Photoelectric packaging structure

Abstract

The utility model discloses a photoelectric packaging structure. The photoelectric packaging structure comprises a substrate, a sensing component, a light-emitting component, a first dam structure and a second dam structure, the sensing assembly and the light-emitting assembly are arranged on the substrate. The first dam structure is arranged on the substrate and covers the side edge of the sensing assembly. The second dam structure is arranged on the first dam structure. The first dam structure and the second dam structure are located between the sensing assembly and the light-emitting assembly. Therefore, according to the photoelectric packaging structure provided by the invention, crosstalk can be effectively reduced, the light receiving efficiency of the sensing assembly is improved, and the height of the whole structure is reduced.

Description

Technical Field

[0001] The present application relates to an optoelectronic packaging structure, and in particular to a miniaturized optoelectronic packaging structure capable of improving a signal-to-noise ratio. Background Art

[0002] In the prior art, optical physiological sensors use the method of comparing detection signal differences to sense human physiological characteristics. Generally speaking, optical physiological sensors only sense light within a specific wavelength range. Therefore, in order to reduce unnecessary light (so-called stray light) from entering the sensor and make the sensing results more accurate, a filter is used to filter out light that is not within the wavelength sensing range, thereby reducing the energy loss caused by light passing through the filter.

[0003] However, the optical physiological sensor of the prior art usually uses a plastic shell to cover the sensing component and the light emitting component, and uses a filter attached to the plastic shell to cover the opening of the plastic shell to achieve the filtering effect. This type of sensor packaging structure has a large size. In addition, the amount of glue required to fix the plastic shell on the substrate is difficult to control. When the amount of glue is too much, it is easy to cause glue overflow and cause the plastic shell to deviate. Utility Model Content

[0004] The technical problem to be solved by the present application is to provide an optoelectronic packaging structure with a miniaturized size and improved signal-to-noise ratio in view of the deficiencies of the prior art.

[0005] In order to solve the above technical problems, one of the technical solutions adopted in the present application is to provide an optoelectronic packaging structure, which includes a substrate, a sensing component, a light-emitting component, a first dam structure and a second dam structure. The sensing component and the light-emitting component are arranged on the substrate. The first dam structure is arranged on the substrate and covers the side of the sensing component. The second dam structure is arranged on the first dam structure. The first dam structure and the second dam structure are located between the sensing component and the light-emitting component.

[0006] Optionally, the first dam structure includes a main body and an extending portion connected to one side of the main body, and the extending portion extends to the upper surface of the sensing component.

[0007] Optionally, from the cross-sectional perspective of the optoelectronic packaging structure, the main body and the extension portion are both tapered structures that taper from bottom to top.

[0008] Optionally, the extension portion has a first width at a position connected to the upper surface of the sensing component, the bottom of the body has a second width, and the first width is less than or equal to 1 / 3 of the second width.

[0009] Optionally, the aspect ratio of the first dam structure is greater than 1.

[0010] Optionally, the width of the second dam structure is greater than the width of the first dam structure.

[0011] Optionally, the optoelectronic packaging structure further includes a first packaging body, which is disposed on the substrate and covers the sensing component and the light-emitting component.

[0012] Optionally, the optoelectronic packaging structure further includes a second packaging body surrounding the first packaging body.

[0013] Optionally, the first dam structure and the second dam structure divide the first package body into a first part and a second part which are separated from each other and do not contact each other, the first part encapsulates the light emitting component, and the second part encapsulates the sensing component.

[0014] Optionally, from the cross-sectional perspective of the optoelectronic packaging structure, there is a first vertical distance between the top of the first part and a first center position on the upper surface of the light-emitting component, there is a first horizontal distance between the first center position and the side of the second dam structure, there is a second vertical distance between the top of the second part and a second center position on the upper surface of the sensing component, there is a second horizontal distance between the second center position and the side of the second dam structure, and the ratio of the first horizontal distance to the first vertical distance is equal to the ratio of the second horizontal distance to the second vertical distance.

