Grinding equipment

Abstract

The utility model provides grinding equipment which comprises a grinding disc, a sample disc, a first driving mechanism and a second driving mechanism, the grinding disc comprises a grinding surface, the sample disc comprises a main body and a plurality of bosses, the main body comprises a first surface, and the bosses protrude relative to the first surface. Every two adjacent bosses are arranged at intervals so as to form a gap used for containing an adhesive, each boss further comprises a second surface used for abutting against a sample, the multiple second surfaces belonging to the different bosses are flush with one another, and the second surfaces are parallel to the grinding face. The first driving mechanism is used for making a sample abut against the grinding face, and the second driving mechanism is used for making the grinding disc move relative to the sample disc, so that the grinding face grinds the sample. The grinding equipment disclosed by the utility model can improve the consistency of the grinding effects of different areas of a sample.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor product testing, in particular to a grinding device. Background Art

[0002] The power module may fail during use. In order to determine the cause of the failure of the power module, the user will choose to open the back of the power module to observe and detect the chips and circuits inside the power module. Opening the back of the power module requires removing the ceramic substrate of the power module. The existing technology mainly removes the ceramic substrate by cutting and grinding. Compared with the method of removing the ceramic substrate by cutting, the method of removing the ceramic substrate by grinding has better applicability. The method of removing the ceramic substrate by grinding is suitable for power modules of various sizes.

[0003] However, in the prior art, the grinding equipment cannot firmly fix the power module. During the grinding process, the power module may shake and tilt, which will further lead to low consistency in the grinding effect of various parts of the ceramic substrate. If the power module is bonded to the sample plate of the grinding equipment, when the user presses the power module on the sample plate, the power module may also tilt because the adhesive has not completely solidified, which may lead to inconsistent grinding effects of various parts of the ceramic substrate. Or the adhesive is squeezed out of the gap between the power module and the sample plate in large quantities, which may lead to insufficient bonding between the power module and the sample plate and fall off during the grinding process, affecting the smooth progress of the grinding process. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a grinding device, which can improve the consistency of the grinding effect of various parts of the sample.

[0005] According to the grinding device of the embodiment of the utility model, it includes: a grinding disc including a grinding surface; a sample disc including a main body and a plurality of bosses, the main body including a first surface, the first surface and the grinding surface are arranged opposite to each other, the boss is connected to the first surface and protrudes relative to the first surface, two adjacent bosses are arranged at intervals to form a gap for accommodating an adhesive, the sample disc and the sample are fixed by the adhesive, the boss also includes a second surface for abutting against the sample, the second surface is located at the end of the boss facing away from the first surface, the second surface is a plane, and a plurality of second surfaces belonging to different bosses are flush with each other, and the second surface is parallel to the grinding surface; a first driving mechanism is used to drive the sample disc close to the grinding disc so that the sample mounted on the sample disc abuts against the grinding surface; a second driving mechanism is used to move the grinding disc relative to the sample disc when the sample abuts against the grinding surface, so that the grinding surface grinds the sample.

[0006] The grinding device according to the embodiment of the utility model has at least the following beneficial effects:

[0007] The grinding device of the utility model fixes the sample by bonding the sample to the sample plate, and the connection between the sample and the sample plate is relatively strong. Therefore, during the grinding process of the sample, the sample is not easy to shake relative to the sample plate, and the sample is not easy to tilt relative to the grinding surface, which is conducive to reducing the risk of inconsistent grinding effects in different areas of the sample.

[0008] Furthermore, since a plurality of bosses are provided and the second surfaces of the plurality of bosses are flush with each other, the sample tray can support the sample at multiple points, which is conducive to placing the sample flat in the sample tray and reducing the risk of the sample tilting relative to the grinding surface.

[0009] In addition, since the gap between the bosses is used to accommodate the adhesive, when the user presses the sample onto the bosses, the second surface abuts against the sample, and the bosses keep the distance between the sample and the first surface constant, the adhesive disposed in the gap is not easily squeezed out of the edge of the sample in large quantities. In this way, the adhesive originally applied on the sample disk can basically be maintained between the first surface and the sample, and most of the adhesive applied on the sample disk can play a bonding role, thereby ensuring the firmness of the connection between the sample and the sample disk, thereby reducing the risk of the sample falling off relative to the sample disk during the grinding process.

[0010] In summary, the grinding device of the present invention can reduce the risk of the sample tilting relative to the grinding surface, thereby reducing the risk of inconsistent grinding effects in different areas of the ceramic substrate.

