Receiving device of silicon wafer sorting machine
By designing the lifting and smoothing mechanism of the material collection device of the silicon wafer sorting machine, the problem of inconsistent drop height of the silicon wafer is solved, ensuring the quality and stability of the silicon wafer, and achieving high consistency and stability in the process of silicon wafer discharge is achieved. sex.
Patent Information
- Application Number
- CN202420854185.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-04-24
AI Technical Summary
The height of the traditional silicon wafer material collection device is fixed, resulting in inconsistent drop height of the silicon wafer, affecting the quality of the silicon wafer.
A silicon wafer sorting machine material collection device is designed, including a base, material collection mechanism, translation mechanism and lifting mechanism. The material collection mechanism is driven to lift and lower by lifting electric cylinder to ensure that the silicon wafer is discharged in a consistent manner and adjust it through the smoothing mechanism. The material collection rack is to a horizontal state to ensure the stability of the silicon wafer and the stability during translation.
The high consistency of silicon wafer cutting is achieved, the quality of silicon wafers and the stability in the collecting frame are improved, the damage and shaking of silicon wafers are avoided, and the stability during the silicon wafer detection process is ensured.
Smart Images
Figure CN222348171U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer production, in particular to a material receiving device of a silicon wafer sorting machine. Background Art
[0002] In the production process of solar cells, the silicon rods need to be cut into silicon wafers first, then the silicon wafers need to be cleaned and tested after cleaning. Generally, the silicon wafers are placed on a conveying device, which transports the silicon wafers to the testing device, and the dirt, hidden cracks, edge defects, warping, etc. on the surface of the silicon wafers are gradually tested. After the test is completed, the silicon wafers need to be transported to the receiving box.
[0003] The height of the traditional silicon wafer receiving device is fixed, and the falling height of the silicon wafers is inconsistent when the silicon wafers enter the receiving box, which may cause different degrees of damage to the silicon wafers and affect the quality of the silicon wafers. Utility Model Content
[0004] The technical problem to be solved by the utility model is to overcome the disadvantages of the prior art and provide a material receiving device for a silicon wafer sorting machine.
[0005] In order to solve the above technical problems, the technical solution of the utility model is as follows:
[0006] A silicon wafer sorting machine receiving device, comprising:
[0007] Base;
[0008] A material receiving mechanism, arranged on the base, for placing materials;
[0009] A translation mechanism, arranged on the base, for driving the material receiving mechanism to translate along the base and to reciprocate between a material receiving station and a material unloading station;
[0010] And, a lifting mechanism is arranged on the base, and is used for driving the material receiving mechanism located at the material receiving station to rise and fall.
[0011] As a preferred solution of the material receiving device of the silicon wafer sorting machine described in the utility model, wherein: the material receiving mechanism includes a material receiving bottom plate arranged on the base and a material receiving frame body arranged on the material receiving bottom plate, the material receiving frame body includes a support plate, a limit plate fixedly arranged on one side of the support plate and a limit rod fixedly arranged on the other side of the support plate, the limit plate and the limit rod are located on two adjacent sides of the support plate, and a material receiving pad is arranged on the support plate.
[0012] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, the lifting mechanism includes a lifting electric cylinder fixedly mounted on a base, a lifting platform drivingly connected to the lifting electric cylinder, and a plurality of lifting limit columns fixedly mounted on the lifting platform, wherein the lifting limit columns are inserted into the base and arranged along the vertical direction;
[0013] When the material receiving mechanism is located at the material receiving station, the lifting platform is located directly below the material receiving bottom plate.
[0014] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, wherein: a plurality of first positioning holes are opened on the receiving bottom plate, a plurality of first positioning columns are correspondingly arranged on the lifting platform, and when the receiving mechanism is located at the material receiving station, each of the first positioning columns is aligned with the adjacent first positioning hole.