[0015] Optionally, from a cross-sectional perspective of the optoelectronic packaging structure, the first dam structure includes a main body and an extension portion connected to one side of the main body, the extension portion extends to the upper surface of the sensing component, the extension portion has a first width at a position where the extension is connected to the upper surface of the sensing component, and there is a first height between the top of the extension portion and the upper surface of the sensing component, and the ratio of the first width to the first height is equal to the ratio of the first horizontal distance to the first vertical distance.

[0016] Optionally, the substrate has a top surface, the top surface includes a first upper surface and a second upper surface, and a step is provided between the first upper surface and the second upper surface.

[0017] Optionally, the substrate further includes a plurality of first metal pads and a plurality of second metal pads, the plurality of first metal pads are electrically connected to the plurality of second metal pads, the plurality of first metal pads are disposed on the first upper surface, and the plurality of second metal pads are disposed on the bottom surface of the substrate.

[0018] Optionally, the optoelectronic packaging structure further includes a light filtering structure disposed on the top surface of the first packaging body, the light filtering structure includes a light absorbing element and a light filtering element, the light absorbing element has an opening, and the light filtering element is exposed in the opening.

[0019] Optionally, the light absorbing element includes a first light absorbing element and a second light absorbing element, and the light filtering element includes a first light filter element and a second light filter element, wherein the first light filter element is exposed at an opening of the first light absorbing element, and the center projection of the opening corresponds to the center position of the light-emitting component; wherein the second light filter element is exposed at an arc-shaped opening of the second light absorbing element, a portion of the contour edge of the arc-shaped opening is a straight line segment, and the orthographic projection of the straight line segment corresponds to the first dam structure and the second dam structure adjacent to the sensing component.

[0020] Beneficial effects of the utility model

[0021] One of the beneficial effects of the present application is that the optoelectronic packaging structure provided by the present application can effectively reduce crosstalk and improve the light receiving efficiency of the sensing component by covering the side of the sensing component with the first dam structure and the second dam structure being arranged on the first dam structure. In addition, the optoelectronic packaging structure provided by the present application can reduce the height of the overall structure, which is in line with the development trend of miniaturization.

[0022] To further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the drawings provided are only for reference and illustration and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional schematic diagram of the optoelectronic packaging structure of the first embodiment of the present application.

[0024] Figure 2 It is a partial exploded view of the optoelectronic packaging structure of the first embodiment of the present application. Figure 3 It is a cross-sectional schematic diagram of an implementation aspect of the optoelectronic packaging structure of the first embodiment of the present application.

[0025] Figure 4 for Figure 3 Schematic diagram of enlarged portion IV.

[0026] Figure 5 It is a cross-sectional schematic diagram of another implementation aspect of the optoelectronic packaging structure of the first embodiment of the present application.

[0027] Figure 6 It is a schematic diagram of an exploded view of a substrate of the optoelectronic packaging structure of the present application.

[0028] Figure 7 It is a three-dimensional schematic diagram of the optoelectronic packaging structure of the second embodiment of the present application.

[0029] Figure 8 It is a partial exploded view of the optoelectronic packaging structure of the second embodiment of the present application.

[0030] Fig. 9It is a cross-sectional schematic diagram of the optoelectronic packaging structure of the second embodiment of the present application. DETAILED DESCRIPTION

[0031] The following is an explanation of the implementation methods of the "optoelectronic packaging structure" disclosed in this application through specific embodiments. Those skilled in the art can understand the advantages and effects of this application from the contents disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. In addition, the drawings of this application are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of this application in detail, but the disclosed contents are not intended to limit the scope of protection of this application.

[0032] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another element. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0033] First embodiment

[0034] See also Figure 1 and Figure 2 As shown, the first embodiment of the present application provides an optoelectronic packaging structure M, which includes a substrate 1, a sensing component, a light emitting component 4, a first dam structure 5 and a second dam structure 6. The substrate 1 can be a circuit board, and the sensing component and the light emitting component 4 are disposed on the substrate 1.