[0011] According to some embodiments of the utility model, the main body is provided with a sample holding groove, and the main body also includes a third surface, the third surface is arranged opposite to the grinding surface, and the opening of the sample holding groove is arranged on the third surface; the wall surface of the end of the sample holding groove away from the opening is the first surface, and from the first surface to the third surface, the first surface, the second surface and the third surface are arranged in sequence.

[0012] According to some embodiments of the present invention, the sample holding groove includes a core area and two edge areas, the two ends of the core area in the first direction are respectively connected to one of the edge areas, the length of the core area in the second direction is greater than the length of the edge area in the second direction, the direction from the first surface to the third surface is the third direction, and any two of the first direction, the second direction and the third direction are perpendicular to each other.

[0013] According to some embodiments of the present invention, the length of the sample holding groove in the first direction is L1, the length of the sample holding groove in the second direction is L2, 0.5 cm≤L1≤10 cm, 0.5 cm≤L2≤10 cm.

[0014] According to some embodiments of the present invention, the distance between the second surface and the third surface is H, 2.5 mm≤H≤5.5 mm.

[0015] According to some embodiments of the present invention, the plurality of bosses are distributed in a rectangular array.

[0016] According to some embodiments of the utility model, the sample plate includes a plurality of columns of bosses spaced apart along a first direction, each column includes a plurality of bosses spaced apart along a second direction, the direction from the first surface to the second surface is a third direction, and any two of the first direction, the second direction and the third direction are perpendicular to each other; wherein a distance between two adjacent bosses in the first direction is D1, D1≥4mm; and / or a distance between two adjacent bosses in the second direction is D2, D2≥4mm.

[0017] According to some embodiments of the present invention, the boss is a cuboid, and the second surface is rectangular.

[0018] According to some embodiments of the present invention, the length of the long side of the second surface is L3, the length of the short side of the second surface is L4, 3mm≤L3≤6mm, 3mm≤L4≤6mm; and / or the protruding height of the boss relative to the first surface is L5, 1mm≤L5≤2mm.

[0019] According to some embodiments of the present invention, the sample tray is cylindrical, and the second driving mechanism can drive the sample tray to rotate around the central axis of the sample tray itself.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 It is a schematic diagram of a power module applicable to the grinding equipment of the utility model;

[0023] Figure 2 It is a schematic diagram of a state in which a grinding device in the prior art is grinding a power module;

[0024] Figure 3 It is a schematic diagram of another ideal situation in which a power module is bonded to a flat sample plate in the prior art;

[0025] Figure 4 is a schematic diagram of a situation where a power module is tilted relative to a flat sample tray;

[0026] Figure 5 A schematic diagram of a situation where excessive adhesive is squeezed out of the power module and the sample tray;

[0027] Figure 6 A schematic diagram of a grinding device according to an embodiment of the present invention;

[0028] Figure 7 A schematic diagram of a sample tray according to an embodiment of the present invention;

[0029] Figure 8 for Figure 7 A cross-sectional view of the sample disk along the AA section;

[0030] Fig. 9 for Figure 8 A schematic diagram of a state where the sample tray in FIG. 1 is installed with a power module;

[0031] Fig.10 It is a schematic diagram of a state in which the surface copper layer of a power module is about to be completely ground away by the grinding device of the utility model;

[0032] Fig.11 It is a schematic diagram showing a state where the ceramic layer of the power module has just been completely ground away by the grinding device of the present invention.

[0033] Reference numerals:

[0034] 101-power module, 102-surface copper layer, 103-ceramic layer, 104-internal copper layer, 105-molded body, 106-ceramic substrate;

[0035] 201-sample plate, 202-grinding plate, 203-mounting hole, 204-pressing rod;

[0036] 301 - grinding device, 302 - mounting arm, 303 - first joint, 304 - second joint, 305 - first axis, 306 - second axis, 307 - main body, 308 - boss, 309 - sample holding groove, 310 - core area, 311 - edge area, 312 - opening, 313 - first surface, 314 - second surface, 315 - third surface, 316 - grinding surface;

[0037] 401-Adhesive. DETAILED DESCRIPTION

[0038] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0041] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0042] In order to facilitate the introduction of the grinding equipment of the present invention, the samples of the grinding equipment suitable for the present invention and the grinding equipment in the prior art are first introduced below.