[0015] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, wherein: the translation mechanism includes a translation slide rail fixedly mounted on the base, a moving seat slidably mounted on the translation slide rail, and a translation drive assembly for driving the moving seat to move along the translation slide rail;
[0016] The material receiving bottom plate is provided with a plurality of second positioning holes, and the movable seat is correspondingly provided with a plurality of second positioning columns, and when the material receiving mechanism is located at the material receiving station, the upper end of each second positioning column extends into the adjacent second positioning hole.
[0017] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, wherein: a stretching mechanism for tilting the receiving frame is arranged between the receiving bottom plate and the receiving frame body, the stretching mechanism comprises a hinge seat fixedly mounted on the receiving bottom plate, and the support plate is hinged to the receiving bottom plate through the hinge seat;
[0018] The stretching mechanism also includes a stretching spring connected between the material receiving bottom plate and the support plate, one end of the stretching spring is fixedly connected to the material receiving bottom plate, and the other end of the stretching spring is detachably connected to the support plate, and when one end of the stretching spring is connected to the support plate, the material receiving frame tilts toward the side where the stretching spring is located.
[0019] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, wherein: a first limit column and a second limit column are fixedly installed on the receiving bottom plate, the first limit column is located on the side of the support plate with a lower height, and the height of the first limit column is greater than the height difference between the side of the support plate with a lower height and the receiving bottom plate, the second limit column is located on the side of the support plate with a higher height, and the height of the second limit column is equal to the height difference between the support plate and the receiving bottom plate when the two are parallel.
[0020] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, the first limiting column and the second limiting column both include a mounting column and a flexible pad fixedly arranged on the upper end of the mounting column, and the upper end surface of the flexible pad is an arc surface.
[0021] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, it further includes a leveling mechanism for adjusting the receiving frame in an inclined state to a horizontal state, and the leveling mechanism includes a lifting drive assembly fixedly mounted on the base and a leveling bracket drivingly connected to the lifting drive assembly;
[0022] When the material receiving mechanism is located at the material unloading station, the smoothing bracket is located below the material receiving frame.
[0023] As a preferred solution of the silicon wafer sorting machine receiving device of the utility model, a smoothing roller is rotatably mounted on the upper end of the smoothing bracket.
[0024] The beneficial effects of the utility model are:
[0025] (1) When receiving materials, the utility model can drive the receiving mechanism to rise and fall as a whole through the lifting mechanism, and every time a silicon wafer enters the receiving rack, the lifting electric cylinder drives the lifting platform to descend a certain distance to ensure that the height of all silicon wafers is kept consistent, thereby ensuring the quality of the silicon wafers.
[0026] (2) The utility model has a first positioning hole on the receiving bottom plate, and a first positioning column is correspondingly fixed on the upper end of the lifting platform. When the lifting cylinder drives the lifting platform to rise, the upper end of the first positioning column extends into the first positioning hole. At this time, the cooperation between the first positioning column and the first positioning hole can ensure the horizontal stability of the receiving mechanism during the lifting process.