[0035] For example, the optoelectronic package structure M of the present application is a photoelectric sensor for sensing physiological characteristics of the human body. The light emitting component 4 is a combination of one or more light emitting diodes (LEDs) and laser diodes, which can emit light of different wavelengths, such as infrared light, ultraviolet light or visible light, for detection by the sensing component. Figure 3 and Figure 5 In some embodiments, the sensing component can be a sensing unit 3 disposed on the carrier 2 (eg Figure 3 ) or a carrier 2' having a light detection area 21 on its surface (eg Figure 5 ).

[0036] like Figure 3 As shown, the carrier 2 can electrically connect the sensing unit 3 and the substrate 1 (circuit board) through its internal circuit or internal structure to achieve the function of transmitting signals. Figure 5As shown, the sensing component is a carrier 2' having one or more light detection areas 21, which may also include a filter structure for ambient light sensing (ALS). In other words, when the sensing component includes a carrier 2, 2', the carrier 2, 2' is used as a carrier to carry the sensing unit, and the carrier 2, 2' can be a controller, a processor, a memory, an application specific integrated circuit (ASIC), an analog front end (AFE) IC component, etc. In addition, it should be noted that the optoelectronic packaging structure M' is Figure 5 The aspect shown can be further reduced in size.

[0037] The sensing unit 3 may be a photodetector, a phototransistor (PTR), a photodiode or a photosensitive IC. The light emitting component 4 may emit light to the surface of an external object (such as the surface of human skin), which is then reflected back and received by the sensing component and converted into an electrical signal to detect changes in the state of the object (such as the physiological characteristics of the human body).

[0038] In the embodiment of the present application, the light emitting assembly 4 includes two light emitting units 41 and 42 for emitting near infrared light with a wavelength between 700 nm and 1500 nm, but the present application is not limited thereto.

[0039] See also Figure 3 and Figure 4 As shown, the first dam structure 5 is disposed on the substrate 1, and the second dam structure 6 is disposed on the first dam structure 5. Specifically, the bottom of the second dam structure 6 contacts and covers the top of the first dam structure 5. The maximum width of the second dam structure 6 in the horizontal direction is greater than the maximum width of the first dam structure 5 in the horizontal direction. The first dam structure 5 and the second dam structure 6 are located between the light emitting component 4 and the sensing component. In other words, the first dam structure 5 and the second dam structure 6 together form a retaining wall structure to separate the light emitting component 4 and the sensing component.

[0040] like Figure 2 As shown, the optoelectronic package structure M further includes a first package body 7 and a second package body 8. The first package body 7 is disposed on the substrate 1, and the second package body 8 surrounds the first package body 7. The first package body 7 covers the carrier 2, the sensing component and the light emitting component 4. Figure 3 As shown, the first dam structure 5 and the second dam structure 6 together divide the first package body 7 into a first portion 71 and a second portion 72 that are separated and not in contact with each other. The first portion 71 encloses the light emitting element 4, and the second portion 72 encloses the carrier 2 and the sensing unit 3.

[0041] The second dam structure 6 and the second package body 8 are integrally formed structures made of the same material. Specifically, the second dam structure 6 is a part of the second package body 8. In the process of manufacturing the optoelectronic package structure M, first, the carrier 2 is placed on the substrate 1, the sensing component is placed on the carrier 2, and the light-emitting component 4 is placed on the substrate 1. Then, a first light-proof adhesive is arranged on the side adjacent to the carrier 2 by dispensing to form the first dam structure 5. The first dam structure 5 covers the side of the carrier 2, and a part of the first dam structure 5 extends to the upper surface 21 of the carrier 2. Then, a transparent colloid, that is, the first package body 7 is arranged on the substrate 1 to cover the carrier 2, the sensing component, the light-emitting component 4 and the first dam structure 5. After that, the outer peripheral part of the first package body 7 and the part located above the first dam structure 5 are removed to form some accommodation spaces, and then a second light-proof adhesive is covered in the accommodation spaces by molding. Therefore, the second light-proof adhesive material filled around the outer side of the first packaging body 7 forms the outer structure of the second packaging body 8 , and the second light-proof adhesive material filled above the first dam structure 5 forms the second dam structure 6 .