[0043] In one embodiment, the sample may be a power module 101. The structure of the power module 101 is as follows: Figure 1 As shown, the power module 101 is in the shape of a plate, and the power module 101 includes a ceramic substrate 106, a molded body 105 and a chip (the chip is not shown). The main material of the molded body 105 is epoxy resin, the chip is wrapped in the molded body 105, and the chip is located below the ceramic substrate 106. The ceramic substrate 106 includes a surface copper layer 102, a ceramic layer 103 and an internal copper layer 104 stacked on each other, the surface copper layer 102 and the internal copper layer 104 are respectively arranged on both sides of the ceramic layer 103, and the surface of the surface copper layer 102 facing away from the ceramic layer 103 is exposed outside the molded body 105. If it is necessary to perform a failure analysis on the power module 101, the user can grind off the ceramic substrate 106, so that the chip inside the molded body 105 and the circuit connected to the chip are exposed. In the process of grinding off the ceramic substrate 106, the part of the molded body 105 located at the outer edge of the ceramic substrate 106 will also be ground off.

[0044] Figure 1 The power module 101 shown includes only one ceramic substrate 106. In other embodiments, the power module 101 may also include two ceramic substrates 106, which are respectively arranged on the upper and lower sides of the molded body 105. In addition, the sample suitable for the grinding device of the utility model is not limited to the power module 101, and the sample may also be other types of semiconductor devices. The sample may also not be a semiconductor device, as long as the sample is an object to be ground. For the convenience of description, the power module 101 is used as the sample below.

[0045] Figure 2 FIG. 2 shows a method of grinding a power module 101 by a grinding device in the prior art. Figure 2 As shown, the grinding device includes a sample disc 201, a grinding disc 202 and a pressing rod 204. The sample disc 201 is provided with a mounting hole 203, in which the power module 101 is placed, and the hole wall of the mounting hole 203 is used to constrain the horizontal position of the power module 101. The pressing rod 204 presses the top of the power module 101 and presses the power module 101 onto the grinding disc 202. When the grinding disc 202 rotates relative to the sample disc 201, the grinding disc 202 grinds the power module 101.

[0046] It should be noted that if the size of the power module 101 does not match the size of the mounting hole 203, the user can first wrap the power module 101 with a resin material, and the size of the resin material after curing matches the size of the mounting hole 203; then, the user can place the resin material and the power module 101 into the mounting hole 203 together.

[0047] However, Figure 2 The grinding equipment shown can easily lead to inconsistent grinding effects in various areas of the ceramic substrate 106. Specifically, in order to facilitate the placement of the power module 101 into the mounting hole 203 or the removal of the power module 101 from the mounting hole 203, there is a gap between the hole wall of the mounting hole 203 and the power module 101. Even if the pressure rod 204 presses the power module 101, when the grinding disc 202 rotates, the power module 101 may still move in the horizontal direction, that is, the power module 101 may shake in the mounting hole 203. During the movement of the power module 101 in the mounting hole 203, if the center of gravity of the power module 101 and the central axis of the pressure rod 204 are staggered, then one side edge of the power module 101 may be tilted upward, while the other side edge is pressed downward. The friction between the tilted side edge of the power module 101 and the grinding disc 202 is small, and the amount of material removed by grinding on this side edge is small. The friction between the edge of the power module 101 that is pressed down and the diaphragm is relatively large, and the amount of material removed by grinding on this edge is relatively large, resulting in inconsistent grinding effects in different areas of the sample.

[0048] The inconsistent grinding effect of each area of ​​the ceramic substrate 106 may hinder the analysis of the failure cause of the power module 101. For example, during the grinding process, the grinding effect of the grinding device on the edge of the ceramic substrate 106 is better, but the grinding effect of the grinding device on the middle of the ceramic substrate 106 is poor. Accordingly, when the edge of the ceramic substrate 106 has been completely ground off, the middle of the ceramic substrate 106 has not been ground off. Further, when the middle of the ceramic substrate 106 is completely ground off, the chip corresponding to the edge of the ceramic substrate 106 may be partially ground off by the grinding device. This means that due to the inconsistent grinding effect of each area of ​​the ceramic substrate 106, the chip may be damaged during the grinding process of the ceramic substrate 106. As a result, it is difficult for the user to determine whether the damage to the chip is caused during the grinding process of the ceramic substrate 106 or during the use of the power module 101, and it is difficult to accurately determine the real failure cause of the power module 101.