[0027] (3) The utility model has a first limit column fixedly installed on the receiving bottom plate, and the height of the first limit column is greater than the height difference between the downwardly inclined side of the support plate and the receiving bottom plate. The lower end of the downwardly inclined side of the support plate will abut against the upper end of the first limit column, and the tension spring continues to apply a downward pulling force to the support plate. In this way, the inclination of the receiving rack body remains stable during the lifting and translation process, and no shaking occurs, thereby improving the stability of the silicon wafers in the receiving rack body;
[0028] (4) The utility model is also provided with a leveling mechanism, which can adjust the inclined material receiving frame to a horizontal state when the translation mechanism drives the material receiving mechanism to move to the material unloading station, so as to facilitate the unloading assembly to unload the silicon wafers in the material receiving frame; at the same time, since the second limiting column is fixedly installed on the material receiving bottom plate, and when the support plate is parallel to the material receiving bottom plate, the height of the second limiting column is equal to the distance between the support plate and the material receiving bottom plate. Therefore, when the leveling mechanism adjusts the material receiving frame to a horizontal state, one side of the support plate will abut against the upper end of the second limiting column, so that the material receiving frame remains in a horizontal state. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0030] Figure 1 A schematic diagram of the structure of a silicon wafer sorting machine receiving device provided by the utility model;
[0031] Figure 2 This is a schematic diagram of the structure of the lifting mechanism in the material receiving device of the silicon wafer sorting machine provided by the utility model;
[0032] Figure 3 This is a schematic diagram of the structure of the components other than the lifting mechanism in the silicon wafer sorting machine receiving device provided by the utility model;
[0033] Figure 4 It is a structural schematic diagram of the receiving device of the silicon wafer sorting machine when the receiving frame is tilted;
[0034] Among them: 100, base; 200, material receiving mechanism; 300, translation mechanism; 400, lifting mechanism; 500, stretching mechanism; 600, smoothing mechanism; 210, material receiving bottom plate; 211, first positioning hole; 212, second positioning hole; 220, material receiving frame; 221, support plate; 222, limit plate; 223, limit rod; 224, material receiving pad; 310, translation slide rail; 320, moving seat; 330, second positioning column; 410, lifting electric cylinder; 420, lifting platform; 421, first positioning column; 430, lifting limit column; 440, connecting frame; 510, articulated seat; 520, stretching spring; 530, first limit column; 540, second limit column; 610, lifting drive assembly; 620, smoothing bracket; 630, smoothing roller. DETAILED DESCRIPTION
[0035] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below according to specific implementation methods and in combination with the accompanying drawings.
[0036] Figure 1 A schematic diagram of the structure of a receiving device of a silicon wafer sorting machine provided in an embodiment of the present application. The device includes a base 100, a receiving mechanism 200, a translation mechanism 300, a lifting mechanism 400, a stretching mechanism 500 and a smoothing mechanism 600. Among them, the receiving mechanism 200 is used to receive materials, i.e. silicon wafers, from the previous process. The translation mechanism 300 is used to drive the receiving mechanism 200 to translate, and to reciprocate between the receiving station and the unloading station on the base 100. The lifting mechanism 400 is used to drive the receiving mechanism 200 located at the receiving station to rise and fall, so that the receiving mechanism 200 can adjust its own height when receiving silicon wafers, to ensure that the height of the unloading of silicon wafers remains consistent.
[0037] Specifically, the base 100 is roughly rectangular. The translation mechanism 300 is used to drive the material receiving mechanism 200 to move along the length direction of the base 100, and when the material receiving mechanism 200 moves to one end of the length direction of the base 100, the material receiving mechanism 200 is located at the material receiving station; when the material receiving mechanism 200 moves to the other end of the length direction of the base 100, the material receiving mechanism 200 is located at the material unloading station.
[0038] The material receiving mechanism 200 is disposed on the base 100. Figure 1The receiving mechanism 200 includes a receiving bottom plate 210 disposed on the bottom plate and a receiving frame 220 disposed on the receiving bottom plate 210. The receiving frame 220 includes a support plate 221, a limit plate 222 fixedly mounted on one side of the support plate 221, and two limit columns fixedly mounted on the other side of the support plate 221. The support plate 221 is roughly rectangular, and the limit plate 222 and the limit columns are respectively disposed on two adjacent sides of the support plate 221, so that the remaining two sides of the support plate 221 form a feed port for silicon wafers to enter. When the silicon wafers are unloaded in the previous process, they can enter the receiving frame 220 through the feed port. A flexible receiving pad 224 is also disposed on the support plate 221, which can buffer the silicon wafers and prevent them from being damaged when they fall into the receiving frame 220.