[0042] As can be seen from the above, both the first dam structure 5 and the second dam structure 6 are opaque structures. However, since the two are made in different ways, the proportions of the constituent materials will also be different. The first dam structure 5 located in the lower layer needs to play a supporting role, so it has a higher hardness. In addition, the first dam structure 5 is closer to the light-emitting component 4 than the second dam structure 6, so it needs to have better light absorption and rotation, that is, the light transmittance is lower. Specifically, the Shore Hardness of the first dam structure 5 is greater than or equal to D70, and the proportion of carbon black doped inside the first dam structure 5 is greater than 25%. The Shore hardness of the second dam structure 6 is D65, and the proportion of carbon black doped inside the second dam structure 6 is less than 25%. The first dam structure 5 and the second dam structure 6 of the present application can make the light transmittance in the 700nm~1500nm band less than 0.2%, effectively reducing the crosstalk caused by stray light to the sensing component and improving the light receiving efficiency. It is worth mentioning that the hardness of the second dam structure 6 is preferably close to the hardness of the first package body 7 to avoid peeling.

[0043] Specifically, the first dam structure 5 includes a main body 51 and an extension portion 52 connected to one side of the main body 51, and the extension portion 52 is the portion of the first dam structure 5 extending to the upper surface 21 of the carrier 2. The first dam structure 5 can be closely adjacent to and cover the side of the carrier 2 and utilize the structural design of the extension portion 52 to further enhance the support and reduce the occurrence of crosstalk. Due to the different molding methods, the thixotropic index (Ti value for short) of the first dam structure 5 is higher, preferably greater than 5, and the best is 10. The thixotropic index of the second dam structure 6 is lower, generally less than or equal to 2. The thixotropic index refers to the ability of a structure (such as the first dam structure 5 and the second dam structure 6 in the present application) to restore its original shape after being damaged by shear force. The higher the Ti value, the stronger the ability of the fluid to restore its original shape.

[0044] Further, if Figure 3 As shown, from the cross-sectional perspective of the optoelectronic packaging structure M, the main body 51 and the extension 52 are both tapered structures that taper from bottom to top. Furthermore, the present application uses a first opaque adhesive with a relatively high hardness and a relatively high thixotropic coefficient (Ti value is preferably 10) to form the first dam structure 5, so that the aspect ratio of the first dam structure 5 is greater than 1. The extension 52 has a first width W1 at the position connected to the upper surface 21 of the carrier 2, and the bottom of the main body 51 has a second width W2, and the first width W1 is less than or equal to 1 / 3 of the second width W2. Preferably, the first width W1 is greater than 50μm. The width W3 of the second dam structure 6 is greater than the width of the first dam structure 5 (the sum of the first width W1 and the second width W2). Through the above structural design, the first dam structure 5 can be stably attached to one side of the carrier 2. In addition, there is also a first height H1 between the top of the extension 52 of the first dam structure 5 (i.e., the contact position between the first dam structure 5 and the second dam structure 6) and the upper surface 21 of the carrier 2. Preferably, the first height H1 is greater than 50 μm.

[0045] See also Figure 3 and Figure 4From the cross-sectional perspective of the optoelectronic packaging structure M, there is a first vertical distance VL1 between the top of the first portion 71 of the first packaging body 7 and the first center position 4C of the upper surface 41 of the light-emitting component 4. There is a second vertical distance VL2 between the top of the second portion 72 and the upper surface of the sensing component, more precisely, the second center position 3C of the upper surface 31 of the sensing unit 3. Further, there is a first horizontal distance HL1 between the first center position 4C and one side 61 of the second dam structure 6, and there is a second horizontal distance HL2 between the second center position 3C and the other side 62 of the second dam structure 6. The ratio of the first horizontal distance HL1 to the first vertical distance VL1 is equal to the ratio of the second horizontal distance HL2 to the second vertical distance VL2. In addition, the ratio of the first width W1 to the first height H1 of the extension portion 52 is equal to the ratio of the first horizontal distance HL1 to the first vertical distance VL1.