[0049] Since the power module 101 is not completely fixed, Figure 2When the grinding device shown in the figure grinds the ceramic substrate 106, it is easy to cause the grinding effect of different areas of the ceramic substrate 106 to be inconsistent. Based on this, in order to solve the problem of inconsistent grinding effect of different areas of the ceramic substrate 106, another prior art is to bond the power module 101 to the sample plate 201. Figure 3 As shown, the sample tray 201 is in a flat plate shape, and the sample fixing surface of the sample tray 201 is a plane. The power module 101 is bonded to the sample fixing surface of the sample tray 201 by an adhesive 401 , thereby achieving the fixing of the power module 101 and the sample tray 201 .

[0050] Figure 3 The figure shows the connection relationship between the power module 101 and the sample tray 201 in an ideal situation. However, since the user needs to press the power module 101 onto the sample tray 201 to make the power module 101 and the sample tray 201 adhere to each other, in actual situations, the connection relationship between the power module 101 and the sample tray 201 may be as follows: Figure 4 or Figure 5 shown.

[0051] like Figure 4 As shown, when the adhesive 401 is not completely cured, if the user presses the power module 101 downward on the sample plate 201, the user may distort the power module 101, resulting in different heights of the left and right edges of the power module 101. This is because the pressure applied by the user to the power module 101 is not necessarily uniform, and does not necessarily act exactly on the center of gravity of the power module 101. If the distorted power module 101 is ground, the problem of inconsistent grinding effects in different areas of the ceramic substrate 106 may also occur.

[0052] like Figure 5 As shown, when the adhesive 401 is not completely cured, if the user presses the power module 101 downward on the sample tray 201, the user may squeeze out most of the adhesive 401 from the gap between the power module 101 and the sample tray 201. As a result, there is less adhesive 401 in the gap between the bottom surface of the power module 101 and the top surface of the sample tray 201, and the fixing effect between the power module 101 and the sample tray 201 is poor. Therefore, during the process of grinding the power module 101 by the grinding equipment, the power module 101 and the sample tray 201 fall off under the action of the lateral friction force during the grinding process, affecting the smooth progress of the grinding process.

[0053] In order to overcome the deficiencies of the above two prior arts, the utility model provides a grinding device 301. Figure 6The grinding device 301 in one embodiment of the present invention is shown, and the grinding device 301 includes a grinding disc 202, a sample disc 201, a first driving mechanism and a second driving mechanism. The first driving mechanism and the second driving mechanism are not shown in the drawings. The main difference between the grinding device 301 of the present invention and the prior art is the structure of the sample disc 201.

[0054] Figure 7 for Figure 6 A bottom view of the sample tray 201 in FIG. Figure 8 for Figure 7 The cross-sectional view of the sample plate 201 along the AA section. Figure 7 and Figure 8 As shown, the sample disc 201 includes a main body 307 and a plurality of bosses 308. The main body 307 includes a first surface 313. The bosses 308 are connected to the first surface 313 and protrude (protrude downward) relative to the first surface 313. The first surface 313 is disposed opposite to the grinding disc 202. Figures 6 to 8 In this embodiment, the sample disk 201 is located above the grinding disk 202, and the first surface 313 of the sample disk 201 is arranged downward. Two adjacent bosses 308 are arranged at intervals to form a gap for accommodating the adhesive 401. The state of the adhesive 401 when it is accommodated in the gap between the bosses 308 is as shown in FIG. Fig. 9 As shown. Figure 8 As shown, the outer surface of the boss 308 includes a second surface 314, the second surface 314 is located at the end of the boss 308 facing away from the first surface 313, the second surface 314 is a plane, and the multiple second surfaces 314 belonging to different bosses 308 are flush with each other. The body 307 and the boss 308 can be integrally formed, and the sample tray 201 can be made of metal or alloy; for example, the sample tray 201 can be made of aluminum, iron or stainless steel.

