwed into the screw hole.

5. The auxiliary heat dissipation structure of a circuit board as claimed in claim 1, characterized in that: An extension portion is disposed on the outer side of the bottom of the air inlet seat, and the air outlet is disposed on the top or side of the extension portion.

6. The auxiliary heat dissipation structure of a circuit board as claimed in claim 1, characterized in that: The cooling strip is hollow and contains cooling liquid.

7. The auxiliary heat dissipation structure of a circuit board as claimed in claim 1, characterized in that: One end of the card slot is provided with a limiting wall, and the other end is a card entrance; two opposite side edges of the circuit board are carded into the card slot from the card entrance.

8. The auxiliary heat dissipation structure of a circuit board as claimed in claim 1, characterized in that: A baffle portion is provided at one end of the convex strip, and the baffle portion extends to the upper and lower sides of the convex strip.

9. The auxiliary heat dissipation structure of a circuit board as claimed in claim 1, characterized in that: It also includes a position adjustment frame, wherein the side bottom rod is installed below the inner side surface of the position adjustment frame; and the mounting top frame is installed in the position adjustment frame above the side bottom rod.

10. The auxiliary heat dissipation structure of a circuit board as claimed in claim 9, characterized in that: Guide grooves are arranged on two opposite inner sides of the position adjustment frame, and both ends of the mounting top frame are accommodated in the guide grooves.

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