[0046] Through the above Figure 3 and Figure 4 The distance ratio relationship shown can obtain the relative positions of the retaining wall (the first retaining dam structure 5 and the second retaining dam structure 6), the sensing component and the light-emitting component 4 in the packaging structure, thereby optimizing the overall size of the packaging structure and reducing crosstalk to improve the luminous efficiency. In other words, the optoelectronic packaging structure M of the present application can simultaneously meet the needs of improving luminous efficiency and miniaturization of the structure. Compared with the prior art, the optoelectronic packaging structure M provided by the present application can improve the luminous efficiency by more than 20% and reduce the height of the packaging structure by more than 20%.

[0047] It should also be noted that the photoelectric sensors in the prior art generally adopt planar packaging, which has a larger area. In contrast, the optoelectronic packaging structure M of the present application uses a redistribution layer (RDL) process to stack the sensing unit 3 on the carrier 2 for rewiring, thereby reducing the area of ​​the packaging structure, reducing the wiring complexity and improving the product yield. In addition, the optoelectronic packaging structure M of the present application further uses a through silicon via (TSV) process to form a plurality of conductive through holes inside the carrier 2 to replace part of the wiring, so as to reduce the number of wiring and simplify the circuit design. In addition, since the sensing unit 3 is stacked on the carrier 2, the light receiving efficiency can be improved.

[0048] See also Figure 3 As shown, the substrate 1 has a top surface 101 and a bottom surface 102 disposed opposite to each other. The top surface 101 of the substrate 1 is a stepped structure formed by the first upper surface P11 and the second upper surface P21, that is, there is a step difference between the first upper surface P11 and the second upper surface P21.

[0049] See also Figure 3 and Figure 6As shown, the substrate 1 also includes a plurality of first metal pads 11 and a plurality of second metal pads 12. The plurality of first metal pads 11 are disposed on the first upper surface P11, and the plurality of second metal pads 12 are disposed on the bottom surface 102 of the substrate 1. The plurality of first metal pads 11 can be electrically connected to the plurality of second metal pads 12 through conductive vias T. The substrate 1 also includes a first solder resist layer SM1 and a second solder resist layer SM2, wherein the first solder resist layer SM1 is disposed on the first upper surface P11, and surrounds the plurality of first metal pads 11 and fills the gaps between the plurality of first metal pads 11. The top of the first solder resist layer SM1 is flush with the top of the plurality of first metal pads 11. The first package 7, the sensing component, the light emitting component 4, and the first dam structure 5 are disposed above the flat surface formed by the first solder resist layer SM1 and the first metal pad 11. The second solder resist layer SM2 is stacked above the flattened surface formed by the first solder resist layer SM1 and the plurality of first metal pads 11, and the sensing component and the first dam structure 5 are disposed on the second solder resist layer SM2. Most of the flattened surface is covered by the second solder resist layer SM2, and only a portion of the first metal pads 11 is exposed to form a plurality of welding regions SR. Therefore, when the carrier 2 is placed on the substrate 1, it is in direct contact with the second solder resist layer SM2. The design of two layers of solder resist can maintain the flatness of the bottom contact surface of the carrier 2, prevent the carrier 2 from tilting when placed on the substrate 1, increase the wire bonding stability and improve product reliability.

[0050] The sensing unit 3 and the carrier, as well as the carrier 2 and the plurality of soldering regions SR on the substrate 1 can be electrically connected through a plurality of metal wires E. It is worth mentioning that the bottom surface 102 of the substrate 1 is also provided with a third solder resist layer SM3 surrounding the plurality of first metal pads 11 .

[0051] Second embodiment

[0052] See also Figures 7 to 9 As shown, the optoelectronic packaging structure M provided in the second embodiment of the present application is similar to the structure of the first embodiment, and the similarities are not repeated here. The main difference is that the optoelectronic packaging structure M in the second embodiment of the present application also includes a filter structure 9. For example, the filter structure 9 is disposed on the top surface 7S of the first package body 7. The filter structure 9 may include a light absorbing element 91 and a filter element 92 stacked on each other. Specifically, the light absorbing element 91 is a layer of opaque film, and the filter element 92 may be a color filter. The light absorbing element 91 has an opening, and the filter element 92 is disposed below the light absorbing element 91 and facing the opening 910. The light absorbing element 91 covers the top surface 7S of the first package body 7. When the light absorbing element 91 and the filter element 92 are stacked, the opening 910 is covered by the filter element 92, so that the filter element 92 is exposed at the opening 910. During the manufacturing process, the light filter 92 is first formed on the top surface 7S of the first package body 7 by sputtering, and then the light absorbing element 91 is covered on the light filter 92 to form the light filter structure 9 .