[0055] like Figure 6 As shown, the grinding disc 202 includes a grinding surface 316. In this embodiment, the top surface of the grinding disc 202 is the grinding surface 316. The grinding surface 316 of the grinding disc 202 is arranged opposite to the first surface 313 of the sample disc 201. In order to ensure the uniformity of grinding, the second surface 314 is parallel to the grinding surface 316. In order to enable the grinding disc 202 to grind off the ceramic layer 103, the grinding surface 316 is provided with diamond particles (not shown). In this embodiment, the second driving mechanism includes a first motor and a second motor. The first motor is used to drive the sample disc 201 to rotate around the first axis 305, and the second motor is used to rotate the grinding disc 202 around the second axis 306. As shown in FIG. Figure 6As shown, the first axis 305 is the central axis of the sample disk 201, and the second axis 306 is the central axis of the grinding disk 202. The first axis 305 and the second axis 306 are both vertical straight lines. The first axis 305 and the second axis 306 are arranged in parallel, and the first axis 305 and the second axis 306 are spaced apart in the radial direction of the grinding disk 202.

[0056] The grinding device 301 also includes a base and a turntable, which are not shown in the accompanying drawings. The base is located below the grinding disc 202 and supports the grinding disc 202. The second motor of the second driving mechanism can be installed inside the base. The second motor is located below the turntable, and the output shaft of the second motor is connected to the bottom of the turntable. The grinding disc 202 is placed above the turntable, and the grinding disc 202 and the turntable are magnetically attracted or bonded to each other. When the second motor drives the turntable to rotate, the grinding disc 202 rotates with the turntable.

[0057] like Figure 6 As shown, the grinding device 301 also includes a mounting arm 302, and the sample disc 201 is mounted on one end of the mounting arm 302, and the other end of the mounting arm 302 is connected to the base through a first driving mechanism. The first driving mechanism is used to drive the mounting arm 302 to rise and fall relative to the base, thereby driving the sample disc 201 away from and close to the grinding disc 202. The first driving mechanism can be set as a driving mechanism such as a cylinder, a screw module, etc. that can drive an object to move in a straight line. The first motor of the second driving mechanism can be installed inside the mounting arm 302. The grinding device 301 also includes a first joint 303 and a second joint 304, the first joint 303 is connected to the first motor, the second joint 304 is connected to the first joint 303 by screws, and the sample disc 201 is connected to the second joint 304 by screws. It should be noted that in other embodiments, if the first joint 303 and the sample disc 201 can be adapted to each other, then the first joint 303 can also be directly connected to the sample disc 201.

[0058] The following describes how to use the grinding device 301 to grind the power module 101 (sample).

[0059] First, the user places the sample tray 201 Fig. 9 The state shown (i.e., the first surface 313 and the second surface 314 face upwards), and the adhesive 401 in a fluid state is injected into the gap between the bosses 308. For example, the adhesive 401 is paraffin wax, and the user places the sample tray 201 on a heating device (e.g., a constant temperature heating table). After the heating device heats the sample tray 201 to a temperature above the melting point of the adhesive 401, the user holds a solid paraffin wax stick and allows the paraffin wax stick to contact the bosses 308; the solid paraffin wax will melt due to the heat, and the melted fluid paraffin wax will enter the gap between the bosses 308.

[0060] After the adhesive 401 is injected, the heating device keeps heating the sample tray 201, and the user places the power module 101 on the boss 308 and presses the power module 101 on the boss 308. In this way, the bottom surface of the molded body 105 of the power module 101 will abut against the second surface 314 of the boss 308, and the adhesive 401 in the gap between the bosses 308 will also contact the molded body 105.

[0061] Then, the user stops the heating device from heating the sample tray 201, so that the temperature of the sample tray 201 and the adhesive 401 decreases until the adhesive 401 solidifies. After the adhesive 401 solidifies, the power module 101 and the sample tray 201 are bonded and fixed to each other.

[0062] Next, the user installs the sample disc 201 on the mounting arm 302 and starts the grinding device 301. The first driving mechanism presses the power module 101 onto the grinding disc 202, so that the ceramic substrate 106 of the power module 101 and the grinding surface 316 of the grinding disc 202 abut against each other at a certain pressure; when the ceramic substrate 106 abuts against the grinding surface 316, the second driving mechanism drives the sample disc 201 and the grinding disc 202 to rotate. In this way, the grinding device 301 can grind the power module 101.

[0063] After the power module 101 is ground, the user can remove the sample tray 201 from the mounting arm 302 , and then heat the sample tray 201 again. After the adhesive 401 is melted, the user can take out the power module 101 from the sample tray 201 .

[0064] The grinding device 301 of the present invention fixes the power module 101 by bonding the power module 101 to the sample tray 201, and the connection between the power module 101 and the sample tray 201 is relatively strong. Therefore, during the grinding process of the power module 101, the power module 101 is not easy to shake relative to the sample tray 201, and the power module 101 is not easy to tilt relative to the grinding surface 316, which is conducive to reducing the risk of inconsistent grinding effects in various areas of the ceramic substrate 106.