[0039] The stretching mechanism 500 is disposed between the receiving bottom plate 210 and the receiving frame 220, and is used to tilt the receiving frame 220 toward the side where the limiting column is located. Figure 2 The stretching mechanism 500 includes an articulated seat 510 fixedly mounted on the receiving bottom plate 210. The support plate 221 in the receiving frame 220 is hinged to the receiving bottom plate 210 through the articulated seat 510, and the receiving frame 220 can rotate around the articulated axis in the articulated seat 510, so as to adjust the angle between the support plate 221 and the receiving bottom plate 210.
[0040] The stretching mechanism 500 further includes a stretching spring 520 connected between the material receiving bottom plate 210 and the support plate 221. One end of the stretching spring 520 is fixedly connected to the material receiving bottom plate 210, and the other end is provided with a hook portion. Correspondingly, a connecting portion is fixedly provided on the lower end surface of the support plate 221. The stretching spring 520 is detachably connected to the support plate 221 through the cooperation between the hook portion and the connecting portion.
[0041] It should be noted that when the support plate 221 is parallel to the material receiving bottom plate 210, the distance between the end of the tension spring 520 connected to the material receiving bottom plate 210 and the connecting portion on the support plate 221 is greater than the length of the tension spring 520 in the naturally stretched state. When the hook portion of the tension spring 520 is connected to the connecting portion on the support plate 221, the tension spring 520 is in the stretched state. At this time, the tension spring 520 will apply a downward pulling force to the support plate 221, causing the support plate 221 to tilt toward the side where the limit column is located, thereby causing the material receiving frame 220 to tilt as a whole toward the side where the material feeding station is located, see Figure 4 .
[0042] Preferably, a first limiting column 530 and a second limiting column 540 are fixedly mounted on the receiving bottom plate 210. The first limiting column 530 is located on the side of the receiving bottom plate 210 close to the unloading station, and the second limiting column 540 is located on the side of the receiving bottom plate 210 close to the receiving station.
[0043] When the tension spring 520 is connected to the support plate 221, the height of the first limiting column 530 is greater than the height difference between the downwardly inclined side of the support plate 221 and the receiving bottom plate 210. The lower end of the downwardly inclined side of the support plate 221 will abut against the upper end of the first limiting column 530, and the tension spring 520 continues to apply a downward pulling force to the support plate 221. In this way, the inclination of the receiving rack body 220 remains stable during the lifting and translation process, and no shaking occurs, thereby improving the stability of the silicon wafers in the receiving rack body 220. When the support plate 221 is parallel to the receiving bottom plate 210, the height of the second limiting column 540 is equal to the distance between the support plate 221 and the receiving bottom plate 210.
[0044] Preferably, the first limiting column 530 and the second limiting column 540 both include a mounting column and a flexible pad fixedly disposed on the upper end of the mounting column, and the upper end surface of the flexible pad is an arc surface. The flexible pad is used to buffer the contact portion between the support plate 221 and the limiting column to avoid impact and damage between the contact portion between the support plate 221 and the limiting column.
[0045] See also Figure 3 The lifting mechanism 400 includes a lifting electric cylinder 410 fixedly mounted on the base 100, a lifting platform 420 drivingly connected to the lifting electric cylinder 410, and four lifting limit columns 430 fixedly mounted on the lifting platform 420. Among them, the lifting platform 420 is located above the base 100. The piston rod of the lifting electric cylinder 410 is retracted in the vertical direction. The four lifting limit columns 430 are all arranged in the vertical direction, and the upper ends of the lifting limit columns 430 are fixedly connected to the lifting platform 420 after passing through the base 100, and the lower ends of the lifting limit columns 430 are fixedly connected to the connecting frame 440. When the lifting electric cylinder 410 is in operation, it can drive the lifting platform 420 to rise and fall in the vertical direction, and during the lifting process, the lifting limit columns 430 can limit and guide the lifting platform 420.
[0046] When the receiving mechanism 200 is located at the receiving station, the lifting platform 420 is located directly below the receiving bottom plate 210. At this time, the lifting platform 420 is driven to rise and fall by the lifting electric cylinder 410, so that the lifting platform 420 can drive the receiving bottom plate 210 to rise and fall synchronously, thereby driving the receiving frame 220 to rise and fall, so that when the silicon wafers discharged from the previous process enter the receiving frame 220, the falling height of all silicon wafers is kept consistent.