[0053] Since the first package body 7 is divided into a first portion 71 and a second portion 72 by the first dam structure 5 and the second dam structure 6, the filter structure 9 may include two portions accordingly, that is, the light absorbing element 91 may include a first light absorbing element 911 and a second light absorbing element 912, and the light filter element 92 may include a first light filter element 921 and a second light filter element 922. The first light absorbing element 911 and the first light filter element 921 are located at the top of the first portion 71, the first light absorbing element 911 is stacked above the first light filter element 921, and the first light filter element 921 is exposed at the opening 9110 of the first light absorbing element 911. The second light absorbing element 912 and the second light filter element 922 are located at the top of the second portion 72, the second light absorbing element 912 is stacked above the second light filter element 922, and the second light filter element 922 is exposed at the opening 9120 of the second light absorbing element 912.

[0054] See also Figure 8 and Fig. 9 As shown, the opening 9110 of the first filter 921 exposed from the first light absorbing member 911 is elliptical, wherein the orthographic projection of the center of the elliptical opening 9110 corresponds to the center point of the position of the light emitting component. More specifically, the orthographic projection of the center of the elliptical opening 9110 to the position of the two light emitting units 41, 42 will overlap the center points of the two light emitting units 41, 42. And the opening 9120 of the second filter 922 exposed from the second light absorbing member 912 is arc-shaped (close to a semicircle). One part of the contour edge of the semicircle is a straight line segment QL, wherein the orthographic projection of the straight line segment QL preferably corresponds to one side of the sensing unit / sensing area, which is adjacent to the retaining wall structure and the light emitting component 4. In other words, the projection line of the straight line segment QL projected onto the sensing unit / sensing area in the sensing component will be adjacent to the retaining wall structure and the light emitting component 4. By means of the structures of the first filter 921 and the second filter 922, the generation of noise can be further reduced.

[0055] Therefore, the present application filters out unnecessary light through the design of the filter structure 9 (light absorbing element 91 and filter element 92), so that the sensing component receives light in a specific wavelength range to reduce crosstalk. Further, the filter structure 9 is directly formed on the first package body 7. Compared with the prior art in which the filter is disposed in the inner cavity of the housing, the size of the filter structure 9 of the present application is not limited by the limited space inside the housing.

[0056] Advantageous Effects of Embodiments

[0057] The optoelectronic packaging structure M provided in the present application forms a retaining wall structure through a first dam structure 5 and a second dam structure 6. The first dam structure 5 covers the side of the sensing component, and the second dam structure 6 is arranged on the first dam structure 5 to effectively reduce crosstalk and improve the light receiving efficiency of the sensing component.

[0058] In addition, the optoelectronic packaging structure provided in the present application can further reduce the overall size of the packaging structure through a double molding structure consisting of a first packaging body 7 and a second packaging body 8, and a structural design of a sensing component (a carrier 2' having a light detection area 21 on the surface, or a sensing unit 3 stacked on the carrier 2), thereby meeting the demand for structural miniaturization.

[0059] The contents disclosed above are only preferred feasible embodiments of the present application, and are not intended to limit the protection scope of the claims of the present application. Therefore, all equivalent technical changes made using the contents of the present application specification and drawings are included in the protection scope of the claims of the present application.

Claims

1. An optoelectronic packaging structure, characterized in that: The optoelectronic packaging structure comprises: a substrate; A sensing component is disposed on the substrate; A light-emitting component is disposed on the substrate; a first dam structure, disposed on the substrate and covering the side of the sensing component; and a second retaining dam structure, disposed on the first retaining dam structure; The first dam structure and the second dam structure are located between the sensing component and the light emitting component.