[0065] Since there are multiple bosses 308 and the second surfaces 314 of the multiple bosses 308 are flush with each other, the sample tray 201 can support the power module 101 at multiple points, which is conducive to placing the power module 101 flat in the sample tray 201 and reducing the risk of the power module 101 tilting relative to the grinding surface 316.

[0066] Since the gap between the bosses 308 is used to accommodate the adhesive 401, when the user presses the power module 101 onto the bosses 308, the second surface 314 abuts against the power module 101, and the bosses 308 keep the distance between the power module 101 and the first surface 313 constant, and the adhesive 401 disposed in the gap is not easily squeezed out of the edge of the power module 101 in large quantities. In this way, the adhesive 401 applied on the sample disk 201 can basically be maintained between the first surface 313 and the power module 101, and most of the adhesive 401 applied on the sample disk 201 can play a bonding role, thereby ensuring the firmness of the connection between the power module 101 and the sample disk 201, thereby reducing the risk of the power module 101 falling off from the grinding surface 316 during the grinding process.

[0067] In summary, the grinding device 301 of the present invention can reduce the risk of the power module 101 tilting relative to the grinding surface 316 , thereby reducing the risk of inconsistent grinding effects in different areas of the ceramic substrate 106 .

[0068] Fig.10 and Fig.11 The power module 101 is shown after being ground by the grinding device 301 of the present invention. Fig.10 and Fig.11 It can be reflected that the grinding effect of the grinding device 301 of the present invention on each area of ​​the power module 101 is highly consistent. Fig.10 FIG. 1 shows a situation where the surface copper layer 102 of the ceramic substrate 106 is about to be completely worn away. Fig.10 As shown, the four corners of the surface copper layer 102 are ground away (i.e., regions B1, B2, and B3), and the ceramic layer 103 is exposed from the corners of the surface copper layer 102. However, the area where the surface copper layer 102 is completely ground away is relatively small, and the grinding effect of each region of the surface copper layer 102 is highly consistent. Fig.11 FIG. 1 shows a situation where the ceramic layer 103 is completely worn away. Fig.11 As shown, the internal copper layer 104 is completely exposed, and no area of ​​the internal copper layer 104 is over-ground, so the grinding effect of each area of ​​the ceramic layer 103 is highly consistent.

[0069] The grinding device 301 of the present invention is further introduced below.

[0070] In the above-described embodiment, the second driving mechanism can drive the grinding disc 202 to rotate, and can also drive the sample disc 201 to rotate. In other embodiments, the second driving mechanism can only drive the grinding disc 202 to rotate, or can only drive the sample disc 201 to rotate, as long as the grinding disc 202 can rotate relative to the sample disc 201. In addition, in other embodiments, the second driving mechanism can also drive the grinding disc 202 to reciprocate relative to the sample disc 201, so as to grind the power module 101. Figure 6 As shown, when the second driving mechanism drives the grinding disc 202 and the sample disc 201 to rotate, the main body 307 of the sample disc 201 and the grinding disc 202 can be configured to be cylindrical to improve the stability of the grinding disc 202 and the sample disc 201 when they rotate.

[0071] like Figure 8 As shown, the main body 307 also includes a third surface 315, which is the bottom surface of the main body 307. The third surface 315 is arranged opposite to the grinding surface 316 of the grinding disc 202. The main body 307 is provided with a sample receiving groove 309, and the opening 312 of the sample receiving groove 309 is arranged on the third surface 315. The opening 312 allows the power module 101 to enter and exit the sample receiving groove 309. The wall surface of the end of the sample receiving groove 309 away from the opening 312 is the first surface 313. From the first surface 313 to the third surface 315, the first surface 313, the second surface 314 and the third surface 315 are arranged in sequence.

[0072] like Fig. 9 As shown, after the power module 101 and the sample tray 201 are bonded and fixed to each other, the power module 101 will be located in the sample receiving groove 309, and the portion of the power module 101 that needs to be ground (ceramic substrate 106) protrudes relative to the third surface 315. The side wall of the sample receiving groove 309 can restrict the flow of the adhesive 401, preventing the adhesive 401 from flowing to the outer peripheral surface of the body 307 or flowing to the workbench where the sample tray 201 is placed. In addition, when the size of the power module 101 accommodated in the sample receiving groove 309 is large, the side wall of the sample receiving groove 309 can abut against the outer edge of the power module 101, thereby positioning the power module 101.