[0047] Preferably, a plurality of first positioning holes 211 are provided on the material receiving bottom plate 210. Correspondingly, first positioning columns 421, the same number as the first positioning holes 211, are fixedly provided on the upper end of the lifting platform 420. The diameter of the first positioning column 421 is larger than the diameter of the first positioning hole 211, and the upper end of the first positioning column 421 is configured to be truncated cone-shaped or frustum-shaped. When the material receiving mechanism 200 is located at the material receiving station, each first positioning column 421 is aligned with the adjacent first positioning hole 211. At this time, when the lifting electric cylinder 410 drives the lifting platform 420 to rise, the upper end of each first positioning column 421 extends into the adjacent first positioning hole 211. At this time, the cooperation between the first positioning column 421 and the first positioning hole 211 can ensure the stability of the material receiving mechanism 200 in the horizontal direction during the lifting process.
[0048] See also Figure 2 The translation mechanism 300 includes two translation rails 310 fixedly mounted on the base 100, and the two translation rails 310 extend along the length direction of the base 100. A moving seat 320 is slidably mounted on the two translation rails 310, and the moving seat 320 slides along the translation rails 310 under the drive of the translation drive assembly. A plurality of second positioning holes 212 are provided on the receiving bottom plate 210. Correspondingly, second positioning columns 330 having the same number as the second positioning holes 212 are fixedly mounted on the moving seat 320. The diameter of the second positioning column 330 is larger than the diameter of the second positioning hole 212, and the upper end of the second positioning column 330 is configured to be truncated cone-shaped or frustum-shaped.
[0049] It should be noted that, in the initial state, the material receiving mechanism 200 is located at the material receiving station, and the upper end of each second positioning column 330 extends into the adjacent second positioning hole 212. At this time, when the movable seat 320 moves along the translation slide rail 310, it will drive the material receiving mechanism 200 to translate synchronously, thereby realizing the reciprocating movement of the material receiving mechanism 200 between the material receiving station and the material unloading station. In addition, when the material receiving mechanism 200 is located at the material receiving station, the lifting mechanism 400 can drive the material receiving mechanism 200 to lift and lower as a whole to receive the material. After the material is received, the lifting mechanism 400 is reset, so that the material receiving bottom plate 210 is located on the movable seat 320 again, and the upper ends of the second positioning columns 330 extend into the adjacent second positioning holes 212, so that the translation mechanism 300 can drive the material receiving mechanism 200 to move to the material unloading station for unloading.
[0050] The leveling mechanism 600 is used to adjust the inclined material receiving frame 220 to a horizontal state when the translation mechanism 300 drives the material receiving mechanism 200 to move to the material unloading station, so as to facilitate the unloading assembly to unload the silicon wafers in the material receiving frame 220. Figure 2The smoothing mechanism 600 includes a lifting drive assembly 610 fixedly mounted on the base 100, and the lifting drive assembly 610 is drivingly connected to the smoothing bracket 620, and is used to drive the smoothing bracket 620 to rise and fall in the vertical direction. When the translation mechanism 300 drives the material receiving mechanism 200 to move to the unloading station, the smoothing bracket 620 is located below the downwardly inclined side of the support plate 221. At this time, the lifting drive assembly 610 drives the smoothing bracket 620 to rise, which can drive the downwardly inclined side of the support plate 221 to lift upward, so that the support plate 221 is in a horizontal state.
[0051] It is understandable that, since the second limiting column 540 is fixedly mounted on the receiving bottom plate 210, and when the support plate 221 is parallel to the receiving bottom plate 210, the height of the second limiting column 540 is equal to the distance between the support plate 221 and the receiving bottom plate 210. Therefore, when the leveling mechanism 600 adjusts the receiving frame 220 to a horizontal state, one side of the support plate 221 will abut against the upper end of the second limiting column 540, so that the receiving frame 220 remains in a horizontal state.