2. The optoelectronic packaging structure according to claim 1, characterized in that: The first dam structure includes a main body and an extension portion connected to one side of the main body, and the extension portion extends to the upper surface of the sensing component.

3. The optoelectronic packaging structure according to claim 2, characterized in that: From the cross-sectional perspective of the optoelectronic packaging structure, the main body and the extension portion are both tapered structures that taper from bottom to top.

4. The optoelectronic packaging structure according to claim 2, characterized in that: The extension portion has a first width at a position connected to the upper surface of the sensing component, and the bottom of the body has a second width, and the first width is less than or equal to 1 / 3 of the second width.

5. The optoelectronic packaging structure according to claim 1, characterized in that: The aspect ratio of the first dam structure is greater than 1.

6. The optoelectronic packaging structure according to claim 1, characterized in that: The width of the second dam structure is greater than the width of the first dam structure.

7. The optoelectronic packaging structure according to any one of claims 1 to 6, characterized in that: The optoelectronic packaging structure further includes a first packaging body, which is disposed on the substrate and covers the sensing component and the light-emitting component.

8. The optoelectronic packaging structure according to claim 7, characterized in that: The optoelectronic packaging structure also includes a second packaging body surrounding the first packaging body.

9. The optoelectronic packaging structure according to claim 7, characterized in that: The first dam structure and the second dam structure divide the first package body into a first part and a second part which are separated from each other and do not contact each other. The first part covers the light emitting component, and the second part covers the sensing component.

10. The optoelectronic packaging structure according to claim 9, characterized in that: From the cross-sectional perspective of the optoelectronic packaging structure, there is a first vertical distance between the top of the first part and a first center position on the upper surface of the light-emitting component, there is a first horizontal distance between the first center position and the side of the second dam structure, there is a second vertical distance between the top of the second part and a second center position on the upper surface of the sensing component, there is a second horizontal distance between the second center position and the side of the second dam structure, and the ratio of the first horizontal distance to the first vertical distance is equal to the ratio of the second horizontal distance to the second vertical distance.

11. The optoelectronic packaging structure according to claim 10, characterized in that: From the cross-sectional perspective of the optoelectronic packaging structure, the first dam structure includes a main body and an extension portion connected to one side of the main body, the extension portion extends to the upper surface of the sensing component, the extension portion has a first width at the position connected to the upper surface of the sensing component, and there is a first height between the top of the extension portion and the upper surface of the sensing component, and the ratio of the first width to the first height is equal to the ratio of the first horizontal distance to the first vertical distance.

12. The optoelectronic packaging structure according to claim 8, characterized in that: The substrate has a top surface, and the top surface includes a first upper surface and a second upper surface. There is a step difference between the first upper surface and the second upper surface.

13. The optoelectronic packaging structure according to claim 12, characterized in that: The substrate further includes a plurality of first metal pads and a plurality of second metal pads, the plurality of first metal pads are electrically connected to the plurality of second metal pads, the plurality of first metal pads are disposed on the first upper surface, and the plurality of second metal pads are disposed on the bottom surface of the substrate.

14. The optoelectronic packaging structure according to claim 7, characterized in that: The optoelectronic packaging structure further includes a light filtering structure disposed on a top surface of the first packaging body. The light filtering structure includes a light absorbing component and a light filtering component. The light absorbing component has an opening, and the light filtering component is exposed at the opening.

15. The optoelectronic packaging structure according to claim 14, characterized in that: The light absorbing component includes a first light absorbing component and a second light absorbing component, and the light filter component includes a first light filter component and a second light filter component, wherein the first light filter component is exposed at an opening of the first light absorbing component, and the center projection of the opening corresponds to the center position of the light-emitting component; wherein the second light filter component is exposed at an arc-shaped opening of the second light absorbing component, and a portion of the contour edge of the arc-shaped opening is a straight line segment, and the orthographic projection of the straight line segment corresponds to the sensing component adjacent to the first dam structure and the second dam structure.

Images