[0073] In this embodiment, the first surface 313 , the second surface 314 and the third surface 315 are all set to be planes, and any two of the three are parallel to each other. This setting is conducive to reducing the difficulty of processing the sample tray 201 .

[0074] It should be noted that, in other embodiments, the sample tray 201 may not need the sample receiving groove 309, because the sample tray 201 is fixed to the power module 101 by the adhesive 401, rather than clamping the power module 101 by the sample receiving groove 309. In the case where the size of the power module 101 is small, the power module 101 placed in the sample receiving groove 309 may not contact the side wall of the sample receiving groove 309.

[0075] like Figure 7 As shown, the sample holding tank 309 includes a core area 310 and an edge area 311 that are interconnected. The core area 310 and the edge area 311 are both rectangular. Two edge areas 311 are provided, and the two ends of the core area 310 in the first direction are respectively connected to the two edge areas 311, and the length L1 of the core area 310 in the second direction is greater than the length L6 of the edge area 311 in the second direction. If the direction from the first surface 313 to the third surface 315 is recorded as the third direction, then any two of the first direction, the second direction and the third direction are perpendicular to each other. Figure 7 In the drawing, the first direction is the left-right direction, the second direction is the front-back direction, and the third direction is the direction perpendicular to the paper and outward.

[0076] The edge area 311 facilitates the user to take the power module 101 out of the sample tray 201. Fig.10 As shown in the figure, when the power module 101 is placed in the core area 310, the edge area 311 is not occupied by the power module 101. Therefore, if the user needs to take the power module 101 out of the sample holding slot 309, the user can insert tweezers or his / her fingers into the edge area 311 and then pull the power module 101 out.

[0077] In this embodiment, the length of the core area 310 in the first direction is the length of the sample holding slot 309 in the first direction. If the length of the sample holding slot 309 in the first direction is recorded as L1, then in some embodiments, L1 satisfies: 0.5cm≤L1≤10cm. The length of the core area 310 in the second direction is L2. In some embodiments, L2 satisfies: 0.5cm≤L2≤10cm. L1 and L2 can be equal or unequal. The sizes of L1 and L2 meet the above requirements, making the sample tray 201 suitable for accommodating common power modules 101 on the market.

[0078] like Figure 8As shown, the distance between the second surface 314 and the third surface 315 is H, and H satisfies: 2.5mm≤H≤5.5mm. H is not less than 2.5mm to reduce the risk of glue overflowing from the sample holding groove 309. The setting of H not greater than 5.5mm is mainly based on the thickness of the common power module 101. H not greater than 5.5mm can prevent the distance between the second surface 314 and the third surface 314 from being too large, so that the part to be ground (ceramic substrate 106) of the power module 101 cannot completely protrude from the third surface 315.

[0079] like Figure 7 As shown, the plurality of bosses 308 are distributed in a rectangular array. Specifically, in the first direction, the plurality of bosses 308 are arranged in a plurality of columns, and each column includes a plurality of bosses 308 arranged along the second direction. The rectangular array distribution is a relatively simple distribution method, and the rectangular array distribution of the plurality of bosses 308 is conducive to reducing the processing difficulty of the sample tray 201. In addition, since the plurality of bosses 308 are distributed in a rectangular array, the array of the bosses 308 is suitable for carrying a plurality of power modules 101 of different sizes, and the applicability of the sample tray 201 is good.

[0080] like Figure 8 As shown, the distance between two adjacent bosses 308 in the first direction is D1, and D1 satisfies: D1 ≥ 4 mm. This arrangement makes the gap between the bosses 308 in the first direction larger, thereby reducing the difficulty of the adhesive 401 entering the gap. Figure 7 As shown, in order to reduce the difficulty of the adhesive 401 entering the gap, the distance between two adjacent bosses 308 in the second direction is D2, and D2 satisfies: D2 ≥ 4 mm.

[0081] Please combine Figure 7 and Figure 8 , the boss 308 is set as a cuboid, the second surface 314 is the bottom surface of the cuboid, and the second surface 314 is rectangular. Since the boss 308 is set as a cuboid, the shape of the boss 308 is relatively simple, and the processing difficulty of the sample tray 201 is relatively low. In other embodiments, the boss 308 can also be set as a cylinder, other polygonal prisms other than a quadrangular prism, etc.