[0052] Preferably, a smoothing roller 630 is rotatably mounted on the upper end of the smoothing bracket 620. In the process of the smoothing mechanism 600 adjusting the material receiving rack 220 to a horizontal state, the support plate 221 is always only in contact with the smoothing roller 630. The smoothing roller 630 converts the sliding friction between the smoothing mechanism 600 and the material receiving rack 220 into rolling friction, thereby avoiding damage to the support plate 221 and the smoothing bracket 620.
[0053] When the above-mentioned silicon wafer sorting machine receiving device is in operation, in the initial state, the receiving mechanism 200 is located at the receiving station, and the end of the tension spring 520 is connected to the support plate 221, so that the receiving frame 220 is tilted as a whole and parallel to the unloading direction of the silicon wafer in the previous process. When receiving the material, the lifting electric cylinder 410 drives the lifting platform 420 to rise, so that the lifting platform 420 drives the receiving mechanism 200 to move upward to a preset position as a whole, so that the silicon wafers in the previous process can enter the receiving frame 220 in sequence, and in this process, every time a silicon wafer enters the receiving frame 220, the lifting electric cylinder 410 drives the lifting platform 420 to descend a certain distance to ensure that the height of the silicon wafer unloading remains consistent. After completing the receiving, the lifting electric cylinder 410 drives the lifting platform 420 to reset, so that the receiving bottom plate 210 is located on the moving seat 320 again, and the upper ends of the second positioning columns 330 are extended to the adjacent second positioning holes 212. Then the translation mechanism 300 drives the receiving mechanism 200 to move to the unloading station. When the receiving mechanism 200 moves to the unloading station, the lifting drive assembly 610 in the smoothing mechanism 600 drives the smoothing bracket 620 to move upward, so that the smoothing roller 630 contacts the bottom surface of the support plate 221, and drives the downwardly inclined side of the support plate 221 to lift upward, so that the support plate 221 is in a horizontal state. Then the silicon wafers in the receiving rack 220 are unloaded by the unloading assembly.
[0054] Therefore, the technical solution of the present application can drive the receiving mechanism 200 to rise and fall as a whole through the lifting mechanism when receiving the material, and each time a silicon wafer enters the receiving rack, the lifting electric cylinder drives the lifting platform to drop a certain distance to ensure that the height of all silicon wafers is kept consistent, thereby ensuring the quality of the silicon wafers. At the same time, the receiving mechanism has high stability when lifting and translating.
[0055] In addition to the above embodiments, the present invention may also have other implementation modes; any technical solutions formed by equivalent replacement or equivalent transformation shall fall within the protection scope required by the present invention.
Claims
1. A silicon wafer sorting machine receiving device, characterized in that: include: Base (100); A material receiving mechanism (200), arranged on the base (100) and used for placing materials; A translation mechanism (300) is arranged on the base (100) and is used to drive the material receiving mechanism (200) to translate along the base (100) and to reciprocate between a material receiving station and a material unloading station; And, a lifting mechanism (400) is arranged on the base (100) and is used to drive the material receiving mechanism (200) located at the material receiving station to rise and fall.
2. The material receiving device of the silicon wafer sorting machine according to claim 1, characterized in that: The material receiving mechanism (200) comprises a material receiving bottom plate (210) arranged on the base (100) and a material receiving frame (220) arranged on the material receiving bottom plate (210); the material receiving frame (220) comprises a support plate (221), a limit plate (222) fixedly arranged on one side of the support plate (221), and a limit rod (223) fixedly arranged on the other side of the support plate (221); the limit plate (222) and the limit rod (223) are located on two adjacent sides of the support plate (221); and a material receiving pad (224) is arranged on the support plate (221).
3. The material receiving device of the silicon wafer sorting machine according to claim 2, characterized in that: The lifting mechanism (400) comprises a lifting electric cylinder (410) fixedly mounted on a base (100), a lifting platform (420) drivingly connected to the lifting electric cylinder (410), and a plurality of lifting limit columns (430) fixedly mounted on the lifting platform (420); the lifting limit columns (430) are inserted into the base (100) and are arranged in a vertical direction; When the material receiving mechanism (200) is located at the material receiving station, the lifting platform (420) is located directly below the material receiving bottom plate (210).
4. The material receiving device of the silicon wafer sorting machine according to claim 3, characterized in that: A plurality of first positioning holes (211) are provided on the material receiving bottom plate (210), and a plurality of first positioning columns (421) are correspondingly provided on the lifting platform (420), and when the material receiving mechanism (200) is located at the material receiving station, each of the first positioning columns (421) is aligned with an adjacent first positioning hole (211).
5. The material receiving device of the silicon wafer sorting machine according to claim 2, characterized in that: The translation mechanism (300) comprises a translation slide rail (310) fixedly mounted on the base (100), a moving seat (320) slidably mounted on the translation slide rail (310), and a translation drive assembly for driving the moving seat (320) to move along the translation slide rail (310); A plurality of second positioning holes (212) are provided on the material receiving bottom plate (210), and a plurality of second positioning columns (330) are correspondingly provided on the movable seat (320), and when the material receiving mechanism (200) is located at the material receiving station, the upper end of each second positioning column (330) extends into an adjacent second positioning hole (212).
6. The material receiving device of the silicon wafer sorting machine according to claim 2, characterized in that: A stretching mechanism (500) for tilting the material receiving frame (220) is provided between the material receiving bottom plate (210) and the material receiving frame (220), the stretching mechanism (500) comprising a hinge seat (510) fixedly mounted on the material receiving bottom plate (210), and the support plate (221) is hingedly connected to the material receiving bottom plate (210) via the hinge seat (510); The stretching mechanism (500) further comprises a stretching spring (520) connected between the material receiving bottom plate (210) and the support plate (221), one end of the stretching spring (520) being fixedly connected to the material receiving bottom plate (210), and the other end of the stretching spring (520) being detachably connected to the support plate (221), and when one end of the stretching spring (520) is connected to the support plate (221), the material receiving frame (220) is tilted toward the side where the stretching spring (520) is located.
7. The material receiving device of the silicon wafer sorting machine according to claim 6, characterized in that: A first limiting column (530) and a second limiting column (540) are fixedly mounted on the material receiving bottom plate (210); the first limiting column (530) is located on the side of the support plate (221) with a lower height, and the height of the first limiting column (530) is greater than the height difference between the side of the support plate (221) with a lower height and the material receiving bottom plate (210); the second limiting column (540) is located on the side of the support plate (221) with a higher height, and the height of the second limiting column (540) is equal to the height difference between the support plate (221) and the material receiving bottom plate (210) when the two are parallel.
8. The material receiving device of the silicon wafer sorting machine according to claim 7, characterized in that: The first limiting column (530) and the second limiting column (540) both comprise a mounting column and a flexible pad fixedly arranged on the upper end of the mounting column, and the upper end surface of the flexible pad is an arc surface.
9. The material receiving device of the silicon wafer sorting machine according to claim 6, characterized in that: It also includes a leveling mechanism (600) for adjusting the material receiving frame (220) in an inclined state to a horizontal state, wherein the leveling mechanism (600) includes a lifting drive assembly (610) fixedly mounted on the base (100) and a leveling bracket (620) drivingly connected to the lifting drive assembly (610); When the material receiving mechanism (200) is located at the material unloading station, the smoothing bracket (620) is located below the material receiving frame (220).
10. The material receiving device of the silicon wafer sorting machine according to claim 9, characterized in that: A smoothing roller (630) is rotatably mounted on the upper end of the smoothing bracket (620).