[0082] like Figure 7 The side length of the first edge of the boss 308 is L3, and the side length of the second edge of the boss 308 is L4, and L3 and L4 satisfy: 3mm≤L3≤6mm, 3mm≤L4≤6mm. The first edge and the second edge are two adjacent edges of the second surface 314, and the first edge and the second edge intersect. L3 and L4 can be equal or unequal. L3 and L4 meet the above-mentioned size range so that the area of ​​the second surface 314 is moderate, so that the boss 308 has a good supporting effect on the power module 101.

[0083] like Figure 8 As shown, the protruding height of the boss 308 relative to the first surface 313 is L5, and L5 satisfies: 1mm≤L5≤2mm. The larger L5 is, the thicker the adhesive 401 is when the adhesive 401 fills the gap between the bosses 308. L5 being not less than 1mm can prevent the thickness of the adhesive 401 from being too small, thereby preventing the bonding force between the sample tray 201 and the power module 101 from being insufficient. L5 being not greater than 2mm can prevent the thickness of the adhesive 401 from being too large, thereby preventing excessive consumption of the adhesive 401 when installing the power module 101.

[0084] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A grinding device, characterized in that: include: Abrasive discs, including abrasive surfaces; A sample tray, comprising a main body and a plurality of bosses, wherein the main body comprises a first surface, the first surface is arranged opposite to the grinding surface, the boss is connected to the first surface and protrudes relative to the first surface, two adjacent bosses are arranged at intervals to form a gap for accommodating an adhesive, the sample tray and the sample are fixed by the adhesive, the boss further comprises a second surface for abutting against the sample, the second surface is located at an end of the boss facing away from the first surface, the second surface is a plane, a plurality of second surfaces belonging to different bosses are flush with each other, and the second surface is parallel to the grinding surface; A first driving mechanism, used for driving the sample disc to approach the grinding disc, so that the sample mounted on the sample disc abuts against the grinding surface; The second driving mechanism is used to move the grinding disc relative to the sample disc when the sample abuts against the grinding surface, so that the grinding surface grinds the sample.

2. The grinding device according to claim 1, characterized in that The main body is provided with a sample holding groove, and the main body further comprises a third surface, the third surface is arranged opposite to the grinding surface, and the opening of the sample holding groove is arranged on the third surface; The wall surface of one end of the sample holding groove away from the opening is the first surface, and from the first surface to the third surface, the first surface, the second surface and the third surface are sequentially spaced apart.

3. The grinding device according to claim 2, characterized in that: The sample holding groove includes a core area and two edge areas, the two ends of the core area in the first direction are respectively connected to one of the edge areas, the length of the core area in the second direction is greater than the length of the edge area in the second direction, the direction from the first surface to the third surface is the third direction, and any two of the first direction, the second direction and the third direction are perpendicular to each other.

4. The grinding device according to claim 3, characterized in that The length of the sample holding groove in the first direction is L1, and the length of the sample holding groove in the second direction is L2, 0.5 cm≤L1≤10 cm, 0.5 cm≤L2≤10 cm.

5. The grinding device according to claim 2, characterized in that: A distance between the second surface and the third surface is H, 2.5 mm≤H≤5.5 mm.

6. The grinding device according to claim 1, characterized in that The plurality of bosses are distributed in a rectangular array.

7. The grinding device according to claim 6, characterized in that The sample plate comprises a plurality of columns of bosses spaced apart along a first direction, each column comprises a plurality of bosses spaced apart along a second direction, the direction from the first surface to the second surface is a third direction, and any two of the first direction, the second direction and the third direction are perpendicular to each other; Wherein, the distance between two adjacent bosses in the first direction is D1, D1≥4mm; and / or the distance between two adjacent bosses in the second direction is D2, D2≥4mm.

8. The grinding device according to claim 1, characterized in that The boss is a cuboid, and the second surface is rectangular.

9. The grinding device according to claim 8, characterized in that The side length of the first edge of the second surface is L3, the side length of the second edge of the second surface is L4, the first edge and the second edge are adjacent to and intersect each other, 3mm≤L3≤6mm, 3mm≤L4≤6mm; And / or, a protruding height of the boss relative to the first surface is L5, 1mm≤L5≤2mm.

10. The grinding device according to claim 1, characterized in that The sample disk is cylindrical, and the second driving mechanism can drive the sample disk to rotate around the central axis of the sample disk itself.

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